Heat dissipation computer case

Abstract

The utility model relates to the technical field of computers, in particular to a heat dissipation computer case which comprises a case body and a mainboard, the case body comprises a top plate, a bottom plate, a front plate, a back plate, a first side plate and a second side plate, the mainboard is located between the first side plate and the second side plate, and one side of the mainboard is integrally bent to form an obliquely-arranged installation frame. The mounting frame is provided with a plurality of blowing fans, an air inlet space is formed among the first side plate, the front plate and the mounting frame, the first side plate is provided with a first air inlet net plate, the first air inlet net plate is arranged corresponding to the air inlet space, the mounting frame, the front plate, the second side plate, the back plate, the mainboard, the top plate and the bottom plate define an air channel, the back plate is provided with an air outlet net plate, and the air outlet net plate is arranged corresponding to the air inlet space. The air outlet end of the air channel corresponds to the air outlet screen plate, and the blowing fan faces the air inlet end of the air channel. According to the mainboard, the inclined mounting frame is integrally formed on the mainboard, and the blowing fan is mounted on the mainboard, so that the blowing fan is obliquely arranged, stable heat dissipation airflow can be formed in the box body, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a heat-dissipating computer chassis. Background Technology

[0002] As a component of a computer, the computer case is primarily used to house and secure various electronic components, such as the motherboard module, providing support and protection. Since the electronic components inside the computer case generate heat during operation, if this heat cannot be dissipated quickly enough, the components will operate at high temperatures for extended periods, potentially causing damage. To address this issue, fans are typically installed inside the computer case for ventilation. A Chinese patent application (application number 201920345677.7) discloses a transparent, seamless computer case, comprising a chassis body including a top panel, bottom panel, back panel, and motherboard, as well as a front panel. A cover A is located opposite the motherboard. The computer components inside the case are fixed to one side of the motherboard, forming a cavity between the cover A and the motherboard. The upper end of the front panel is fixed to the end of the top panel, and the lower end of the front panel is fixed to... The bottom panel has its upper end fixed to the side of the top panel, and its lower end fixed to the side of the bottom panel. The side of the front panel is in contact with the side of the cover plate A. Both the front panel and the cover plate A are light-transmitting panels. Cooling radiator assemblies are provided on the top panel, bottom panel, and back panel. A cooling radiator assembly is fixed to the side of the motherboard. A cooling fan is mounted on the cooling radiator assembly, blowing air outwards from the chassis. The cooling fan has an LED strip. A cover plate B is mounted on the outer surface of the motherboard, and the cover plate B has an air inlet. In this patent document, the cooling fan and cover plate A are directly opposite each other. The airflow from the cooling fan impacts cover plate A perpendicularly, causing some airflow to bounce back to the cooling fan. This results in unstable / turbulent airflow inside the computer chassis, hindering heat dissipation and leading to insufficient cooling performance. This necessitates adding more cooling fans in multiple locations within the computer chassis, increasing costs. Therefore, the defects are obvious, and a solution is urgently needed. Utility Model Content

[0003] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a heat-dissipating computer case.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A heat-dissipating computer case includes a case body and a motherboard installed inside the case body for mounting a motherboard module. The case body includes a top plate, a bottom plate, a front plate, a back plate, a first side plate, and a second side plate. The motherboard is located between the first side plate and the second side plate. One side of the motherboard is integrally bent into an inclined mounting frame, which is equipped with a plurality of fans. An air intake space is formed between the first side plate, the front plate, and the mounting frame. The first side plate is provided with a first air intake grille, which is correspondingly arranged with the air intake space. The mounting frame, the front plate, the second side plate, the back plate, the motherboard, the top plate, and the bottom plate form an air duct. The back plate is provided with an air exhaust grille, and the air exhaust end of the air duct is correspondingly arranged with the air exhaust grille. The fans face the air intake end of the air duct.

[0006] Furthermore, a cavity is formed between the motherboard and the first side plate, and the motherboard module mounted on the motherboard is housed within the cavity.

