Compact vacuum wafer transmission device

Abstract

The utility model discloses a compact vacuum wafer transmission device, which comprises a support frame and a transmission cavity positioned at the top of the support frame, a lifting platform is arranged in the transmission cavity, the lifting platform is vertically connected with the transmission cavity in a sliding manner, a lifting driving device is arranged below the transmission cavity, and the lifting driving device is connected with the transmission cavity in a sliding manner. The lifting driving device is connected with the supporting frame, the lifting end of the lifting driving device extends into the transmission cavity to be connected with the lifting platform, the lifting platform is provided with a wafer transmission carrying table in horizontal sliding connection, the wafer transmission carrying table is connected with a horizontal movement driving device, and the top and the side face of the transmission cavity are provided with a discharging port and an uploading port respectively. Vacuum valves are arranged at the discharging opening and the uploading opening, and the bottom of the lower portion of the conveying cavity is connected with a molecular vacuum pump. The compact vacuum wafer transmission device is simple in structure, low in manufacturing and maintenance cost, stable in performance, simple to operate, compact in layout, small in occupied area and capable of quickly uploading and downloading wafers.

Description

Technical Field

[0001] This utility model relates to the field of transmission device technology, and more specifically to a compact vacuum wafer transmission device. Background Technology

[0002] Currently, wafer transport devices in semiconductor equipment typically consist of a wafer loading cavity and a wafer transport cavity. Wafer transport is generally accomplished using a vacuum multi-axis robot housed within the wafer transport cavity. Vacuum multi-axis robots are complex in structure, have high manufacturing and maintenance costs, and occupy a large space. Therefore, there is a need to design a wafer transport device that is simple in structure, has lower manufacturing and maintenance costs, and a smaller footprint. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a compact vacuum wafer transfer device. This compact vacuum wafer transfer device has a simple structure, low manufacturing and maintenance costs, stable performance, simple operation, compact layout, small footprint, and can quickly upload and download wafers.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A compact vacuum wafer transfer device includes a support frame and a transfer cavity located at the top of the support frame. A lifting platform is disposed within the transfer cavity and is vertically slidably connected to the transfer cavity. A lifting drive device is disposed below the transfer cavity, and the lifting drive device is connected to the support frame with its lifting end extending into the transfer cavity and connected to the lifting platform. A wafer transfer stage is disposed on the lifting platform and is horizontally slidably connected. The wafer transfer stage is connected to a horizontal movement drive device. A discharge port and a loading port are respectively disposed on the top and side of the transfer cavity, and vacuum valves are disposed at the discharge port and the loading port. A molecular vacuum pump is connected to the bottom of the transfer cavity.

[0006] The horizontal movement drive device further includes a drive motor, a first synchronous belt assembly, and a second synchronous belt assembly. The first and second synchronous belt assemblies are located on opposite sides of the wafer transfer stage, and are identical, each including a first pulley, a second pulley, and a synchronous belt. The first and second pulleys are horizontally arranged and rotatably connected to the lifting platform. The synchronous belt is mounted on the first and second pulleys. Connecting blocks are provided on both sides of the wafer transfer stage, and the connecting blocks on both sides are respectively connected to the synchronous belts of the first and second synchronous belt assemblies. The drive motor is located below the transfer cavity and connected to the lifting platform, and the main shaft of the drive motor is connected to a drive shaft. The drive shaft extends into the transfer cavity and is connected to the first pulley of the first synchronous belt.

[0007] Furthermore, the lifting platform is provided with a horizontal slide rail, and the bottom of the wafer transfer stage is provided with a horizontal slider, which is slidably connected to the horizontal slide rail.

[0008] Furthermore, the side of the transmission cavity is provided with several vertical slide rails, and the side of the lifting platform is provided with several vertical sliders, and the vertical slide rails and the vertical sliders are slidably connected in cooperation.

[0009] Furthermore, a transparent observation window is provided on the vacuum valve at the discharge port.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] The compact vacuum wafer transfer device of this invention has a simple structure, low manufacturing and maintenance costs, stable performance, simple operation, compact layout, small footprint, and can quickly upload and download wafers. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0013] Figure 1 A schematic diagram of the structure of a compact vacuum wafer transport device. Figure 1 ;

[0014] Figure 2 A schematic diagram of the structure of a compact vacuum wafer transport device. Figure 2 .

