Pressure transmitter

Abstract

The utility model relates to the technical field of pressure transmitters, and particularly provides a pressure transmitter, which comprises a first joint, an adapter tube, a shell, a pressure sensor, a circuit board, a heating mechanism, a second joint and a connector, the outer wall of the first end of the first connector is sleeved with a pressure sensor, the end, connected with the pressure sensor, of the first connector is inserted into the first end of the adapter, the outer wall of the second end of the adapter is sleeved with the first end of the shell, a cavity is formed in the shell, a circuit board is arranged in the cavity, and the second end of the adapter is connected with the circuit board. The back face of the circuit board is attached to the heating mechanism, the second end of the shell is connected with a second connector, and a connector is inserted into the second connector. The circuit board is respectively connected with the pressure sensor and the connector through electric signal transmission lines, so that the pressure transmitter can be suitable for an ultralow-temperature environment, and the circuit board and the pressure sensor are ensured to stably work at the ultralow temperature.

Description

Technical Field

[0001] This application relates to the field of pressure transmitter technology, and more particularly to a pressure transmitter. Background Technology

[0002] A pressure transmitter is a complex system consisting of multiple modules, including a pressure sensor core, signal processing circuit, output circuit, housing and connecting components, and power supply. Its core function is to convert pressure signals into standardized electrical signal outputs, providing crucial support for industrial automation and control systems.

[0003] Currently, some pressure sensor cores can operate stably within a wide temperature range of -65℃ to 175℃, meeting the pressure measurement requirements in ultra-low temperature environments. Another crucial component of a pressure transmitter is the circuit board, which is the core part responsible for signal processing, data conversion, and output control. However, its operating temperature range is typically narrower than that of the pressure sensor core. In ultra-low temperature environments, electronic components on the circuit board, such as integrated circuits, capacitors, and resistors, may experience performance degradation or even failure due to the low temperature, resulting in signal distortion, response delays, or complete malfunction.

[0004] Therefore, although the pressure sensor core can operate normally at ultra-low temperatures, the operating temperature limit of the circuit board still restricts the overall performance of the pressure transmitter when operating at ultra-low temperatures. Utility Model Content

[0005] To address the aforementioned issues, this application provides a method that enables the circuit board and pressure sensor to operate stably at ultra-low temperatures by directly attaching the heating mechanism to the circuit board of the pressure transmitter.

[0006] To achieve the objectives of this application, the following technical solution is provided:

[0007] This application provides a pressure transmitter, including: a first connector, an adapter tube, a housing, a pressure sensor, a circuit board, a heating mechanism, a second connector, and a connector;

[0008] A pressure sensor is sleeved on the outer wall of the first end of the first connector. The end of the first connector with the pressure sensor is inserted into the first end of the adapter tube. The outer wall of the second end of the adapter tube is sleeved on the first end of the housing. A cavity is provided inside the housing. A circuit board is provided inside the cavity. The second end of the adapter tube is connected to the circuit board. The back of the circuit board is attached to the heating mechanism. The second end of the housing is connected to the second connector. A connector is inserted into the second connector.

[0009] The circuit board is connected to the pressure sensor and the connector respectively via electrical signal transmission lines.

[0010] In one possible implementation, the first connector is a stepped variable diameter column, which includes a first part, a second part, and a third part connected in sequence with progressively smaller radii.

[0011] The first part is located outside the first end of the adapter tube, the outer wall of the second part is press-fitted with the inner wall of the adapter tube and the second part is sleeved on the first end of the adapter tube, and the third part is located inside the adapter tube and sleeved on the pressure sensor.

[0012] A sealing ring is provided between the outer wall of the second part and the inner wall of the adapter pipe, and a sealing ring is provided between the outer wall of the second end of the adapter pipe and the inner wall of the housing. The inner wall of the housing is lined with thermal insulation cotton.

[0013] In one possible implementation, the circuit board is provided with a controller, a temperature sensor, a humidity sensor, a pressure signal acquisition and conditioning module, a humidity signal acquisition and conditioning unit, and a PWM signal transmitter.

[0014] The pressure sensor is communicatively connected to the controller via a pressure signal acquisition conditioner.

