Cleaning device and production line

By using the lifting and transmission components of the cleaning device in tandem, plasma bombardment is used to remove dirt from the glass substrate, solving the problem of weak adhesion between the glass substrate and the metal coating, achieving efficient coating operations and increasing production capacity.

CN223892837UActive Publication Date: 2026-02-10S C NEW ENERGY TECH CORP
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Patent Information

Application Number
CN202520184456.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-06
Publication Date
2026-02-10
Estimated Expiration
2035-02-06

AI Technical Summary

Technical Problem

In vacuum coating processes, the adhesion between the glass substrate and the metal coating is weak, resulting in low coating efficiency and difficulty in increasing production capacity.

Method used

A cleaning device is used to clean the glass substrate. Plasma bombardment is used to remove dirt. The lifting and transmission components of the cleaning device work together to achieve efficient cleaning and coating of the glass substrate and improve adhesion.

Benefits of technology

It improves the adhesion between the glass substrate and the metal layer, enhances the efficiency of the coating process, and thus increases production capacity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a cleaning device and a production line, the cleaning device comprises a cleaning main body, a gas distribution part, a bearing structure, a lifting assembly and a transmission assembly, and the cleaning main body comprises a cleaning cavity; at least part of the gas distribution piece is located in the cleaning cavity and used for introducing process gas into the cleaning cavity; the bearing structure is located in the cleaning cavity and comprises a first conductive part and a first insulating part, the first conductive part is connected to the upper side of the first insulating part, and the first conductive part is used for supporting a carrier and can be electrically connected with a power source; the transmission assembly is connected with the cleaning body, located in the cleaning cavity and used for supporting and conveying a carrier; the lifting assembly is connected with the cleaning body and connected to the lower side of the first insulating part, and the lifting assembly is used for driving the bearing structure to move up and down. According to the cleaning device and the production line, the glass base material can be cleaned, so that the glass base material is easily combined with the metal layer, and the efficiency of coating operation is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vacuum coating, in particular to a cleaning device and a production line. BACKGROUND

[0002] In the vacuum coating process, a metal coating is usually plated on the surface of a glass substrate to optimize its performance. The problem is that the bonding force between the glass substrate and the metal coating is weak, and the metal coating is difficult to deposit stably on the surface of the glass substrate. Therefore, a long time is usually required for plating operation to ensure that the metal coating is stably attached to the glass substrate, which leads to low efficiency of the plating operation and is not conducive to improving productivity. CONTENT OF THE INVENTION

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a cleaning device that can improve the efficiency of the plating operation and is beneficial to improving productivity.

[0004] The present application also provides a production line having the above cleaning device.

[0005] The cleaning device according to the embodiments of the present application comprises a cleaning main body, a gas distribution member, a bearing structure, a lifting assembly and a transmission assembly;

[0006] The cleaning main body comprises a cleaning cavity;

[0007] The gas distribution member is at least partially located in the cleaning cavity and is used to introduce process gas into the cleaning cavity;

[0008] The bearing structure is located in the cleaning cavity, and the bearing structure comprises a first conductive member and a first insulating member. The first conductive member is connected to the upper side of the first insulating member, and the first conductive member is used to support the carrier and can be electrically connected to the power supply;

[0009] The transmission assembly is connected to the cleaning main body, and the transmission assembly is located in the cleaning cavity. The transmission assembly is used to support and transport the carrier;

[0010] The lifting assembly is connected to the lower side of the first insulating member, and the lifting assembly is used to drive the bearing structure to move up and down;

[0011] The lifting assembly has a jacking state and a sinking state. In the jacking state, the first conductive member is configured to support the carrier and is separated from the transmission assembly to trigger the power supply;

[0012] In the sinking state, the first conductive member is configured to be arranged at intervals with the carrier to turn off the power supply.

