Wafer taking device
By pressing and spraying liquid around the outer periphery of the polished workpiece and using a wafer pick-up track for guidance, the safe transfer of wafers is achieved, solving the problem of wafer scratches caused by the clamping mechanism and ensuring wafer quality.
Patent Information
- Application Number
- CN202423180818.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-23
AI Technical Summary
Since wafers are relatively thin, using clamping devices to separate the wafer from the wax-free pad can easily cause scratches on the wafer, affecting its quality.
The wafer picking mechanism presses against the outer periphery of the holes in the polished workpiece, and sprays liquid onto the wafer through the liquid spraying component. Under the action of the liquid impact, the wafer moves along the picking track. Combined with the guiding effect of the picking track, the wafer is transferred from the polished workpiece to the basket, avoiding direct contact and damage.
This technology enables safe transfer of wafers, avoids direct contact damage to the wafers by the clamping mechanism, and protects wafer quality.
Smart Images
Figure CN223899673U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer picking technology, and more particularly to wafer picking apparatus. Background Technology
[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. It is circular in shape, hence the name "wafer." The raw material for wafers is high-purity silicon, which typically undergoes a series of processing steps, such as crystal pulling, dicing, and polishing, to ultimately form a thin wafer used in integrated circuit manufacturing. In the wafer processing, CMP (Chemical Mechanical Polishing) is usually the final step in wafer polishing; this method is a single-sided polishing technique. To achieve single-sided wafer polishing, the wafer needs to be attached to a substrate that can tightly hold and fix it in place. Wax-free pads are currently a common type of polishing material used as a substrate for wafer attachment.
[0003] In the wafer polishing process, the side of the wafer that does not need polishing is attached to the hole of the wax-free pad. The smooth hole surface and a certain hole depth can effectively hold the wafer during the polishing process and prevent the wafer from being peeled off. After the wafer is polished, it is necessary to separate the wafer from the wax-free pad. Usually, a clamping device is used to hold the sidewall of the wafer to separate the wafer from the wax-free pad, and then the wafer is placed into a basket for transportation.
[0004] However, because wafers are thin, using clamping devices to hold the wafer sidewalls and separate the wafer from the wax-free pad can easily cause wafer scratches, affecting wafer quality. Utility Model Content
[0005] This application provides a wafer picking device to solve the technical problem in the related art that when wafers are thin, the method of using clamping elements to hold the wafer sidewalls to separate the wafer from the wax-free pad can easily cause wafer scratches, affecting wafer quality.
[0006] This application provides a wafer picking device, including a picking mechanism and a carrying mechanism;
[0007] The wafer-removing mechanism is used to press against the outer periphery of the holes in the polished workpiece;
[0008] The film retrieval mechanism includes a film retrieval track and a liquid spraying component;
[0009] The inner diameter of the wafer picking track is matched with the diameter of the wafer to be picked;
[0010] The liquid outlet of the spraying component is positioned facing the outlet of the wafer pick-up track, and is used to spray liquid onto the wafer so that the wafer moves along the wafer pick-up track towards its outlet under the force of the liquid.
[0011] The support mechanism is located at the exit of the wafer pick-up track and is used to support the basket; the basket is used to load the wafers.
[0012] In one feasible implementation, the liquid spraying component includes a first liquid spraying component and a second liquid spraying component;
[0013] The outlets of the first liquid spraying component and the plate picking track are positioned opposite each other;
[0014] The second spraying element is located between the first spraying element and the outlet of the plate-taking track.
[0015] In one feasible implementation, the tablet-retrieving mechanism forms a U-shaped structure, with a liquid spraying component in the first part of the U-shaped structure and a tablet-retrieving track in the second part of the U-shaped structure.
[0016] The pick-up track is a groove formed on the side wall of the U-shaped structure. The two side walls of the groove are inclined, and one of the side walls of the groove abuts against the surface of the polished workpiece.