[0015] The temperature sensor is communicatively connected to the controller via the temperature signal acquisition and conditioning unit;

[0016] The humidity sensor is communicatively connected to the controller via the humidity signal acquisition and conditioning unit;

[0017] The heating mechanism and the PWM signal transmitter are respectively connected to the controller for communication.

[0018] In one possible implementation, the circuit board is further provided with a power-on preheating controller, which is connected to the heating mechanism.

[0019] In one possible implementation, the circuit board further includes a power supply, which is electrically connected to the controller, the pressure signal acquisition and conditioning module, the humidity signal acquisition and conditioning unit, the PWM signal transmitter, and the power-on preheating controller.

[0020] In one possible implementation, the heating mechanism includes a PI heating film.

[0021] In one possible implementation, the heating mechanism includes a heat spreader and a PI heating film stacked sequentially on the back of the circuit board.

[0022] Beneficial effects: This application achieves integrated design of pressure sensor and circuit board through nested design of first connector, adapter pipe and housing, reducing external interference and improving overall structural stability; at the same time, the heating mechanism is directly attached to the circuit board, which can be used in low temperature environment and ensures that the circuit board and pressure sensor work stably at ultra-low temperature. Attached Figure Description

[0023] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.

[0024] Figure 1 A schematic diagram of the structure of a pressure transmitter provided in an embodiment of this application is shown;

[0025] Figure 2 A schematic diagram of the structure of a control device based on a pressure transmitter provided in an embodiment of this application is shown;

[0026] Figure 3 A flowchart of a temperature control method based on a pressure transmitter provided in an embodiment of this application is shown;

[0027] Figure 4 A flowchart of a temperature control method based on a pressure transmitter according to another embodiment of this application is shown;

[0028] Diagram markings: 1. First connector; 2. Pressure sensor; 3. Adapter pipe; 4. Housing; 5. Circuit board; 6. Heating mechanism; 7. Second connector; 8. Connector; 9. Temperature sensor. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of this application, unless otherwise stated, "multiple" means two or more.

[0031] Pressure transmitters used in aerospace (e.g., aircraft fuel systems, rocket propellant monitoring), defense and military (e.g., missile guidance, deep-sea equipment), energy industry (e.g., LNG storage tanks, geothermal extraction), automotive (e.g., hydrogen fuel cell vehicles, racing engines), industrial manufacturing (e.g., semiconductor equipment, chemical pipelines), and polar or space exploration (e.g., Mars rovers, polar robots) generally need to be stable in extreme temperature environments. Currently, some pressure transmitters use pressure sensors that can adapt to ultra-low temperatures. Therefore, to solve this problem, this application provides a pressure transmitter and a temperature control method based on the pressure transmitter.

[0032] The technical solution of this application will be described in conjunction with the following embodiments.

[0033] Figure 1 A schematic diagram of the structure of a pressure transmitter provided in an embodiment of this application is shown, as follows: Figure 1 As shown in the figure, this application provides a pressure transmitter, including: a first connector 1, a transfer tube 2, a pressure transmitter 3, a housing 4, a circuit board 5, a heating mechanism 6, a second connector 7, and a connector 8.

[0034] In this design, a pressure sensor 2 is fitted onto the outer wall of the first end of the first connector 1. The end of the first connector 1 connected to the pressure sensor 2 is inserted into the first end of the adapter pipe 3. The outer wall of the second end of the adapter pipe 3 is fitted onto the first end of the housing 4. A cavity is provided inside the housing 4, and a circuit board 5 is housed within the cavity. The second end of the adapter pipe 3 is connected to the circuit board 5, specifically via a pan head screw on the end face of the second end of the adapter pipe 3. The two ends of the adapter pipe 3 are respectively connected to the first connector 1 and the housing 4, forming a sealed pressure transmission channel that transmits the pressure of the measured medium (such as fluid in a pipe) to the diaphragm of the pressure sensor 2 without loss.

[0035] The back of the circuit board 5 is attached to the heating mechanism 6. The second end of the housing 4 is connected to the second connector 7, and a connector 8 is inserted into the second connector 7. The connector 8 serves as the electrical interface between the circuit board 5 and the external system. The circuit board 5 is connected to the pressure sensor 2 and the connector 8 via electrical signal transmission lines.