[0013] According to the cleaning device provided by the embodiment of the present application, the first insulating member is used to block the conduction between the first conductive member and the lifting assembly, and the lifting assembly can support the carrier to rise, so that the transmission assembly is separated from the carrier during the cleaning operation. Through the cooperation of the first insulating member and the lifting assembly, the first conductive member can be prevented from conducting the cleaning main body during the cleaning operation. Therefore, during the cleaning operation, the process gas can be delivered into the cleaning cavity through the airflow channel, and the first conductive member is used to conduct the power supply. Thus, during the cleaning operation, the cleaning main body serves as an anode, the first conductive member can be connected to the carrier, the carrier serves as a cathode, and under the action of the anode and the cathode, the process gas in the cleaning cavity can generate glow discharge to form plasma. In turn, the charged plasma bombards the glass substrate carried by the carrier to remove the dirt on the surface of the glass substrate, thereby achieving the cleaning of the glass substrate. In addition, the transmission assembly can also deliver the carrier to the upper side of the first conductive member or move the carrier away from the upper side of the first conductive member, which is beneficial to improving the cleaning efficiency. Furthermore, through the cleaning of the glass substrate, the glass substrate and the metal layer are more easily combined, which is beneficial to improving the efficiency of the film coating operation.

[0014] According to some embodiments of the present application, the lifting assembly comprises a driving member and a supporting member. The driving member is connected to the cleaning main body, and the supporting member is connected to the output end of the driving member and connected to the lower side of the first insulating member.

[0015] According to some embodiments of the present application, the lifting assembly further comprises a guide member. The guide member extends upward and downward. The guide member is movably connected to the supporting member.

[0016] According to some embodiments of the present application, the lifting assembly comprises a second insulating member. The second insulating member is located below the first insulating member, and the upward projection of the second insulating member covers the projection of the carrying structure.

[0017] According to some embodiments of the present application, the cleaning device further comprises a suction pump. The suction pump is in communication with the cleaning cavity, and the suction pump is used to suck the gas in the cleaning cavity.

[0018] According to some embodiments of the present application, the cleaning device further comprises a uniform gas member. The uniform gas member is located in the cleaning cavity. The peripheral side of the uniform gas member is arranged in a spaced manner with the cavity wall of the cleaning cavity. The uniform gas member is located above the first conductive member, and in the jacking state, the uniform gas member is configured to have a spacing with the carrier.

[0019] According to some embodiments of the present application, the transmission assembly is arranged on both sides of the first conductive member. The transmission assembly comprises a fixed member and a rotating member. The rotating member is rotatably connected to the fixed member, and the fixed member is connected to the cleaning main body.

[0020] According to some embodiments of the present application, the two side walls of the cleaning main body arranged in a spaced manner are connected to the gas distribution members.

[0021] According to some embodiments of the present application, the cleaning device further comprises a second conductive member electrically connected with the first conductive member, and the cleaning body further comprises a power supply port in communication with the cleaning cavity, and the second conductive member is configured to be electrically connected with the power supply through the power supply port.

[0022] According to the production line of the embodiments of the present application, the production line comprises the coating device and the cleaning device of any of the above embodiments, and the coating device is arranged adjacent to the cleaning device.

[0023] According to the production line of the embodiments of the present application, at least the following beneficial effects are achieved: the cleaning device is used to clean the glass substrate, the coating device can receive the cleaned glass substrate and coat the surface of the cleaned glass substrate, and the cleaned glass substrate is easier to be combined with the metal layer. Therefore, the production line of the present application produces work by cleaning first and coating later, which is beneficial to improve the coating efficiency and thus improve the production capacity.

[0024] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0025] The present application will be further described below in conjunction with the drawings and embodiments, in which:

[0026] Figure 1 It is a partial schematic view of the cleaning device of the embodiments of the present application;

[0027] Figure 2 It is an assembly schematic view of the bearing structure and the lifting assembly of the embodiments of the present application;

[0028] Figure 3 It is a sectional view of the cleaning device in the sunken state of the embodiments of the present application;

[0029] Figure 4 It is a sectional view of the cleaning device in the jacking state of the embodiments of the present application;

[0030] Figure 5 It is another partial schematic view of the cleaning device of the embodiments of the present application.

