Semiconductor cleaning device

Abstract

The utility model relates to a semiconductor cleaning device which comprises a water storage barrel, a working table plate, sealing plates, a cover plate and a water collecting barrel, a water tank is arranged on the working table plate, the sealing plates are arranged at the two ends of the water tank respectively, the water storage barrel is located above a water inlet of the water tank, and the water storage barrel is detachably connected with the sealing plates located above the water inlet. According to the embodiment, the through hole is formed in the top of the water storage barrel, so that water in the water storage barrel smoothly enters the water tank. A plurality of grooves are formed in the bottom of the water tank side by side and used for containing semiconductor chips, the water collecting bucket is located below the tail end of the water tank so as to receive water in the water tank, and the cover plate is buckled between the two sealing plates and buckled on the working table in a sealed mode.

Description

Technical Field

[0001] This utility model relates to a cleaning device, specifically a semiconductor cleaning device. Background Technology

[0002] In the semiconductor chip packaging process, soldering is used to achieve electrical connections or mechanical fixation. Electrical connections ensure reliable electrical connections between the various components within the chip and between the chip and external circuits, guaranteeing smooth current flow and enabling the chip to function properly. Mechanical fixation securely bonds the chip's pins or solder joints to the circuit board or packaging carrier, providing mechanical support and ensuring the chip remains stably fixed in its position under various environmental conditions.

[0003] During the soldering process, tiny solder beads sometimes form on semiconductor chips. To ensure electrical performance and protect the chip's physical structure, these solder beads need to be removed.

[0004] For some semiconductor chips with good heat resistance, heating is typically used to remove solder residue. For some semiconductor chips with poor heat resistance, solvent cleaning or mechanical cleaning methods are typically used, depending on the specific circumstances.

[0005] Mechanical cleaning is suitable for semiconductor chips with less solder ball residue and looser structure. However, when using mechanical cleaning, the chip surface may be scratched or the pins may be damaged. Utility Model Content

[0006] The main purpose of this invention is to provide a semiconductor cleaning device for cleaning solder ball residue on semiconductor chips.

[0007] To achieve the above objectives, this utility model provides a semiconductor cleaning apparatus, comprising:

[0008] Water storage tank;

[0009] The workbench has a water tank with an inlet at one end, allowing water from a storage tank to flow into the tank. The tank has recesses for placing semiconductor chips.

[0010] Sealing plates are provided at both ends of the water tank. The sealing plates are located above the water tank and are sealed to the workbench.

[0011] The cover plate is detachably connected to the workbench plate. The cover plate is sealed to the sealing plates on both sides. The cover plate is equipped with an air inlet hose. The air blown out of the air inlet hose is obliquely blown towards the water tank. The semiconductor chips located in the water tank are all located at one end of the air outlet of the air inlet hose, and the air outlet is close to the end of the cover plate away from the water inlet.

[0012] Preferably, the water storage tank is detachably connected to the sealing plate located above the water inlet.

[0013] Preferred options also include:

[0014] Drain hole, located at the end of the water tank;

[0015] The water collection bucket is located below the drain hole.

[0016] In a further preferred embodiment, a filter screen is provided below the drainage hole.

[0017] Preferably, a baffle plate is provided between the sealing plate and the cover plate located above the water inlet.

[0018] The beneficial effects of this utility model are as follows:

[0019] In this invention, the air blown from the air inlet hose is angled and directed towards the water tank, with all semiconductor chips located at the air outlet end of the hose. This utilizes the impact force of the air to create flow and turbulence in the water. For the semiconductor chips, this flowing water can better wash away solder residue from the chip surface. Furthermore, because the air outlet is closer to the cover plate than the water inlet, the water flow within the tank forms a more efficient path, further improving cleaning efficiency.

[0020] Furthermore, this invention creates a relatively enclosed cleaning space by installing sealing plates at both ends of the water tank, with the sealing plates and the workbench plate sealed together. The cover plate is also sealed to both the workbench plate and the sealing plates. This sealing structure effectively prevents cleaning water and gas from splashing out during the cleaning process, reducing pollution to the surrounding environment. It also ensures the stability of the cleaning process, avoids external factors interfering with the cleaning effect, and guarantees water flow within the water tank, thereby enhancing the impact force of the water flow. Attached Figure Description

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0022] Figure 1 This is a three-dimensional structural diagram of the rinsing device of this utility model;

[0023] Figure 2 This is a front view of the flushing device of this utility model;

[0024] Figure 3 This is a schematic diagram of the water tank structure of the rinsing device of this utility model;

[0025] Figure 4 This is a cross-sectional view of the water tank of the rinsing device of this utility model.

