Pressing and positioning high-frequency mold for hanging nails
By using a high-frequency mold for positioning with a hanging pin, the problems of inaccurate positioning and uneven heating in traditional welding methods have been solved, enabling precise positioning and efficient welding of shoe upper materials, improving welding quality and efficiency, and reducing production costs.
Patent Information
- Application Number
- CN202520492331.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-19
AI Technical Summary
Traditional welding methods suffer from problems such as inaccurate positioning, uneven heating, and low processing efficiency in shoe upper material processing, making it difficult to meet the needs of modern footwear production.
The high-frequency mold for positioning using hanging pins includes a base, a pressure system, and an upper mold. The base is equipped with matching punches and hanging pins, which can be detached and installed to ensure precise material positioning. The upper mold has clearance holes to prevent damage to the hanging pins and achieves uniform heating through high-frequency treatment.
It improves welding quality and processing efficiency, reduces production costs, ensures the accuracy and stability of material positioning during the welding process, prevents deformation, and shortens welding time.
Smart Images

Figure CN223890491U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of shoe manufacturing technology, and in particular to a high-frequency mold for nail pressing and positioning. Background Technology
[0002] In the field of shoe upper material processing, traditional welding methods often suffer from problems such as inaccurate positioning, uneven heating, and low processing efficiency. These problems not only affect the welding quality of shoe upper materials but also increase production costs and processing cycles. With the advancement of technology and the continuous improvement of consumers' demands for product quality, traditional welding methods are no longer sufficient to meet the needs of modern footwear production.
[0003] To overcome the shortcomings of traditional welding methods, people have begun to explore more efficient and precise welding technologies. High-frequency (high-frequency) welding technology has gradually attracted attention due to its advantages such as fast heating speed, high welding strength, and ability to maintain the original properties of materials.
[0004] However, when applying high-frequency wave welding technology to the processing of shoe upper materials, ensuring the precise positioning of the materials and preventing welding deformation have become urgent technical challenges.
[0005] Therefore, a technical solution to the above problems is needed. Utility Model Content
[0006] In order to solve the technical problems existing in the prior art, the purpose of this utility model is to provide a high-frequency mold for pin positioning to solve the above-mentioned technical problems.
[0007] To achieve its purpose, the present invention adopts the following technical solution:
[0008] A high-frequency mold for pin positioning includes:
[0009] A base for mounting shoe upper material, the base mold including a punch with a shape matching the shoe upper material and multiple hooks for positioning the shoe upper material;
[0010] Pressure system, mounted on the base; and
[0011] The upper mold, whose shape is adapted to the bottom mold, is used to press and perform high-frequency treatment on the shoe upper material of the bottom mold by closing the mold with the bottom mold. The upper mold is provided with clearance holes whose positions correspond to the positions of the hanging pins.
[0012] Preferably, the hook is detachably mounted on the bottom mold.
[0013] Preferably, the bottom mold is provided with a positioning groove for installing the hanging nail.
[0014] Preferably, the positioning groove is on the bottom mold and located around the periphery of the punch; or, the positioning groove is disposed on the punch.
[0015] Preferably, the end of the hook furthest from the bottom mold has a rounded head.
[0016] Preferably, it also includes a heat insulation sheet that can extend between the bottom mold and the upper mold.
[0017] Preferably, the heat insulation sheet is made of high-temperature resistant insulating paper.
[0018] Preferably, the upper mold is a lower pressing plate.
[0019] This invention employs a unique hook positioning system, which ensures precise positioning of the shoe upper material during the welding process. The hook structure not only improves the accuracy and stability of positioning but also effectively prevents deformation and displacement of the material during heating, thereby greatly improving welding quality. Furthermore, the hooks are set on the bottom mold, changing the traditional method of visual positioning in the production process. Employees can quickly position the material during production, making the operation simple and improving work efficiency.
