Auxiliary device for semiconductor product processing

Abstract

The utility model provides an auxiliary device for processing a semiconductor product. The main body structure of the auxiliary device for processing the semiconductor product is a cylinder; a first groove is formed in the upper surface of the auxiliary device for semiconductor product processing; the length of the first groove is smaller than the diameter of the auxiliary device for semiconductor product processing; the side wall of the auxiliary device for semiconductor product processing is provided with at least eight second grooves. A through hole is formed in the center of the auxiliary device for semiconductor product processing; and the positions of the first groove and the through hole do not coincide. According to the auxiliary device for semiconductor product processing, the first groove is formed in the upper surface of the auxiliary device, the at least eight second grooves are formed in the side wall of the auxiliary device, the first groove and the second grooves are matched with each other, a semiconductor product can be rapidly fixed and positioned, the semiconductor product can be kept stable in the processing process, stress in the processing process can be effectively dispersed, and the service life of the semiconductor product is prolonged. The problem that a semiconductor product is prone to abnormity or deformation in the machining process is solved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and in particular relates to an auxiliary device for semiconductor product processing. Background Technology

[0002] Semiconductor technology refers to the technology of using semiconductors as materials to fabricate components and integrated circuits. Semiconductor technology includes wafer growth, thin film deposition, photolithography, etching, doping, and process integration. When processing semiconductor products, auxiliary devices are needed to hold them in place so that milling or turning slots can be performed. Because semiconductor products are thin-walled parts, the large number of slots milled during processing makes them extremely prone to deformation or abnormalities. This can lead to compromises in perpendicularity, parallelism, flatness, or roundness, compromising the workpiece's dimensions and rendering the semiconductor product unusable.

[0003] CN215357374U discloses a semiconductor target fixture, which includes a body, a positioning plate and a first positioning pin on the surface of the body, at least two limiting grooves on the surface of the positioning plate, and a magnet at the bottom of the limiting groove. The first positioning pin is inserted into the limiting groove, and the magnet and the first positioning pin are interference-fitted to achieve positioning of the semiconductor target.

[0004] CN218785551U discloses a semiconductor component fixture, which includes a base and a boss. The boss has at least two positioning holes and at least two first waist holes that penetrate the boss. The semiconductor component is connected to the positioning holes via positioning pins.

[0005] Although the aforementioned literature has made structural improvements to semiconductor processing fixtures, the effect achieved is only to improve the clamping and positioning of the fixtures, and cannot avoid the problem of semiconductor product deformation during processing.

[0006] Therefore, designing an auxiliary device to prevent deformation during semiconductor product processing is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0007] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an auxiliary device for semiconductor product processing, which solves the problem that semiconductor products are prone to abnormalities or deformation during processing, and at the same time enables rapid positioning of semiconductor products, thereby improving product production rate and quality.

[0008] To achieve this objective, the present invention adopts the following technical solution:

[0009] This utility model provides an auxiliary device for semiconductor product processing, wherein the main structure of the auxiliary device for semiconductor product processing is a cylinder;

[0010] The upper surface of the auxiliary device for semiconductor product processing is provided with a first groove;

[0011] The length of the first groove is less than the diameter of the semiconductor product processing auxiliary device;

[0012] The sidewall of the auxiliary device for semiconductor product processing is provided with at least 8 second grooves;

[0013] The auxiliary device for semiconductor product processing has a through hole at its center;

[0014] The first groove does not coincide with the position of the through hole.

[0015] This invention features a first groove on the upper surface and at least eight second grooves on the sidewalls of an auxiliary device for semiconductor product processing. The first and second grooves cooperate to better fix and position the semiconductor product, ensuring its stability during processing and effectively dispersing stress. This helps prevent abnormalities and deformations during the milling of numerous slots in the semiconductor product, thus guaranteeing its precision. Furthermore, by controlling the length of the first groove to be less than the diameter of the auxiliary device, abnormalities and deformations during the milling process are also avoided. Additionally, the second grooves also serve to clamp the semiconductor product. The semiconductor product is clamped and fixed via a fixing pin, a pressure plate, and a through hole.