[0026] Explanation of reference numerals in the attached figures

[0027] 100. Workbench; 110. Water tank; 111. Groove;

[0028] 120. Water inlet; 130. Drain hole; 140. Filter screen; 150. Water baffle;

[0029] 200. Sealing plate; 210. Cover plate; 211. Intake hose;

[0030] 300, water storage tank; 400, water collection tank. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] like Figures 1 to 4 As shown, this embodiment provides a semiconductor cleaning apparatus, including a water storage tank 300, a workbench 100, a sealing plate 200, a cover plate 210, and a water collection tank 400. A water tank 110 is provided on the workbench 100, and sealing plates 200 are respectively provided at both ends of the water tank 110. The water storage tank 300 is located above the water inlet 120 of the water tank 110, and the water storage tank 300 is detachably connected to the sealing plate 200 located above the water inlet 120. In this embodiment, a through hole is provided at the top of the water storage tank 300 to allow water from the water storage tank 300 to smoothly enter the water tank 110. Multiple grooves 111 are arranged side by side at the bottom of the water tank 110. These grooves 111 are used to place semiconductor chips. The water collection bucket 400 is located below the end of the water tank 110 to collect water in the water tank 110. The cover plate 210 is fastened between two sealing plates 200 and the cover plate 210 is sealed and fastened to the workbench plate 100.

[0033] Specifically, in this embodiment, the sealing plate 200 is located above the water tank 110, and the sealing plate 200 is sealed to the workbench 100.

[0034] In this embodiment, the cover plate 210 is sealed to the sealing plates 200 located on both sides. An air inlet hose 211 is provided on the cover plate 210, and the gas blown out of the air inlet hose 211 is directed at an angle towards the water tank 110. Therefore, an air inlet hole (e.g., an air inlet hole) needs to be obliquely provided on the cover plate 210. Figure 4 As shown), the semiconductor chips located in the water tank 110 are all located at one end of the air outlet of the air inlet hose 211, and the air outlet is close to the end of the cover plate 210 away from the water inlet 120.

[0035] In this embodiment, a drain hole is provided at the end of the water tank 110 so that the water in the water tank 110 flows into the water collection bucket 400. In addition, in order to facilitate the collection of welding residue, a filter screen 140 is provided below the drain hole 130 to collect the welding residue carried in the water flow on the filter screen 140.

[0036] In this embodiment, a baffle plate 150 is also provided between the sealing plate 200 and the cover plate 210 above the water inlet 120. In this way, when the semiconductor chip is no longer being rinsed, the water in the water tank 110 is blocked by the baffle plate 150.

[0037] Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

Claims

1. A semiconductor cleaning apparatus, characterized in that, include: Water storage tank; A workbench is provided with a water tank, one end of which has a water inlet, allowing water from a water storage tank to flow into the water tank. The water tank has a recess for placing semiconductor chips. A sealing plate is provided at both ends of the water tank, the sealing plate is located above the water tank, and the sealing plate is sealed to the workbench plate; The cover plate is detachably connected to the workbench plate and is sealed to the sealing plates located on both sides. The cover plate is provided with an air inlet hose, and the gas blown out of the air inlet hose is obliquely blown towards the water tank. The semiconductor chips located in the water tank are all located at one end of the air outlet of the air inlet hose, and the air outlet is close to the end of the cover plate away from the water inlet.

2. The semiconductor cleaning apparatus according to claim 1, characterized in that, The water storage tank is detachably connected to the sealing plate located above the water inlet.

3. The semiconductor cleaning apparatus according to claim 1, characterized in that, Also includes: A drain hole is located at the end of the water tank; A water collection bucket is located below the drain hole.

4. The semiconductor cleaning apparatus according to claim 3, characterized in that, A filter screen is installed below the drainage hole.

5. A semiconductor cleaning apparatus according to claim 1, characterized in that, A baffle plate is provided between the sealing plate above the water inlet and the cover plate.

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