LED flip chip embedded light source
By introducing a heat dissipation and light-shielding structure into the LED flip-chip embedded light source, the problem of limited heat dissipation area of the ring-shaped light-shielding sheet is solved, achieving more efficient heat conduction and reducing the risk of short circuit.
Patent Information
- Application Number
- CN202520055065.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-01-09
AI Technical Summary
The limited heat dissipation area of existing ring-shaped light-blocking plates makes it difficult for LED flip chips to conduct heat quickly when outputting at high power, causing the chip temperature to rise and potentially leading to a short circuit.
Design an LED flip-chip embedded light source with a heat dissipation and light shielding structure, including a light shield, a heat collection cavity and a heat transfer cavity, to increase the heat dissipation area, and improve the heat conduction efficiency through an aluminum alloy light shield and copper alloy connecting wires.
It effectively reduces the possibility of circuit short circuits caused by high temperature, and improves the heat dissipation efficiency by increasing the heat dissipation area and improving the thermal conductivity of the material.
Smart Images
Figure CN223899608U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED flip chips, and in particular to an embedded LED flip chip light source. Background Technology
[0002] In the field of LED lighting technology, flip chips are widely used due to their high brightness and high efficiency. However, in order to concentrate the light from flip chips and avoid refraction and glare that could affect the LED lighting effect, existing solutions typically include using a ring-shaped light-blocking plate to reduce refraction and glare.
[0003] However, although the ring-shaped light-blocking plate can effectively block light, its ring structure does not have good heat dissipation performance. Due to the limited light-blocking height of the ring-shaped light-blocking plate, in order to avoid the light-blocking plate being too high and affecting the LED lighting effect, the heat transfer area of the ring-shaped light-blocking plate is limited. During long-term operation or high power output, the heat generated by the flip chip is difficult to be quickly conducted away, which leads to the chip temperature rising and is prone to causing short circuits.
[0004] Therefore, in order to solve the problem of heat conduction being limited by the heat dissipation area of the annular light-blocking sheet, this utility model proposes a novel LED flip-chip embedded light source design. Utility Model Content
[0005] The purpose of this invention is to provide an LED flip-chip embedded light source to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: an LED flip-chip embedded light source, comprising:
[0007] substrate;
[0008] A flip chip body is disposed on the top of a substrate, and the positive and negative terminals of the flip chip body are symmetrically provided with power-conducting parts for powering the flip chip body.
[0009] An isolation structure is disposed on the top of the substrate and located on the outside of the flip chip body. The isolation structure is used to isolate the color conversion layer from the external environment.
[0010] A heat dissipation and light shielding structure is disposed on the top of the substrate and located on the outside of the flip chip body. The heat dissipation and light shielding structure is disposed at the bottom of the isolation structure. The heat dissipation and light shielding structure is used to assist the heat dissipation when the flip chip body emits light.
[0011] Preferably, the heat dissipation and light-shielding structure includes:
[0012] A light-blocking plate is disposed on the top of the substrate and located on the outside of the flip chip body. The light-blocking plate is used to block light from directly hitting the surface of the substrate.
[0013] Multiple heat collection cavities are disposed on the inner wall of the light-blocking plate, and the heat collection cavities are used to absorb the heat of the flip chip body;
[0014] Multiple heat transfer cavities are disposed on the outer side of the light-blocking plate, and the heat transfer cavities are used to increase the heat dissipation area of the light-blocking plate.
[0015] Preferably, both the heat collection cavity and the heat transfer cavity are configured as annular.
[0016] Preferably, the energized part includes:
[0017] A connecting wire is disposed on the top of the substrate and at the bottom of the isolation structure and the light-blocking plate;
[0018] A connecting electrode is disposed at the end of a connecting wire and located at the bottom of the flip chip body;
[0019] A fixing member is disposed on the opposite side of the flip chip body electrode and the connecting electrode, and the fixing member is used to connect the flip chip body and the connecting electrode.
[0020] Preferably, the fastener includes solder, which is disposed on the top of the connecting electrode.
[0021] Preferably, the top of the connecting electrode is serrated, and the serration is used to increase the contact area between the solder and the connecting electrode.
[0022] Preferably, the isolation structure includes:
[0023] A color conversion layer is disposed on the top of the flip chip body, and the color conversion layer is used for light conversion of the flip chip body;
[0024] A sealing layer is disposed on top of the color conversion layer, and the bottom of the sealing layer is fixedly connected to the top of the substrate.
