Adjustable semiconductor plastic package mold

Abstract

The utility model discloses an adjustable semiconductor plastic package mold, which belongs to the field of semiconductor plastic package molds and comprises a semiconductor plastic package mold body, grooves are arranged on the periphery of the upper surface of the semiconductor plastic package mold body, an adjusting mechanism is inserted in the grooves, an extrusion mechanism is sleeved on the outer surface of the adjusting mechanism, and the extrusion mechanism is connected with the semiconductor plastic package mold body. The bottom of the semiconductor plastic packaging mold body is fixedly connected with a connecting plate; through cooperative use of all the devices and through the arranged adjusting mechanism, when a semiconductor product is processed, the adjusting mechanism can be used for adjusting the extrusion force according to requirements, the proper pressure can ensure that a packaging material fully fills each corner of a mold, bubbles, cavities or unfilled areas are prevented from being formed, and the packaging efficiency is improved. Therefore, the reliability and durability of the semiconductor can be improved, and the defects such as cracks, stripping and other structural problems generated in the packaging process can be reduced through the correct pressure setting, so that the overall quality of a final product is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor plastic package mould technical field, concretely is a adjustable semiconductor plastic package mould. BACKGROUND

[0002] Semiconductor refers to a kind of material with conductivity between conductor and insulator, is widely used in electronic devices and circuit, and the basic characteristics of semiconductor make them play a vital role in modern technology, and semiconductor plastic package mould is the equipment for packaging semiconductor chip, it plays a vital role in semiconductor manufacturing, adjustable semiconductor plastic package mould is a kind of professional equipment for semiconductor packaging, and its main function is to package semiconductor chip in plastic material to protect them from environmental factors, during packaging process, it is crucial to maintain accurate temperature and pressure, so adjustable mould design can provide higher flexibility and control.

[0003] According to the search, Chinese utility model patent discloses a kind of adjustable semiconductor plastic package mould (publication number: CN219486424U), including base, base bottom fixedly connected with supporting leg, base top is provided with adjusting mechanism, adjusting mechanism top is provided with semiconductor plastic package mould main body, semiconductor plastic package mould main body front and rear sides are provided with mounting mechanism, adjusting mechanism includes drive assembly, lifting assembly and limit component, drive assembly is set to base top.The adjustable semiconductor plastic package mould, by the adjusting mechanism of setting, staff only needs to start drive motor to complete the adjustment work of the horizontal height of semiconductor plastic package mould main body, during the movement of workbench, fixed slide cylinder is slidably connected in the outer ring of limit slide rod, is connected with workbench by connecting block and completes the limiting work of workbench, so that the four corners of workbench do not appear deviation during up and down movement, increase the stability during the lifting of workbench.

[0004] Although the above-mentioned patent can adjust the horizontal height of semiconductor plastic package mould main body by the setting of adjusting mechanism, but the pressure of the mold extrusion is inconvenient to adjust when the semiconductor plastic package mould main body is made into a model, and inappropriate pressure will cause bubbles in the injection molding process, thereby affecting the sealing performance and structural integrity of packaging, and also cause the non-uniformity of plastic packaging material in the curing process, thereby affecting its thermal performance, electrical performance and mechanical performance, so that the quality of processed semiconductor products is poor.

[0005] Therefore, the utility model provides a kind of adjustable semiconductor plastic package mould to solve the above problems. UTILITY MODEL CONTENT

[0006] (1) technical problem solved

[0007] The utility model provides a adjustable semiconductor plastic package mould, aims at solving the problem in the background technique.

[0008] (II) Technical solutions

[0009] To achieve the above object, the utility model provides the following technical scheme: a adjustable semiconductor plastic package mould, including semiconductor plastic package mould body, the four around of semiconductor plastic package mould body upper surface all are seted up with recess, the recess is inserted with adjusting mechanism in, the outer surface of adjusting mechanism is sleeved with extrusion mechanism, the bottom of semiconductor plastic package mould body is fixedly connected with connecting plate, the bottom of connecting plate is fixedly connected with adjusting mechanism,

[0010] The adjusting mechanism includes a threaded rod, the outer surface of the threaded rod is inserted into the recess, a A washer is fixedly connected to the bottom of the outer surface of the threaded rod, a vertical rod is fixedly connected to the bottom of the A washer, a spring is sleeved on the outer surface of the vertical rod, a B washer is fixedly connected to one end of the spring, and a nut is threadedly connected to the outer surface of the threaded rod.

