Integrated LED car lamp module

Abstract

The utility model discloses an integrated LED (light-emitting diode) car lamp module, which comprises a ceramic-metal composite substrate comprising a ceramic layer and a metal layer which are combined with each other; the LED chip array is arranged on the surface of the ceramic layer; the driving circuit is embedded in the metal layer and is electrically connected with the LED chip through a vertical conductive channel; the micro heat pipe radiating assembly is coupled with the bottom surface of the substrate; and the whole module is coated with the multi-layer sealing structure. Due to the adoption of the technical scheme, the LED light source assembly and the driver are integrated into a whole, the size is reduced by 40% (compared with a traditional separated structure), the thermal resistance of a system is reduced to 1.2 DEG C / W, the grade of an overall waterproof and dustproof structure is improved, light attenuation can be delayed, and therefore the service life of the automobile lamp is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of automotive lighting technology, and in particular to an LED vehicle lamp module with an integrated structure. Background Technology

[0002] With the development of new energy vehicle technology and the improvement of cost-effectiveness, many new energy vehicles have gradually entered our lives. Current new energy LED vehicle lights generally adopt a separate architecture, meaning the LED light source and its driver are designed separately and connected only by wires. This design has the following technical drawbacks: it easily leads to an increase of approximately 30% in assembly time due to the need to separately fix the light source module and driver during installation; the failure rate at the wiring harness interface is prone to poor contact (>40%); and the volume occupied in the engine compartment is greater than 1:1.2 of the traditional structure. In addition, insufficient heat dissipation efficiency is also a major drawback. For example, the separate design of the light source module and driver interrupts the heat conduction path, and the independent heat dissipation of the drive circuit results in a total thermal resistance ≥4℃ / W, while the heat flux density relying solely on passive heat sink fins is <3W / cm². Furthermore, it suffers from poor protection reliability; independent sealing of multiple components poses a risk of leakage; the waterproof rating at connectors is substandard; and even the sealant is prone to cracking, leading to severe light decay and affecting the lifespan of the vehicle lights. Summary of the Invention

[0003] This application provides an integrated LED automotive lighting module, and the technical solution adopted to solve one of the above-mentioned technical problems is as follows:

[0004] Design an integrated LED automotive lighting module, comprising: a ceramic-metal composite substrate, which includes a ceramic layer and a metal layer bonded together; an LED chip array disposed on the surface of the ceramic layer; a driving circuit embedded in the metal layer, electrically connected to the LED chips through a vertical conductive channel; a micro heat pipe heat dissipation assembly coupled to the bottom surface of the substrate; and a multi-layer sealed structure covering the entire module.

[0005] By adopting the above technical solution, the LED light source component and driver are integrated into one unit, reducing its volume by 40% compared to the traditional separate structure. The system thermal resistance is reduced to 1.2℃ / W, and the overall waterproof and dustproof structure meets the standards, which can delay light decay and thus extend the service life of the vehicle lights.

[0006] To better achieve the purpose of this utility model, the present utility model also has the following preferred solutions:

[0007] In some implementations, to improve heat dissipation performance, the ceramic layer is made of aluminum nitride ceramic with a thickness of 1.2±0.1 mm and a surface roughness Ra≤0.8 μm.

[0008] In some implementations, to improve the overall dust and water protection level, the vertical conductive channel includes: a microhole formed by laser drilling with a diameter of Φ=100±10μm; and a copper pillar filled in the microhole with a height-to-diameter ratio ≥5:1.

[0009] In some implementations, to improve the overall protection level and prevent the sealant from cracking, the multi-layer sealing structure includes: a sealant deposited on the surface of the LED chip. Thin film with a thickness of 3-8μm; a silicone gel layer covering the entire substrate; a metal shell with a hardness of Shore 00-3; and a laser-welded weld depth ≥1.5mm.

[0010] In some embodiments, to improve communication and power transmission performance, a Cr / Cu seed layer is prepared on the surface of a ceramic-metal composite substrate by magnetron sputtering; an LED chip is bonded to the ceramic layer using a silver sintering process; and the ceramic-metal composite substrate and the ceramic layer are formed by plasma-enhanced chemical vapor deposition (PECVD) in a vacuum environment. Encapsulation layer. Attached Figure Description

[0011] Figure 1 : A three-dimensional schematic diagram of an embodiment of this application;

[0012] Figure 2 : A half-sectional schematic diagram of an embodiment of this application;

[0013] Figure 3 : An exploded view of an embodiment of this application. Detailed Implementation

[0014] The present invention will be further described in detail below with reference to the embodiments.

