Wafer bearing device and ejector rod thereof

Abstract

The utility model provides a wafer bearing device and an ejector rod thereof. The ejector rod comprises a supporting rod; the lifting rod is coaxially arranged at the upper end of the supporting rod and is in threaded connection with the supporting rod so as to ascend and descend when rotating relative to the supporting rod; and the elastic device is arranged between the supporting rod and the lifting rod and is configured to apply force enabling the supporting rod and the lifting rod to be close to each other or away from each other. The lifting rod can ascend and descend relative to the supporting rod, and the height of the upper end of the lifting rod can be adjusted, so that the ejector rod can be adjusted in the height direction. The elastic device can provide force enabling the supporting rod and the lifting rod to be close to each other or away from each other, tooth gaps between threads can be eliminated, the ejector rod is prevented from slightly shaking due to the tooth gaps, the stability of the ejector rod is guaranteed, the wafer taking and placing accuracy is further guaranteed, the wafers are prevented from being not placed in place or collided, and the wafers are protected. The elastic device can also improve the strength and rigidity of the ejector rod, and the stability of the ejector rod is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor support technology, and in particular to a wafer carrier device and its top rod. Background Technology

[0002] In recent years, the domestic semiconductor-related equipment industry has developed rapidly, and defect detection equipment is an indispensable yield monitoring device in integrated circuit manufacturing. One component of defect detection equipment is a wafer carrier, also known as a Z-axis lifting platform, which provides vertical movement for the wafer. The wafer carrier is designed with a wafer lifter to raise the wafer. When a wafer needs to be fed into the wafer carrier, the wafer loading stage (also known as an electrostatic chuck) descends, and the wafer lifter is now higher than the electrostatic chuck. A robotic arm picks up the wafer and places it on the wafer lifter. The robotic arm then moves away, the electrostatic chuck rises, and the wafer falls onto it and is held in place. When the wafer needs to be removed, the wafer lifter raises the wafer, creating a distance between the wafer and the electrostatic chuck, ensuring that the robotic arm has space to access the lower surface of the wafer and remove it.

[0003] Currently, there are two main types of wafer ejector pins: active ejector pins and passive ejector pins. Active ejector pins primarily consist of a support plate, pins, a lifting mechanism, and springs. Multiple pins are mounted on the support plate, the lifting mechanism raises the support plate, and the springs cause the support plate to move downwards. When it is necessary to raise the pins, the lifting mechanism raises the support plate, causing multiple pins to rise simultaneously. Passive ejector pins achieve relative movement with the wafer loading stage through its lifting and lowering. When the wafer loading stage is at a low position, the ejector pin is higher than the platform, used to catch the wafer or for a robotic arm to remove it. When the ejector pin is lower than the wafer loading stage, the wafer falls onto and is held in place on the wafer loading stage.

[0004] For passive push rods, each push rod cannot be height-adjusted; for active push rods, because multiple push rods move synchronously, each push rod itself cannot be height-adjusted. When the upper ends of multiple push rods are not on the same horizontal plane, neither passive nor active push rods can be adjusted to make the upper ends of multiple push rods meet the usage requirement of being on the same horizontal plane. Utility Model Content

[0005] In view of the above problems, this utility model is proposed to provide a push rod and wafer carrier device for a wafer carrier device that overcomes or at least partially solves the above problems, and is adjustable in the height direction to meet the usage requirements such as placing the upper ends of multiple push rods on the same plane.

[0006] One objective of this invention is to prevent slight wobbling of the push rod, ensuring its stability and thus guaranteeing the accuracy of wafer placement and removal, preventing improper wafer placement or collisions, and protecting the wafer.

[0007] Another objective of this invention is to make the top rod simple in structure and easy to install.

[0008] Another objective of this invention is to make the lifting and lowering of the top rod convenient and easy to operate.

[0009] Specifically, this utility model provides a push rod for a wafer carrier device, comprising:

[0010] Support rod;

[0011] A lifting rod is coaxially disposed at the upper end of the support rod and threadedly connected to the support rod so as to lift and lower when rotating relative to the support rod;

[0012] An elastic device is disposed between the support rod and the lifting rod, configured to apply a force that moves the support rod and the lifting rod closer to or further apart from each other.

[0013] Optionally, the support rod includes:

[0014] The installation section is provided with external threads;

[0015] A guide section, which is coaxially disposed on the upper part of the mounting section;

[0016] The lifting boom includes:

[0017] The assembly section has an internal thread on its inner wall that mates with the external thread;

[0018] A top support section is connected to the upper end of the assembly section, and the top support section has a guide hole; the guide section is inserted into the guide hole.