[0011] As a preferred technical solution of the present application, the extrusion mechanism includes a cover plate, a hole slot is formed around the cover plate, the hole slot is sleeved on the outer surface of the threaded rod, an outer shell is fixedly connected to the bottom of the cover plate, a heating plate is fixedly installed in the inner portion of the outer shell, a sleeve is fixedly connected to the bottom of the outer shell, a heat conduction rod is fixedly connected in the inner portion of the sleeve, and an extrusion block is fixedly connected to one end of the heat conduction rod.

[0012] As a preferred technical solution of the present application, the adjusting mechanism includes an A rotating piece, one end of the A rotating piece is fixedly connected to the bottom of the connecting plate, an A fixed plate is fixedly connected to the bottom of the A rotating piece, and an electric push rod is fixedly connected to the bottom of the A fixed plate.

[0013] As a preferred technical solution of the present application, the bottom of the electric push rod is fixedly connected with a B fixed plate, and B rotating pieces are fixedly connected to the two ends of the bottom of the B fixed plate.

[0014] As a preferred technical solution of the present application, the bottom of the B rotating piece is fixedly connected with a bottom plate, and an anti-skid block is fixedly connected to the bottom of the bottom plate.

[0015] As a preferred technical solution of the present application, the inner side wall of the A fixed plate is fixedly connected with a supporting plate, and a level is fixedly connected to the upper surface of the supporting plate.

[0016] (III) Beneficial effects

[0017] 1、By setting the adjusting mechanism, when processing semiconductor products, the adjusting mechanism can adjust the degree of extrusion according to the needs, and appropriate pressure can ensure that the packaging material fully fills every corner of the mold, avoiding the formation of bubbles, voids or unfilled areas, which helps to improve the reliability and durability of the semiconductor, and the correct pressure setting helps to reduce defects such as cracks, peeling and other structural problems during the packaging process, thereby improving the overall quality of the final product;

[0018] 2、By setting the adjusting mechanism, when placing the material in the semiconductor plastic packaging mold body, to ensure that the material can flow completely in every corner of the semiconductor plastic packaging mold body, start the adjusting mechanism, tilt the semiconductor plastic packaging mold body left and right, and flow the material in the mold, which is convenient for filling more completely when pouring the material, and ensures the integrity of the semiconductor mold. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure diagram of an adjustable semiconductor plastic packaging mold;

[0020] Figure 2 It is a structure diagram of a semiconductor plastic packaging mold body in an adjustable semiconductor plastic packaging mold;

[0021] Figure 3 It is a structure diagram of a cover plate in an adjustable semiconductor plastic packaging mold;

[0022] Figure 4 It is a structure diagram of an electric push rod in an adjustable semiconductor plastic packaging mold;

[0023] Figure 5 It is a structure diagram of a threaded rod in an adjustable semiconductor plastic packaging mold;

[0024] Figure 6 It is a structure diagram of a level in an adjustable semiconductor plastic packaging mold.

[0025] In the drawings:

[0026] 1, semiconductor plastic packaging mold body; 2, connecting plate; 3, threaded rod; 4, A gasket; 5, vertical rod; 6, spring; 7, B gasket; 8, nut; 9, cover plate; 10, shell; 11, heating plate; 12, sleeve; 13, heat conducting rod; 14, extrusion block; 15, A rotating part; 16, A fixed plate; 17, electric push rod; 18, B fixed plate; 19, B rotating part; 20, bottom plate; 21, support plate; 22, level. DETAILED DESCRIPTION

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] This invention provides an adjustable semiconductor molding die, such as... Figures 1-6 As shown, the adjustable semiconductor molding die includes a semiconductor molding die body 1. Grooves are provided around the upper surface of the semiconductor molding die body 1. An adjustment mechanism is inserted into the inside of the grooves. An extrusion mechanism is sleeved on the outer surface of the adjustment mechanism. A connecting plate 2 is fixedly connected to the bottom of the semiconductor molding die body 1. An adjustment mechanism is fixedly connected to the bottom of the connecting plate 2.