[0031] The drawings show: the cleaning body 110, the cleaning cavity 120, the air distribution member 130;

[0032] The bearing structure 200, the first conductive member 210, the first insulating member 220;

[0033] The lifting assembly 300, the driving member 310, the support member 320, the guide member 330, the second insulating member 340;

[0034] The transmission assembly 400, the fixing member 410, the rotating member 420;

[0035] Suction pump 510, gas equalization component 520, carrier 530, power supply 540, second conductive component 550, power supply port 560. Detailed Implementation

[0036] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0037] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0039] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0040] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] The embodiments of this application are described below with reference to the accompanying drawings:

[0042] refer to Figures 1 to 3The cleaning apparatus of this application embodiment includes a cleaning body 110, an air distribution component 130, a support structure 200, a lifting assembly 300, and a transmission assembly 400. The cleaning body 110 includes a cleaning chamber 120, which provides a vacuum environment for the cleaning operation. During the cleaning operation, the cleaning body 110 serves as the anode of the cleaning apparatus. The air distribution component 130 is at least partially located within the cleaning chamber 120. The air distribution component 130 is used to connect to a gas source and to introduce process gas, such as argon, into the cleaning chamber 120. The support structure 200 is located within the cleaning chamber 120 and includes a first conductive component 210 and a first insulating component 220. The first conductive component 210 is connected to the upper side of the first insulating component 220 and supports a carrier 530, and is electrically connected to a power source 540. The carrier 530 is used to support the glass substrate. During the cleaning operation, the first conductive element 210 conducts power to the power supply 540 as the cathode of the cleaning device. Thus, the carrier 530 can be connected to the power supply 540 and together with the first conductive element 210, serve as the cathode of the cleaning device.

[0043] It should be noted that, Figure 3 The dashed line in the diagram represents the cable connecting the power supply 540 to the first conductive element 210.

[0044] The power supply 540 in this application can be a DC, AC, or radio frequency power supply.

[0045] During the cleaning operation, the electric field generated by the power supply 540 can ionize the process gas in the cleaning chamber 120 to generate plasma. Under the action of the electric field, the plasma moves towards the cathode to bombard the glass substrate carried by the carrier 530 for cleaning, thereby improving the bonding force between the glass substrate and the metal layer. As a result, the glass substrate is easier to deposit a metal layer on, which is beneficial to improving the efficiency of the coating operation.

[0046] Reference Figures 1 to 3 The transmission assembly 400 is connected to the cleaning body 110 and is located in the cleaning chamber 120. The transmission assembly 400 is used to support and transport the carrier 530. For example, the transmission assembly 400 drives the carrier 530 to move above the first conductive element 210, or the transmission assembly 400 is used to move the carrier 530 away from above the first conductive element 210. The transmission assembly 400 can be a robotic arm, cantilever, or other structure capable of transporting the carrier 530.

[0047] The lifting assembly 300 is connected to the cleaning body 110 and is located below the first insulating member 220. The first insulating member 220 is used to prevent the first conductive member 210 from being connected to the lifting assembly 300, thus preventing a short circuit between the anode and cathode of the cleaning device during cleaning operations and ensuring the normal operation of the cleaning process. The lifting assembly 300 is used to drive the support structure 200 to move up and down. For example, the lifting assembly 300 can be a linear drive structure such as a cylinder or a linear motor.

[0048] Reference Figures 2 to 4 The lifting assembly 300 has a lifting state and a lowering state. In the lifting state, the first conductive element 210 is configured to support the carrier 530 to separate from the transmission assembly 400 to trigger the power supply 540. In the lowering state, the first conductive element 210 is configured to be spaced apart from the carrier 530 to turn off the power supply 540.

[0049] It should be noted that, Figure 4 The dashed line in the diagram represents the cable connecting the power supply 540 to the first conductive element 210.

