Socket for high-frequency signal transmission and chip aging test device

Abstract

The utility model relates to a socket used for high frequency signal transmission and a chip aging test device, the socket comprises a supporting part and a plurality of signal pins, the supporting part comprises a conductive block and an insulating film, the surface of the conductive block is provided with a plurality of grounding holes and a plurality of signal holes in a penetrating manner, the inner wall of each signal hole is provided with a first insulating layer, and the first insulating layer is provided with a second insulating layer. The conductive block is provided with the insulating films at the two sides of the ports of the grounding hole and the signal hole; the plurality of signal pins are respectively arranged in the grounding hole and the signal hole in a penetrating manner, and the two ends of each signal pin are arranged in a manner of penetrating through the insulating film. By arranging the insulating layer on the inner wall of the signal hole, electrical insulation and mechanical support can be realized, the inner conductor is ensured to be centered, and characteristic impedance is controlled; and secondly, through the insulating films at the top and the bottom, short circuit can be prevented, the performance of a power distribution network (PDN) can be improved, parasitic parameters are reduced, impedance matching is optimized, electromagnetic leakage is inhibited, and interference coupling is reduced.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit testing technology, and in particular to a socket and chip aging test device for high-frequency signal transmission. Background Technology

[0002] Chip test sockets are widely used in the semiconductor industry, especially after chip packaging, to comprehensively test the chip's functionality, performance, and reliability by simulating real-world working environments. These tests include functional testing, performance testing, reliability testing, and aging testing. The socket used for testing chips is commonly referred to as a chip test socket or IC socket; it is a precision device used for electrical performance testing.

[0003] Based on the different frequencies of the transmitted signals, test sockets can be divided into ordinary sockets and coaxial sockets. Ordinary sockets are suitable for the transmission of low-frequency and low-speed signals, while coaxial sockets are suitable for the transmission of high-frequency and high-speed signals and for scenarios with complex electromagnetic environments.

[0004] Existing coaxial sockets typically consist of two parts, upper and lower, with a signal pin running through the middle. Signal transmission is achieved by the signal pin contacting the pins on the chip surface. Because the socket body is made of conductive material, short circuits can easily occur when the probe contacts the socket body during use. Furthermore, electromagnetic leakage and signal interference are prone to occur during signal transmission. Utility Model Content

[0005] Therefore, the technical problem to be solved by this utility model is to overcome the defects of the coaxial socket in the prior art, which is prone to short circuit and electromagnetic leakage and signal interference during signal transmission.

[0006] To solve the above-mentioned technical problems, this utility model provides a socket for high-frequency signal transmission, comprising:

[0007] The support includes a conductive block and an insulating film. The surface of the conductive block is provided with multiple grounding holes and multiple signal holes. The inner wall of the signal holes is provided with a first insulating layer. The insulating film is provided on both sides of the ports of the grounding holes and signal holes on the conductive block.

[0008] Multiple signal pins are respectively inserted into the grounding hole and the signal hole, and both ends of the signal pins are inserted through the insulating film.

[0009] In one embodiment of the present invention, a second insulating layer is provided at both ports of the signal hole, and the second insulating layer is disposed between the insulating film and the conductive block.

[0010] In one embodiment of this utility model, the first insulating layer and the second insulating layer are integrally formed.

[0011] In one embodiment of this utility model, the insulating film and the conductive block are connected by pressure-sensitive adhesive.

[0012] In one embodiment of the present invention, the signal needle includes a first probe, a second probe, and a spring, one end of the first probe is connected to the second probe, and the spring is sleeved on the outside of the first probe and the second probe.

[0013] In one embodiment of the present invention, a first slot is provided at one end of the first probe connected to the second probe, and a second slot is provided at one end of the second probe connected to the first probe. The first slot is engaged in the second slot, and the first slot is perpendicular to the second slot.

[0014] In one embodiment of this utility model, a first probe is provided at the end of the first probe away from the second probe, and a second probe is provided at the end of the second probe away from the first probe. The insulating film has mounting holes that cooperate with the first probe and the second probe.