[0016] As a preferred technical solution of this utility model, the diameter of the auxiliary device for semiconductor product processing is 200-300mm, for example, it can be 210mm, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm or 290mm, etc., but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0017] As a preferred technical solution of this utility model, the height of the auxiliary device for semiconductor product processing is 40-70mm, for example, it can be 45mm, 50mm, 55mm, 60mm or 65mm, etc., but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0018] As a preferred technical solution of this utility model, the depth of the first groove is 1.8-2.5mm, for example, it can be 1.9mm, 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm or 2.45mm, etc., but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0019] In this invention, the first groove is an arc groove or a cuboid groove, and the width / diameter of the first groove is 2-5mm, for example, it can be 2.2mm, 2.4mm, 2.6mm, 2.8mm, 3mm, 3.2mm, 3.5mm, 4mm, 4.5mm or 4.8mm, etc., but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0020] As a preferred embodiment of the present invention, the top of the second groove is located at the junction of the upper surface and the side wall of the auxiliary device for semiconductor product processing.

[0021] In this invention, the top of the second groove is positioned at the junction of the upper surface and the side wall of the semiconductor product processing auxiliary device, which facilitates workpiece clamping and positioning, ensures the stability of the workpiece position during processing, reduces processing errors, and improves processing quality.

[0022] As a preferred embodiment of this invention, the second groove is a circular groove.

[0023] The spacing between adjacent second grooves is 0.2-0.8mm, for example, it can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm or 0.75mm, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0024] As a preferred technical solution of this utility model, the depth of the second groove is 1-2mm, for example, it can be 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm or 1.9mm, etc., but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0025] The diameter of the second groove is 20-30mm, for example, it can be 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm, 28mm or 29mm, etc., but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0026] As a preferred technical solution of this utility model, the diameter of the through hole is 10-20mm, for example, it can be 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm or 19mm, etc., but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0027] In this invention, the semiconductor product is connected to the through hole via a fixing pin and a pressure plate to ensure that the semiconductor product is fixed on the auxiliary device.

[0028] As a preferred technical solution of this utility model, the upper surface of the auxiliary device for semiconductor product processing is provided with two positioning holes.

[0029] In this invention, the positioning hole penetrates the auxiliary device for semiconductor product processing. The semiconductor product is connected to the positioning hole via a positioning pin, which ensures that the semiconductor product can be fixed and positioned when it is repeatedly processed or processed in batches, so that the semiconductor product always remains in the same processing position, which helps to improve processing accuracy.

[0030] The positioning holes are symmetrically distributed around the through hole.

[0031] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0032] The auxiliary device provided by this utility model has a first groove on the upper surface and at least eight second grooves on the side wall. The first groove and the second groove cooperate with each other to better fix and position the semiconductor product, keeping it stable during processing. It can also effectively disperse the stress during processing, thereby avoiding abnormalities and deformations during the milling of a large number of slots in the semiconductor product, ensuring the precision of the semiconductor product. At the same time, the second groove also has the function of clamping the semiconductor product. In addition, the semiconductor product is connected to the through hole through a fixing pin and a pressure plate to achieve clamping and fixing of the semiconductor product. Attached Figure Description

[0033] Figure 1 A front view of the semiconductor product processing auxiliary device provided in Embodiment 1;

[0034] Figure 2 A top view of the semiconductor product processing auxiliary device provided in Embodiment 1;

[0035] Wherein, 1-first groove, 2-second groove, 3-through hole, 4-positioning hole. Detailed Implementation

[0036] It should be understood that in the description of this utility model, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0037] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] This embodiment provides an auxiliary device for semiconductor product processing (its front view and top view are shown below). Figure 1-2 As shown in the figure, the main structure of the auxiliary device for semiconductor product processing is a cylinder; the diameter of the auxiliary device for semiconductor product processing is 250mm and the height is 60mm;

