Printed circuit board (PCB) capable of improving scratches and high-current electric product

Abstract

The utility model relates to a printed circuit board (PCB) capable of improving scratches and a high-current electric product, the PCB capable of improving scratches is provided with a protection area on a first outer layer board and / or a second outer layer board, and at least one protection piece is arranged in the protection area, so that the PCB is prevented from being scratched in the transfer process of the PCB production stage, the production efficiency is improved, and the production cost is reduced. Therefore, the risk that the circuit on the edge of the PCB is broken and tilted is reduced, and the yield of the PCB is improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing technology, specifically to a PCB board with improved scratch resistance and a high-current power supply product. Background Technology

[0002] With increasing market demand for high-current products, PCB designs using thicker outer copper (2oz) boards are becoming more common, increasing weight by approximately 30% compared to standard copper-thickness (1oz) boards. Currently, automotive products primarily utilize a semi-green ink design. At this weight, the solder mask layer on the PCB is extremely susceptible to scratches during any operation in the manufacturing process. The lack of protection along the board edges also makes them prone to breakage and damage, affecting product quality and resulting in significant internal scrap losses. Utility Model Content

[0003] In view of the above problems, this utility model provides a PCB board and high-current electrical products with improved scratch resistance, which solves the problem that in the prior art, the solder mask layer of heavy PCB boards is easily scratched during any operation in the production process. The lack of protection for the circuitry along the board edges also makes them prone to breakage and damage, affecting product quality and causing significant internal scrap losses.

[0004] According to one aspect of the present invention, a PCB board with improved scratch resistance is provided, comprising a PCB motherboard, the PCB motherboard including a first outer layer board, a second outer layer board and at least one inner layer board; the inner layer board is connected and disposed between the first outer layer board and the second outer layer board;

[0005] The outer side of the first outer layer and / or the outer side of the second outer layer are provided with a protective area, and at least one protective component is provided in the protective area to prevent the PCB board surface from being scratched during the production and transfer process.

[0006] In some alternative embodiments, the protected area has a first copper cladding layer, the copper thickness of which is greater than or equal to the outer layer circuit copper thickness of the first outer layer board and / or the second outer layer board.

[0007] In some optional embodiments, the protected area is further provided with a first solder resist layer, which is disposed on the outer surface of the first copper-clad layer; the ink thickness of the first solder resist layer is greater than or equal to the ink thickness of the solder resist layer of the first outer layer and / or the second outer layer.

[0008] In some alternative embodiments, the protective element is disposed on the outer surface of the first copper-clad layer or the first solder resist layer, and the height of the protective element is higher than the height of the molded surface of the first outer layer or the second outer layer.

[0009] In some alternative embodiments, the protective element is a white ink block formed by printing text on a first outer layer or a second outer layer.

[0010] In some optional embodiments, the cross-section of the protective area is elliptical, and a plurality of the protective elements are evenly distributed within the protective area.

[0011] In some alternative embodiments, the protective element is formed by multi-layer printing based on different textual materials, creating a protective array with a high center and low perimeter in the protective area.

[0012] In some optional embodiments, the protective element has a size of 1mm*1mm.

[0013] In some optional embodiments, when there are multiple protective areas, the multiple protective areas are disposed on the outside of the first outer layer plate or the second outer layer plate, and each protective area is provided with a protective component.

[0014] According to another aspect of the present invention, a high-current power supply product is provided, including the above-described improved scratch-resistant PCB board.

[0015] The present invention relates to a high-current power supply product for improving scratched PCB boards, the advantages of which are as follows:

[0016] 1. The PCB board with improved scratch resistance provided by this utility model has a protective area on the outer side of the first outer layer board and / or the outer side of the second outer layer board, and at least one protective component is provided in the protective area to prevent the PCB board from being scratched during the transfer process in the PCB board production stage, thereby reducing the risk of broken or misaligned circuits on the board edge and improving the yield of the PCB board.

[0017] 2. The high-current electrical products provided by this utility model protect the outer circuitry of the high-current electrical products by setting a protective area on the PCB board and installing protective components within the protective area. This prevents the thick copper outer circuitry of the high-current electrical products from being broken or bent due to the movement of the PCB board during the production process, thereby improving the production safety of high-current electrical products.

[0018] The above description is merely an overview of the technical solutions of the present utility model embodiments. In order to better understand the technical means of the present utility model embodiments and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present utility model embodiments more obvious and understandable, specific embodiments of the present utility model are described below. Attached Figure Description

[0019] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0020] Figure 1 This invention provides a schematic diagram of a PCB board with improved scratch resistance according to Embodiment 1.

[0021] Figure 2 This invention provides a schematic cross-sectional view of an improved scratch-resistant PCB board according to Embodiment 1.

