Semiconductor machine wafer transmission device

Abstract

The utility model discloses a semiconductor machine wafer transmission device which comprises a mechanical arm, the bottom of the mechanical arm is provided with a base, the tail end of the mechanical arm is provided with an overturning piece, the overturning piece is provided with a vacuum adsorption assembly and comprises a driving motor and a speed reducer, the tail end of the mechanical arm is provided with a connecting plate, and the connecting plate is provided with a vacuum adsorption assembly. A pedestal is arranged on the connecting plate, the driving motor is arranged on the pedestal, the input end of the speed reducer is connected to the output end of the driving motor, the output end of the speed reducer is connected with a rotating shaft, and the vacuum adsorption assembly is arranged on the rotating shaft. The utility model belongs to the technical field of wafer transmission devices, and particularly relates to a wafer transmission device of a semiconductor machine table.

Description

Technical Field

[0001] This utility model belongs to the technical field of wafer transmission devices, specifically referring to a wafer transmission device for a semiconductor machine. Background Technology

[0002] In semiconductor manufacturing, wafer transfer and positioning are key process steps. Traditional wafer transfer devices typically use robotic arms in conjunction with vacuum chucks to grasp and move wafers. However, in some processes, wafers need to be flipped during transfer (e.g., processing on both sides).

[0003] In existing technologies, wafer flipping is usually achieved through a separate flipping station, which not only increases the equipment footprint but also reduces transmission efficiency. Utility Model Content

[0004] The technical problem this invention aims to solve is that wafer flipping is usually achieved through a separate flipping station, which not only increases the equipment footprint but also reduces transmission efficiency.

[0005] To achieve the above functions, the technical solution adopted by this utility model is as follows: A semiconductor machine wafer transmission device includes a robotic arm, a base at the bottom of the robotic arm, a flipping component at the end of the robotic arm, a vacuum adsorption assembly on the flipping component, the flipping component including a drive motor and a reducer, a connecting plate at the end of the robotic arm, a pad on the connecting plate, the drive motor on the pad, the input end of the reducer connected to the output end of the drive motor, the output end of the reducer connected to a rotating shaft, and the vacuum adsorption assembly on the rotating shaft.

[0006] Preferably, the pad is provided with a bracket, and a sealing cover is fixedly embedded at the end of the bracket away from the pad. The end of the sealing cover is fixed to the reducer and covers the outside of the rotating shaft.

[0007] Preferably, the vacuum adsorption assembly includes a vacuum pump, a sealing cover, and an adsorption chamber. The vacuum pump is located on the side wall of the robotic arm near the base. A connecting shaft is fixed to the end of the rotating shaft away from the chassis. The connecting shaft has a hollow cavity structure. The end of the connecting shaft rotates through the sealing cover and extends out through a rotary seal. The connecting shaft has a through hole communicating with the sealing cover. The end of the adsorption chamber is connected to the connecting shaft. The output end of the vacuum pump is connected to the sealing cover through a pipeline.

[0008] Preferably, the adsorption chambers are arranged in two sets opposite each other in a U-shaped structure, and the adsorption chambers are provided with a plurality of adsorption holes.

[0009] Preferably, the end of the robotic arm is fixed with a connecting plate by a flange and bolts, and the pad is disposed on the connecting plate.

[0010] Preferably, an angle sensor is provided on the extended end of the connecting shaft.

[0011] Preferably, it also includes linear guide rail one and linear guide rail two, wherein two sets of linear guide rail one are arranged in parallel, and both ends of linear guide rail two are disposed on the slides of the two linear guide rails one, and the base is disposed on the slides of linear guide rail two.

[0012] The beneficial effects achieved by adopting the above-described structure are as follows:

[0013] 1. By integrating the flipping mechanism into the end of the robotic arm, the equipment footprint is reduced and the transmission efficiency is improved.

[0014] 2. A servo motor and reducer are used to drive the rotating shaft, and an angle sensor is used to control the flipping angle, ensuring the accuracy of wafer flipping.