[0019] Optionally, the elastic device is disposed within the assembly section and is located between the mounting section and the top support section;

[0020] The elastic device is a compression spring, which is fitted onto the guide section.

[0021] Optionally, the ratio between the length of the mating area between the kit section and the installation section and the length of the kit section is 1 / 5 to 9 / 10;

[0022] The ratio between the length of the guide section inserted into the guide hole and the length of the guide section is 1 / 5 to 9 / 10.

[0023] Optionally, the ratio between the diameter of the guide section and the diameter of the mounting section is 1 / 4 to 2 / 3;

[0024] The ratio between the outer diameter of the portion of the top support section that defines the guide hole and the diameter of the mounting section is 2 / 3 to 1.

[0025] Optionally, the push rod further includes:

[0026] An anti-slip component is provided on the upper end surface of the lifting rod.

[0027] Optionally, the anti-slip component is a friction ring; the upper end face of the lifting rod is provided with an annular mounting groove, the annular mounting groove being a constricted groove, the anti-slip component is installed in the annular mounting groove, and a portion of the friction ring is located on the upper side of the upper end face; or,

[0028] The anti-slip component is a friction pad, which is disposed on the upper end surface of the lifting rod.

[0029] Optionally, the upper part of the lifting rod is provided with a through hole for inserting an external tool so that the lifting rod can rotate under the drive of the external tool.

[0030] Optionally, the push rod further includes:

[0031] A support base is provided at the lower end of the support rod, and the support base is provided with mounting holes;

[0032] The mounting hole is configured for the screw to pass through, and the lower end of the mounting hole is flared to accommodate the head of the screw and prevent the screw from moving upward.

[0033] This utility model also provides a wafer carrier device, which includes:

[0034] Base assembly;

[0035] A wafer loading stage is disposed above the base assembly, and the wafer loading stage is provided with through holes;

[0036] In any of the above-mentioned top rods, the support rod is mounted on the base assembly and is coaxially arranged with the through hole; the lifting rod is configured to extend upward out of the through hole.

[0037] Optionally, the wafer carrier further includes:

[0038] A wafer loading stage lifting device is disposed between the base assembly and the wafer loading stage, and is configured to drive the wafer loading stage to move up and down.

[0039] In the wafer carrier device of this utility model, the top rod includes a support rod and a lifting rod. The lifting rod can be raised and lowered relative to the support rod, and the height of the upper end of the lifting rod can be adjusted so that the top rod can be adjusted in the height direction to meet the usage requirements such as making the upper ends of multiple top rods on the same plane.

[0040] Furthermore, in the wafer carrier device, the support rod and the lifting rod are connected by a threaded connection, which makes the structure simple and the structure of the top rod simple and low in cost. It is easy to integrate the various components of the top rod, and the structure is compact, the size is small, and it is easy to install.

[0041] Furthermore, in the wafer carrier device and the push rod of this utility model, due to the presence of an elastic device, the support rod and the lifting rod can be brought closer or further apart, eliminating backlash between the threads and preventing slight wobbling of the push rod due to backlash. This ensures the stability of the push rod, thereby guaranteeing the accuracy of wafer placement and removal, preventing improper placement or collisions, and protecting the wafer. The elastic device also improves the strength and rigidity of the push rod, further enhancing its stability.

[0042] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0043] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0044] Figure 1 This is a schematic structural diagram of a top rod according to an embodiment of the present utility model;

[0045] Figure 2 This is a schematic exploded view of a top rod according to an embodiment of the present invention;

[0046] Figure 3 This is a schematic top view of a top rod according to an embodiment of the present utility model;

[0047] Figure 4 It is along Figure 3 A schematic cross-sectional view of the AA plane;

[0048] Figure 5 yes Figure 4 A schematic enlarged view of point B in the middle;

[0049] Figure 6 yes Figure 4 A schematic enlarged view of point C in the middle;

[0050] Figure 7 This is a schematic structural diagram of a wafer carrier device according to an embodiment of the present invention.