[0022] Figure 3 A schematic diagram of the PCB board structure of multiple protective areas provided in Embodiment 1 of this utility model is shown;

[0023] Figure 4 A cross-sectional schematic diagram of an improved scratch-resistant PCB board according to Embodiment 2 of this utility model is shown.

[0024] Figure label:

[0025] 1. PCB motherboard; 11. First outer layer board; 12. Inner layer board; 13. Second outer layer board; 14. Outer layer circuitry; 15. Solder mask layer;

[0026] 2. Protected area; 21. Protective component; 22. First copper cladding layer; 23. First solder resist layer. Detailed Implementation

[0027] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein.

[0028] Example 1,

[0029] See Figure 1-3This utility model provides a first embodiment of a scratch-resistant PCB board. This PCB board can be applied to high-current electrical products, which have outer layer circuitry 14 with a thickness much greater than conventional copper. The scratch-resistant PCB board of this utility model provides protection during the PCB board manufacturing process, preventing scratches on the PCB board surface and even damage to the outer layer circuitry 14. The scratch-resistant PCB board of this utility model includes a PCB motherboard 1, which includes a first outer layer board 11, a second outer layer board 13, and at least one inner layer board 12. The inner layer board 12 is connected and disposed between the first outer layer board 11 and the second outer layer board 13. In this embodiment, the first outer layer board 11, the second outer layer board 13, and at least one inner layer board 12 are fixed by lamination, and the routing of the inner layer circuitry and outer layer circuitry 14 of the first outer layer board 11, the second outer layer board 13, and at least one inner layer board 12 is manufactured according to the functional design of the PCB board.

[0030] Specifically, a protective area 2 is provided on the outer side of the first outer layer 11 and / or the outer side of the second outer layer 13, and at least one protective element 21 is provided in the protective area 2 to prevent the PCB board from being scratched during the transfer process in the PCB board production stage. The PCB board with improved scratch resistance provided by this utility model, by providing a protective area 2 on the first outer layer 11 and / or the second outer layer 13, and providing at least one protective element 21 in the protective area 2, prevents the PCB board from being scratched during the transfer process in the PCB board production stage, thereby reducing the risk of broken or misaligned circuits on the board edge and improving the yield rate of the PCB board.

[0031] Example 2:

[0032] Based on Embodiment 1, this utility model provides a second embodiment of an improved PCB board for scratch protection, and further explains the protective area 2 through this embodiment.

[0033] In some optional embodiments, the protective area 2 has a first copper cladding layer 22, the copper thickness of which is greater than or equal to the copper thickness of the outer layer circuitry 14 of the first outer layer board 11 and / or the second outer layer board 13. In this embodiment, the first copper cladding layer 22 can be fabricated according to the outer layer data of the first outer layer board 11 and / or the second outer layer board 13, so that the first copper cladding layer 22 and the outer layer circuitry 14 are formed in the same process; this not only ensures that the thickness of the first copper cladding layer 22 is greater than or equal to the copper thickness of the outer layer circuitry 14 of the first outer layer board 11 and / or the second outer layer board 13, but also protects the outer layer circuitry 14 immediately after the outer layer circuitry 14 of the first outer layer board 11 and / or the second outer layer board 13 is fabricated; thereby achieving protection of the PCB board surface during the PCB board production process.

[0034] Specifically, the fabrication process of the outer layer circuit 14 of the PCB board is as follows: Contaminants on the copper surface of the PCB board are removed and the roughness and contact area of ​​the copper surface are increased through cleaning, deoxidation, and roughening treatment. A photosensitive dry film is tightly adhered to the copper foil surface of the PCB board using a hot-pressing method. Strong light irradiation causes the photosensitive material on the dry film to undergo a polymerization reaction, thereby transferring the circuit pattern from the film to the copper foil dry film. The unpolymerized dry film is washed away using a weak alkaline solution, such as sodium carbonate solution, to develop the desired circuit pattern and expose the unwanted parts of the copper foil. A strong alkaline solution, such as sodium hydroxide solution, is used to wash away the photopolymerized dry film, exposing the final outer layer circuit 14 and the first copper cladding layer 22.

[0035] In some optional embodiments, the protective area 2 is further provided with a first solder resist layer 23, which is disposed on the outer surface of the first copper-clad layer 22; the ink thickness of the first solder resist layer 23 is greater than or equal to the ink thickness of the solder resist layer 15 of the first outer layer 11 and / or the second outer layer 13. In this embodiment, the first solder resist layer 23 can be formed together with the solder resist layer 15 of the PCB board during the solder resist process to ensure that the height of the first solder resist layer 23 is greater than or equal to the ink thickness of the solder resist layer 15 of the first outer layer 11 and / or the second outer layer 13.