[0015] 3. The sealing cover and the rotating shaft are connected by a rotary seal to ensure that the vacuum pipeline does not rotate when the shaft rotates, thereby avoiding pipeline entanglement. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model. Figure 1 ;

[0017] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the present utility model. Figure 2 ;

[0018] Figure 3 This is a partial cross-sectional view of an embodiment of the present utility model;

[0019] Figure 4 for Figure 3 Enlarged view of section A in the middle;

[0020] Figure 5 This is a perspective view of an embodiment of the present utility model.

[0021] The components include: 1. robotic arm; 2. base; 3. flipping component; 4. vacuum adsorption assembly; 5. drive motor; 6. reducer; 7. connecting plate; 8. pad; 9. bracket; 10. sealing cover; 11. vacuum pump; 12. adsorption chamber; 13. connecting shaft; 14. through hole; 15. adsorption hole; 16. angle sensor; 17. linear guide rail one; 18. linear guide rail two; and 19. rotating shaft. Detailed Implementation

[0022] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0024] like Figure 1-5 As shown, this utility model proposes a semiconductor machine wafer transmission device, including a robotic arm 1, a base 2 at the bottom of the robotic arm 1, a flipping component 3 at the end of the robotic arm 1, a vacuum adsorption assembly 4 on the flipping component 3, the flipping component 3 including a drive motor 5 and a reducer 6, a connecting plate 7 at the end of the robotic arm 1, the connecting plate 7 being fixed to the end of the robotic arm 1 by a flange and bolts, a pad 8 being disposed on the connecting plate 7, the drive motor 5 being disposed on the pad 8, the input end of the reducer 6 being connected to the output end of the drive motor 5, the output end of the reducer 6 being connected to a rotating shaft 19, and the vacuum adsorption assembly 4 being disposed on the rotating shaft 19. When the drive motor 5 is started, the output shaft of the drive motor 5 drives the input end of the reducer 6 to rotate, and transmits power to the rotating shaft 19 at the output end. The rotating shaft 19 drives the connecting shaft 13 and the vacuum adsorption assembly 4 and wafer fixed on the connecting shaft 13 to flip.

[0025] like Figure 2 As shown, the pad 8 is provided with a bracket 9, and a sealing cover 10 is fixedly embedded at the end of the bracket 9 away from the pad 8. The end of the sealing cover 10 is fixed to the reducer 6 and covers the outside of the rotating shaft 19.

[0026] like Figure 1 and 4As shown, the vacuum adsorption assembly 4 includes a vacuum pump 11, a sealing cover 10, and an adsorption chamber 12. The vacuum pump 11 is located on the side wall of the robotic arm 1 near the base 2. A connecting shaft 13 is fixed to the end of the rotating shaft 19 away from the chassis. The connecting shaft 13 has a hollow cavity structure. The end of the connecting shaft 13 rotates through the sealing cover 10 and extends out through a rotating seal. The connecting shaft 13 has a through hole 14 that connects to the sealing cover 10. The end of the adsorption chamber 12 is connected to the connecting shaft 13. An angle sensor 16 is provided on the side wall of the extended end of the connecting shaft 13. The output end of the vacuum pump 11 is connected to the sealing cover 10 through a pipeline. When the vacuum pump 11 is started, it begins to work and extracts the air in the sealing cover 10 through the pipeline, creating a vacuum environment inside the sealing cover 10. Since the connecting shaft 13 is connected to the adsorption chamber 12, the air in the adsorption chamber 12 is also extracted. The adsorption holes 15 on the adsorption chamber 12 generate suction, adsorbing the wafer onto the surface of the adsorption chamber 12.

[0027] like Figure 4 As shown, the adsorption chambers 12 are arranged in two sets opposite each other and in a U-shaped structure. The adsorption chambers 12 are provided with a number of adsorption holes 15. The two sets of U-shaped adsorption chambers 12 arranged opposite each other and the number of adsorption holes 15 thereon increase the adsorption area of ​​the wafer and further improve the reliability of adsorption.

[0028] like Figure 5 As shown, it also includes linear guide rail 17 and linear guide rail 2 18. Two sets of linear guide rail 17 are arranged in parallel. The two ends of linear guide rail 2 18 are set on the slides of the two linear guide rails 17. The base 2 is set on the slide of linear guide rail 2 18.