[0015] In one embodiment of this utility model, the diameter of the mounting hole is smaller than the diameter of the grounding hole and the signal hole.

[0016] In one embodiment of this utility model, protrusions are provided on both sides of the first probe, and the two ends of the spring are engaged between the protrusions and the insulating film.

[0017] A chip aging test apparatus includes the aforementioned socket for high-frequency signal transmission.

[0018] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0019] The present invention discloses a socket and chip aging test device for high-frequency signal transmission. By setting an insulating layer on the inner wall of the signal hole, electrical insulation and mechanical support can be achieved, ensuring that the inner conductor is centered and controlling the characteristic impedance. Secondly, the insulating films at the top and bottom can prevent short circuits and improve the performance of the power distribution network (PDN), reduce parasitic parameters, optimize impedance matching, suppress electromagnetic leakage, and reduce interference coupling. Attached Figure Description

[0020] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a cross-sectional view of the internal structure of this utility model;

[0023] Figure 3 for Figure 2 A partial structural diagram at point A in the middle;

[0024] Figure 4 for Figure 1 A schematic diagram of the structure of the signal needle;

[0025] Figure 5 for Figure 4 A schematic diagram of the structure of the first probe in the middle;

[0026] Figure 6 for Figure 4 A schematic diagram of the structure of the second probe in the middle;

[0027] Explanation of reference numerals in the accompanying drawings: 1. Conductive block; 2. Signal pin; 3. Insulating film; 4. Pressure-sensitive adhesive; 11. Signal hole; 12. Grounding hole; 21. First probe; 22. Second probe; 23. Spring; 31. Mounting hole; 111. First insulating layer; 112. Second insulating layer; 211. First probe; 212. First slot; 213. Protrusion; 221. Second probe; 222. Second slot. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention. Example 1

[0029] Reference Figures 1-6 As shown, this utility model discloses a socket for high-frequency signal transmission, comprising:

[0030] The support part includes a conductive block 1 and an insulating film 3. The surface of the conductive block 1 is provided with a plurality of grounding holes 12 and a plurality of signal holes 11. The inner wall of the signal hole 11 is provided with a first insulating layer 111. The insulating film 3 is provided on both sides of the port of the grounding hole 12 and the signal hole 11 of the conductive block 1.

[0031] Multiple signal pins 2 are respectively inserted into the grounding hole 12 and the signal hole 11, and both ends of the signal pins 2 are inserted through the insulating film 3.

[0032] In this invention, the conductive block 1 in the support section provides an installation and support structure, protects the internal signal pins 2 and electroplated layer from physical damage, and ensures that the signal path does not deviate or short-circuit. Specifically, the conductive block 1 is made of conductive metal and has multiple grounding holes 12 and multiple signal holes 11 inside. Each grounding hole 12 and signal hole 11 has a signal pin 2 inserted for signal conduction and transmission. The conductive block 1 forms a closed conductive shielding layer for the signal pins 2, preventing electromagnetic waves from leaking to the outside and also preventing external electromagnetic interference (EMI) from entering the signal transmission path.

[0033] In this invention, a first insulating layer 111 is provided on the inner wall of the signal hole 11. Firstly, it separates the signal needle 2 from the conductive block 1, preventing the signal needle 2 from directly contacting the conductive block 1, thereby avoiding a short circuit. Secondly, the first insulating layer 111 can fix the signal needle 2 in the center, preventing it from shifting or contacting the conductive block 1, and maintaining the geometric stability of the coaxial structure.