[0025] The technical effects and advantages of this utility model are as follows:
[0026] This invention features a heat dissipation and light-shielding structure on the outside of the flip chip. When the flip chip is in operation, the heat dissipation and light-shielding structure blocks the light. Compared with existing annular light-shielding sheets, this heat dissipation and light-shielding structure not only blocks the light but also increases the heat dissipation area to accelerate the conduction and dissipation of heat from the flip chip, reducing the possibility of short circuits caused by high temperatures. Attached Figure Description
[0027] Figure 1This is a schematic diagram of the overall structure of this utility model.
[0028] Figure 2 This is a cross-sectional view of the entire utility model.
[0029] Figure 3 This utility model Figure 2 Enlarged view of the structure at point A in the middle.
[0030] Figure 4 This is a schematic diagram of the structure of the light-blocking plate of this utility model.
[0031] In the diagram: 1. Substrate; 2. Flip chip body; 3. Color conversion layer; 4. Encapsulating layer; 5. Connecting wire; 501. Connecting electrode; 6. Light blocking plate; 601. Heat collection cavity; 602. Heat transfer cavity; 7. Solder. Detailed Implementation
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0033] This utility model provides, for example Figure 1-4 As shown:
[0034] Example 1:
[0035] An LED flip-chip embedded light source includes: a substrate 1, a flip-chip body 2, an isolation structure, and a heat dissipation and light shielding structure;
[0036] Specifically, the flip chip body 2 is disposed on the top of the substrate 1, the isolation structure is disposed on the top of the substrate 1 and located outside the flip chip body 2, the heat dissipation and light shielding structure is disposed on the top of the substrate 1 and located outside the flip chip body 2, and the heat dissipation and light shielding structure is disposed at the bottom of the isolation structure.
[0037] It should be noted that the flip chip body 2 has symmetrically arranged positive and negative terminals with power supply parts for powering the flip chip body 2, the isolation structure is used to block the color conversion layer 3 from the external environment, and the heat dissipation and light shielding structure is used to assist the dissipation of heat when the flip chip body 2 emits light.
[0038] Specifically, the heat dissipation and light-shielding structure includes: a light-blocking plate 6, multiple heat collection chambers 601 and multiple heat transfer chambers 602;
[0039] It should be noted that the light-blocking plate 6 is used to block light from shining directly onto the surface of the substrate 1, the heat collection cavity 601 is used to absorb the heat of the flip chip body 2, and the heat transfer cavity 602 is used to increase the heat dissipation area of the light-blocking plate 6.
[0040] Specifically, the light-blocking plate 6 is disposed on the top of the substrate 1 and located on the outside of the flip chip body 2, the heat collection cavity 601 is disposed on the inner wall of the light-blocking plate 6, and a plurality of heat transfer cavities 602 are disposed on the outside of the light-blocking plate 6.
[0041] It should be noted that the light-blocking plate 6 is made of aluminum alloy, which has good thermal conductivity. The light-blocking plate 6 is used to prevent the light generated by the flip chip 2 from shining on the substrate 1. The light-blocking plate 6 also limits the reflection and glare of light, making the light source of the flip chip 2 more concentrated. The light-blocking plate 6 is welded and fixed to the substrate 1.
[0042] Specifically, both the heat collection cavity 601 and the heat transfer cavity 602 are set as annular. The annular design is used to increase the contact area between the light-blocking plate 6 and the flip chip body 2, and also to increase the contact area between the light-blocking plate 6 and the isolation structure, so as to facilitate the rapid conduction of heat from the light-blocking plate 6.
[0043] The energized part includes: connecting wire 5, connecting electrode 501 and fixing component;
[0044] Specifically, the connecting wire 5 is disposed at the top of the substrate 1 and at the bottom of the isolation structure and the light-blocking plate 6, the connecting electrode 501 is disposed at the end of the connecting wire 5 and at the bottom of the flip chip body 2, and the fixing member is disposed on the opposite side of the electrode of the flip chip body 2 and the connecting electrode 501.
[0045] It should be noted that the fastener is used to connect the flip chip body 2 and the connecting electrode 501. The connecting wire 5 is made of copper alloy. The connecting wire 5 is fixed to the substrate 1 by welding. The connecting electrode 501 and the connecting wire 5 are integrally cast. The fastener includes solder 7, which is set on the top of the connecting electrode 501. The bottom of the light-blocking plate 6 has a through groove for the connecting wire 5 to pass through.