[0017] In one feasible implementation, the slice-taking track includes a transition section and a straight section. One end of the transition section is connected to the first part, and the other end of the transition section is connected to the straight section. The transition section is set to an arc shape.
[0018] The straight section extends from the transition section toward the load-bearing mechanism.
[0019] In one feasible implementation, the tablet taking device further includes a tray mechanism, which includes a support and a tray;
[0020] The support includes a fixed column and a rotating frame. The rotating frame is rotatably mounted on the fixed column and forms a first limiting space. The tray is detachably mounted within the first limiting space.
[0021] The tray surface is used to support the polished workpiece. The tray and the polished workpiece are adapted to each other, and multiple wafers are arranged around the surface of the polished workpiece.
[0022] In one feasible implementation, a limiting protrusion is provided on the surface of the bearing mechanism, which forms a second limiting space for bearing the flower basket.
[0023] This application provides a wafer pick-up device. In this embodiment, the pick-up mechanism is positioned to press against the outer periphery of the hole in the polished workpiece, facilitating relative movement between the wafer and the polished workpiece under the impact of the liquid spraying component, allowing the wafer to detach from the workpiece. The liquid spraying component, with its outlet facing the outlet of the pick-up track, generates a force on the wafer in the direction of the pick-up track outlet. Because the polished workpiece is pressed by the pick-up mechanism, the wafer detaches from the workpiece and moves along the pick-up track towards the support mechanism, ultimately reaching the basket. Furthermore, the pick-up track, with its inner diameter matched to the wafer diameter, allows the wafer to move along it, thus guiding the wafer. In this embodiment, the liquid impingement allows the wafer to detach from the polishing workpiece and transfer to the wafer tray, avoiding damage caused by direct contact between the wafer and the clamping mechanism in the prior art, thus protecting the wafer. This embodiment provides a wafer retrieval device that facilitates wafer removal and protects the wafer. Attached Figure Description
[0024] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0025] Figure 1 This is a schematic diagram of the structure of a wafer picking device provided in one embodiment of this application;
[0026] Figure 2 yes Figure 1 partial cross-section Figure 1 ;
[0027] Figure 3 yes Figure 1 partial cross-section Figure 2 ;
[0028] Figure 4 yes Figure 1 partial cross-section Figure 3 .
[0029] Explanation of reference numerals in the attached figures:
[0030] 100 - Pallet mechanism; 200 - Sheet picking mechanism; 300 - Transmission mechanism; 400 - Loading mechanism;
[0031] 110 - Support component; 111 - Fixed column; 112 - Rotating frame; 120 - Pallet;
[0032] 210 - First part; 220 - Second part; 221 - Plate picking track; 221a - Transition section; 221b - Straight section; 230 - First spraying element; 240 - Second spraying element; 250 - Handle;
[0033] 310 - First gear; 320 - First rack; 330 - Second gear assembly; 331 - Ratchet; 332 - Second gear; 340 - Second rack; 350 - Support rod; 360 - Support plate;
[0034] 410 - Limiting protrusion. Detailed Implementation
[0035] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.
[0036] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.
[0037] In the description of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "level," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In this application, unless otherwise expressly specified and limited, the first feature being "upper" or "lower" than the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.
[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by an intermediate structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0039] In this application, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0040] In the wafer fabrication process, CMP (Chemical Mechanical Polishing) is usually the final step in wafer polishing, and this polishing method is a single-sided polishing method. In order to polish the wafer on one side, the wafer needs to be attached to a substrate that can tightly hold and fix the wafer. Wax-free pads are currently a common product used as a substrate to hold the wafer.
[0041] In the wafer polishing process, the side of the wafer that does not need polishing is attached to the hole of the wax-free pad. The smooth hole surface and a certain hole depth can effectively hold the wafer during the polishing process and prevent the wafer from being peeled off. After the wafer is polished, it is necessary to separate the wafer from the wax-free pad. Usually, a clamping device is used to hold the sidewall of the wafer to separate the wafer from the wax-free pad, and then the wafer is placed into a basket for transportation.