[0015] refer to Figures 1 to 3 As shown, the integrated LED automotive lighting module of this utility model includes: a three-dimensional stacked structure including a substrate assembly: a ceramic-metal composite substrate 101 is formed by connecting a ceramic layer 101a and a metal layer 101b through active metal brazing, the substrate size is (L)×(W)×(T)=80mm×60mm×3mm, and the coefficient of thermal expansion CTE=6.5ppm / ℃; an LED chip array 102: including an LED chip array 102 arranged in a matrix with a spacing P=5mm, connected to the substrate driving circuit 103 embedded in the internal cavity of the substrate through a silver sintered layer, forming a vertical interconnection with the LEDs; a heat dissipation system: including a heat pipe assembly 201 comprising: a miniature heat pipe heat dissipation assembly 201 with copper sintered heat pipes arranged in an S-shape, bonded to the bottom surface of the substrate through thermally conductive adhesive SN900, the condensation section extending to the metal shell 303 for heat dissipation; and a sealing structure, from the inside out including: Thin film 301: 5μm thick 302: Silicon gel layer with deposition temperature of 200℃; hardness shore00-30; fill rate >95%; laser-welded metal shell 303.

[0016] The headlight module manufacturing substrate processing involves vacuum brazing ceramic layer 101a and metal layer 101b at 850℃ using Ag72Cu28 solder. Laser drilling forms Φ100μm microholes 104a, and electroplating fills the holes to form copper pillars 104b. Chip packaging uses an ASMAD831 pick-and-place machine to sinter the flip-chip array 102 with silver paste to connect it to the substrate. The driver IC 103 is QFN packaged and implanted into the substrate's reserved cavity 103a. For the heat dissipation system assembly, the evaporation section of the micro heat pipe heat dissipation component 201 is coated with SN900 thermally conductive adhesive and pressed onto the substrate. Phase change material 203 is injected into the honeycomb heat storage cavity of the aluminum alloy shell and sealed. Deposition under vacuum The film 30 was injected with liquid silicone and cured at 80°C for 2 hours. The shell was then welded using an IPG fiber laser at a welding speed of 3 m / min.

[0017] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. An integrated LED automotive lighting module, characterized in that, include: A ceramic-metal composite substrate (101) includes a ceramic layer (101a) and a metal layer (101b) bonded together; an LED chip array (102) disposed on the surface of the ceramic layer (101a); a driving circuit (103) embedded in the metal layer (101b) and electrically connected to the LED chips through a vertical conductive channel (104); a micro heat pipe heat dissipation assembly (201) coupled to the bottom surface of the substrate; and a multi-layer sealed structure covering the entire module.

2. The vehicle headlight module according to claim 1, characterized in that: The ceramic layer (101a) is aluminum nitride ceramic with a thickness of 1.2±0.1mm and a surface roughness Ra≤0.8μm.

3. The vehicle headlight module according to claim 1, characterized in that: The vertical conductive channel (104) includes: a microhole (104a) formed by laser drilling, with a diameter Φ=100±10μm; and a copper pillar (104b) filled in the microhole, with a height-to-diameter ratio ≥5:

1.

4. The vehicle headlight module according to claim 1, characterized in that, The multilayer sealing structure includes: deposited on the surface of the LED chip. Thin film (301) with a thickness of 3-8 μm; silicone gel layer (302) covering the entire substrate; metal shell (303) with a hardness of Shore 00-3 and laser welded with a weld penetration depth ≥1.5 mm.

5. The vehicle headlight module according to claim 1 or 4, characterized in that: A Cr / Cu seed layer was prepared on the surface of a ceramic-metal composite substrate (101) by magnetron sputtering; an LED chip was bonded to the ceramic layer (101a) using a silver sintering process; the ceramic-metal composite substrate (101) and the ceramic layer (101a) were then formed by plasma-enhanced chemical vapor deposition in a vacuum environment. Encapsulation layer.

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