Embedded micro-channel chip packaging structure for heat dissipation of hot spot area

Abstract

The utility model provides an embedded micro-channel chip packaging structure for heat dissipation of a hot spot area, which relates to the field of semiconductor packaging and comprises a heat dissipation cover bonded on the upper surface of a chip; the micro-channels and the matrix structure are arranged on the surface, facing the chip, of the heat dissipation cover, and the starting end and the tail end of each micro-channel are communicated with a liquid inlet channel and a liquid outlet channel respectively; the matrix structure is located right above the chip hot spot, the matrix structure is located on a flow path of the micro-channel, the matrix structure comprises capillary channels in a first direction and a second direction, and the second direction is perpendicular to the first direction; the liquid inlet and the liquid outlet are formed in the heat dissipation cover, the liquid inlet is used for communicating with the liquid inlet flow channel, the liquid outlet is used for communicating with the liquid outlet flow channel, the liquid inlet and the liquid outlet are used for enabling a working medium to enter and flow out of the micro-flow channel and the matrix structure, the capillary flow channel can increase the contact area of the working medium and the hot spot area, and therefore the heat dissipation effect on the hot spot area is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor package, especially relates to a embedded micro -channel chip package structure for hot spot area heat dissipation. BACKGROUND

[0002] The chip often produces heat in the working process, and the heat can cause the performance of the chip to decline, accelerate the aging of the chip and shorten the service life of the chip. The heat generated by the chip is not uniform, but the corresponding hot spot is generated in one or several regions of the chip due to high power consumption, that is, the heat generation is more in the hot spot region, and the heat generation is relatively less in other regions.

[0003] At present, in the chip heat dissipation appliance, it is often treated according to uniform heat dissipation, which leads to poor heat dissipation effect, and the chip after heat dissipation still has temperature gradient, therefore, the present application carries out targeted heat dissipation for the hot spot region of the chip, and improves the heat dissipation effect of the chip. UTILITY MODEL CONTENTS

[0004] The utility model provides a embedded micro -channel chip package structure for hot spot area heat dissipation, and the purpose is to solve the problem that the existing heat dissipation appliance does not carry out targeted heat dissipation for the hot spot region.

[0005] In order to achieve the above purpose, the embodiment of the utility model provides a embedded micro -channel chip package structure for hot spot area heat dissipation, which comprises:

[0006] The heat dissipation cover is bonded to the upper surface of the chip.

[0007] The micro -channel is arranged on the side of the heat dissipation cover facing the chip, and the micro -channel is provided with M, M micro -channels are arranged along the first direction, and the inlet flow channel and the outlet flow channel are communicated at the beginning and the end of each micro -channel, and M is a positive integer greater than or equal to 1.

[0008] The matrix structure is arranged on the side of the heat dissipation cover facing the chip, and the matrix structure is located directly above the hot spot of the chip, and the matrix structure is located on the flow path of the micro -channel, and the matrix structure comprises capillary flow channels in the first direction and the second direction, and the second direction is perpendicular to the first direction.

[0009] The inlet and the outlet are arranged on the heat dissipation cover respectively, the inlet is used for communicating the inlet flow channel, the outlet is used for communicating the outlet flow channel, and the inlet and the outlet are used for the working medium to enter and flow out of the micro -channel and the matrix structure.

[0010] Preferably, the heat sink has a recessed area on the side facing the chip, and the matrix structure is disposed in the recessed area. The matrix structure includes N1 rib structures arranged along a first direction and N2 rib structures arranged along a second direction. The rib structures in the first and second directions are arranged in a rectangular array. The rib structures arranged in the first direction form a capillary channel in the second direction, and the rib structures arranged in the second direction form a capillary channel in the first direction. N1 and N2 are both positive integers greater than or equal to 3.

[0011] Preferably, the recessed area is provided with flow channel sidewalls arranged along the first direction, and there are M+1 flow channel sidewalls, with adjacent flow channel sidewalls forming the microchannel.

[0012] Preferably, a thermal interface material layer is provided at one end of the pin rib structure and the flow channel sidewall near the chip, and the pin rib structure and the flow channel sidewall are fixed to the chip through the thermal interface material layer.

[0013] Preferably, the working fluid is a nanofluid, and the nanomaterial in the nanofluid is Al2O3, CuO, or Fe2O3, with a volume fraction of 0-5% in the nanofluid.

[0014] Preferably, the heat sink is made of silicon, copper, or aluminum.

[0015] Preferably, the bonding method between the heat sink and the chip is one of high-temperature bonding, direct bonding, or metal bonding.