[0046] Specifically, the top of the connecting electrode 501 is serrated, and the solder 7 is made of high-temperature solder paste to connect and fix the positive and negative electrodes of the flip chip body 2 to the connecting electrode 501. The serration shape is used to increase the contact area between the solder 7 and the connecting electrode 501, thereby increasing the welding contact area.
[0047] Example 2: An isolation structure applied to the LED flip-chip embedded light source in Example 1;
[0048] The isolation structure includes: a color conversion layer 3 and a sealing layer 4;
[0049] Specifically, the color conversion layer 3 is disposed on the top of the flip chip body 2, the encapsulation layer 4 is disposed on the top of the color conversion layer 3, and the bottom of the encapsulation layer 4 is fixedly connected to the top of the substrate 1.
[0050] It should be noted that the color conversion layer 3 is used for light conversion of the flip chip 2. The color conversion layer 3 absorbs the ultraviolet or blue light emitted by the flip chip 2 and excites the fluorescent material therein, thereby emitting visible light of other colors. This process realizes the conversion of the LED chip from a single color to multiple colors. The encapsulation layer 4 is made of silicone resin and is bonded and fixed to the substrate 1.
[0051] In practical use, by setting a heat dissipation and light shielding structure on the outside of the flip chip body 2, the heat dissipation and light shielding structure blocks the light when the flip chip body 2 is working. Compared with the existing ring light shield, the light shielding plate 6 in the heat dissipation and light shielding structure not only blocks the light, but also increases the heat dissipation area of the light shielding plate 6 with the heat collection cavity 601 and the heat transfer cavity 602, which accelerates the conduction and dissipation of the working heat of the flip chip body 2 and reduces the possibility of short circuit caused by high temperature.
[0052] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An LED flip-chip embedded light source, characterized in that, include: substrate(1); A flip chip body (2) is disposed on the top of a substrate (1), and the positive and negative poles of the flip chip body (2) are symmetrically provided with a power supply part for powering the flip chip body (2); An isolation structure is disposed on the top of the substrate (1) and located on the outside of the flip chip body (2). The isolation structure is used to block the color conversion layer (3) from the external environment. The heat dissipation and light shielding structure is disposed on the top of the substrate (1) and located on the outside of the flip chip body (2). The heat dissipation and light shielding structure is disposed at the bottom of the isolation structure. The heat dissipation and light shielding structure is used to assist the heat dissipation when the flip chip body (2) emits light.
2. The LED flip-chip embedded light source according to claim 1, characterized in that, The heat dissipation and light-shielding structure includes: A light-blocking plate (6) is disposed on the top of the substrate (1) and located on the outside of the flip chip body (2). The light-blocking plate (6) is used to block light from shining directly onto the surface of the substrate (1). Multiple heat collection cavities (601) are disposed on the inner wall of the light-blocking plate (6) and the heat collection cavities (601) are used to absorb the heat of the flip chip body (2); Multiple heat transfer cavities (602) are disposed on the outside of the light-blocking plate (6), and the heat transfer cavities (602) are used to increase the heat dissipation area of the light-blocking plate (6).
3. The LED flip-chip embedded light source according to claim 2, characterized in that, Both the heat collection cavity (601) and the heat transfer cavity (602) are configured as annular.
4. The LED flip-chip embedded light source according to claim 2, characterized in that, The energized part includes: Connecting wire (5), the connecting wire (5) is disposed on the top of the substrate (1) and located at the bottom of the isolation structure and the light-blocking plate (6); A connecting electrode (501) is disposed at the end of the connecting wire (5) and located at the bottom of the flip chip body (2); A fixing member is provided on the opposite side of the flip chip body (2) electrode and the connecting electrode (501), and the fixing member is used to connect the flip chip body (2) and the connecting electrode (501).
5. The LED flip-chip embedded light source according to claim 4, characterized in that, The fastener includes solder (7), which is disposed on the top of the connecting electrode (501).
6. The LED flip-chip embedded light source according to claim 5, characterized in that, The top of the connecting electrode (501) is serrated, which is used to increase the contact area between the solder (7) and the connecting electrode (501).
7. The LED flip-chip embedded light source according to claim 1, characterized in that, The isolation structure includes: Color conversion layer (3), the color conversion layer (3) is disposed on the top of the flip chip body (2), the color conversion layer (3) is used for light conversion of the flip chip body (2); A sealing layer (4) is disposed on top of the color conversion layer (3), and the bottom of the sealing layer (4) is fixedly connected to the top of the substrate (1).