[0041] The upper surface of the auxiliary device for semiconductor product processing is provided with a first groove 1;

[0042] The sidewall of the auxiliary device for semiconductor product processing is provided with 24 second grooves 2;

[0043] The auxiliary device for semiconductor product processing has a through hole 3 at its center;

[0044] The first groove 1 and the through hole 3 are not in the same position;

[0045] The upper surface of the auxiliary device for semiconductor product processing is provided with two positioning holes 4; the positioning holes 4 penetrate the auxiliary device for semiconductor product processing; the positioning holes 4 are symmetrically distributed with the through hole 3 as the center;

[0046] The first groove 1 is an arc-shaped groove; the length of the first groove 1 is less than the diameter of the auxiliary device for semiconductor product processing; the depth of the first groove 1 is 2 mm and the diameter is 2.5 mm;

[0047] The top of the second groove 2 is located at the junction of the upper surface and the side wall of the semiconductor product processing auxiliary device; the second groove 2 is a circular groove; the distance between adjacent second grooves 2 is 0.2 mm; the depth of the second groove 2 is 1.5 mm and the diameter is 25 mm;

[0048] The diameter of the through hole 3 is 15mm.

[0049] When processing semiconductor products using the auxiliary device provided in this embodiment, the first and second grooves cooperate with each other to avoid abnormalities and deformations during the milling of a large number of slots in the semiconductor product, thus ensuring the precision of the semiconductor product. In addition, the semiconductor product is not only connected to the through hole through the fixing pin and pressure plate, but also connected to the positioning hole through the positioning pin, ensuring that the semiconductor product is fixed on the auxiliary device. This ensures that when the semiconductor product is repeatedly processed or processed in batches, it can be positioned so that the semiconductor product always stays in the same processing position, achieving rapid positioning of the semiconductor product and improving processing accuracy.

[0050] Example 2

[0051] This embodiment provides an auxiliary device for semiconductor product processing. The main structure of the auxiliary device is a cylinder. The diameter of the auxiliary device is 210mm and the height is 70mm.

[0052] The upper surface of the auxiliary device for semiconductor product processing is provided with a first groove;

[0053] The sidewall of the auxiliary device for semiconductor product processing is provided with 16 second grooves;

[0054] The auxiliary device for semiconductor product processing has a through hole at its center;

[0055] The first groove and the through hole are not located at the same position;

[0056] The upper surface of the auxiliary device for semiconductor product processing is provided with two positioning holes; the positioning holes penetrate the auxiliary device for semiconductor product processing; the positioning holes are symmetrically distributed with the through hole as the center;

[0057] The first groove is an arc-shaped groove; the length of the first groove is less than the diameter of the semiconductor product processing auxiliary device; the depth of the first groove is 2.5 mm and the diameter is 4 mm;

[0058] The top of the second groove is located at the junction of the upper surface and the side wall of the semiconductor product processing auxiliary device; the second groove is a circular groove; the distance between adjacent second grooves is 0.5 mm; the depth of the second groove is 1.1 mm and the diameter is 20 mm;

[0059] The diameter of the through hole is 12mm.

[0060] When processing semiconductor products using the auxiliary device provided in this embodiment, the first and second grooves cooperate with each other to avoid abnormalities and deformations during the milling of a large number of slots in the semiconductor product, thus ensuring the precision of the semiconductor product. In addition, the semiconductor product is not only connected to the through hole through the fixing pin and pressure plate, but also connected to the positioning hole through the positioning pin, ensuring that the semiconductor product is fixed on the auxiliary device. This ensures that when the semiconductor product is repeatedly processed or processed in batches, it can be positioned so that the semiconductor product always stays in the same processing position, achieving rapid positioning of the semiconductor product and improving processing accuracy.

[0061] Example 3

[0062] This embodiment provides an auxiliary device for semiconductor product processing. The main structure of the auxiliary device is a cylinder. The diameter of the auxiliary device is 300mm and the height is 50mm.