[0016] The above-mentioned solution of this utility model has the following beneficial effects:

[0017] In this application, the chip is cooled as a whole by embedding microchannels on the heat sink, which shortens the distance between the working fluid and the chip, thereby reducing thermal resistance and ensuring the basic heat dissipation effect of the chip. A matrix structure is set on the microchannel, and the position of the matrix structure corresponds to the hot spot area of ​​the chip. The matrix structure has capillary channels, so that the working fluid flows through the capillary channels when flowing in the microchannel. The capillary channels can increase the contact area between the working fluid and the hot spot area, thereby improving the heat dissipation effect of the hot spot area.

[0018] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0019] Figure 1 This is a longitudinal sectional view of the present invention;

[0020] Figure 2 This is a schematic diagram of microchannels and matrix structures.

[0021] [Explanation of Labels in the Attached Image]

[0022] 10-Heat dissipation cap, 11-Microchannel, 12-Liquid inlet channel, 13-Liquid outlet channel

[0023] 14-Capillary channel, 15-Inlet, 16-Outlet, 18-Needle rib structure, 19-Channel sidewall, 20-Chip Detailed Implementation

[0024] To make the technical problems, technical solutions and advantages of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0025] like Figure 1 and 2 As shown, an embodiment of this utility model provides an embedded microfluidic chip packaging structure for heat dissipation in hot spots, including a heat sink 10 and a chip 20. The heat sink 10 is bonded to the upper surface of the chip 20. Microchannels 11 and a matrix structure are provided on the side of the heat sink 10 facing the chip 20. M microchannels 11 are provided, all arranged along a first direction. Each microchannel 11 has an inlet channel 12 and an outlet channel 13 connected to its beginning and end, respectively. M is a positive integer greater than or equal to 1. The matrix structure is located directly above the hot spots of the chip 20, along the flow path of the microchannels 11. The matrix structure includes capillary channels 14 in the first and second directions, which are perpendicular to each other.

[0026] The heat dissipation cover 10 is also provided with an inlet 15 and an outlet 16. The inlet 15 is used to connect to the inlet channel 12, and the outlet 16 is used to connect to the outlet channel 13. The inlet 15 and the outlet 16 are used for the working fluid to flow into and out of the microchannel 11 and the matrix structure.

[0027] When the working fluid flows into the inlet 15, it is diverted through the inlet channel 12 into M microchannels 11. During the flow of the working fluid within the microchannels 11, it dissipates heat from the entire chip 20, achieving basic heat dissipation. After heat exchange between the working fluid and the chip 20, it flows from the M microchannels 11 to the outlet channel 13 and is discharged through the outlet 16. This circulation of the working fluid achieves basic heat dissipation.

[0028] Furthermore, since the matrix structure is set on the flow path of the microchannel 11 and is located directly above the hot spot area, when the working fluid encounters the matrix structure, it is diverted along the capillary channel 14 in the first direction. After entering the capillary channel 14 in the first direction, the working fluid is diverted to the first or second direction, thereby increasing the contact area between the working fluid and the hot spot, rapidly cooling the hot spot and preventing the hot spot from heating up due to heat accumulation. The working fluid in the capillary channel 14 flows into the microchannel 11 and is discharged through the liquid outlet channel 13 and the liquid outlet 16.

[0029] In this application, basic heat dissipation of the chip 20 is achieved through the microchannel 11, maintaining the chip 20 at a good operating temperature. The matrix structure dissipates heat from hot spots through the capillary channel 14. When the flow rate is constant, the cross-sectional area of ​​the capillary channel 14 is smaller than that of the microchannel 11. Therefore, the working fluid flows faster through the capillary channel 14, increasing the heat exchange efficiency. At the same time, the capillary channel 14 also increases the contact area with the hot spots of the chip 20, effectively preventing the temperature at the hot spots from exceeding the overall temperature of the chip 20. Taking the microchannel 11 as an example, the cross-sectional area refers to the product of the height of the microchannel 11 and the length of the microchannel 11 in the second direction.

[0030] In one embodiment of this application, a recessed area is provided on the side of the heat sink 10 facing the chip 20. The aforementioned matrix structure is disposed within the recessed area. The matrix structure includes N1 rib structures 18 disposed along a first direction and N2 rib structures 18 disposed along a second direction. The rib structures 18 in the first and second directions are equally spaced and arranged in a rectangular array. The aforementioned rib structures 18 in the first direction form capillary channels 14 in the second direction, and the rib structures 18 in the second direction form capillary channels 14 in the first direction.

[0031] In this application, N1 and N2 are both positive integers greater than or equal to 3, meaning there are at least two capillary channels 14 in the first direction and the second direction. Preferably, the length of the matrix structure in the first direction is greater than or equal to the length of the hotspot in the first direction, and the width of the matrix structure in the second direction is greater than or equal to the width of the hotspot in the second direction. The number of matrix structures is set based on the number of hotspots on the chip 20.