[0007] Furthermore, the cavity is connected to the air inlet space, and the first side plate is provided with a second air inlet mesh plate, which is correspondingly arranged with the cavity.

[0008] Furthermore, an exhaust fan is embedded in the air outlet grille.

[0009] Furthermore, an arc-shaped air guide plate is provided at the angle between the front panel and the second side panel.

[0010] Furthermore, the motherboard has heat dissipation holes that communicate with the air duct.

[0011] The beneficial effects of this invention are as follows: In practical applications, outside air forms an airflow under the action of the fan and is blown into the air duct. The airflow within the duct carries away the heat generated by the motherboard module as it passes through the motherboard and is then blown out from the exhaust grille to dissipate heat from inside the computer case. Because the fan is angled, the airflow from the fan impacts the second side panel at an angle. The obstruction of the second side panel causes the airflow to change direction and flow along the air duct, resulting in smooth airflow within the computer case and efficient heat dissipation. Compared to traditional fans that face the second side panel directly, this fan's airflow impacts the second side panel perpendicularly, causing some airflow to bounce back towards the fan. This bounced airflow conflicts with the fan's airflow, creating turbulent airflow within the computer case and hindering efficient heat dissipation. This invention, by integrally molding an angled mounting frame on the motherboard and mounting the fan on the frame, achieves an angled fan setup, thereby creating a stable airflow within the case and improving heat dissipation. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0013] Figure 2 This is a three-dimensional structural diagram of the present invention after the second side panel and the front panel are hidden.

[0014] Figure 3 This is a three-dimensional structural diagram of the present invention after the first side plate is hidden.

[0015] Figure 4 This is a three-dimensional structural diagram of the motherboard of this utility model.

[0016] Figure 5 This is a three-dimensional structural diagram of the present invention after the top plate is hidden.

[0017] Explanation of reference numerals in the attached figures:

[0018] 1. Cabinet; 2. Mainboard; 3. Top plate; 4. Bottom plate; 5. Front plate; 6. Back plate; 7. First side plate; 8. Second side plate; 9. Mounting frame; 10. Fan; 11. Air inlet space; 12. First air inlet grille; 13. Air duct; 14. Air outlet grille; 15. Chamber; 16. Second air inlet grille; 17. Heat dissipation holes. Detailed Implementation

[0019] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0020] like Figures 1 to 5 As shown, this utility model provides a heat dissipation computer case, which includes a case body 1 and a motherboard 2 installed inside the case body 1 for mounting the motherboard module. The case body 1 includes a top plate 3, a bottom plate 4, a front plate 5, a back plate 6, a first side plate 7, and a second side plate 8. The motherboard 2 is located between the first side plate 7 and the second side plate 8. One side of the motherboard 2 is integrally bent into an inclined mounting frame 9, and the mounting frame 9 is equipped with a plurality of fans 10. The first side plate 7, the front plate 5, and the mounting frame 8 are connected. An air intake space 11 is formed between the frames 9. The first side plate 7 is provided with a first air intake mesh plate 12, which is correspondingly arranged with the air intake space 11. The mounting frame 9, front plate 5, second side plate 8, back plate 6, main board 2, top plate 3 and bottom plate 4 are arranged to form an air duct 13. The back plate 6 is provided with an air outlet mesh plate 14. The air outlet end of the air duct 13 is correspondingly arranged with the air outlet mesh plate 14. The blower 10 faces the air intake end of the air duct 13 and is inclined relative to the second side plate 8.

[0021] In practical applications, ambient air is drawn into the air duct 13 by the fan 10, carrying away heat generated by the motherboard module as it passes the motherboard 2. The airflow is then expelled from the exhaust grille 14 to dissipate heat from inside the computer case. Because the fan 10 is angled, the airflow from it impacts the second side panel 8 at an angle. The second side panel 8 obstructs the airflow, causing it to change direction and flow along the air duct 13, resulting in smooth airflow within the computer case and efficient heat dissipation. In contrast to a traditional fan 10 directly facing the second side panel 8, this fan 10's airflow impacts the second side panel 8 perpendicularly, causing some airflow to bounce back towards the fan 10. This bounced airflow clashes with the fan 10's airflow, creating turbulent airflow within the computer case and hindering efficient heat dissipation. This invention integrates an inclined mounting frame 9 on the motherboard 2 and mounts the fan 10 on the mounting frame 9, so that the fan 10 is tilted, thereby forming a stable heat dissipation airflow inside the housing 1 and improving the heat dissipation effect.