[0042] However, because wafers are thin, using clamping devices to hold the wafer sidewalls and separate the wafer from the wax-free pad can easily cause wafer scratches, affecting wafer quality.
[0043] Therefore, this application provides a wafer picking device to solve the technical problem in the related art that when the wafer is thin, the method of using clamping members to hold the wafer sidewall to separate the wafer from the wax pad is easy to cause wafer scratches and affect wafer quality.
[0044] Figure 1 This is a schematic diagram of the structure of a wafer retrieval device for an emergency kit provided in one embodiment of this application.
[0045] This application provides a wafer picking device, referring to... Figure 1 It includes a film-taking mechanism 200 and a carrying mechanism 400;
[0046] The pick-up mechanism 200 is used to press against the outer periphery of the hole in the polished workpiece;
[0047] The film receiving mechanism 200 includes a film receiving track 221 and a liquid spraying component;
[0048] The inner diameter of the wafer picking track 221 is matched with the diameter of the wafer to be picked;
[0049] The liquid outlet of the spraying component is positioned facing the outlet of the wafer pick-up track 221, and is used to spray liquid onto the wafer so that the wafer moves along the wafer pick-up track 221 toward its outlet under the force of the liquid.
[0050] The carrying mechanism 400 is located at the exit of the wafer pick-up track 221 and is used to carry the basket; the basket is used to load the wafers.
[0051] It should be noted that the flower basket is a special container used to load wafers, providing the necessary support, transportation, storage and protection for the wafers, ensuring the quality and integrity of the wafers throughout the entire production process.
[0052] In actual use, the wafer picking mechanism 200 is pressed against the outer periphery of the hole of the polished workpiece (such as one without a wax pad) to which the wafer is attached. The liquid spraying component starts spraying liquid, and the liquid flows from the outlet of the liquid spraying component towards the outlet of the wafer picking track 221. During the flow, the wafer is acted upon by gravity, giving it an impact force toward the outlet of the wafer picking track 221. Under the continuous action of the liquid spraying component, the wafer moves along the wafer picking track 221 and finally moves from the outlet of the wafer picking track 221 to the basket on the carrying mechanism 400.
[0053] For example, the polishing workpiece can be a wax-free pad, or it can be other types of polishing pads used to hold wafers in place.
[0054] From the above description, it can be seen that this solution achieves the following technical effects:
[0055] This application provides a wafer picking device. In this embodiment, the picking mechanism 200 is positioned to press against the outer periphery of the hole in the polished workpiece, facilitating relative movement between the wafer and the polished workpiece under the impact of the liquid spraying component, allowing the wafer to detach from the workpiece. The liquid spraying component, with its outlet facing the outlet of the picking track 221, generates a component force on the wafer in the direction of the outlet of the picking track 221. Because the polished workpiece is pressed by the picking mechanism 200, the wafer detaches from the workpiece and moves along the picking track 221 towards the carrying mechanism 400, ultimately reaching the basket. Furthermore, the picking track 221, with its inner diameter matched to the diameter of the wafer to be picked, allows the wafer to move along it, thus guiding the wafer. In this embodiment, the liquid pressure allows the wafer to detach from the polishing workpiece and transfer to the wafer tray, avoiding damage caused by direct contact with the wafer by the clamping mechanism in the prior art, thus protecting the wafer. This embodiment provides a wafer handling device that facilitates wafer removal and protects the wafer.
[0056] Figure 2 yes Figure 1 partial cross-section Figure 1 .
[0057] In some examples, refer to Figure 2 The spraying component includes a first spraying component 230 and a second spraying component 240;
[0058] The outlets of the first liquid spraying component 230 and the plate picking track 221 are arranged opposite to each other;
[0059] The second spraying element 240 is disposed between the first spraying element 230 and the outlet of the plate picking track 221.