[0020] The upper mold of this invention is provided with a clearance hole to prevent damage to the hanging nails. The upper mold adopts a pressing plate to ensure the uniform transmission of high-frequency energy, so that the shoe upper material can be heated quickly and evenly during the welding process. This not only shortens the welding time, but also improves the processing efficiency and reduces the production cost. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a perspective view of the bottom mold of the high-frequency mold for pin positioning in this utility model;
[0023] Figure 2 This is a perspective view of the upper mold of the high-frequency mold for pin positioning in this utility model;
[0024] Figure 3 This is a perspective view of the high-frequency mold for positioning the hanging nail in this utility model being installed on a high-frequency device.
[0025] In the diagram: 100, base; 110, support frame; 120, worktable; 121, bottom mold; 1211, hanging nail; 1212, positioning groove; 1213, punch; 200, machine head; 210, upper mold; 211, clearance hole; 300, pressure system; 310, support column; 320, drive device; 400, control system. Detailed Implementation
[0026] The present invention will now be described in further detail with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0027] It should be noted that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0029] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0030] In the above description, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0031] like Figure 1 The diagram shown is a schematic representation of the overall structure of the automatic rotary bonding strip machine of this utility model.
[0032] like Figures 1 to 3 As shown, a high-frequency mold for pin positioning is used for welding and fusion of shoe upper materials. It includes a bottom mold 121 for mounting the shoe upper material and an upper mold 210 whose shape is adapted to the bottom mold 121. The upper mold 210 is used to close with the bottom mold 121 to press and perform high-frequency treatment on the shoe upper material on the bottom mold 121.
[0033] Among them, reference Figure 1 The bottom mold 121 includes hooks 1211 for positioning the upper material, which can be quickly positioned on the bottom mold 121 by means of the hooks 1211.
[0034] Specifically, the hook 1211 is a strip-shaped structure, meticulously forged from high-strength alloy material. Its head features an innovative rounded design. When the hook 1211 is installed on the bottom mold 121, the rounded head is located at the end furthest from the bottom mold 121. This rounded head ensures that the upper material is fixed to the hook 1211 without being scratched. Simultaneously, the bottom mold 121 is carefully designed with positioning grooves 1212 corresponding to the number of hooks 1211. The hooks 1211 perfectly match the positioning grooves 1212 on the bottom mold 121, accurately inserting into them. This allows the hooks 1211 to be detachably installed on the bottom mold 121, further enhancing ease of use.
[0035] Preferably, the number of hooks 1211 is at least three. The upper material can be quickly positioned on the bottom mold 121 by the hooks 1211, and the upper material is fixed by the hooks 1211. During heat setting, the upper material can be prevented from shrinking and ensured that the upper material does not deform. Specifically, in this embodiment, there are five hooks 1211.
[0036] Preferably, the bottom mold 121 also includes a punch 1213 whose shape matches the shape of the shoe upper material, and a positioning groove 1212 is provided on the punch 1213 so that when multiple hooks 1211 are installed in the positioning groove 1212, the multiple hooks 1211 are evenly distributed on the punch 1213.
[0037] Preferably, various shoe upper patterns can be set on the punch 1213.
[0038] It is understood that in some other embodiments, the pin 1211 may not be provided on the punch 1213, but on the bottom mold 121, with the pin 1211 arranged around the periphery of the punch 1213.
[0039] refer to Figure 2 The upper mold 210 is a pressing plate. When the machine head 200 is driven, the upper mold 210 presses down on the bottom mold 121, applying pressure / high-frequency current to the shoe upper material, so that the shoe upper material is quickly heated and shaped.
[0040] Preferably, the upper mold 210 is provided with clearance holes 211, the number of clearance holes 211 is the same as the number of hanging nails 1211, and the position of the clearance holes 211 corresponds to the position of the hanging nails 1211. When the upper mold 210 is pressed down, the hanging nails 1211 can be inserted into the clearance holes 211, so as to prevent the upper mold 210 from damaging the hanging nails 1211.
