Heat dissipation cover

Abstract

The utility model provides a heat dissipation cover, which relates to the field of semiconductor parts, is used for being arranged above a substrate, and comprises a cover body, a concave area is arranged on one surface of the cover body facing the substrate, the shape of the concave area is the same as that of the cover body, and the concave area is arranged on the other surface of the cover body. The length and the width of the concave area are reduced in an equal ratio compared with the length and the width of the cover body; the plurality of supporting columns are arranged in the concave area, and the supporting columns are used for connecting the cover body and the substrate to limit the warping of the cover body and / or the substrate; according to the heat dissipation cover, the supporting columns connected with the substrate and the cover body are arranged on the cover body, the warping amplitude of the cover plate and the substrate is limited through the supporting columns, and therefore it is guaranteed that the cover body and the substrate make close contact, air gaps are avoided, and the heat conduction efficiency of the heat dissipation cover is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor components, and in particular to a heat sink cover. Background Technology

[0002] In semiconductor packaging, in order to control and manage the heat generated when the semiconductor chip is working, a heat sink is usually placed on the semiconductor substrate to dissipate heat from the semiconductor.

[0003] When a large heat sink (35*35mm or larger) is connected to the substrate, excessive warping between the heat sink and the substrate may prevent the thermal interface material on the substrate from making close contact with the surface of the heat sink, thus forming an air gap. This not only increases the thermal resistance of the thermal interface material and reduces the heat conduction efficiency, but may also affect the overall heat dissipation effect of the semiconductor, leading to excessively high semiconductor temperature and affecting the performance and reliability of the semiconductor.

[0004] To address the problem of poor semiconductor heat dissipation caused by excessive warpage between the heat sink and the substrate in large-size packages, this application provides a heat sink. Utility Model Content

[0005] This utility model provides a heat dissipation cover, the purpose of which is to solve the problem of poor heat dissipation caused by warping between the heat dissipation cover and the substrate.

[0006] To achieve the above objectives, embodiments of this utility model provide a heat dissipation cover for placement above a substrate, comprising:

[0007] The cover body has a recessed area on the side facing the substrate. The recessed area has the same shape as the cover body, and the length and width of the recessed area are proportionally reduced compared to the length and width of the cover body.

[0008] Several support columns are disposed within the recessed area, and the support columns are used to connect the cover body and the substrate to limit the warping of the cover body and / or the substrate.

[0009] Preferably, the cover body is rectangular, circular, or elliptical.

[0010] Preferably, the cover body is rectangular, and the plurality of the support columns are arranged in a rectangular array.

[0011] Preferably, the support column is made of metal.

[0012] Preferably, the support column is made of copper.

[0013] Preferably, the cross-section of the support column is circular or polygonal.

[0014] Preferably, the support column is formed separately from the cover body, and the support column is connected in the recessed area of ​​the cover body.

[0015] Preferably, the support column is mechanically connected or bonded to the cover body or substrate.

[0016] Preferably, the mechanical connection includes bolt connection, riveting, welding, and snap-fit.

[0017] Preferably, the bonding is performed by using high-temperature adhesive to connect the support column to the cover body or substrate.

[0018] The above-mentioned solution of this utility model has the following beneficial effects:

[0019] By designing support pillars between the cover body and the substrate, the warping of the cover and the substrate is limited, thereby ensuring close contact between the heat sink and the chip and the thermal interface material, avoiding the separation of the thermal interface material from the heat sink and the chip to create air gaps, and improving the thermal conduction efficiency of the package.

[0020] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a rectangular heat sink.

[0022] Figure 2 This is a schematic diagram of an oval-shaped heat sink.

[0023] Figure 3 yes Figure 1 A diagram illustrating the use of the heat dissipation cover.

[0024] [Explanation of Labels in the Attached Image]

[0025] 1-Cover body, 2-Recessed area, 3-Support column.

[0026] A-Packaging substrate, B-Chip, C-Thermal interface material layer. Detailed Implementation

[0027] To make the technical problems, technical solutions and advantages of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0028] like Figure 1 and 2As shown, an embodiment of this utility model provides a heat dissipation cover for mounting on a substrate. Specifically, the heat dissipation cover includes a cover body 1, on which a recessed area 2 is provided. The recessed area 2 has the same shape as the cover body 1, and its center coincides with the center of the cover body 1. Furthermore, the length and width of the recessed area 2 are proportionally reduced compared to the length and width of the cover body 1, meaning the recessed area 2 is located within the outline of the cover body 1. Preferably, the distance M between the edge of the recessed area 2 and the edge of the cover body 1 is equidistant.

[0029] The cover body 1 has a length direction and a width direction, and the recessed area 2 has a length direction and a width direction. The length direction and width direction of the recessed area 2 and the cover body 1 are the same.

[0030] A support column 3 is also provided in the recessed area 2, with its two ends used to connect the cover body 1 and the substrate, respectively. By connecting the support column 3 to the cover body 1 and the substrate, the cover body 1 and the substrate are formed as a whole, thereby preventing the cover body 1 and / or the substrate from warping and ensuring the heat conduction efficiency of the heat sink.