[0036] To enable circuit board 5 to operate in ultra-low temperature environments, this application adds a heating mechanism 6 to the back of circuit board 5. For example, a PI heating film is attached to the back of circuit board 5, or a heat spreader layer and a PI heating film are sequentially stacked on the back of circuit board 5. The PI heating film acts as an active heat source, precisely heating itself by receiving PWM signals from the controller, converting electrical energy into stable and controllable heat energy. The heat spreader layer (such as a high thermal conductivity graphite sheet or metal composite material) is arranged closely to the heating film, utilizing its excellent planar thermal conductivity to rapidly diffuse the heat generated by the heating film laterally, eliminating localized high-temperature points and ensuring a uniform overall temperature distribution on circuit board 5.

[0037] Therefore, in this embodiment, the heating mechanism 6 heats the circuit board 5, enabling the circuit board 5 to work stably at ultra-low temperatures, thereby ensuring that the pressure transmitter works stably at ultra-low temperatures. This can be applied to special scenarios with extremely high requirements for temperature tolerance and reliability.

[0038] To achieve a tight connection between the first connector 1 and other parts of the pressure transmitter, and to facilitate the insertion of the first connector 1 into the adapter tube 3, the embodiments of this application design the first connector 1 as a stepped reducing column. The stepped reducing column includes a first part, a second part, and a third part connected sequentially with progressively smaller radii. The first part is located outside the first end of the adapter tube 3, the outer diameter of the second part is interference-fitted with the adapter tube 3 so that the second part can be sleeved onto the first end of the adapter tube 3, and the third part is located inside the adapter tube 3 and sleeved onto the pressure sensor 2.

[0039] To ensure a sealed connection between the first connector 1 and the adapter pipe 3, a sealing ring is provided between the outer wall of the second part and the inner wall of the first end of the adapter pipe 3. To ensure a sealed connection between the second end of the adapter pipe 3 and the housing 4, a sealing ring is provided between the outer wall of the second end of the adapter pipe 3 and the inner wall of the housing 4.

[0040] The inner wall of the housing 4 is lined with thermal insulation cotton, such as aerogel or ceramic fiber. The thermal insulation cotton reduces heat loss to the outside of the housing 4 by reflecting the heat generated by the heating film back to the circuit board 5 area.

[0041] The pressure transmitter provided in this application embodiment can operate stably in a wide temperature range of -65℃ to 175℃. Therefore, in order to simultaneously achieve heating and heat preservation at ultra-low temperatures and ensure heat dissipation at high temperatures, in one embodiment, multiple heat dissipation ribs are uniformly spaced along the circumference of the outer wall of the pressure transmitter housing 4. The insulation layer is cylindrical and coaxially attached to the inner wall of the housing 4. A paraffin-based phase change layer and insulation cotton are uniformly spaced along the circumference of the insulation layer. The insulation cotton and the paraffin-based phase change layer are connected, so that the insulation layer in the area where the inner wall of the housing 4 overlaps with the heat dissipation ribs is a paraffin-based phase change layer. The paraffin-based phase change layer can melt at high temperatures to enhance heat conduction and solidify at low temperatures to restore heat insulation. Therefore, at low temperatures, the insulation layer keeps the temperature and reduces heat loss, and at high temperatures, the paraffin-based phase change layer melts and exposes the heat dissipation ribs, which dissipate heat.

[0042] It should be noted that the paraffin-based phase change layer is a thermally responsive composite material, including paraffin, graphite powder, and silicone rubber. At high temperatures, the melting and volume expansion of paraffin can push the graphite powder to the edges, forming heat dissipation channels such as heat dissipation ribs; at low temperatures, paraffin shrinks, and the elasticity of silicone rubber pulls the graphite powder back from the edges and disperses it, thus eliminating the heat dissipation channels. The paraffin-based phase change layer can not only achieve low-temperature curing and high-temperature melting, but also can be recycled to achieve thousands of phase changes.