[0041] It also includes a heat insulation sheet (not shown). After the bottom mold 121 is installed on the upper material, the heat insulation sheet can cover the upper material to prevent the upper mold 210 from pressing marks on the upper material and to avoid excessive temperature during high-frequency operation, which could damage the upper material.
[0042] Preferably, the heat insulation sheet is made of high-temperature resistant insulating paper, which is not easy to leave marks on the shoe upper material, nor is it easy to melt or stick to the shoe upper material when heated.
[0043] Preferably, the heat insulation sheet is rotatably disposed on the side of the bottom mold 121, and can be flipped to cover the top surface of the bottom mold 121.
[0044] It is understandable that in some other embodiments, the heat insulation sheet may not be installed on the bottom mold 121, but may be directly placed on the upper material of the bottom mold 121 after the upper material is installed.
[0045] like Figure 3 As shown, it is a structural diagram of a high-frequency mold for mounting on a high-frequency equipment. The high-frequency equipment generally includes a base 100, a machine head 200 and a pressure system 300. The pressure system 300 is mounted on the base 100 and the machine head 200 is mounted on the drive end of the pressure system 300.
[0046] Among them, the bottom mold 210 of the high-frequency mold for pin positioning is installed on the base 100, and the upper mold 210 is installed on the machine head 200. The pressure system 300 can drive the machine head 200 to move on the base 100, so that the bottom mold 121 and the upper mold 210 are closed, and the shoe upper material is pressed, so that the shoe upper material can be welded and fused.
[0047] Specifically, the base 100 includes a support frame 110 and a worktable 120 on top of the support frame 110 for performing operations. The machine head 200 and the pressure system 300 are also located on top of the support frame 110 and supported by the worktable 120. The machine head 200 can be driven by the pressure system 300 to move on the worktable 120 and apply pressure to the shoe upper material.
[0048] When the bottom mold 121 is installed on the worktable 120 and the upper mold 210 is installed on the machine head 200, the position of the upper mold 210 corresponds to the position of the bottom mold 121. The bottom mold 121 is used to place the shoe upper material. When the machine head 200 is driven by the pressure system 300, the upper mold 210 presses on the bottom mold 121, applying pressure to the shoe upper material / high-frequency oscillating current to quickly heat and shape the shoe upper material, so that the shoe upper material is welded and fused.
[0049] The machine head 200 is equipped with a pressure sensor (not shown) and a high-frequency current generator (not shown). When the upper mold 210 is installed on the machine head 200, the high-frequency current generator is integrated on the upper side of the upper mold 210. When the machine head 200 slowly descends under the drive of the pressure execution module, the upper mold 210 makes gentle contact with the shoe upper material, and the downward pressure is monitored in real time by the high-precision pressure sensor. At the same time, the high-frequency current generator on the upper side of the upper mold 210 is quickly activated. The high-frequency current generator transmits a stable high-frequency oscillating current through the upper mold 210 to the shoe upper material. Under the dual action of pressure and high-frequency current, the shoe upper material on the bottom mold 121 is rapidly heated and precisely shaped, thus successfully completing the welding and fusion process.
[0050] The pressure system 300 generally includes a support column 310 mounted on the base 100 and a drive device 320 mounted on the support column 310. The machine head 200 is connected to the drive device 320 and can move on the base 100 by being driven by the drive device 320.
[0051] Preferably, the drive device 320 is a drive cylinder or a drive motor.
[0052] The high-frequency equipment also includes a control system 400, which includes a controller, a touch screen, and physical knobs. The machine head 200, the drive unit 320, the touch screen, and the physical knobs are all electrically connected to the controller. The operator operates the controller through the touch screen and the physical knobs to control the machine head 200 and the drive unit 320, so that the machine head 200 can apply pressure / high-frequency oscillating current to the shoe upper material on the bottom mold 121, making control more convenient and highly automated.
[0053] Preferably, the controller can be a PLC controller or a microcontroller.