[0050] Specifically, when the transmission assembly 400 drives the carrier 530 to move above the first conductive element 210, the lifting assembly 300 drives the first conductive element 210 to move upward to receive the carrier 530, so that the carrier 530 is separated from the transmission assembly 400. Thus, the lifting assembly 300 switches from the sinking state to the lifting state. While ensuring that the first conductive element 210 and the carrier 530 are connected, it also prevents the carrier 530 from being connected to the cleaning body 110 through the transmission assembly 400. Thus, the anode and cathode of the cleaning device are insulated and blocked. After the carrier 530 is separated from the transmission assembly 400, the first conductive element 210 electrically connects to the power supply 540 to carry out the cleaning operation. After the cleaning operation is completed, the lifting assembly 300 drives the first conductive element 210 to descend, the transmission assembly 400 supports the carrier 530, the first conductive element 210 separates from the carrier 530, thus the lifting assembly 300 switches from the lifting state to the lowering state, and the transmission assembly 400 moves the carrier 530 away from above the first conductive element 210, completing the cleaning operation of the glass substrate.

[0051] In summary, the transmission component 400 in this application enables the loading and unloading of the carrier 530 during the cleaning operation, and the lifting component 300 drives the support structure 200 to rise and fall. During the cleaning operation, the support structure 200 supports the carrier 530, making the carrier 530 insulated from the cleaning body 110. After cleaning, the support structure 200 separates from the carrier 530, and the transmission component 400 unloads the cleaned glass substrate. Thus, the cleaning device of this application can clean the glass substrate, thereby improving the coating efficiency of the glass substrate and thus improving production capacity.

[0052] Reference Figures 1 to 3In some embodiments, the lifting assembly 300 includes a drive member 310 and a support member 320. The drive member 310 is connected to the cleaning body 110, and the support member 320 is connected to the output end of the drive member 310. For example, the drive member 310 is a cylinder, and the support member 320 is connected to the piston rod of the drive member 310. The support member 320 can move together with the piston rod of the drive member 310. The support member 320 is connected to the lower side of the first insulating member 220. The support member 320 and the first insulating member 220 form a double-layer support structure, which is beneficial to further improve the stability of the support structure 200 supporting the carrier 530 and ensure the cleaning effect of the glass substrate.

[0053] In addition, the first insulating member 220 is used to block the electrical conduction between the support member 320 and the first conductive member 210. During the cleaning operation, the first conductive member 210 is prevented from conducting through the support member 320 and the drive member 310 to the cleaning body 110, thus ensuring that the anode and cathode of the cleaning device are mutually insulated and isolated.

[0054] It should be noted that the first insulating component 220 can be made of insulating materials such as rubber, plastic or ceramic, and the support component 320 can be made of a more stable metal material. By additionally setting the support component 320 to support the first insulating component 220, the carrier 530 can be supported more stably. As a result, the glass substrate is more stable, which is beneficial to improving the cleaning effect of the glass substrate.

[0055] Reference Figures 1 to 3 In other embodiments, the cleaning device includes two spaced-apart double-layer support structures, each double-layer support structure having a plurality of first conductive elements 210 connected to its upper side. For example, each double-layer support structure has two first conductive elements 210 connected to its upper side. The two first conductive elements 210 are spaced apart, which on the one hand ensures stable support for the carrier 530, and on the other hand, the plurality of first conductive elements 210 makes the electric field strength at various points on the carrier 530 more similar, and the cleanliness of the glass substrate surface more uniform.

[0056] Reference Figures 2 to 4 In some embodiments, the lifting assembly 300 further includes a guide 330, which extends vertically and is movably connected to the support 320. The drive 310 drives the support 320 to lift. The guide 330 is used to guide the lifting of the support 320 and prevent the support 320 from tilting relative to the horizontal plane. As a result, the support structure 200 supports the carrier 530 to lift more smoothly, and the cleaning of the glass substrate is more uniform.

[0057] Reference Figures 1 to 3In other embodiments, the guide 330 is movably connected to the first insulator 220, the support 320 drives the first insulator 220 to rise and fall, the guide 330 is used to provide guidance for the rise and fall of the first insulator 220, and the load-bearing structure 200 can support the carrier 530 more stably.