[0043] This application provides another embodiment that, with the assistance of the heating mechanism 6, can solve the problem of circuit short circuits or sensor failure caused by condensation accumulation under extreme temperature difference environments. When the pressure transmitter operates in a low-temperature and high-humidity environment, external cold air may seep into the housing 4 through joint gaps and form condensation when it encounters the high-temperature circuit board 5 or the heating mechanism 6. Therefore, this embodiment of the application provides a condensation collection tank inside the housing 4, and an evaporator and a liquid level sensor are installed in the condensation collection tank. When the liquid level sensor detects that the liquid level is greater than the liquid level threshold, the evaporator and the heating mechanism 6 are activated to reduce the humidity inside the housing 4. This can achieve the effect of keeping the circuit board 5 inside the housing 4 dry even if the pressure transmitter housing is repeatedly condensed due to diurnal temperature differences.

[0044] This application provides another embodiment of a control device capable of regulating the start-up time, heating duration, heating temperature, heating frequency, and heating power of the heating mechanism 6 according to the temperature and / or humidity changes inside the pressure transmitter housing 4. Figure 2 A schematic diagram of the control device structure based on a pressure transmitter provided in an embodiment of this application is shown, as follows: Figure 2 As shown, the control device is mounted on circuit board 5 and includes a controller, a temperature sensor 9, a humidity sensor, a pressure signal acquisition and conditioning module, a humidity signal acquisition and conditioning unit, and a PWM signal transmitter. The temperature sensor 9 is mounted on the front of circuit board 5 or on the side of the heating mechanism 6 opposite to circuit board 5.

[0045] Pressure sensor 2 is connected to the controller via a pressure signal acquisition and conditioning unit. It should be noted that the adapter pipe 3, as the core channel for pressure transmission, connects one end to the measured medium (such as gas or liquid in a pipeline) and the other end to pressure sensor 2 through a sealed structure, transmitting external pressure to pressure sensor 2 without loss. Pressure sensor 2 converts the physical pressure transmitted by adapter pipe 3 into a raw electrical signal (usually a weak analog signal at the millivolt level). The pressure signal acquisition and conditioning unit then immediately intervenes, processing the signal through high-precision amplification, temperature compensation, nonlinear correction, and noise filtering to convert the raw signal into a standard industrial signal and transmit it to the controller on circuit board 5.

[0046] Temperature sensor 9 is connected to the controller via a temperature signal acquisition and conditioning unit. It should be noted that temperature sensor 9 (exemplarily including PT100 or thermocouple) senses the temperature of key components (such as pressure sensor 2, circuit board 5, or inside housing 4) in real time. Its weak analog output signal is amplified, compensated, and linearized by the temperature signal acquisition and conditioning unit, and then converted into a high-precision digital signal. After receiving this signal, the controller dynamically adjusts the power of heating mechanism 6 based on preset temperature thresholds and algorithms (such as neural network models and PID control).

[0047] The humidity sensor communicates with the controller via a humidity signal acquisition and conditioning unit. It should be noted that the humidity sensor monitors humidity changes inside the housing 4 in real time (such as a sudden increase in humidity caused by condensate evaporation). The humidity acquisition and conditioning unit amplifies, linearizes, and performs temperature compensation processing on the raw signal, converting it into a high-precision digital signal that is transmitted to the controller. The controller then dynamically adjusts the power of the heating mechanism 6 or starts and stops the evaporator according to a preset humidity threshold.

[0048] The heating mechanism 6 and the PWM signal transmitter are respectively connected to the controller for communication. It should be noted that the controller generates dynamic control commands based on the real-time data fed back by the temperature sensor 9, and converts the digital commands into high-precision pulse width modulation signals through the PWM signal transmitter to accurately drive the power output of the heating mechanism 6 (such as a PI heating film); at the same time, the PWM transmitter monitors the heating circuit current in real time and feeds back the load status to the controller to form bidirectional communication.

[0049] This application provides another embodiment, in which a power-on preheating controller is also provided on the circuit board 5, and the power-on preheating controller is connected to the heating mechanism 6. It should be noted that during the cold start phase of the pressure transmitter, the power-on preheating controller controls the heating architecture to gradually heat key components such as the signal conditioning chip and the reference voltage source on the circuit board 5. Specifically, the heating power of the heating mechanism 6 is precisely controlled by the PWM signal transmitter to slowly increase the temperature of the key components, avoiding low-temperature cracking or condensation short circuits.