[0015] The components in the diagram are labeled as follows: 1. Support frame; 2. Transfer cavity; 3. Discharge port; 4. Loading port; 5. Lifting drive device; 6. Drive motor; 7. Transmission shaft; 8. Lifting platform; 9. Wafer transfer stage; 10. Synchronous belt; 11. First pulley; 12. Second pulley; 13. Horizontal slide rail; 14. Connecting block; 15. Vertical slide rail; 16. Vertical slider; 17. First synchronous belt assembly; 18. Second synchronous belt assembly. Detailed Implementation

[0016] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0018] A compact vacuum wafer transport device, such as Figure 1-2 As shown, the device includes a support frame 1 and a transfer cavity 2 located at the top of the support frame 1. A lifting platform 8 is provided inside the transfer cavity 2, and the lifting platform 8 is vertically slidably connected to the transfer cavity 2. A lifting drive device 5 is provided below the transfer cavity 2. The lifting drive device 5 is connected to the support frame 1, and its lifting end extends into the transfer cavity 2 and is connected to the lifting platform 8. A wafer transfer stage 9 is provided on the lifting platform 8 and is horizontally slidably connected. The wafer transfer stage 9 is connected to a horizontal movement drive device. A discharge port 3 and a loading port 4 are respectively provided on the top and side of the transfer cavity 2, and vacuum valves are provided at the discharge port 3 and the loading port 4. A molecular vacuum pump is connected to the bottom of the transfer cavity 2.

[0019] Preferably, the horizontal movement drive device includes a drive motor 6, a first synchronous belt assembly 17, and a second synchronous belt assembly 18. The first synchronous belt assembly 17 and the second synchronous belt assembly 18 are located on both sides of the wafer transfer stage 9, and the first synchronous belt assembly 17 and the second synchronous belt assembly 18 are identical, each including a first pulley 11, a second pulley 12, and a synchronous belt 10. The first pulley 11 and the second pulley 12 are both arranged horizontally and rotatably connected to the lifting platform 8. The synchronous belt 10 is installed on the first pulley 11 and the second pulley 12. Connecting blocks 14 are provided on both sides of the wafer transfer stage 9, and the connecting blocks 14 on both sides are respectively connected to the synchronous belts 10 of the first synchronous belt assembly 17 and the second synchronous belt assembly 18. The drive motor 6 is located below the transfer cavity 2 and is connected to the lifting platform 8. The main shaft of the drive motor 6 is connected to a transmission shaft 7, which extends into the transfer cavity 2 and is connected to the first pulley 11 of the first synchronous belt assembly 17.

[0020] Specifically, the wafer transfer stage 9 is driven and moved by the drive motor 6, the first synchronous belt assembly 17, and the second synchronous belt assembly 18. The overall structure is relatively simple and ensures smooth and accurate transmission.

[0021] Preferably, the lifting platform 8 is provided with a horizontal slide rail 13, and the bottom of the wafer transfer stage 9 is provided with a horizontal slider. The horizontal slider and the horizontal slide rail 13 are slidably connected to each other, thereby realizing the horizontal sliding connection of the wafer transfer stage 9 and ensuring accurate horizontal movement.

[0022] Preferably, the side of the transmission cavity 2 is provided with a plurality of vertical slide rails 15, and the side of the lifting platform 8 is provided with a plurality of vertical sliders 16. The vertical slide rails 15 and the vertical sliders 16 are slidably connected to each other, thereby realizing the vertical sliding connection of the lifting platform 8 in the transmission cavity 2, ensuring smooth and accurate lifting.

[0023] Preferably, the vacuum valve at the discharge port 3 is provided with a transparent observation window, so as to facilitate observation of the internal situation through the transparent observation window.

[0024] Preferably, the surface of the wafer transfer stage 9 is covered with a soft, high-temperature resistant, and wear-resistant material to protect the wafer surface from scratches.