[0058] Reference Figures 1 to 3 In some embodiments, the lifting assembly 300 includes a second insulating member 340 located below the first insulating member 220. The upward projection of the second insulating member 340 covers the projection of the supporting structure 200. The second insulating member 340 serves to insulate and prevent the formation of an electric field between the lower side of the carrier 530 and the bottom wall of the cleaning body 110, thereby preventing plasma bombardment of the lower side of the carrier 530 and affecting the cleaning efficiency. Thus, the plasma can more concentratedly bombard the glass substrate supported above the carrier 530, which is beneficial for improving reaction efficiency and reducing the consumption of process gases.

[0059] Reference Figures 1 to 3 In other embodiments, the guide 330 is connected to the second insulating member 340, the guide 330 extends upward beyond the upper surface of the second insulating member 340, the second insulating member 340 is used to fix the guide 330, the support 320 is movably connected to the guide 330, and the support 320 can slide up and down relative to the guide 330, effectively preventing the support 320 from tilting relative to the horizontal plane.

[0060] Reference Figures 3 to 5 In some embodiments, the cleaning device further includes a suction pump 510, which is connected to the cleaning chamber 120. The suction pump 510 is used to draw gas from the cleaning chamber 120 to maintain stable gas pressure in the cleaning chamber 120, so that the gas pressure in the cleaning chamber 120 is maintained within the range where the process gas can generate glow discharge, which is beneficial to ensuring the continuity of the cleaning operation.

[0061] Reference Figures 3 to 5 In other embodiments, the cover is connected to the upper side of the box, and the suction pump 510 is connected to the cover and communicates with the cleaning chamber 120. The suction pump 510 draws gas from the cleaning chamber 120 from above. The suction pump 510 can adaptively adjust the suction intensity according to the gas pressure in the cleaning chamber 120. The suction pump 510 can be a molecular pump.

[0062] Reference Figures 3 to 5In some embodiments, the cleaning apparatus further includes a gas equalizer 520 located within the cleaning chamber 120. The periphery of the gas equalizer 520 is spaced apart from the cavity wall of the cleaning chamber 120. The gas equalizer 520 is located above the first conductive element 210. In the lifting state, the gas equalizer 520 is configured to be spaced apart from the carrier 530. The gas equalizer 520 is used to ensure that the process gas is discharged from the outer periphery of the supporting structure 200 and to ensure the gas concentration between the first conductive element 210 and the gas equalizer 520, thereby improving the cleaning efficiency of the glass substrate.

[0063] Reference Figures 3 to 5 In other embodiments, the suction pump 510 draws gas from the cleaning chamber 120 above the cleaning body 110. The gas equalization component 520 is used to block the suction pump 510 from directly drawing gas distributed between the first conductive component 210 and the gas equalization component 520. For example, during the suction operation of the suction pump 510, the gas in the cleaning chamber 120 flows out of the cleaning chamber 120 through the gap between the periphery of the gas equalization component 520 and the cavity wall of the cleaning chamber 120, ensuring that the gas pressure in the cleaning chamber 120 is stable.

[0064] It should be noted that the gas distributed between the first conductive element 210 and the gas equalization element 520 is mainly used to bombard the glass substrate to clean the glass substrate and ensure the gas concentration between the first conductive element 210 and the gas equalization element 520, that is, to ensure the cleaning efficiency of the cleaning device.

[0065] Reference Figures 1 to 3 In some embodiments, transmission components 400 are arranged on both the left and right sides of the first conductive element 210, that is, the first conductive element 210 is located between the two transmission components 400. The transmission component 400 includes a fixed element 410 and a rotating element 420. The rotating element 420 is rotatably connected to the fixed element 410. The fixed element 410 is connected to the cleaning body 110. The fixed element 410 is used to provide an installation position for the rotating element 420. The rotating element 420 can be a roller. The rotating element 420 is used to support and transport the carrier 530 to move the carrier 530 above the first conductive element 210, or to move the carrier 530 away from the first conductive element 210. There can be multiple rotating elements 420. When the rotating element 420 drives the carrier 530 to move, its position relative to the fixed element 410 remains unchanged, which can realize the continuous transmission of the carrier 530 and is beneficial to improving the transmission efficiency.