[0051] In the attached image:

[0052] The components include: base assembly 100, top rod 200, support base 210, screw 211, support rod 220, mounting section 221, guide section 222, lifting rod 230, assembly section 231, top support section 232, guide hole 233, through hole 234, annular mounting groove 235, elastic device 240, anti-slip component 250, wafer loading stage 300, lower wedge block 410, and upper wedge block 420. Detailed Implementation

[0053] The following reference Figures 1 to 7 This invention describes a push rod 200 for a wafer carrier device and a wafer carrier device according to embodiments of the present invention. In this description, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0054] Unless otherwise expressly specified and limited, the terms "set," "install," "connect," "link," "fix," and "couple" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0055] Furthermore, in the description of this embodiment, "above" or "below" the second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. That is, in the description of this embodiment, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "below" of the second feature can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] In the description of this embodiment, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0057] Figure 1 This is a schematic structural diagram of the top rod 200 according to an embodiment of the present utility model, as shown below. Figure 1 As shown, and refer to Figures 2 to 7 This utility model provides a top rod 200 for a wafer carrier device. The top rod 200 includes a support rod 220, a lifting rod 230, and an elastic device 240.

[0058] The support rod 220 is typically vertically mounted on the base assembly 100 of the wafer carrier. A lifting rod 230 is coaxially disposed at the upper end of the support rod 220 and threadedly connected to it for lifting during rotation relative to the support rod 220. An elastic device 240 is disposed between the support rod 220 and the lifting rod 230, configured to apply a force that brings the support rod 220 and the lifting rod 230 closer together or further apart.

[0059] In use, rotating the lifting rod 230 allows it to rise or fall relative to the support rod 220 under the action of the thread, thus adjusting the height of the top rod 200. Under the action of the elastic device 240, the thread on the lifting rod 230 can tightly engage with the thread on the support rod 220, preventing backlash from causing the lifting rod 230 to wobble relative to the support rod 220.

[0060] In the top rod 200 of this utility model embodiment, since the top rod 200 includes a support rod 220 and a lifting rod 230, the lifting rod 230 can be raised and lowered relative to the support rod 220, and the height of the upper end of the lifting rod 230 can be adjusted, so that the top rod 200 can be adjusted in the height direction to meet the usage requirements such as making the upper ends of multiple top rods 200 on the same plane.

[0061] The support rod 220 and the lifting rod 230 are connected by a thread, which makes the structure simple and the structure of the top rod 200 simple and low-cost. It is easy to integrate the various components of the top rod 200, resulting in a compact structure, small size, and convenient installation. The support rod 220 does not need to be removed from the base assembly 100 when lifting.

[0062] Furthermore, the elastic device 240 provides a force that moves the support rod 220 and the lifting rod 230 closer together or further apart. This eliminates backlash between the threads, preventing slight wobbling of the push rod 200 due to backlash. This ensures the stability of the push rod 200, thereby guaranteeing the accuracy of wafer placement and preventing improper wafer placement or collisions, thus protecting the wafer. The elastic device 240 also enhances the strength and rigidity of the push rod 200, further improving its stability and ensuring the stability of the support height provided by the push rod 200, thus providing stable support.

[0063] In some embodiments of this utility model, such as Figures 2 to 5 As shown, the support rod 220 includes a mounting section 221 and a guide section 222. The mounting section 221 is provided with external threads. The guide section 222 is coaxially disposed on the upper part of the mounting section 221.

[0064] The lifting rod 230 includes a mounting section 231 and a top support section 232. The inner wall of the mounting section 231 has an internal thread that mates with the external thread. The top support section 232 is connected to the upper end of the mounting section 231 and has a guide hole 233. A guide section 222 is inserted into the guide hole 233.

[0065] In this embodiment of the invention, the nested arrangement of the fitting section 231 and the installation section 221 facilitates the installation of threads and increases the contact area between the support rod 220 and the lifting rod 230 during installation. Furthermore, the guide hole 233 and guide post prevent the lifting rod 230 from tilting relative to the support rod 220, ensuring the top rod 200 is vertically positioned. The guide hole 233 and guide post also enhance the strength and rigidity of the top rod 200, ensuring its stability without requiring excessively thick walls in the fitting section 231.

[0066] In some embodiments of this utility model, such as Figure 4As shown, the length of the mating area between the mounting section 231 and the installation section 221 is 1 / 5 to 9 / 10 of the length of the mounting section 231. In other words, the ratio of the length of the mating area between the mounting section 231 and the installation section 221 to the length of the mounting section 231 is 1 / 5 to 9 / 10. The length of the guide section 222 inserted into the guide hole 233 is 1 / 5 to 9 / 10 of the length of the guide section 222. This limits the lifting range of the lifting rod 230, preventing poor stability of the top rod 200 due to insufficient overlap between the support rod 220 and the lifting rod 230.

