Infrared detector module and infrared imaging equipment

Abstract

The utility model relates to the field of infrared detection, and discloses an infrared detector module and an infrared imaging device, the infrared detector module comprises a circuit board, an infrared detector and a curved surface light transmission member, and the infrared detector is electrically connected with the circuit board; the curved-surface light-transmitting part is used for transmitting infrared light, at least one surface of the curved-surface light-transmitting part is a curved surface, and the curved-surface light-transmitting part is located on an incident light path of the infrared detector and used for expanding the field angle of the infrared detector; and the outer surface of the curved-surface light-transmitting part is the surface of one side, far away from the infrared detector, of the curved-surface light-transmitting part. The infrared light can irradiate on the infrared detector for infrared imaging after penetrating through the curved-surface light-transmitting part, and at least one surface of the curved-surface light-transmitting part is a curved surface, so that the effect of enlarging the angle of the incident infrared light is achieved, and the field angle of the infrared detector can be increased.

Description

Technical Field

[0001] This application relates to the field of infrared detection, and in particular to an infrared detector module and an infrared imaging device. Background Technology

[0002] An infrared detector is a device that can convert incident infrared radiation signals into electrical signals and is widely used in security monitoring, temperature detection, night vision equipment and other fields.

[0003] An infrared detector consists of an infrared detection chip and an optical window. The optical window is located above the infrared detection chip, through which infrared light enters the chip. Because infrared detectors are sensitive to their environment, a protective casing can be placed around them to prevent environmental influences. However, this casing can affect the field of view of the infrared detector when detecting infrared light.

[0004] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Utility Model Content

[0005] The purpose of this application is to provide an infrared detector module and an infrared imaging device to increase the field of view of the infrared detector while providing protection.

[0006] To address the aforementioned technical problems, this application provides an infrared detector module, comprising:

[0007] Circuit boards, infrared detectors, and curved light-transmitting components;

[0008] The infrared detector is electrically connected to the circuit board;

[0009] The curved light-transmitting element is used to transmit infrared light. At least one surface of the curved light-transmitting element is curved. The curved light-transmitting element is located in the incident light path of the infrared detector and is used to expand the field of view of the infrared detector. The outer surface of the curved light-transmitting element is the surface of the curved light-transmitting element away from the infrared detector.

[0010] Optionally, it also includes a protective shell having a window, and the curved light-transmitting element is located in the window;

[0011] The protective shell is fixedly connected to the surface of the circuit board, and the protective shell, the curved light-transmitting element, and the circuit board form a cavity; the infrared detector is located in the cavity.

[0012] Optionally, the curved light-transmitting element is fixed to the window by adhesive bonding, clips, or pressure.

[0013] Optionally, it also includes:

[0014] An encapsulation cap layer located inside the vacuum cavity of the infrared detector, used to encapsulate the infrared detection chip of the infrared detector.

[0015] Optionally, the curved light-transmitting element includes any of the following:

[0016] Spherical light-transmitting components, aspherical light-transmitting components, hemispherical light-transmitting components, wavy curved surface light-transmitting components, cylindrical light-transmitting components, free-form surface light-transmitting components, Fresnel surface light-transmitting components, composite curved surface light-transmitting components, diffractive surface light-transmitting components, hyperboloid light-transmitting components, and fisheye surface light-transmitting components.

[0017] Optionally, it also includes:

[0018] A protective cover located above the curved light-transmitting element; and / or,

[0019] The upper surface of the protective shell is higher than the outer surface of the curved light-transmitting element, and the upper surface of the protective shell is the surface of the protective shell away from the infrared detector.

[0020] Optionally, the protective case includes a plastic case.

[0021] Optionally, the curved light-transmitting element includes at least two components, which are arranged sequentially along the incident light path of the infrared detector.

[0022] Optionally, the at least two curved light-transmitting elements are fixedly installed by one or more protective shells (2).

[0023] This application also provides an infrared imaging device, including any of the infrared detector modules described above.