[0066] Reference Figures 2 to 4In some embodiments, the two side walls of the cleaning body 110 are connected to gas distribution components 130 at intervals. These two side walls can be left and right side walls, front and back side walls, or top and bottom side walls. For example, the left and right side walls of the cleaning body 110 are connected to gas distribution components 130 for introducing process gas into the cleaning chamber 120 from the left and right sides of the cleaning body 110. This results in a more uniform concentration of process gas in the cleaning chamber 120, leading to more uniform cleaning of the glass substrate surface and facilitating faster coating on the glass substrate surface.

[0067] Reference Figures 2 to 4 In other embodiments, a plurality of air distribution components 130 are connected to the left side wall of the cleaning body 110, and a plurality of air distribution components 130 are connected to the right side wall of the cleaning body 110. By introducing process gas into the cleaning chamber 120 through the plurality of air distribution components 130, it is easier to maintain the concentration of process gas in various parts of the cleaning chamber 120, thereby improving the cleaning efficiency.

[0068] It should be noted that the number and position of the gas distribution components 130 in this application can be adjusted according to requirements to ensure that the process gas in the cleaning chamber 120 is more balanced.

[0069] Reference Figures 1 to 3 In some embodiments, the gas distribution element 130 includes at least two gas outlets, spaced apart. An airflow channel connects to the cleaning chamber 120 through each gas outlet. The multiple gas outlets allow for faster introduction of process gas into the cleaning chamber 120, ensuring stable concentration of the process gas within the chamber. Furthermore, the multiple outlets at different locations enable a more uniform distribution of the process gas within the cleaning chamber 120. This improves the efficiency of cleaning the glass substrate and ensures a more consistent surface cleanliness, making it easier to coat the glass substrate.

[0070] Reference Figure 1 and Figure 2 In other embodiments, the air distribution component 130 is located inside the cleaning chamber 120. The air distribution component 130 includes a first air distribution pipe and a second air distribution pipe. One end of the first air distribution pipe is connected to the side wall of the cleaning body 110. The cleaning body 110 is provided with a through hole. The lumen of the first air distribution pipe is connected to the through hole. The other end of the first air distribution pipe is connected to the second air distribution pipe. The two can be arranged non-perpendicularly or perpendicularly. The lumen of the first air distribution pipe and the second air distribution pipe together define an airflow channel. The second air distribution pipe is provided with two air outlets. The airflow channel is connected to the cleaning chamber 120 through the two air outlets. Thus, the air source can flow into the cleaning chamber 120 through the airflow channel. The process gas enters the cleaning chamber 120 from the air outlets at different positions, which facilitates more uniform diffusion of the process gas in the cleaning chamber 120.

[0071] Reference Figures 3 to 5 In some other embodiments, the cleaning body 110 includes a cover and a box, which are detachably connected. The cover and the box together enclose the cleaning cavity 120. The detachability of the cover and the box facilitates the assembly of the load-bearing structure 200, the lifting assembly 300, and the transmission assembly 400.

[0072] Reference Figures 2 to 4 In some embodiments, the lifting assembly 300 further includes a detection element for detecting the position of the first conductive element 210 to determine whether the lifting assembly 300 is in a lifting state or a lowering state, thereby triggering or turning off the power supply 540. The detection element can be a position sensor, such as a photoelectric sensor or an electromagnetic sensor.

[0073] Alternatively, the detection element can be used to detect the duration of the lifting or lowering state, triggering or shutting off the power supply at regular intervals. For example, when the lifting assembly 300 enters the lifting or lowering state, the detection element is triggered to start a timer. When the detection time reaches a preset duration, the detection element triggers or shuts off the power supply 540, thereby enabling continuous cleaning operations.