[0063] The upper surface of the auxiliary device for semiconductor product processing is provided with a first groove;

[0064] The sidewall of the auxiliary device for semiconductor product processing is provided with 12 second grooves;

[0065] The auxiliary device for semiconductor product processing has a through hole at its center;

[0066] The first groove and the through hole are not located at the same position;

[0067] The upper surface of the auxiliary device for semiconductor product processing is provided with two positioning holes; the positioning holes penetrate the auxiliary device for semiconductor product processing; the positioning holes are symmetrically distributed with the through hole as the center;

[0068] The first groove is an arc-shaped groove; the length of the first groove is less than the diameter of the auxiliary device for semiconductor product processing; the depth of the first groove is 1.85 mm and the diameter is 5 mm;

[0069] The top of the second groove is located at the junction of the upper surface and the side wall of the semiconductor product processing auxiliary device; the second groove is a circular groove; the distance between adjacent second grooves is 0.6 mm; the depth of the second groove is 2 mm and the diameter is 25 mm;

[0070] The diameter of the through hole is 18mm.

[0071] When processing semiconductor products using the auxiliary device provided in this embodiment, the first and second grooves cooperate with each other to avoid abnormalities and deformations during the milling of a large number of slots in the semiconductor product, thus ensuring the precision of the semiconductor product. In addition, the semiconductor product is not only connected to the through hole through the fixing pin and pressure plate, but also connected to the positioning hole through the positioning pin, ensuring that the semiconductor product is fixed on the auxiliary device. This ensures that when the semiconductor product is repeatedly processed or processed in batches, it can be positioned so that the semiconductor product always stays in the same processing position, achieving rapid positioning of the semiconductor product and improving processing accuracy.

[0072] Comparative Example 1

[0073] This comparative example provides an auxiliary device for semiconductor product processing, which is the same as that in Example 1 except that the first groove is not provided.

[0074] When using the auxiliary device provided in this comparative example to process semiconductor products, although the semiconductor products can be quickly positioned, the semiconductor products cannot be better fixed and positioned because only the second groove is set. This leads to instability during the processing and makes it impossible to avoid abnormalities and deformations during the milling of a large number of slots in the semiconductor products.

[0075] Comparative Example 2

[0076] This comparative example provides an auxiliary device for semiconductor product processing, which is identical to Example 1 except that it does not have a second groove.

[0077] When using the auxiliary device provided in this comparative example to process semiconductor products, although it can achieve rapid positioning of semiconductor products, it cannot effectively disperse the stress during the processing because only the first groove is set. As a result, it cannot avoid the problems of abnormality and deformation during the processing of semiconductor products with a large number of slots.

[0078] The applicant declares that the above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model fall within the protection and disclosure scope of the present utility model.

Claims

1. An auxiliary device for semiconductor product processing, characterized in that, The main structure of the auxiliary device for semiconductor product processing is cylindrical; The upper surface of the auxiliary device for semiconductor product processing is provided with a first groove; The length of the first groove is less than the diameter of the semiconductor product processing auxiliary device; The sidewall of the auxiliary device for semiconductor product processing is provided with at least 8 second grooves; The auxiliary device for semiconductor product processing has a through hole at its center; The first groove does not coincide with the position of the through hole.

2. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The diameter of the auxiliary device for semiconductor product processing is 200-300mm.

3. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The height of the auxiliary device for semiconductor product processing is 40-70mm.

4. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The depth of the first groove is 1.8-2.5mm.

5. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The top of the second groove is located at the junction of the upper surface and the side wall of the semiconductor product processing auxiliary device.

6. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The second groove is a circular groove.

7. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The distance between adjacent second grooves is 0.2-0.8 mm.

8. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The depth of the second groove is 1-2 mm; The diameter of the second groove is 20-30mm.

9. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The diameter of the through hole is 10-20 mm.

10. The auxiliary device for semiconductor product processing according to claim 1, characterized in that, The upper surface of the auxiliary device for semiconductor product processing is provided with two positioning holes; The positioning holes are symmetrically distributed around the through hole.

Images