[0050] Circuit board 5 also includes a power supply, which is electrically connected to the controller, pressure signal acquisition and conditioning module, humidity signal acquisition and conditioning unit, PWM signal transmitter, and start-up preheating controller. It should be noted that the power supply, acting as an energy hub, works collaboratively with each module through a hierarchical power distribution strategy: the power supply prioritizes providing stable voltage to core circuits such as the controller, signal conditioning module (pressure / humidity), and PWM signal transmitter to ensure real-time signal acquisition and processing; while the start-up preheating controller, acting as a power management unit, dynamically allocates power during the cold start phase, first pre-powering the sensors and conditioning circuits, and only after the controller passes its self-test does it drive the heating mechanism 6 through the modulation signal output from the PWM signal transmitter. Simultaneously, the heating mechanism 6 is indirectly powered through the PWM transmitter, which utilizes its current isolation characteristics to eliminate interference and ensure circuit stability, and also allows for precise control of heating power through duty cycle adjustment.

[0051] Based on the above embodiments, combined with Figure 2The controller acquires data from a digital temperature sensor (such as DS18B20) via a 1-wire bus. After internal PID calculations, it outputs an analog control signal via a PWM signal and a V / F converter (voltage-to-frequency converter). Simultaneously, it achieves bidirectional communication with a host computer via an RS232 serial port—uploading real-time temperature data and receiving parameter commands from monitoring software. This design combines digital precision with the flexibility of analog control, and is typically used in industrial temperature control systems. The 1-wire bus saves I / O resources, the V / F converter enhances anti-interference capabilities, and the RS232 provides reliable long-distance communication.

[0052] Figure 3 This paper presents a flowchart of a temperature control method based on a pressure transmitter according to an embodiment of this application. Figure 4 A flowchart of a temperature control method based on a pressure transmitter according to another embodiment of this application is shown, as follows: Figure 3 and Figure 4 As shown, based on the pressure transmitter described in the above embodiments, this application also provides a temperature control method based on the pressure transmitter, including the following steps:

[0053] It should be noted that the pressure transmitter cavity contains a pressure sensor 2 and a circuit board 5 connected to the pressure sensor 2. The circuit board 5 houses a temperature sensor 9 and a controller, and a heating mechanism 6 is attached to the back of the circuit board 5. The circuit board 5 includes a controller, temperature sensor 9, humidity sensor, pressure signal acquisition and conditioning module, humidity signal acquisition and conditioning unit, PWM signal transmitter, and start-up preheating controller. Specifically, pressure sensor 2 communicates with the controller via the pressure signal acquisition and conditioning unit; temperature sensor 9 communicates with the controller via the temperature signal acquisition and conditioning unit; humidity sensor communicates with the controller via the humidity signal acquisition and conditioning unit; the heating mechanism 6 and the PWM signal transmitter are each communicated with the controller; and the start-up preheating controller is connected to the heating mechanism 6.

[0054] S100 collects the first temperature in real time through temperature sensor 9. When the first temperature is lower than the first preset temperature, the controller starts the heating mechanism 6 to heat the circuit board 5.

[0055] After collecting and verifying a large amount of data, the first preset temperature was set to -40℃.

[0056] After the first preset time, the S200 collects the second temperature in real time through the temperature sensor 9. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements an intelligent power adjustment scheme.

[0057] After extensive data verification, the preset absolute value of the temperature difference is 2℃. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, it indicates that the temperature rise rate inside the casing 4 is too slow. If the heating power of the heating mechanism 6 is maintained, the circuit board 5 may be damaged due to ultra-low temperature. Therefore, the heating power of the heating mechanism 6 needs to be increased to ensure that the temperature inside the casing 4 rises rapidly. The first preset time is 10 seconds. This intelligent power adjustment scheme is generated by the controller based on a neural network model and implemented by the controller trigger, specifically including:

[0058] The neural network model is trained using historical data, including pressure, temperature, heating film power, and trends in temperature and humidity over time.

[0059] The controller inputs the difference into the neural network model, which then uses the model to predict the temperature changes within the cavity over a preset time period and generates an intelligent power adjustment scheme based on these temperature changes.