[0029] The adjustment mechanism includes a threaded rod 3, the outer surface of which is inserted into the interior of a groove. A gasket A 4 is fixedly connected to the bottom of the outer surface of the threaded rod 3. A vertical rod 5 is fixedly connected to the bottom of the gasket A 4. A spring 6 is fitted onto the outer surface of the vertical rod 5. A gasket B 7 is fixedly connected to one end of the spring 6. A nut 8 is threadedly connected to the outer surface of the threaded rod 3. When processing semiconductor products, the adjustment mechanism can be used to adjust the extrusion force according to the requirements. Appropriate pressure can ensure that the packaging material fully fills every corner of the mold, avoiding the formation of bubbles, voids, or unfilled areas. This helps to improve the reliability and durability of semiconductors. Correct pressure settings help to reduce defects generated during the packaging process, such as cracks, peeling, and other structural problems, thereby improving the overall quality of the final product.

[0030] The extrusion mechanism includes a cover plate 9, which has holes and slots around its perimeter. The outer surface of the threaded rod 3 is fitted inside the holes and slots. A housing 10 is fixedly connected to the bottom of the cover plate 9. A heating plate 11 is fixedly installed inside the housing 10. A sleeve 12 is fixedly connected to the bottom of the housing 10. A heat-conducting rod 13 is fixedly connected inside the sleeve 12. An extrusion block 14 is fixedly connected to one end of the heat-conducting rod 13. During extrusion, the heating plate 11 is activated, and the heat from the heating plate 11 is transferred to the sleeve 12. The temperature of the extrusion block 14 is raised through the heat-conducting rod 13 inside the sleeve 12. This allows the mold to be heated during extrusion, making it easier to adjust and level, resulting in better quality semiconductor products.

[0031] The adjusting mechanism comprises an A rotating piece 15, one end of the A rotating piece 15 being fixedly connected to the bottom of the connecting plate 2, the bottom of the A rotating piece 15 being fixedly connected with an A fixed plate 16, the bottom of the A fixed plate 16 being fixedly connected with an electric push rod 17. When the material is placed in the semiconductor plastic packaging mold body 1, in order to ensure that the material can completely flow in every corner of the semiconductor plastic packaging mold body 1, the adjusting mechanism is started, the semiconductor plastic packaging mold body 1 is tilted left and right, the material flows in the mold, which is convenient for filling more completely when pouring the material, and ensures the integrity of the semiconductor mold.

[0032] The bottom of the electric push rod 17 is fixedly connected with a B fixed plate 18, and both ends of the bottom of the B fixed plate 18 are fixedly connected with B rotating pieces 19.

[0033] The bottom of the B rotating piece 19 is fixedly connected with a bottom plate 20, and the bottom of the bottom plate 20 is fixedly connected with an anti-skid block. The bottom plate 20 and the anti-skid block both have a supporting effect, which can increase the anti-skid effect when supporting and avoid slipping.

[0034] The inner side wall of the A fixed plate 16 is fixedly connected with a supporting plate 21, and the upper surface of the supporting plate 21 is fixedly connected with a level 22. The level 22 has a reference effect, and the electric push rod 17 returns to a stable state. By observing the level 22, the semiconductor plastic packaging mold body 1 can be adjusted to a horizontal state.