[0024] This application provides an infrared detector module, comprising: a circuit board, an infrared detector, and a curved light-transmitting element, wherein the infrared detector is electrically connected to the circuit board; the curved light-transmitting element is used to transmit infrared light, at least one surface of the curved light-transmitting element is curved, the curved light-transmitting element is located in the incident light path of the infrared detector, and is used to expand the field of view of the infrared detector; the outer surface of the curved light-transmitting element is the surface of the curved light-transmitting element away from the infrared detector.

[0025] As can be seen, the infrared detector module in this application includes a circuit board, an infrared detector, and a curved light-transmitting component. The curved light-transmitting component is located in the incident light path of the infrared detector. After the infrared light passes through the curved light-transmitting component, it can illuminate the infrared detector to perform infrared imaging. Since at least one surface of the curved light-transmitting component is curved, it has the function of expanding the angle of the incident infrared light, thereby increasing the field of view of the infrared detector.

[0026] In addition, this application also provides an infrared imaging device with the above-mentioned advantages. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application. Figure 1 ;

[0029] Figure 2 A cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application. Figure 2 ;

[0030] In the diagram, 1 is the circuit board, 2 is the protective shell, 3 is the infrared detector, 4 is the curved light-transmitting component, 5 is the cavity, 6 is the bonding alloy wire, and 7 is the support column. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0033] As described in the background section, infrared detectors are sensitive to the environment. To avoid the infrared detector being affected by the environment, a protective shell can be set around the infrared detector. However, this will affect the field of view angle of the infrared detector in detecting infrared light.

[0034] In view of this, this application provides an infrared detector module, please refer to... Figure 1 It can include:

[0035] Circuit board 1, infrared detector 3, and curved light-transmitting component 4;

[0036] The infrared detector 3 is electrically connected to the circuit board 1;

[0037] The curved light-transmitting element 4 is used to transmit infrared light. At least one surface of the curved light-transmitting element 4 is curved. The curved light-transmitting element 4 is located on the incident light path of the infrared detector 3 and is used to expand the field of view of the infrared detector 3. The outer surface of the curved light-transmitting element 4 is the surface of the curved light-transmitting element 4 away from the infrared detector 3.

[0038] It should be noted that the number of curved light-transmitting elements 4 is not limited in this application and can be set arbitrarily. The number of curved light-transmitting elements 4 can be one, or the number of curved light-transmitting elements 4 can include at least two, arranged sequentially along the incident light path of the infrared detector 3.

[0039] The outer surface of the curved light-transmitting element 4 can be curved, or the inner surface of the curved light-transmitting element 4 can be curved, or both the inner and outer surfaces of the curved light-transmitting element 4 can be curved. The inner surface of the curved light-transmitting element 4 is the surface of the curved light-transmitting element 4 closest to the infrared detector 3.

[0040] It should be noted that the type of curved light-transmitting element 4 is not limited in this embodiment and can be set arbitrarily. For example, the curved light-transmitting element 4 includes any of the following:

[0041] Spherical light-transmitting components, aspherical light-transmitting components, hemispherical light-transmitting components, wavy curved surface light-transmitting components, cylindrical light-transmitting components, free-form surface light-transmitting components, Fresnel surface light-transmitting components, composite curved surface light-transmitting components, diffractive surface light-transmitting components, hyperboloid light-transmitting components, and fisheye surface light-transmitting components.

[0042] Among them, a free-form surface refers to a surface with arbitrary settings, which has the characteristic of flexible design. The cylindrical light-transmitting component 4 has curvature in one direction and is flat in another direction. The composite surface in the composite surface light-transmitting component 4 can be a composite surface of spheres and aspherical surfaces, a composite surface of spheres and cylindrical surfaces, and so on.

[0043] This application does not limit the packaging type of the infrared detector 3; it depends on the circumstances. For example, the infrared detector 3 includes, but is not limited to, any of the following:

[0044] Metal-packaged infrared detectors, ceramic-packaged infrared detectors, wafer-level packaged infrared detectors, and pixel-level packaged infrared detectors.

[0045] As one possible implementation, the infrared detector 3 can be electrically connected to the circuit board 1 via the bonding wire 6. However, this application does not specifically limit this, and other connection methods can also be used.