[0034] Furthermore, insulating films 3 are provided on both sides of the ports of the grounding hole 12 and the signal hole 11 of the conductive block 1. In some high-frequency and power transmission applications, the insulating films 3 at the top and bottom can prevent power noise from leaking to the outside through electromagnetic coupling, improving the stability of the power transmission network. The insulating films 3 can also prevent external electromagnetic interference from coupling with the internal signal through the top or bottom, protecting the signal integrity and further reducing signal interference. Secondly, in high-frequency circuits, the parasitic capacitance between the inner and outer conductors can affect signal transmission and increase signal loss. Adding insulating films 3 can introduce additional electrical isolation at the top and bottom, helping to reduce local parasitic capacitance, especially in critical contact areas. In addition, by adding insulating films 3 at the top and bottom, the geometry of the coaxial structure can be further stabilized, impedance consistency can be improved, and reflections and standing waves caused by discontinuities can be reduced. The insulating films 3 at the top and bottom, in conjunction with the conductive block 1, can reduce the leakage of high-frequency electromagnetic waves to the outside through both ends, improving the overall electromagnetic shielding effect. The insulating films 3 can prevent external electromagnetic interference from coupling with the internal signal through the top or bottom, protecting the signal integrity, which is especially important in high-speed signal transmission.

[0035] In this invention, by setting an insulating layer on the inner wall of the signal hole 11, electrical insulation and mechanical support can be achieved, ensuring that the inner conductor is centered and controlling the characteristic impedance; secondly, the insulating films 3 at the top and bottom can prevent short circuits and improve the performance of the power distribution network (PDN), reduce parasitic parameters, optimize impedance matching, suppress electromagnetic leakage and reduce interference coupling.

[0036] Furthermore, a second insulating layer 112 is provided at both ports of the signal hole 11, and the second insulating layer 112 is disposed between the insulating film 3 and the conductive block 1. The first insulating layer 111 and the second insulating layer 112 are integrally formed.

[0037] Specifically, in this invention, a second insulating layer 112 is provided at the port of the grounding hole 12, and the first insulating layer 111 and the second insulating layer 112 are integrally formed. The entire insulating layer extends from the inside of the hole to the outside, which firstly improves the reliability of the insulation effect. Secondly, in high-speed signal transmission, parasitic capacitance and parasitic inductance can cause high-frequency interference. The extended insulating layer helps to reduce these parasitic effects and improve the signal's anti-interference capability.

[0038] As a preferred embodiment of the present invention, the first insulating layer 111 and the second insulating layer 112 are attached to the inner wall of the signal hole 11 by a deposition process, and their main components are one of (CVD) silicon oxide, nitrogen oxide and aluminum oxide zirconium oxide.

[0039] Furthermore, the insulating film 3 and the conductive block 1 are connected by pressure-sensitive adhesive 4.

[0040] Specifically, in actual production, after applying the first insulating layer 111 and the second insulating layer 112 to the grounding hole 12, pressure-sensitive adhesive 4 is applied to the surfaces of both sides of the conductive block 1, and the insulating film 3 is fixed to both sides of the conductive block 1 by the pressure-sensitive adhesive 4. As a preferred embodiment of this utility model, the insulating film 3 can also be fixed by bolt connection, adhesive tape containing adhesive, rivets, or ultrasonic welding, etc.

[0041] Furthermore, the signal needle 2 includes a first probe 21, a second probe 22, and a spring 23. One end of the first probe 21 is connected to the second probe 22, and the spring 23 is sleeved on the outside of the first probe 21 and the second probe 22.

[0042] In this application, the signal pin 2 needs to ensure a stable contact load and contact formation with the integrated circuit. Specifically, the signal pin 2 structure includes a first probe 21, a second probe 22 and a spring 23. The spring 23 is located between the first probe 21 and the second probe 22. The whole structure is a three-section structure, which can adapt to smaller socket structures. Secondly, the tension force that the spring 23 can provide ensures stable contact between the signal pin 2 and the product.

[0043] Furthermore, a first slot 212 is provided at the end where the first probe 21 connects to the second probe 22, and a second slot 222 is provided at the end where the second probe 22 connects to the first probe 21. The first slot 212 is engaged within the second slot 222, and the first slot 212 is perpendicular to the second slot 222. A first probe 211 is provided at the end of the first probe 21 away from the second probe 22, and a second probe 221 is provided at the end of the second probe 22 away from the first probe 21. The insulating film 3 has mounting holes 31 that mate with the first probe 211 and the second probe 221.