[0060] When the difference between the second temperature and the first temperature is less than or equal to a preset difference, the controller implements an intelligent power adjustment scheme. This scheme includes the heating frequency, heating start time, heating duration, and heating power of the heating mechanism 6. By implementing the intelligent power adjustment scheme, the temperature inside the cavity is raised to the third temperature range.

[0061] After the second preset time of S300, the third temperature is collected in real time by the temperature sensor 9. When the third temperature is not within the third temperature range, the controller controls the heating mechanism 6 to continue to adjust the heating power. After the third preset time of adjusting the heating power, the temperature is collected again until the collected temperature is within the third temperature range.

[0062] The third temperature range is -35℃ ± 2℃. When the temperature inside the housing 4 is within this third temperature range, the circuit board 5 can operate normally. The second preset time is 30 seconds.

[0063] Specifically, when the third temperature is not within the third temperature range, the controller controls the heating mechanism 6 to continue adjusting the heating power, including:

[0064] When the third temperature is lower than the minimum value of the third temperature range, the controller controls the heating mechanism 6 to increase the heating power. After a third preset time for increasing the heating power, the temperature continues to be collected until the collected temperature falls within the third temperature range. The third preset time is 50 seconds. The heating power can be increased incrementally, such as increasing by 5% of the original power every 5 seconds.

[0065] Alternatively, if the third temperature is higher than the maximum value of the third temperature range, the controller controls the heating mechanism 6 to reduce the heating power. After a third preset time of reducing the heating power, the temperature continues to be collected until the collected temperature falls within the third temperature range. When increasing the heating power, it can be reduced in stages, such as reducing the original power by 5% every 5 seconds.

[0066] It should be noted that when the third temperature is within the third temperature range, the controller controls the heating mechanism 6 to stop heating.

[0067] In another embodiment provided in this application, the controller in S300 controls the heating mechanism 6 to continue adjusting the heating power, specifically including:

[0068] Based on the error between the difference and the preset difference, the control quantity of the controller is dynamically calculated through a neural network model. The control quantity includes proportional coefficient, integral coefficient and derivative coefficient. The PWM signal transmitter maps the control quantity to the PWM duty cycle. The heating power of the heating mechanism 6 is adjusted according to the PWM duty cycle.

[0069] Another embodiment of this application provides a pressure transmitter, wherein a condensate collection tank is provided inside the cavity of the pressure transmitter, and a liquid level sensor and an evaporator are provided in the collection tank. Therefore, the temperature control method based on the pressure transmitter in this embodiment of the application further includes:

[0070] When the liquid level sensor detects that the liquid level is greater than the liquid level threshold, the controller starts the evaporator and heating mechanism 6;

[0071] The controller controls the heating mechanism 6 to raise the temperature inside the cavity to the fourth temperature, which is ≥ Tdew + △T, where Tdew is the current dew point temperature and △T is the preset safety margin, △T = 5℃.

[0072] When the humidity sensor detects that the relative humidity is below the humidity threshold and the liquid level sensor detects that the current liquid level is below the liquid level threshold, the controller shuts down the evaporator and heating mechanism 6. The liquid level threshold is 2mm and the humidity threshold is 20%RH.

[0073] This application provides yet another temperature control method based on a pressure transmitter, including the following steps executed by a controller:

[0074] Temperature sensor 9 collects the first temperature. When the first temperature is lower than the first preset temperature, the power-on preheating controller controls the heating mechanism 6 to preheat.

[0075] When the controller's operating temperature reaches the first preset temperature, the preheating controller is turned off, and the PWM signal transmitter is started to adjust the heating power of the heating mechanism 6. When adjusting the power, the heating power of the heating mechanism 6 can be adjusted in real time through a neural network model and PID control algorithm. Alternatively, the controller can be triggered to implement an intelligent power adjustment scheme predicted by the neural network model.

[0076] The beneficial effects that can be achieved by the embodiments of this application are as follows: The pressure transmitter described in the embodiments of this application adopts a nested design of a first connector, a transfer tube and a housing, realizing the integrated design of the pressure sensor and the circuit board, reducing external interference and improving the overall structural stability; at the same time, the heating mechanism is directly attached to the circuit board, which can respond to the requirements of low temperature environment and ensure that the circuit board and the pressure sensor work stably at ultra-low temperature.