[0046] As one possible implementation, it may also include a protective shell 2, the protective shell 2 having a window, and the curved light-transmitting element 4 located in the window;

[0047] The protective shell 2 is fixedly connected to the surface of the circuit board 1, and the protective shell 2, the curved light-transmitting element 4, and the circuit board 1 form a cavity 5; the infrared detector 3 is located in the cavity 5.

[0048] By setting up a protective shell 2, the protective shell 2, circuit board 1, and curved light-transmitting component 4 form a cavity 5, and the infrared detector 3 is set in the cavity 5 to achieve the protection of the infrared detector 3.

[0049] The inner surface of the protective shell 2, together with the window and the photosensitive area of ​​the infrared detector chip, constitute the field of view of the infrared detector 3.

[0050] The window of the protective shell 2 matches the curved light-transmitting element 4 to ensure that the protective shell 2 and the curved light-transmitting element 4 can fit tightly together to form the cavity 5.

[0051] The protective shell 2 includes a plastic shell, such as a thermotropic liquid crystal polymer, a lyotropic liquid crystal polymer, or polyimide. These materials have the advantage of being less prone to deformation at high temperatures (250°C), thus improving the stability of the protective shell 2 at high temperatures. Of course, the protective shell 2 can also be made of other materials, such as metal or ceramic. Furthermore, the lightweight nature of the plastic shell reduces the weight of the infrared detector module, facilitating transportation.

[0052] It should be noted that the shape of the protective shell 2 is not limited in this application and can be set by the user. For example, the shape of the protective shell 2 can be a hexahedron with an opening, or a triangular prism, pentagonal prism, hexagonal prism, etc. with an opening, and the side with the opening is connected to the circuit board 1.

[0053] It should be noted that this application does not limit the connection method between the curved light-transmitting component 4 and the window, and it can be determined as appropriate. Three options are provided below.

[0054] In the first method, the curved light-transmitting component 4 is fixed to the window by adhesive bonding. The curved light-transmitting component 4 is bonded to the window using an adhesive, including but not limited to epoxy, silicone, and polyurethane adhesives. Epoxy, silicone, and polyurethane adhesives have high-temperature resistance properties, which enables the infrared detector module to possess high-temperature resistance characteristics.

[0055] In the second method, the curved light-transmitting component 4 is fixed to the window by a clip. The clip can hold the curved light-transmitting component 4 in place at the window. To avoid damage to the curved light-transmitting component 4, the clip can be a flexible clip.

[0056] Thirdly, the curved light-transmitting element 4 is fixed to the window by a pressure member. The pressure member can press the curved light-transmitting element 4 at the window. In order to avoid damage to the curved light-transmitting element 4 by the pressure member, the pressure member can be a flexible pressure member.

[0057] This application does not limit the shape of the window and allows for customization. For example, the shape of the window may include, but is not limited to, any one of the following: circle, rectangle, square, ellipse, pentagon, or hexagon.

[0058] When the number of curved light-transmitting elements 4 is at least two, the at least two curved light-transmitting elements 4 are fixedly installed by one or more protective shells 2. When multiple protective shells 2 are used for fixing, the number of protective shells 2 is equal to the number of curved light-transmitting elements 4, and the protective shells 2 can be sequentially nested from the inside to the outside.

[0059] In this embodiment, the infrared detector module includes a circuit board 1, an infrared detector 3, and a curved light-transmitting element 4. The curved light-transmitting element 4 is located in the incident light path of the infrared detector 3. After the infrared light passes through the curved light-transmitting element 4, it can illuminate the infrared detector 3 to perform infrared imaging. Since at least one surface of the curved light-transmitting element 4 is curved, it has the function of expanding the angle of the incident infrared light, thereby increasing the field of view of the infrared detector 3.

[0060] Based on the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0061] An encapsulation cap layer located inside the vacuum cavity of the infrared detector 3, used to encapsulate the infrared detection chip of the infrared detector 3.

[0062] The infrared detector 3 includes an infrared detector chip and an optical window, with a vacuum cavity between them. The infrared detector chip has stringent environmental requirements; in this embodiment, by placing an encapsulation cap layer within the vacuum cavity, the operating environment of the infrared detector chip can be further protected.

[0063] Based on any of the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0064] A protective cover located above the curved light-transmitting component 4.