[0067] In some embodiments of this utility model, such as Figure 4 As shown, in order to further improve the strength and support capacity of the top rod 200 and ensure the verticality of the top rod 200, the ratio between the diameter of the guide section 222 and the diameter of the mounting section 221 is 1 / 4 to 2 / 3, preferably 1 / 3, and the ratio between the outer diameter of the portion of the top support section 232 used to define the guide hole 223 and the diameter of the mounting section 221 is 2 / 3 to 1, preferably 3 / 4 or 4 / 5.

[0068] In some alternative embodiments of this utility model, the support rod 220 is provided with a central through hole, and the lower end of the lifting rod 230 is directly threaded into the central through hole.

[0069] In some embodiments of this utility model, such as Figure 4 and Figure 5 As shown, the space within the housing section 231 also provides installation space for the elastic device 240. Specifically, the elastic device 240 is disposed within the housing section 231 and is located between the installation section 221 and the top support section 232. This arrangement prevents the elastic device 240 from being exposed, protects the elastic device 240, and improves the integration of the top rod 200, facilitating the installation and assembly of the top rod 200.

[0070] In some embodiments of this utility model, the elastic device 240 can be a compression spring, fitted onto the guide section 222. This fitted arrangement ensures that the upper surface of the mounting section 221 and the lower surface of the support section 232 experience relatively uniform forces, preventing the lifting rod 230 and the support rod 220 from tilting due to eccentric force distribution. The compression spring provides an upward force to propel the lifting rod 230.

[0071] In some alternative embodiments of this utility model, the elastic device 240 may also be fitted onto the mounting section 221, and the upper end of the elastic device 240 may abut against the lower end face of the mounting section 231.

[0072] In some embodiments of this utility model, such as Figures 1 to 3 As shown, the push rod 200 also includes a support base 210 disposed at the lower end of the support rod 220. The support base 210 is used to cooperate with other structures of the wafer carrier to install the push rod 200, such as when the support base 210 is installed on the base assembly 100 of the wafer carrier.

[0073] Specifically, the support 210 is provided with a mounting hole. The mounting hole is configured to allow a screw 211 to pass through, and the lower end of the mounting hole is flared to accommodate the head of the screw 211 and prevent the screw from moving upward. Figure 7 As shown, the base assembly 100 of the wafer support device may have a threaded hole with the opening facing downwards. A screw passes through from bottom to top and is screwed into the threaded hole on the base assembly 100, and the head of the screw can be completely inside the lower end of the mounting hole. The screw 211 is preferably a countersunk screw, a flat screw, etc., so that the push rod 200 can be installed on the equipment from bottom to top, improving the portability of the installation.

[0074] In some embodiments of this utility model, such as Figure 4 and Figure 6 As shown, to facilitate the rotation of the lifting rod 230, especially manual rotation, a through hole 234 is provided on the upper part of the lifting rod 230. The through hole 234 is used for inserting an external tool so that the lifting rod 230 can rotate under the drive of the external tool. The external tool can be a rod-shaped tool, such as a screwdriver.

[0075] In some alternative embodiments of this utility model, such as Figure 2 and Figure 6 As shown, the push rod 200 also includes an anti-slip component 250, which is disposed on the upper end surface of the lifting rod 230. With the anti-slip component 250 disposed at the upper end of the lifting rod 230, when the wafer is at the upper end of the push rod 200, the anti-slip component 250 can increase the friction between the push rod 200 and the wafer, preventing the wafer from slipping.

[0076] In some embodiments of this invention, the anti-slip component 250 is a friction ring. An annular mounting groove 235 is formed on the upper end face of the lifting rod 230. The annular mounting groove 235 is a constricted groove, and the anti-slip component 250 is installed within it, with the friction ring portion positioned on the upper side of the upper end face. The annular mounting groove 235 facilitates the installation of the friction ring and prevents it from detaching from the groove. The high-friction ring has high flexibility and will not scratch the wafer.

[0077] In some other embodiments of this utility model, the anti-slip component 250 is a friction pad, which is disposed on the upper end surface of the lifting rod 230. The friction pad can be installed on the upper end surface of the lifting rod 230 by adhesive bonding.