[0031] Furthermore, in this application, the shape of the cover body 1 can be one of rectangle, circle, or ellipse.

[0032] When the cover body 1 is rectangular, the support columns 3 are arranged in a rectangular array. The four support columns are arranged in a rectangular array at the four corners of the recessed area 2. If the length and / or width of the cover body 1 is too long, warping will still occur after the four support columns 3 are fixed. Support columns 3 can be added in the length and width directions. The newly added support columns 3 are located between the support columns 3 at the two corners until no warping occurs.

[0033] When the cover body 1 is elliptical, the support columns 3 can be arranged along the major axis and minor axis of the ellipse. Similarly, if the major or minor axis of the cover body 1 is too long, warping will still occur after fixing the four support columns 3. In this case, additional support columns 3 can be added along the major or minor axis, with the newly added support columns 3 located between the existing support columns 3 along the major or minor axis, to prevent warping of the cover body 1. Similarly, the support columns 3 can be arranged in the same manner as the elliptical cover body 1 for a circular cover body.

[0034] In order to improve the heat conduction efficiency of the cover body 1, the support column 3 is made of metal. One end of the metal support column 3 is connected to the substrate and the other end is connected to the cover body 1, so as to conduct the heat generated by the semiconductor during operation to the cover body 1, thereby achieving heat dissipation.

[0035] Preferably, the support column 3 is made of copper.

[0036] Preferably, the cross-section of the support column 3 is circular or polygonal, with rectangles being a commonly used polygon.

[0037] In order to enable the installation of the support column 3 and improve its compatibility, and to facilitate the improvement of the heat sink of the existing semiconductor, the support column 3 and the cover body 1 are manufactured separately. During assembly, the support column 3 is set in the recessed area 2 of the cover body 1.

[0038] Preferably, the support column 3 is mechanically connected to the cover body 1 and the support column 3 is bonded to the substrate. The mechanical connection includes screwing the support column 3 to the cover body 1 or the substrate using bolts, riveting the support column 3 to the cover body 1 or the substrate using anchors, welding the support column 3 to the cover body 1 or the substrate by heating and melting, and snapping the support column 3 to the cover body 1 or the substrate using slots and buckles.

[0039] Bonding refers to using adhesive to connect the support post 3 to the cover body 1 and / or substrate. Preferably, a high-temperature adhesive is selected to prevent the semiconductor from delaminating due to the large amount of heat generated during operation, which would cause the support post 3 to detach from the cover body 1 and / or substrate.

[0040] Reference Figure 3 , Figure 3 This is a schematic diagram of the rectangular heat sink. In use, the side with the recessed area 2 faces the packaging substrate A. A thermal interface material is applied to the upper surface of the chip B to form a thermal interface layer C. The cover body 1 is then attached to the packaging substrate A, surrounding the chip B. Simultaneously, the two ends of the support pillars 3 are mechanically connected or bonded to the cover body 1 and the packaging substrate A, respectively, thus achieving semiconductor encapsulation. During operation, the heat generated by the encapsulated semiconductor is transferred to the cover body 1 through the support pillars 3, and then dissipated through the cover body 1. Because of the added support pillars 3, and the fact that both ends of the support pillars 3 remain connected to the packaging substrate and the cover body 1, warping of the cover body 1 is prevented, thus preventing separation between the cover body 1 and the thermal interface layer C, or between the chip B and the thermal interface layer C, which could create an air gap affecting heat dissipation.

[0041] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A heat dissipation cover for being disposed above a substrate, characterized in that, include: The cover body (1) has a recessed area (2) on the side of the cover body (1) facing the substrate. The recessed area (2) has the same shape as the cover body (1), and the length and width of the recessed area (2) are proportionally reduced compared to the length and width of the cover body. Several support columns (3) are disposed in the recessed area (2), the support columns (3) are used to connect the cover body (1) and the substrate to limit the warping of the cover body (1) and / or the substrate.

2. The heat dissipation cover according to claim 1, characterized in that: The cover body (1) is one of the following shapes: rectangular, circular, or elliptical.

3. The heat dissipation cover according to claim 2, characterized in that: The cover body (1) is rectangular, and the supporting columns (3) are arranged in a rectangular array.

4. The heat dissipation cover according to claim 1, characterized in that: The support column (3) is made of metal.

5. The heat dissipation cover according to claim 4, characterized in that: The support column (3) is made of copper.

6. The heat dissipation cover according to claim 4, characterized in that: The cross-section of the support column (3) is circular or polygonal.

7. The heat dissipation cover according to claim 1, characterized in that: The support column (3) is formed separately from the cover body (1), and the support column (3) is connected in the recessed area (2) of the cover body (1).

8. The heat dissipation cover according to claim 7, characterized in that: The support column (3) is mechanically connected or bonded to the cover body (1) or the substrate.

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