[0054] Taking the manufacturing of a typical shoe upper material with a bottom layer of fabric, a middle layer of PU structure, and a top layer of TPU (thermoplastic polyurethane) coating as an example, the steps for manufacturing the shoe upper material using the high-frequency mold for pin positioning according to this utility model are as follows:
[0055] Printing and punching: Using the bottom mold 121 of this application as the bottom mold 121 for printing and punching, first, the upper mold 210 and the die head 200 are replaced with a die head for printing and punching (e.g., a laser printing and punching die head), and the hanging pins 1211 are removed from the bottom mold 121. Then, the bottom fabric, the middle PU structure and the top TPU (thermoplastic polyurethane) film are placed on the bottom mold 121 in sequence, and the die head for printing and punching is driven to work. The desired pattern is printed on the top TPU film (laser printing), and holes are punched at the corresponding positions of the bottom fabric, the middle PU structure and the top TPU (thermoplastic polyurethane) film (laser punching).
[0056] High-frequency welding: The printing and punching head is removed from the equipment, the upper mold 210 is reinstalled, and the hanging pins 1211 are installed on the bottom mold 121. The printed and punched bottom fabric, middle PU structure, and top TPU (thermoplastic polyurethane) coating are all hung on the hanging pins 1211 of the bottom mold 121 through the opened holes and positioned sequentially on the bottom mold 121. Then, the operator can operate the pressure system 300 of the high-frequency welding equipment to drive the printing head 200 to apply pressure / high-frequency oscillating current to the shoe upper material on the bottom mold 121, so that the bottom fabric, middle PU structure, and top TPU (thermoplastic polyurethane) coating are welded and fused together, completing the manufacturing of the shoe upper material.
[0057] In this production step, printing and punching are performed using the bottom mold 121. Positioning holes can be printed simultaneously when printing patterns. Then, in the high-frequency pressing step, the hanging nails 1211 and positioning holes are used for positioning. The printing and positioning of the shoe upper material use the same bottom surface, and the shoe upper material uses the same standard to achieve stable product quality.
[0058] It is understood that in some other embodiments, the upper material may also be an upper with other structures.
[0059] This utility model features a high-frequency mold for positioning with multiple hooks 1211 working together with avoidance holes to quickly and accurately position the shoe upper material. The multi-point fixation of the hooks 1211 effectively suppresses material shrinkage due to heat, improving the product size qualification rate. In addition, a heat insulation sheet is set to reduce the occurrence of indentations and prevent the material from sticking to the mold.
[0060] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.
Claims
1. A high-frequency mold for positioning and pressing pins, characterized in that, include: A bottom mold for installing shoe upper material, the bottom mold including a punch with a shape matching the shape of the shoe upper material and multiple hooks for positioning the shoe upper material; The upper mold, whose shape is adapted to the bottom mold, is used to press and perform high-frequency treatment on the shoe upper material of the bottom mold by closing the mold with the bottom mold. The upper mold is provided with clearance holes whose positions correspond to the positions of the hanging pins.
2. The high-frequency mold for pin positioning according to claim 1, characterized in that, The hanging nails can be detachably installed on the bottom mold.
3. The high-frequency mold for pin positioning according to claim 2, characterized in that, The bottom mold is provided with a positioning groove for installing the hanging nail.
4. The high-frequency mold for pin positioning according to claim 3, characterized in that, The positioning groove is on the bottom mold and located around the periphery of the punch; or, the positioning groove is disposed on the punch.
5. A high-frequency mold for pin positioning according to any one of claims 1-4, characterized in that, The end of the hanging nail furthest from the bottom mold has a rounded head structure.
6. A high-frequency mold for pin positioning according to any one of claims 1-4, characterized in that, It also includes a heat insulation sheet that can extend between the bottom mold and the upper mold.
7. A high-frequency mold for positioning a hanging nail according to claim 6, characterized in that, The heat insulation sheet is made of high-temperature resistant insulating paper.
8. A high-frequency mold for pin positioning according to any one of claims 1-4, characterized in that, The upper mold is a pressing plate.