[0078] like Figure 7 As shown, this embodiment of the invention also provides a wafer carrier device, which includes a base assembly 100, a wafer loading stage 300, and a top rod 200 as described in any of the above embodiments. The wafer loading stage 300 is disposed above the base assembly 100 and is used to carry wafers; that is, the wafer can be mounted on the wafer loading stage 300 and rise or fall with the wafer loading stage 300. The wafer loading stage 300 has a through hole. The support rod 220 of the top rod 200 is mounted on the base assembly 100 and is coaxially arranged with the through hole. The lifting rod 230 is configured to extend upward out of the through hole. Multiple through holes and top rods 200 can be provided to support the wafer at multiple locations.

[0079] In some embodiments of this utility model, the wafer carrier device further includes a wafer loading stage lifting device, disposed between the base assembly 100 and the wafer loading stage 300, configured to drive the wafer loading stage 300 to move up and down. Figure 7 As shown, the wafer loading stage lifting device includes a lower wedge 410, an upper wedge 420, and a driving device. The lower wedge 410 is movably disposed on the base assembly 100 in the horizontal direction. The inclined surface of the upper wedge 420 engages with the inclined surface of the lower wedge 410, and the inclined surface of the upper wedge 420 moves on the inclined surface of the lower wedge 410. The upper wedge 420 is vertically mounted on the base assembly 100. The wafer loading stage 300 is disposed on the upper wedge 420. The driving device is configured to drive the lower wedge 410 to move in the horizontal direction.

[0080] In some other embodiments of the present invention, the wafer carrier device further includes a lifting device for a top rod 200, which is disposed between the base assembly 100 and the top rod 200 and configured to drive the top rod 200 to move up and down.

[0081] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A push rod for a wafer carrier device, characterized in that, include: Support rod; A lifting rod is coaxially disposed at the upper end of the support rod and threadedly connected to the support rod so as to lift and lower when rotating relative to the support rod; An elastic device is disposed between the support rod and the lifting rod, configured to apply a force that moves the support rod and the lifting rod closer to or further apart from each other.

2. The push rod according to claim 1, characterized in that, The support rod includes: The installation section is provided with external threads; A guide section, which is coaxially disposed on the upper part of the mounting section; The lifting boom includes: The assembly section has an internal thread on its inner wall that mates with the external thread; A top support section is connected to the upper end of the assembly section, and the top support section has a guide hole; the guide section is inserted into the guide hole; The elastic device is disposed within the assembly section and is located between the installation section and the top support section; the elastic device is a compression spring and is fitted into the guide section.

3. The push rod according to claim 2, characterized in that, The ratio between the length of the mating area between the kit section and the installation section and the length of the kit section is 1 / 5 to 9 / 10; The ratio between the length of the guide section inserted into the guide hole and the length of the guide section is 1 / 5 to 9 / 10.

4. The push rod according to claim 2, characterized in that, The ratio between the diameter of the guide section and the diameter of the mounting section is 1 / 4 to 2 / 3; The ratio between the outer diameter of the portion of the top support section that defines the guide hole and the diameter of the mounting section is 2 / 3 to 1.

5. The push rod according to claim 1, characterized in that, Also includes: An anti-slip component is provided on the upper end surface of the lifting rod.

6. The push rod according to claim 5, characterized in that, The anti-slip component is a friction ring; the upper end face of the lifting rod has an annular mounting groove, which is a constricted groove, and the anti-slip component is installed in the annular mounting groove, with part of the friction ring located on the upper side of the upper end face; or, The anti-slip component is a friction pad, which is disposed on the upper end surface of the lifting rod.

7. The push rod according to claim 1, characterized in that, The upper part of the lifting rod is provided with a through hole for inserting an external tool so that the lifting rod can rotate under the drive of the external tool.

8. The push rod according to claim 1, characterized in that, Also includes: A support base is provided at the lower end of the support rod, and the support base is provided with mounting holes; The mounting hole is configured for the screw to pass through, and the lower end of the mounting hole is flared to accommodate the head of the screw and prevent the screw from moving upward.

9. A wafer carrier device, characterized in that, include: Base assembly; A wafer loading stage is disposed above the base assembly, and the wafer loading stage is provided with through holes; The top rod according to any one of claims 1 to 8, wherein the support rod is mounted on the base assembly and coaxially arranged with the through hole; the lifting rod is configured to extend upward out of the through hole.

10. The wafer carrier device according to claim 9, characterized in that, Also includes: A wafer loading stage lifting device is disposed between the base assembly and the wafer loading stage, and is configured to drive the wafer loading stage to move up and down; or, A lifting device for the top rod is disposed between the base assembly and the support rod, and is configured to drive the top rod to lift or lower.

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