[0074] For example, when the lifting assembly 300 is in the raised state, the glass substrate is cleaned, and the detection component keeps track of the duration of the raised state. When the duration reaches the preset duration, the lifting assembly 300 switches to the lowered state, and the detection component turns off the power 540.

[0075] The detection components may include sensors and timers.

[0076] The following is the cleaning process of the cleaning device according to an embodiment of this application:

[0077] Reference Figures 1 to 5 The carrier 530 carrying the glass substrate is placed on the rotating member 420. The rotating member 420 rotates relative to the fixed member 410, driving the carrier 530 to move until the carrier 530 moves above the first conductive member 210 (at this time it is in a sunken state, there is a gap between the first conductive member 210 and the carrier 530, and the power supply 540 is not triggered).

[0078] The driving component 310 drives the support component 320 to rise, thereby the support component 320, the first insulating component 220 and the first conductive component 210 rise synchronously until the first conductive component 210 contacts the carrier 530 and supports the carrier 530 to a certain height (this process separates the carrier 530 from the rotating component 420, so that there is a gap between the carrier 530 and the rotating component 420, and at this time it is in the lifting state). The gap between the carrier 530 and the rotating component 420 blocks the conduction between the two, and the first insulating component 220 blocks the conduction between the first conductive component 210 and the support component 320. The power supply 540 supplies power to the first conductive component 210, and the carrier 530 and the first conductive component 210 are connected. The two together serve as the cathode of the cleaning device, and the cleaning body 110 serves as the anode of the cleaning device.

[0079] The process gas in the cleaning chamber 120 is ionized by the power supply 540, which then bombards the glass substrate carried by the carrier 530, thus cleaning the glass substrate. After the glass substrate is cleaned, the drive component 310 drives the support component 320 to descend. The support component 320, the first insulating component 220, and the first conductive component 210 descend synchronously, and the rotating component 420 re-supports the carrier 530 until the first conductive component 210 separates from the carrier 530 (at this time, the lifting assembly 300 switches to the lowered state). Then, the rotating component 420 rotates relative to the fixed component 410 to transport the carrier 530 to the next process, for example, a coating process. Coating after cleaning can improve coating efficiency.

[0080] It should be noted that after the glass substrate is cleaned, before the rotating part 420 resupports the carrier 530, the power supply 540 is disconnected from the first conductive part 210 to avoid short-circuiting the anode and cathode of the cleaning device. For example, the power supply 540 is immediately disconnected after the glass substrate is cleaned.

[0081] Reference Figures 1 to 4 In some embodiments, the cleaning device further includes a second conductive element 550, which is electrically connected to the first conductive element 210. The cleaning body 110 also includes a power supply port 560, which is connected to the cleaning chamber 120. The second conductive element 550 is configured to be electrically connected to a power source 540 through the power supply port 560. For example, the wire of the power source 540 passes through the power supply port 560 into the cleaning chamber 120, thereby electrically connecting the second conductive element 550 to supply power to the first conductive element 210. Alternatively, the second conductive element 550 passes through the power supply port 560 and is electrically connected to the power source 540, thereby supplying power to the first conductive element 210 and ensuring the normal operation of the cleaning work.

[0082] Reference Figures 1 to 4In other embodiments, the supporting structure 200 includes a plurality of first conductive elements 210, which are spaced apart and used to jointly support the carrier 530. The first conductive elements 210 are connected to each other through second conductive elements 550 to achieve electrical conduction. For example, the wire of the power supply 540 passes through the power supply port 560 into the cleaning chamber 120 and is electrically connected to the second conductive element 550. The second conductive element 550 can deform as the lifting assembly 300 rises and falls, so as to adapt to the lifting action of the lifting assembly 300 while ensuring conduction.

[0083] The second conductive element 550 can also be a wire. The second conductive element 550 passes through the power supply port 560 and is electrically connected to the power supply 540. When the lifting assembly 300 performs the lifting action, it can pull the second conductive element 550 to move, so as to ensure a stable power supply to the first conductive element 210. The power supply port 560 can be set on the lower side of the cleaning body 110, which helps to avoid the second conductive element 550 interfering with the lifting action of the lifting assembly 300.