[0060] In this embodiment, the first spraying element 230 is positioned opposite to the outlet of the wafer pick-up track 221, with the first spraying element 230 facing towards the outlet of the wafer pick-up track 221. When the liquid from the first spraying element 230 acts on the wafer, it provides a component force to the wafer towards the outlet of the wafer pick-up track 221, thereby moving the wafer toward the support mechanism 400. Furthermore, in this embodiment, a second spraying element 240 is positioned between the first spraying element 230 and the outlet of the wafer pick-up track 221. When the liquid from the second spraying element 240 acts on the wafer, it also provides a component force to the wafer towards the outlet of the wafer pick-up track 221, thus assisting the first spraying element 230 in moving the wafer toward the support mechanism 400.
[0061] In other examples, continue to refer to Figure 1 The wafer picking mechanism 200 forms a U-shaped structure. The first part 210 of the U-shaped structure is provided with a liquid spraying component, and the second part 220 of the U-shaped structure forms a wafer picking track 221 that is compatible with the wafer.
[0062] The pick-up track 221 is a groove formed on the side wall of the U-shaped structure. The two side walls of the groove are inclined, and one of the side walls of the groove abuts against the surface of the polished workpiece.
[0063] For example, the first part of the U-shaped structure is set to the arc shape of the U-shape, and the arc shape of the U-shape is adapted to the outer periphery of the hole of the polished workpiece.
[0064] In this embodiment, the wafer-retrieving mechanism 200 forms a U-shaped structure. The first part of the U-shaped structure is adapted to the outer periphery of the hole in the polished workpiece, and the second part of the U-shaped structure forms a wafer-retrieving track 221 adapted to the wafer. Furthermore, the wafer is guided by the groove. By tilting the two sidewalls of the groove, the wafer, being thin, transitions easily from the first part 210 of the annular mechanism to the wafer-retrieving track 221. By having one sidewall of the groove abut against the surface of the polished workpiece, the other sidewall of the groove presses the polished workpiece firmly, facilitating separation of the polished workpiece and the wafer.
[0065] Figure 3 yes Figure 1 partial cross-section Figure 2 .
[0066] For example, refer to Figure 3 The pick-up track 221 includes a transition section 221a and a straight section 221b. One end of the transition section 221a is connected to the first part 210, and the other end of the transition section 221a is connected to the straight section 221b. The transition section 221a is set to an arc shape.
[0067] The straight section 221b extends from the transition section 221a toward the bearing mechanism 400.
[0068] The embodiment of this application further facilitates the transition of the wafer from the first part 210 of the ring mechanism to the straight part 221b of the wafer pick-up track 221 by setting the transition part 221a, so that the wafer can move from the straight part 221b of the wafer pick-up track 221 to the basket.
[0069] Figure 4 yes Figure 1 partial cross-section Figure 3 .
[0070] In other examples, continue to refer to Figure 1 The tablet taking device also includes a tray mechanism 100, which includes a support member 110 and a tray 120;
[0071] The support member 110 includes a fixed column 111 and a rotating frame 112. The rotating frame 112 is rotatably mounted on the fixed column 111 and forms a first limiting space. The tray 120 is detachably mounted in the first limiting space.
[0072] The surface of tray 120 is used to support the polished workpiece. The tray 120 is adapted to the polished workpiece, and multiple wafers are arranged around the surface of the polished workpiece.
[0073] For example, in practical applications, the surface of the tray mechanism 100 is adapted to the size of the polished workpiece, the radial dimension of the polished workpiece is larger than the radial dimension of the wafer, and multiple wafers can be set on the surface of one polished workpiece.
[0074] For example, the tray 120 can be made of ceramic material. The surface of the tray 120 is used to hold the polished workpiece. Multiple wafers are attached to the surface of a polished workpiece. After one wafer is removed, the tray 120 is rotated to remove other wafers from the polished workpiece.