[0077] The temperature control method based on a pressure transmitter described in this application significantly improves the reliability and energy efficiency of the pressure transmitter in extreme environments through closed-loop control of multi-level temperature acquisition and intelligent adjustment. Its core advantage lies in its progressive temperature control strategy: when ultra-low temperature (such as the first temperature) is detected, a rapid heating mode is immediately activated to prevent cold-start damage to circuit board components; through dynamic analysis of the temperature difference before and after the temperature change via neural network, the PWM duty cycle is intelligently adjusted to achieve precise temperature control of ±1℃, avoiding the overshoot problem of traditional PID algorithms; and the multi-time-window temperature verification mechanism (such as 10 / 30 / 50-second stepped detection) ensures that the temperature stably enters a safe range (such as the third temperature range) while preventing energy waste caused by overheating.

[0078] In the embodiments provided in this application, it should be understood that the disclosed systems, modules, and methods can be implemented in other ways. For example, the module embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between modules or units, and may be electrical, mechanical, or other forms.

[0079] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. This application is not limited to the exact structures described above and illustrated in the accompanying drawings, and it should not be considered that the specific implementation of this application is limited to these descriptions. For those skilled in the art, various changes and modifications made without departing from the concept of this application should be considered to fall within the protection scope of this application.

Claims

1. A pressure transmitter, characterized in that, include: First connector, adapter tube, housing, pressure sensor, circuit board, heating mechanism, second connector, and connector; A pressure sensor is sleeved on the outer wall of the first end of the first connector. The end of the first connector with the pressure sensor is inserted into the first end of the adapter tube. The outer wall of the second end of the adapter tube is sleeved on the first end of the housing. A cavity is provided inside the housing. A circuit board is provided inside the cavity. The second end of the adapter tube is connected to the circuit board. The back of the circuit board is attached to the heating mechanism. The second end of the housing is connected to the second connector. A connector is inserted into the second connector. The circuit board is connected to the pressure sensor and the connector respectively via electrical signal transmission lines.

2. The pressure transmitter according to claim 1, characterized in that, The first connector is a stepped reducing column, which includes a first part, a second part, and a third part connected in sequence with their radii decreasing sequentially. The first part is located outside the first end of the adapter tube, the outer wall of the second part is press-fitted with the inner wall of the adapter tube and the second part is sleeved on the first end of the adapter tube, and the third part is located inside the adapter tube and sleeved on the pressure sensor. A sealing ring is provided between the outer wall of the second part and the inner wall of the adapter pipe, and a sealing ring is provided between the outer wall of the second end of the adapter pipe and the inner wall of the housing. The inner wall of the housing is lined with thermal insulation cotton.

3. The pressure transmitter according to claim 1, characterized in that, The circuit board is equipped with a controller, a temperature sensor, a humidity sensor, a pressure signal acquisition and conditioning module, a humidity signal acquisition and conditioning unit, and a PWM signal transmitter. The pressure sensor is communicatively connected to the controller via a pressure signal acquisition conditioner. The temperature sensor is communicatively connected to the controller via a temperature signal acquisition conditioner; The humidity sensor is communicatively connected to the controller via the humidity signal acquisition and conditioning unit; The heating mechanism and the PWM signal transmitter are respectively connected to the controller for communication.

4. The pressure transmitter according to claim 3, characterized in that, The circuit board is also equipped with a start-up preheating controller, which is connected to the heating mechanism.

5. The pressure transmitter according to claim 4, characterized in that, The circuit board also includes a power supply, which is electrically connected to the controller, the pressure signal acquisition and conditioning module, the humidity signal acquisition and conditioning unit, the PWM signal transmitter, and the power-on preheating controller.

6. The pressure transmitter according to claim 1, characterized in that, The heating mechanism includes a PI heating film.

7. The pressure transmitter according to claim 1, characterized in that, The heating mechanism includes a heat-spreading layer and a PI heating film stacked sequentially on the back of the circuit board.

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