[0084] Therefore, by setting multiple spaced first conductive elements 210 and electrically conducting them through second conductive elements 550, each first conductive element 210 has a more similar electric field strength. Consequently, the electric field strength at various points on the carrier 530 is more uniform, enabling more uniform cleaning of the glass substrate surface.

[0085] Reference Figures 1 to 5 The production line of this application embodiment includes a coating device and a cleaning device as described in any of the above embodiments. The coating device and the cleaning device are arranged adjacent to each other. For example, the coating device is arranged downstream of the cleaning device. The coating device is used to receive the carrier 530 loaded with the cleaned glass substrate and to perform coating operations on the cleaned glass substrate. The adhesion between the cleaned glass substrate and the metal layer is higher, and the metal layer is easier to coat onto the glass substrate. As a result, the coating operation is faster and it is beneficial to increase production capacity.

[0086] Alternatively, the coating apparatus is arranged upstream of the cleaning apparatus, which is used to receive the carrier 530 containing the glass substrate and to clean the coated workpiece.

[0087] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A cleaning device, characterized in that, include: The main cleaning unit includes the cleaning chamber; A gas distribution component, at least partially located within the cleaning chamber, is used to introduce process gas into the cleaning chamber; A support structure is located inside the cleaning chamber. The support structure includes a first conductive element and a first insulating element. The first conductive element is connected to the upper side of the first insulating element. The first conductive element is used to support the carrier and can be electrically connected to the power source. A transmission assembly is connected to the cleaning body and is located in the cleaning chamber. The transmission assembly is used to support and transport the carrier. A lifting assembly is connected to the cleaning body and is located on the lower side of the first insulating member. The lifting assembly is used to drive the supporting structure to move up and down. The lifting assembly has a lifting state and a lowering state. In the lifting state, the first conductive element is configured to support the separation of the carrier from the transmission assembly to trigger the power supply. In the submerged state, the first conductive element is configured to be spaced apart from the vehicle to shut off the power supply.

2. The cleaning device according to claim 1, characterized in that, The lifting assembly includes a driving component and a supporting component. The driving component is connected to the cleaning body, and the supporting component is connected to the output end of the driving component and to the lower side of the first insulating component.

3. The cleaning device according to claim 2, characterized in that, The lifting assembly also includes a guide member, which extends vertically and is movably connected to the support member.

4. The cleaning device according to claim 1, characterized in that, The lifting assembly includes a second insulating member located below the first insulating member, and the upward projection of the second insulating member covers the projection of the supporting structure.

5. The cleaning device according to claim 1, characterized in that, The cleaning device also includes a suction pump, which is connected to the cleaning chamber and is used to draw gas from the cleaning chamber.

6. The cleaning apparatus according to claim 1, characterized in that, The cleaning device further includes an air equalizer located inside the cleaning chamber. The periphery of the air equalizer is spaced apart from the cavity wall of the cleaning chamber. The air equalizer is located above the first conductive element. In the lifting state, the air equalizer is configured to be spaced apart from the carrier.

7. The cleaning device according to claim 1, characterized in that, The transmission assembly is arranged on both the left and right sides of the first conductive element. The transmission assembly includes a fixed part and a rotating part. The rotating part is rotatably connected to the fixed part, and the fixed part is connected to the cleaning body.

8. The cleaning apparatus according to claim 1, characterized in that, The air distribution element is connected to both side walls of the cleaning body, which are arranged at intervals.

9. The cleaning apparatus according to claim 1, characterized in that, The cleaning device further includes a second conductive element, which is electrically connected to the first conductive element. The cleaning body also includes a power supply port, which is connected to the cleaning chamber. The second conductive element is configured to be electrically connected to the power source through the power supply port.

10. A production line, characterized in that, include: Coating equipment; The cleaning apparatus according to any one of claims 1 to 9, wherein the coating apparatus is arranged adjacent to the cleaning apparatus.