[0075] For example, the position on the surface of the tray 120 where the wafer is placed is tilted, with the tilt direction being from the center of the tray 120 towards the edge of the tray 120, so that when the liquid spraying component sprays liquid, the liquid can flow along the tilt direction to generate an impact force on the wafer and move the wafer from the wafer pick-up track 221 to the basket.
[0076] This embodiment of the application, by setting up the rotating frame 112 and detachably placing the tray 120 within the first limiting space formed by the rotating frame 112, facilitates the installation and removal of the tray 120. After the wafer on the polished workpiece on the surface of one tray 120 is removed, the next tray can be quickly replaced to remove the wafer from the next tray 120. This embodiment of the application, by rotatably setting the rotating frame 112 on the fixed post 111 and setting a polished workpiece on the surface of the tray 120, with multiple wafers on the surface of the polished workpiece, allows for the removal of another wafer from the polished workpiece by rotating the rotating frame 112 after one wafer on the polished workpiece has been removed. The configuration of this embodiment of the application facilitates wafer removal.
[0077] In another implementation, we continue to refer to... Figure 1 The surface of the bearing mechanism 400 is provided with a limiting protrusion 410, which forms a second limiting space for bearing the flower basket.
[0078] In this embodiment, a limiting protrusion 410 is provided on the surface of the bearing mechanism 400, and a second limiting space is formed by the limiting protrusion 410, which facilitates the limiting of the flower basket.
[0079] It is readily understood that, based on the several embodiments provided in this application, those skilled in the art can combine, split, or reorganize the embodiments of this application to obtain other embodiments, none of which exceed the protection scope of this application.
[0080] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.
Claims
1. A wafer picking device, characterized in that, Includes the film-taking mechanism and the carrying mechanism; The pick-up mechanism is used to press against the outer periphery of the hole in the polished workpiece; The film-retrieving mechanism includes a film-retrieving track and a liquid spraying component; The inner diameter of the wafer picking track is adapted to the diameter of the wafer to be picked; The outlet of the spraying component is positioned facing the outlet of the wafer pick-up track, and is used to spray liquid onto the wafer so that the wafer moves along the wafer pick-up track toward its outlet under the force of the liquid. The supporting mechanism is located at the exit of the wafer picking track and is used to carry the flower basket; the flower basket is used to load the wafer.
2. The wafer pick-up device according to claim 1, characterized in that, The liquid spraying component includes a first liquid spraying component and a second liquid spraying component; The outlets of the first spray nozzle and the plate-taking track are arranged opposite to each other; The second spraying element is disposed between the first spraying element and the outlet of the plate-taking track.
3. The wafer pick-up device according to claim 1, characterized in that, The tablet-taking mechanism forms a U-shaped structure, with the first part of the U-shaped structure being provided with the liquid spraying component, and the second part of the U-shaped structure forming the tablet-taking track; The pick-up track is a groove formed on the side wall of the U-shaped structure. The two side walls of the groove are inclined, and one of the side walls of the groove abuts against the surface of the polished workpiece.
4. The wafer pick-up device according to claim 3, characterized in that, The film-taking track includes a transition section and a straight section. One end of the transition section is connected to the first part, and the other end of the transition section is connected to the straight section. The transition section is configured to be arc-shaped. The straight section extends from the transition section toward the bearing mechanism.
5. The wafer pick-up apparatus according to any one of claims 1-4, characterized in that, The film-taking device also includes a tray mechanism, which includes a support member and a tray; The support includes a fixed column and a rotating frame. The rotating frame is rotatably mounted on the fixed column and forms a first limiting space. The tray is detachably mounted within the first limiting space. The tray surface is used to support the polished workpiece, the tray and the polished workpiece are adapted to each other, and multiple wafers are arranged around the surface of the polished workpiece.
6. The wafer pick-up apparatus according to any one of claims 1-4, characterized in that, The surface of the bearing mechanism is provided with a limiting protrusion, which forms a second limiting space for supporting the flower basket.