[0029] In practical use, the vacuum pump 11 is started and begins to work. The air inside the sealing cover 10 is extracted through the pipeline, creating a vacuum environment inside the sealing cover 10. Since the connecting shaft 13 is connected to the adsorption chamber 12, the air inside the adsorption chamber 12 is also extracted. The adsorption holes 15 on the adsorption chamber 12 generate suction, adsorbing the wafer onto the surface of the adsorption chamber 12.

[0030] Once the wafer is firmly adsorbed, the drive motor 5 is activated. The output shaft of the drive motor 5 drives the input end of the reducer 6 to rotate, and transmits power to the output shaft 19. The shaft 19 drives the connecting shaft 13 and the adsorption cavity 12 fixed on the connecting shaft 13 and the wafer to rotate. During the rotation process, the angle sensor 16 monitors the rotation angle of the connecting shaft 13 in real time and feeds the signal back to the external control system to control the rotation angle so that the wafer is rotated to the required angle position. Subsequently, the base 2 of the robotic arm 1 moves on the linear guide rail 17 and the linear guide rail 18 according to the preset motion trajectory, moving the adsorption cavity 12 with the wafer adsorbed to the designated position, completing the wafer transmission process.

[0031] After the robotic arm 1 moves the wafer to the target position, the vacuum pump 11 is turned off, and the vacuum in the adsorption chamber 12 gradually disappears. The adsorption force between the wafer and the surface of the adsorption chamber 12 weakens, so as to gradually release the wafer.

[0032] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A semiconductor machine wafer transmission device, comprising a robotic arm (1), wherein the bottom of the robotic arm (1) is provided with a base (2), characterized in that: The end of the robotic arm (1) is provided with a flipping component (3), and the flipping component (3) is provided with a vacuum adsorption assembly (4). The flipping component (3) includes a drive motor (5) and a reducer (6). The end of the robotic arm (1) is provided with a connecting plate (7), and the connecting plate (7) is provided with a pad (8). The drive motor (5) is located on the pad (8). The input end of the reducer (6) is connected to the output end of the drive motor (5). The output end of the reducer (6) is connected to a rotating shaft (19). The vacuum adsorption assembly (4) is located on the rotating shaft (19).

2. The semiconductor machine wafer transmission device according to claim 1, characterized in that: The pad (8) is provided with a bracket (9), and a sealing cover (10) is fixedly embedded at the end of the bracket (9) away from the pad (8). The end of the sealing cover (10) is fixed on the reducer (6) and covers the outside of the rotating shaft (19).

3. The semiconductor machine wafer transmission device according to claim 2, characterized in that: The vacuum adsorption assembly (4) includes a vacuum pump (11), a sealing cover (10), and an adsorption chamber (12). The vacuum pump (11) is located on the side wall of the robotic arm (1) near the base (2). A connecting shaft (13) is fixed at the end of the rotating shaft (19) away from the chassis. The connecting shaft (13) is a hollow cavity structure. The end of the connecting shaft (13) is rotated through the sealing cover (10) and extends out through a rotating seal. The connecting shaft (13) has a through hole (14) that connects to the sealing cover (10). The end of the adsorption chamber (12) is connected to the connecting shaft (13). The output end of the vacuum pump (11) is connected to the sealing cover (10) through a pipeline.

4. The semiconductor machine wafer drive device according to claim 3, characterized in that: The adsorption chambers (12) are arranged in two sets opposite each other and in a U-shaped structure. The adsorption chambers (12) are provided with a number of adsorption holes (15).

5. The semiconductor machine wafer drive device according to claim 1, characterized in that: The end of the robotic arm (1) is fixed with a connecting plate (7) by a flange and bolts, and the pad (8) is provided on the connecting plate (7).

6. The semiconductor machine wafer drive device according to claim 3, characterized in that: An angle sensor (16) is provided on the extended end of the connecting shaft (13).

7. The semiconductor machine wafer drive device according to claim 1, characterized in that: It also includes linear guide rail one (17) and linear guide rail two (18). The linear guide rail one (17) is provided in two parallel sets. The two ends of the linear guide rail two (18) are provided on the slides of the two linear guide rails one (17). The base (2) is provided on the slide of the linear guide rail two (18).

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