[0022] In this embodiment, a cavity 15 is formed between the motherboard 2 and the first side plate 7. The motherboard module installed on the motherboard 2 is housed in the cavity 15. The first side plate 7 covers the motherboard module on the motherboard 2, resulting in an aesthetically pleasing appearance. Furthermore, the motherboard module is housed in the cavity 15, making the structure compact.

[0023] In this embodiment, the cavity 15 is connected to the air inlet space 11, and the first side plate 7 is provided with a second air inlet mesh plate 16, which is correspondingly arranged with the cavity 15. When the blower 10 blows airflow into the air duct 13, the air in the cavity 15 will be drawn into the air duct 13 by the blower 10 through the air inlet space 11, so as to remove the heat generated by the motherboard module in the cavity 15, further improving the heat dissipation effect.

[0024] In this embodiment, an exhaust fan is embedded in the air outlet mesh plate 14. While the blower fan 10 blows air into the air duct 13, the exhaust fan draws the air out of the air duct 13 and blows it out into the external environment, further improving the stability of the airflow and making the airflow speed faster.

[0025] In this embodiment, an arc-shaped air guide plate is provided at the angle between the front plate 5 and the second side plate 8, with the center of the arc-shaped air guide plate facing the air passage 13. The arc-shaped air guide plate guides the airflow blown out by the fan 10, which helps to make the airflow in the air passage 13 more stable and faster.

[0026] In this embodiment, the motherboard 2 has heat dissipation holes 17 that communicate with the air duct 13. The heat dissipation holes 17 facilitate the efficient removal of heat generated by the motherboard module by the airflow within the air duct 13, resulting in better heat dissipation.

[0027] All technical features in this embodiment can be freely combined according to actual needs.

[0028] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A heat-dissipating computer case, comprising a case body (1) and a motherboard (2) installed inside the case body (1) for mounting a motherboard module, the case body (1) comprising a top plate (3), a bottom plate (4), a front plate (5), a back plate (6), a first side plate (7) and a second side plate (8), the motherboard (2) being located between the first side plate (7) and the second side plate (8), characterized in that: One side of the main board (2) is integrally bent and formed with an inclined mounting frame (9). The mounting frame (9) is equipped with several blowers (10). An air intake space (11) is formed between the first side plate (7), the front plate (5) and the mounting frame (9). The first side plate (7) is provided with a first air intake mesh plate (12). The first air intake mesh plate (12) is correspondingly set with the air intake space (11). The mounting frame (9), the front plate (5), the second side plate (8), the back plate (6), the main board (2), the top plate (3) and the bottom plate (4) surround an air duct (13). The back plate (6) is provided with an air outlet mesh plate (14). The air outlet end of the air duct (13) is correspondingly set with the air outlet mesh plate (14). The blowers (10) face the air inlet end of the air duct (13).

2. The heat dissipation computer case according to claim 1, characterized in that: A cavity (15) is formed between the motherboard (2) and the first side plate (7), and the motherboard module installed on the motherboard (2) is housed in the cavity (15).

3. A heat-dissipating computer case according to claim 2, characterized in that: The cavity (15) is connected to the air inlet space (11), and the first side plate (7) is provided with a second air inlet mesh plate (16), which is correspondingly provided with the cavity (15).

4. A heat-dissipating computer case according to claim 1, characterized in that: An exhaust fan is embedded in the air outlet mesh panel (14).

5. A heat-dissipating computer case according to claim 1, characterized in that: An arc-shaped air guide plate is provided at the angle between the front plate (5) and the second side plate (8).

6. A heat-dissipating computer case according to claim 1, characterized in that: The motherboard (2) has heat dissipation holes (17) that communicate with the air passage (13).

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