[0036] Specifically, the first solder resist layer 23 and the solder mask layer 15 are manufactured through the following steps: Using appropriate cleaning agents and tools, such as a solder resist sandblasting machine, oxides, grease, and other impurities on the PCB board surface are removed. The surface roughness is increased by mechanical scraping, brushing, or sandblasting to improve the adhesion between the solder resist and the board surface. Solder resist ink is evenly coated onto the PCB board surface using methods such as screen printing, spray printing, curtain printing, or roller printing. The printed PCB board is placed in a pre-baking oven, and appropriate baking temperature and time are set according to the ink type and process requirements. The pre-baked PCB board is placed in an exposure machine, and appropriate exposure time and energy are used to ensure clear and accurate transfer of the pattern to the board surface. The exposed PCB board is placed in a developing machine, and appropriate developing solution, temperature, and spray pressure are used to ensure good developing results. The developed PCB board is inspected for quality using microscopes, AOI (Automated Optical Inspection) equipment, and other inspection equipment. Defects and poor locations found during inspection are repaired using appropriate repair tools and materials. The inspected and qualified PCB boards are placed in a post-baking oven, and cured at an appropriate temperature and time according to the ink type and process requirements. Through the above steps, the first solder resist layer 23 and the solder mask layer 15 are produced.

[0037] In some optional embodiments, the protective element 21 is disposed on the outer surface of the first copper-clad layer 22 or the first solder resist layer 23, and the height of the protective element 21 is higher than the height of the molded surface of the first outer layer board 11 or the second outer layer board 13. In this embodiment, when the PCB board needs to be protected by a solder resist process, the first solder resist layer 23 is disposed on the outer surface of the first copper-clad layer of the protected area 2 so that the base height of the protected area 2 is higher than or equal to the surface of the PCB board; when the protective element 21 is disposed on the first solder resist layer 23, it can be ensured that the protective plate protrudes from the surface of the PCB board to protect the solder resist layer 15 and the outer layer circuit 14 of the PCB board. If the PCB board does not need to be protected by a solder resist process, the protective element 21 can be directly fabricated on the first copper-clad layer so that the protective element 21 is higher than the surface of the PCB board.

[0038] In some alternative embodiments, the protective element 21 is a white ink block formed by printing text on the first outer layer 11 or the second outer layer 13. The protective element 21 can be formed together with other text on the PCB board in the same step as the text step, so as to protect the PCB board in the text step and subsequent forming steps.

[0039] Specifically, the manufacturing steps of the protective component 21 are as follows: A stencil is made based on the text information; screen printing is performed by screen printing the text stencil onto a multilayer PCB board, forming text ink on the multilayer PCB board; baking is performed by placing the multilayer PCB board in a baking device to cure the text ink. This forms the protective component 21 on the PCB board. Simultaneously, a white ink block of a specific thickness can also be formed on the PCB board through multilayer screen printing.

[0040] In a specific example, the cross-section of the protective area 2 is elliptical, and multiple protective components 21 are evenly distributed within the protective area 2. The protective components 21 are formed by multi-layer printing based on different textual materials, creating a protective array in the protective area 2 that is higher in the center and lower around the edges. The size of the protective component is 1mm*1mm. In this embodiment, the protective components 21 of the protective area 2 can be formed by multiple printing processes based on textual materials, giving the protective components 21 a specific shape and height to achieve protection of the PCB board. Setting the protective area 2 as an ellipse not only makes full use of the empty space of the PCB board but also allows for the placement of as many protective components 21 as possible within the protective area 2. The elliptical design can fully utilize space to provide better buffering protection for the PCB board.

[0041] In some alternative embodiments, see Figure 3When there are multiple protective areas 2, the multiple protective areas 2 are located on the outer side of the first outer layer plate 11 or the second outer layer plate 13, and each protective area 2 is provided with a protective element 21. In this embodiment, when there are two protective areas 2, the protective areas 2 can be located on the left and right sides or the top and bottom sides of the PCB board surface to protect the PCB board surface. When there are four protective areas 2, the protective areas 2 can be located on the four sides of the PCB board to achieve complete protection of the PCB board. In addition, when there is only one protective area 2, when the PCB board is placed on a flat surface, the surface of the PCB board with the protective element 21 can be lifted up to protect the PCB board surface.