[0032] Furthermore, a flow channel sidewall 19 is provided in the recessed area along the first direction. M+1 flow channel sidewalls 19 are provided, and adjacent flow channel sidewalls 19 form the aforementioned microchannels 11.

[0033] In another embodiment of this application, no recessed area is provided on the side of the heat sink 10 facing the chip 20, and the liquid inlet channel 12, liquid outlet channel 13, microchannel 11 and capillary channel 14 are formed by milling.

[0034] In the two embodiments described above, a thermal interface material is coated on one end of the pin rib structure 18 and the flow channel sidewall 19 near the chip 20. The pin rib structure 18 and the flow channel sidewall 19 are bonded to the chip 20 through the thermal interface material, thereby forming a thermal interface material layer between the pin rib structure 18, the flow channel sidewall 19 and the chip 20. The thermal interface material layer can improve the thermal conductivity between the chip 20 and the heat sink 10 and optimize the heat dissipation performance.

[0035] In the two embodiments described above, the working fluid is a nanofluid, and the nanomaterial in the nanofluid is one of AL2O3, CUO or FE2O3, with a volume fraction of 0-5% in the nanofluid.

[0036] In this application, a highly thermally conductive nanofluid is used as the working fluid, which has a better thermal conductivity than conventional deionized water. However, due to the high viscosity of the nanofluid, its flow can be affected in conventional heat dissipation channels. In this application, the microchannels 11 and capillary channels 14 can overcome the limitations caused by the high viscosity of the nanofluid by reducing the flow rate, thus fully utilizing the thermal conductivity of the nanofluid.

[0037] Preferably, the heat sink 10 is made of silicon, copper, or aluminum.

[0038] Preferably, the bonding method between the heat sink 10 and the chip 20 is one of high-temperature bonding, direct bonding, or metal bonding.

[0039] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. An embedded microfluidic chip packaging structure for heat dissipation in hotspot areas, characterized in that, include: A heat sink (10) is bonded to the upper surface of the chip (20); Microchannels (11) are disposed on the side of the heat sink (10) facing the chip (20). M microchannels (11) are disposed along a first direction. Each microchannel (11) is connected to an inlet channel (12) and an outlet channel (13) at its beginning and end, respectively. M is a positive integer greater than or equal to 1. A matrix structure is disposed on the side of the heat sink (10) facing the chip (20). The matrix structure is located directly above the hot spot of the chip (20) and on the flow path of the microchannel (11). The matrix structure includes capillary channels (14) in a first direction and a second direction, wherein the second direction is perpendicular to the first direction. The liquid inlet (15) and liquid outlet (16) are respectively provided on the heat dissipation cover (10). The liquid inlet (15) is used to connect the liquid inlet channel (12), and the liquid outlet (16) is used to connect the liquid outlet channel (13). The liquid inlet (15) and the liquid outlet (16) are used for the working fluid to enter and flow out of the microchannel (11) and matrix structure.

2. The embedded microfluidic chip packaging structure for heat dissipation in hotspot areas according to claim 1, characterized in that: The heat sink (10) has a recessed area on the side facing the chip (20), and the matrix structure is disposed in the recessed area. The matrix structure includes N1 rib structures (18) arranged along a first direction and N2 rib structures (18) arranged along a second direction. The rib structures (18) in the first direction and the second direction are arranged in a rectangular array. The rib structures (18) arranged in the first direction form a capillary channel (14) in the second direction, and the rib structures (18) arranged in the second direction form a capillary channel (14) in the first direction. N1 and N2 are both positive integers greater than or equal to 3.

3. The embedded microfluidic chip packaging structure for heat dissipation in hotspot areas according to claim 2, characterized in that: The recessed area is provided with a flow channel sidewall (19) arranged along the first direction. There are M+1 flow channel sidewalls (19), and adjacent flow channel sidewalls (19) form the microchannel (11).

4. The embedded microfluidic chip packaging structure for heat dissipation in hotspot areas according to claim 3, characterized in that: A thermal interface material layer is provided at one end of the pin rib structure (18) and the flow channel sidewall (19) near the chip (20). The pin rib structure (18) and the flow channel sidewall (19) are fixed on the chip (20) through the thermal interface material layer.

5. The embedded microfluidic chip packaging structure for heat dissipation in hotspot areas according to claim 1, characterized in that: The working fluid is a nanofluid, and the nanomaterials within the nanofluid are AL2O3, CUO, or FE2O3.

6. The embedded microfluidic chip packaging structure for heat dissipation in hotspot areas according to claim 1, characterized in that: The heat sink (10) is made of silicon, copper or aluminum.

7. The embedded microfluidic chip packaging structure for heat dissipation in hotspot areas according to claim 1, characterized in that: The bonding method between the heat sink (10) and the chip (20) is one of high-temperature bonding, direct bonding or metal bonding.

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