[0044] Specifically, one end of the first slot 212 of the first probe 21 is connected to one end of the second slot 222 of the second probe 22, and the two are installed perpendicular to each other. After assembly, the probes at both ends of the entire signal needle 2 extend out of the mounting holes 31 of the insulating film 3.

[0045] In this invention, the insulating film 3 can also provide limiting support for the signal needle 2. Specifically, the first probe 211 has protrusions 213 on both sides, and the two ends of the spring 23 are engaged between the protrusions 213 and the insulating film 3, so that the extension and retraction of the signal needle 2 can be achieved by the tension of the spring 23.

[0046] Furthermore, the diameter of the mounting hole 31 is smaller than the diameter of the grounding hole 12 and the signal hole 11.

[0047] Specifically, the insulating film 3 can act as an encapsulation part of the signal pin 2, preventing dust, moisture or other contaminants from entering the coaxial structure, protecting the internal signal transmission path, and extending the service life of the device. Example 2

[0048] A chip aging test apparatus includes the aforementioned socket for high-frequency signal transmission.

[0049] In summary, this utility model introduces a socket and chip aging test device for high-frequency signal transmission, suitable for high-frequency signal transmission scenarios. First, the conductor block forms a closed conductive shielding layer for the internal signal pin 2, preventing electromagnetic waves from leaking to the outside and also preventing external electromagnetic interference (EMI) from entering the signal transmission path, thus ensuring signal integrity. By setting an insulating layer on the inner wall of the signal hole 11, electrical insulation and mechanical support can be achieved, ensuring the inner conductor is centered and controlling the characteristic impedance. Secondly, the insulating films 3 at the top and bottom can prevent short circuits and improve the performance of the power distribution network (PDN), reduce parasitic parameters, optimize impedance matching, suppress electromagnetic leakage, and reduce interference coupling.

[0050] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A socket for high-frequency signal transmission, characterized in that, include: The support includes a conductive block and an insulating film. The surface of the conductive block is provided with multiple grounding holes and multiple signal holes. The inner wall of the signal holes is provided with a first insulating layer. The insulating film is provided on both sides of the ports of the grounding holes and signal holes on the conductive block. Multiple signal pins are respectively inserted into the grounding hole and the signal hole, and both ends of the signal pins are inserted through the insulating film.

2. The socket for high-frequency signal transmission according to claim 1, characterized in that: A second insulating layer is provided at both ports of the signal hole, and the second insulating layer is disposed between the insulating film and the conductive block.

3. The socket for high-frequency signal transmission according to claim 2, characterized in that: The first insulating layer and the second insulating layer are integrally formed.

4. The socket for high-frequency signal transmission according to claim 1, characterized in that: The insulating film and the conductive block are connected by pressure-sensitive adhesive.

5. The socket for high-frequency signal transmission according to claim 1, characterized in that: The signal needle includes a first probe, a second probe, and a spring. One end of the first probe is connected to the second probe, and the spring is sleeved on the outside of the first probe and the second probe.

6. The socket for high-frequency signal transmission according to claim 5, characterized in that: The first probe is provided with a first slot at one end where it is connected to the second probe, and the second probe is provided with a second slot at one end where it is connected to the first probe. The first slot is engaged in the second slot, and the first slot is perpendicular to the second slot.

7. The socket for high-frequency signal transmission according to claim 5, characterized in that: The first probe is provided with a first probe at the end of the first probe away from the second probe, and the second probe is provided with a second probe at the end of the second probe away from the first probe. The insulating film has mounting holes that cooperate with the first probe and the second probe.

8. The socket for high-frequency signal transmission according to claim 7, characterized in that: The diameter of the mounting hole is smaller than the diameter of the grounding hole and the signal hole.

9. The socket for high-frequency signal transmission according to claim 7, characterized in that: The first probe has protrusions on both sides, and the two ends of the spring are engaged between the protrusions and the insulating film.

10. A chip aging test apparatus, characterized in that, Includes a socket for high-frequency signal transmission as described in any one of claims 1-9.

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