[0025] Preferably, the side of the transmission cavity 2 is also provided with an exhaust port, and an exhaust valve is provided at the exhaust port.

[0026] Preferably, the lifting drive device 5 can be an existing mature product, such as a screw jack or a linear motor.

[0027] Transmission and upload process:

[0028] 1. Under atmospheric pressure, open the vacuum valve at the discharge port 3 of the transfer chamber 2, then place the wafer on the wafer transfer stage 9, and then close the vacuum valve;

[0029] 2. Open the molecular vacuum pump and exhaust valve to evacuate the transfer chamber 2;

[0030] 3. Open the vacuum valve at the loading port 4 connected to the process chamber, then start the horizontal movement drive device to move the wafer transfer stage 9 toward the loading port 4 and through the loading port 4 into the process chamber. Then, when the wafer transfer stage 9 moves to the fixture of the process chamber, the lifting drive device 5 is started to control the entire lifting platform 8 and the wafer transfer stage 9 to descend, so that the wafer is placed in the fixture of the process chamber, completing the loading.

[0031] 4. Subsequently, the horizontal movement drive is activated, causing the wafer transfer stage 9 to move back into the transfer cavity 2;

[0032] 5. Close the vacuum valve at the discharge port connected to the process chamber, and the process chamber can then be used for process operations;

[0033] 6. After the process is completed, the vacuum valve at the discharge point connected to the process chamber is opened, the horizontal movement drive device is started again, extends into the process chamber to take out the wafer, and then the reverse process of the loading process is performed to return the wafer to its starting position.

[0034] 7. After all wafer operations are completed, close the exhaust valve, allow ventilation to bring the pressure inside the transmission chamber 2 to atmospheric pressure, then open the vacuum valve at the discharge port 3 and remove the wafer.

[0035] The compact vacuum wafer transfer device of this invention has a simple structure, low manufacturing and maintenance costs, stable performance, simple operation, compact layout, small footprint, and can quickly upload and download wafers.

[0036] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A compact vacuum wafer transport device, characterized in that: The device includes a support frame and a transfer cavity located on top of the support frame. A lifting platform is installed inside the transfer cavity and is vertically slidably connected to the transfer cavity. A lifting drive device is installed below the transfer cavity. The lifting drive device is connected to the support frame and its lifting end extends into the transfer cavity and is connected to the lifting platform. A wafer transfer stage is installed on the lifting platform and is horizontally slidably connected. The wafer transfer stage is connected to a horizontal movement drive device. A discharge port and a loading port are respectively provided on the top and side of the transfer cavity, and vacuum valves are provided at the discharge port and the loading port. A molecular vacuum pump is connected to the bottom of the transfer cavity.

2. The compact vacuum wafer transport device according to claim 1, characterized in that: The horizontal movement drive device includes a drive motor, a first synchronous belt assembly, and a second synchronous belt assembly. The first and second synchronous belt assemblies are located on opposite sides of the wafer transfer stage, and are identical, each including a first pulley, a second pulley, and a synchronous belt. The first and second pulleys are horizontally arranged and rotatably connected to the lifting platform. The synchronous belt is mounted on the first and second pulleys. Connecting blocks are provided on both sides of the wafer transfer stage, and the connecting blocks on both sides are respectively connected to the synchronous belts of the first and second synchronous belt assemblies. The drive motor is located below the transfer cavity and connected to the lifting platform, and the main shaft of the drive motor is connected to a drive shaft. The drive shaft extends into the transfer cavity and is connected to the first pulley of the first synchronous belt.

3. A compact vacuum wafer transport device according to claim 2, characterized in that: The lifting platform is equipped with a horizontal slide rail, and the bottom of the wafer transfer stage is equipped with a horizontal slider, which is slidably connected to the horizontal slide rail.

4. A compact vacuum wafer transport device according to claim 3, characterized in that: The side of the transmission cavity is provided with several vertical slide rails, and the side of the lifting platform is provided with several vertical sliders. The vertical slide rails and the vertical sliders are slidably connected.

5. A compact vacuum wafer transport device according to claim 1, characterized in that: A transparent observation window is provided on the vacuum valve at the discharge port.

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