[0065] The protective cover can be placed over the curved light-transmitting component 4 to protect it from external scratches, bumps, etc., and to extend its service life.

[0066] Based on any of the above embodiments, in one embodiment of this application, in the infrared detector module, the upper surface of the protective shell 2 is higher than the outer surface of the curved light-transmitting element 4, and the upper surface of the protective shell 2 is the surface of the protective shell 2 away from the infrared detector 3.

[0067] In this embodiment, the outer surface of the curved light-transmitting component 4 is set to be lower than the upper surface of the protective shell 2. The protective shell 2 can protect the curved light-transmitting component 4, prevent the curved light-transmitting component 4 from being scratched or bumped by the outside, and improve the service life of the curved light-transmitting component 4.

[0068] Please refer to Figure 2 Based on any of the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0069] The support column 7 is located inside the cavity 5 and between the circuit board 1 and the protective shell 2.

[0070] The shape of the support column 7 can be a cylinder or a prism, etc., and no specific limitation is made in this application.

[0071] This application does not limit the number of support columns 7; it can be set arbitrarily. The number of support columns 7 can be one, two, three, etc.

[0072] When the infrared detector module is subjected to external force, the protective shell 2 may be damaged or collapse due to insufficient resistance. In this embodiment, by setting a support column 7 between the circuit board 1 and the protective shell 2, the ability of the infrared detector module to resist external force can be enhanced, and the stability of the infrared detector module can be improved.

[0073] This application also provides an infrared imaging device, including the infrared detector module described in any of the above embodiments.

[0074] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0075] The infrared detector module and infrared imaging device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. An infrared detector module, characterized in that, include: Circuit board (1), infrared detector (3) and curved light-transmitting component (4); The infrared detector (3) is electrically connected to the circuit board (1); The curved light-transmitting element (4) is used to transmit infrared light. At least one surface of the curved light-transmitting element (4) is curved. The curved light-transmitting element (4) is located on the incident light path of the infrared detector (3) and is used to expand the field of view of the infrared detector (3). The outer surface of the curved light-transmitting element (4) is the surface of the curved light-transmitting element (4) away from the infrared detector (3).

2. The infrared detector module as described in claim 1, characterized in that, Also includes: A protective shell (2) having a window, wherein the curved light-transmitting element (4) is located in the window; The protective shell (2) is fixedly connected to the surface of the circuit board (1), and the protective shell (2), the curved light-transmitting element (4) and the circuit board (1) form a cavity (5); the infrared detector (3) is located in the cavity (5).

3. The infrared detector module as described in claim 2, characterized in that, The curved light-transmitting component (4) is fixed to the window by adhesive bonding, clips, or pressure.

4. The infrared detector module as described in claim 1, characterized in that, Also includes: An encapsulation cap layer located inside the vacuum cavity of the infrared detector (3) for encapsulating the infrared detection chip of the infrared detector (3).

5. The infrared detector module as described in claim 1, characterized in that, The curved light-transmitting component (4) includes any one of the following: Spherical light-transmitting components, aspherical light-transmitting components, hemispherical light-transmitting components, wavy curved surface light-transmitting components, cylindrical light-transmitting components, free-form surface light-transmitting components, Fresnel surface light-transmitting components, composite curved surface light-transmitting components, diffractive surface light-transmitting components, hyperboloid light-transmitting components, and fisheye surface light-transmitting components.

6. The infrared detector module as described in claim 1, characterized in that, Also includes: A protective cover located above the curved light-transmitting element (4); and / or, The upper surface of the protective shell (2) is higher than the outer surface of the curved light-transmitting element (4), and the upper surface of the protective shell (2) is the surface of the protective shell (2) away from the infrared detector (3).

7. The infrared detector module as described in claim 1, characterized in that, The protective shell (2) includes a plastic shell.

8. The infrared detector module as described in claim 2, characterized in that, The curved light-transmitting element (4) includes at least two, which are arranged sequentially along the incident light path of the infrared detector (3).

9. The infrared detector module as described in claim 8, characterized in that, The at least two curved light-transmitting elements (4) are fixedly installed by one or more protective shells (2).

10. An infrared imaging device, characterized in that, Including the infrared detector module as described in any one of claims 1 to 9.

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