[0035] Specifically, after the material is poured into the semiconductor plastic packaging mold body 1, the electric push rod 17 is started. When the electric push rod 17 rises and falls, through the inclination of the A rotating piece 15 and the B rotating piece 19, the A fixed plate 16 and the B fixed plate 18 can be tilted left and right. When the A fixed plate 16 and the B fixed plate 18 are tilted, the semiconductor plastic packaging mold body 1 can be tilted, which is convenient for the material in the semiconductor plastic packaging mold body 1 to flow uniformly, ensures that the material flows in every corner, and ensures the integrity of the mold. Then, after the mold flows completely, the electric push rod 17 returns to a stable state. By observing the level 22, the semiconductor plastic packaging mold body 1 can be adjusted to a horizontal state. Then, the cover plate 9 is sleeved on the threaded rod 3, the outer shell 10 and the extrusion block 14 are pressed downward, the force of the extrusion block 14 is adjusted according to the need, the nut 8 is screwed, the cover plate 9 is pressed downward, the cover plate 9 is extruded on the A gasket 4, the A gasket 4 is extruded on the spring 6 and the B gasket 7, and the stand 5 is used for supporting, so that the model in the semiconductor plastic packaging mold body 1 is extruded. When extruding, the heating plate 11 is started, the heat of the heating plate 11 is transmitted to the sleeve 12, the temperature of the extrusion block 14 is raised through the heat-conducting rod 13 in the sleeve 12, the mold can be heated when extruding, which is convenient for adjusting the flatness, and the quality of the semiconductor product is better.

[0036] The above merely describes a preferred embodiment of the present application, and the protection scope of the present application is not limited thereto, and any skilled person in the art, according to the technical scheme and the inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An adjustable semiconductor molding die, comprising a semiconductor molding die body (1), characterized in that: The semiconductor molding die body (1) has grooves on all four sides of its upper surface. An adjustment mechanism is inserted into the inside of the grooves. An extrusion mechanism is sleeved on the outer surface of the adjustment mechanism. A connecting plate (2) is fixedly connected to the bottom of the semiconductor molding die body (1). An adjustment mechanism is fixedly connected to the bottom of the connecting plate (2). The adjusting mechanism includes a threaded rod (3), the outer surface of which is inserted into the inside of a groove. A gasket A (4) is fixedly connected to the bottom of the outer surface of the threaded rod (3). A vertical rod (5) is fixedly connected to the bottom of the gasket A (4). A spring (6) is sleeved on the outer surface of the vertical rod (5). A gasket B (7) is fixedly connected to one end of the spring (6). A nut (8) is threadedly connected to the outer surface of the threaded rod (3).

2. The adjustable semiconductor molding die according to claim 1, characterized in that: The extrusion mechanism includes a cover plate (9), which has holes and slots around its perimeter. The inner surface of the holes and slots is fitted onto the outer surface of the threaded rod (3). A housing (10) is fixedly connected to the bottom of the cover plate (9). A heating plate (11) is fixedly installed inside the housing (10). A sleeve (12) is fixedly connected to the bottom of the housing (10). A heat-conducting rod (13) is fixedly connected inside the sleeve (12). An extrusion block (14) is fixedly connected to one end of the heat-conducting rod (13).

3. The adjustable semiconductor molding die according to claim 1, characterized in that: The adjustment mechanism includes a rotating component A (15), one end of which is fixedly connected to the bottom of the connecting plate (2), and a fixed plate A (16) is fixedly connected to the bottom of the rotating component A (15), and an electric push rod (17) is fixedly connected to the bottom of the fixed plate A (16).

4. An adjustable semiconductor molding die according to claim 3, characterized in that: The bottom of the electric push rod (17) is fixedly connected to a B fixing plate (18), and both ends of the bottom of the B fixing plate (18) are fixedly connected to B rotating parts (19).

5. An adjustable semiconductor molding die according to claim 4, characterized in that: The bottom of the B rotating component (19) is fixedly connected to a base plate (20), and the bottom of the base plate (20) is fixedly connected to an anti-slip block.

6. An adjustable semiconductor molding die according to claim 3, characterized in that: A support plate (21) is fixedly connected to the inner wall of the fixed plate A (16), and a level (22) is fixedly connected to the upper surface of the support plate (21).

Images