[0042] In some alternative embodiments, see Figure 4 The PCB motherboard 1 includes a first outer layer board 11, a second outer layer board 13, and at least one inner layer board; the inner layer board is connected and disposed between the first outer layer board 11 and the second outer layer board 13. The protective area 2 includes a first copper-clad layer 22, a first solder resist layer 23, and a protective element 21 sequentially disposed on the PCB motherboard. The first copper-clad layer 22 and the first solder resist layer 23 can be fabricated together with the outer layer circuitry 14 and the solder resist layer 15 on the PCB motherboard during PCB manufacturing. Furthermore, there can be multiple protective areas 2, with multiple protective areas respectively disposed on the first outer layer board 11 and the second outer layer board 13 on the upper and lower surfaces of the PCB motherboard, further enhancing the PCB board's scratch resistance.

[0043] Example 3:

[0044] According to another aspect of the present invention, a high-current electrical product is provided, including the aforementioned scratch-resistant PCB board. The high-current electrical product provided by the present invention protects the outer layer circuitry 14 of the high-current electrical product by setting a protective area 2 on the PCB board and installing a protective component 21 within the protective area 2. This prevents the thick copper outer layer circuitry 14 of the high-current electrical product from being broken or bent due to impacts during the transfer and movement of the PCB board during production, thereby improving the production safety of the high-current electrical product.

[0045] Specifically, a protective area 2 is provided on the outer side of the first outer layer 11 and / or the outer side of the second outer layer 13 of the PCB board of a high-current electrical product, and at least one protective element 21 is provided in the protective area 2 to prevent the PCB board from being scratched during the transfer process in the PCB board production stage. The PCB board with improved scratch resistance provided by this utility model, by providing a protective area 2 on the first outer layer 11 and / or the second outer layer 13, and providing at least one protective element 21 in the protective area 2, prevents the PCB board from being scratched during the transfer process in the PCB board production stage, thereby reducing the risk of broken or misaligned circuits on the board edge and improving the yield rate of the PCB board.

[0046] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the present invention may be practiced without these specific details. Similarly, for the sake of brevity and to aid in understanding one or more aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the embodiments of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. The claims, which follow the detailed description, are hereby expressly incorporated into that detailed description, wherein each claim itself constitutes a separate embodiment of the invention.

[0047] Those skilled in the art will understand that the modules in the device of the embodiment can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiment can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components, except that at least some of such features and / or processes or units are mutually exclusive.

[0048] It should be noted that the above embodiments are illustrative of the present invention and not restrictive of it, and those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several systems, several of these systems may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be construed as limiting the order of execution.

Claims

1. A PCB board with improved scratch resistance, characterized in that, The PCB motherboard (1) includes a first outer layer board (11), a second outer layer board (13), and at least one inner layer board (12); the inner layer board (12) is connected and disposed between the first outer layer board (11) and the second outer layer board (13); The outer side of the first outer layer (11) and / or the outer side of the second outer layer (13) are provided with a protective area (2), and at least one protective element (21) is provided in the protective area (2) to prevent the PCB board from being scratched during the production and transfer process.

2. The PCB board with improved scratch resistance according to claim 1, characterized in that, The protective area (2) has a first copper cladding layer (22), the copper thickness of which is greater than or equal to the copper thickness of the outer circuit (14) of the first outer layer board (11) and / or the second outer layer board (13).

3. The PCB board with improved scratch resistance according to claim 2, characterized in that, The protective area (2) is also provided with a first solder resist layer (23), which is disposed on the outer surface of the first copper clad layer (22); the ink thickness of the first solder resist layer (23) is greater than or equal to the ink thickness of the solder resist layer (15) of the first outer layer (11) and / or the second outer layer (13).

4. The PCB board with improved scratch resistance according to claim 2 or 3, characterized in that, The protective component (21) is disposed on the outer surface of the first copper clad layer (22) or the first solder resist layer (23), and the height of the protective component (21) is higher than the height of the molded surface of the first outer layer plate (11) or the second outer layer plate (13).

5. The PCB board with improved scratch resistance according to claim 4, characterized in that, The protective element (21) is a white ink block formed by printing text on the first outer layer plate (11) or the second outer layer plate (13).

6. The PCB board with improved scratch resistance according to claim 5, characterized in that, The cross-section of the protective area (2) is elliptical, and multiple protective components (21) are evenly distributed inside the protective area (2).

7. The PCB board with improved scratch resistance according to claim 5, characterized in that, The protective component (21) is formed by multi-layer printing according to different text materials, creating a protective array with a high center and low perimeter in the protective area (2).

8. The PCB board with improved scratch resistance according to claim 4, characterized in that, The protective component (21) has a size of 1mm*1mm.

9. The PCB board with improved scratch resistance according to claim 1, characterized in that, When there are multiple protective areas (2), the multiple protective areas (2) are arranged on the outside of the first outer layer plate (11) or the second outer layer plate (13), and each protective area (2) is provided with a protective component (21).

10. A high-current electrical product, characterized in that, Including the PCB board with improved scratch resistance as described in any one of claims 1-9.

Images