Recovery device for volatile solvent in polyimide film drying process

By designing a condensation mechanism and a temperature control system, the volatile solvents in the polyimide film drying process are efficiently recovered, solving the problems of efficiency reduction and environmental pollution caused by solvent evaporation, and realizing efficient resource utilization and environmentally friendly production.

CN223901253UActive Publication Date: 2026-02-13TIANJIN TIANYUAN ELECTRONICS MATERIAL
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Patent Information

Application Number
CN202423272508.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2026-02-13
Estimated Expiration
2034-12-30

AI Technical Summary

Technical Problem

The evaporation of solvents during the drying process of polyimide films leads to decreased efficiency, increased production costs, and environmental pollution. Existing technologies make it difficult to effectively recover the evaporating solvents.

Method used

Design a condensation mechanism comprising a metal cone, a hollow tube, a flow guide tube, and a semiconductor cooling chip to achieve efficient recovery by condensing and collecting volatile solvents, combined with a temperature control box.

Benefits of technology

It improves solvent condensation efficiency, reduces harmful gas emissions, lowers production costs, increases resource utilization, and improves the production environment and health and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a device for recovering a volatile solvent in a polyimide film drying process, which comprises a drying tank, a support frame is fixedly arranged on the surface of the drying tank, the top of the drying tank is communicated with an exhaust pipe, and the top of the exhaust pipe is communicated with a condensation box. Through the arrangement of the metal cone, the hollow pipe and other parts, a gaseous solvent is condensed into a liquid state when encountering the surface of the metal cone, flows towards the bottom through the conical design of the metal cone, enters the flow guide pipe through the hollow pipe and the conical pipe, and then enters the collection box, so that efficient collection is carried out, and the collection efficiency is improved. By controlling the temperature of the semiconductor chilling plate, the condensation efficiency of the solvent can be higher, heat generated by the semiconductor chilling plate is exhausted through the heat dissipation plate and the fan, gas circulates through the air inlet, and the condensation efficiency of the solvent is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to polyimide film manufacturing technical field especially relates to a kind of recovery device of volatile solvent in polyimide film drying process. BACKGROUND

[0002] Polyimide film (PI film) is a high-quality polymer material, with the highest flame retardant rating (UL-94), good electrical insulation performance, mechanical properties, chemical stability, aging resistance and radiation resistance, polyimide film drying is an important link in the processing process, usually produced by casting method, and high-temperature baking is carried out in imidization furnace to complete the imidization process. The baking process needs to accurately control temperature, time and atmosphere to ensure the quality of the film, the temperature needs to be higher than the glass transition temperature of PI material but lower than its decomposition temperature, the time needs to be set according to experimental data, and the atmosphere needs to be controlled as nitrogen or inert gas, etc. to exclude the influence of oxygen on the baking process. Precise baking conditions can avoid cracks and color changes in the film, ensure the adhesion and transparency of the film, and meet the application requirements in the field of microelectronics.

[0003] Polyimide film needs to be used with specific solvents during drying. Under high temperature conditions, solvents are particularly prone to volatilization, which can reduce the use efficiency, increase the production cost of the factory, and the volatilization of solvents can cause damage to the air and environmental pollution. Therefore, a recovery device for volatile solvent in polyimide film drying process is proposed to solve the above problems. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the deficiency of prior art, and provides a kind of recovery device of volatile solvent in polyimide film drying process.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: a kind of recovery device of volatile solvent in polyimide film drying process, comprising: drying tank, the surface of the drying tank is fixedly installed with support frame, the top of the drying tank is communicated with exhaust pipe, the top of the exhaust pipe is communicated with condensing box, the left side of the condensing box is fixedly connected with support plate, the inside of the condensing box is provided with condensing mechanism, and the condensing mechanism is used to recover the volatile solvent of drying tank, and the surface of the drying tank is fixedly connected with placing plate.

[0006] Further, the condensing mechanism includes a metal cone, two metal cones are fixedly installed on the surface of the inner wall of the condensing box, the inside of the metal cone is fixedly connected with a hollow tube, the bottom of the hollow tube is fixedly connected with a conical tube, the bottom of the condensing box is communicated with a flow guide pipe, and the materials of the hollow tube, conical tube and flow guide pipe are metal.

[0007] Furthermore, the bottom of the guide pipe is connected to a collection box, and a fixing ring is movably connected to the surface of the collection box. The inner side of the fixing ring is fixedly connected to the surface of the drying tank. There are two fixing rings, and the collection box is installed on the top of the placement plate.

[0008] Furthermore, a temperature control box is fixedly connected to the top of the support plate, a metal plate is fixedly connected to the surface of the metal cone, a semiconductor refrigeration chip is fixedly connected to the outside of the metal plate, a heat-conducting plate is fixedly connected to the outside of the semiconductor refrigeration chip, and a fan is fixedly connected to the outside of the heat-conducting plate.

[0009] Furthermore, the temperature control box has an air inlet on its top, and a dustproof net is provided on the top of the air inlet.

[0010] Furthermore, the surface of the metal cone has openings, and the number of openings is several and they are evenly distributed in a ring.

[0011] The beneficial effects of this utility model are as follows: By using components such as a metal cone and a hollow tube, the gaseous solvent is condensed into a liquid state upon contact with the surface of the metal cone, flows to the bottom, and enters the interior of the guide tube through the hollow tube and the conical tube, thus entering the interior of the collection box for efficient collection. By controlling the temperature of the semiconductor cooling chip, the solvent condensation efficiency can be further improved. The heat generated by the semiconductor cooling chip is discharged through the heat sink and fan, and the gas circulates through the air inlet, which improves the solvent condensation efficiency and makes it convenient for users. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ;

[0013] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ;

[0014] Figure 3 This is a schematic diagram of the condenser box structure of this utility model;

[0015] Figure 4 This is a schematic diagram of the hollow tube structure of this utility model;

[0016] Figure 5 For the present utility model Figure 4 Enlarged structural diagram at point A in the middle;

[0017] Figure 6 This is a schematic diagram of the exhaust pipe structure of this utility model;

[0018] In the figure: 1, drying tank; 2, support frame; 3, exhaust pipe; 4, condensing box; 5, support plate; 6, condensing mechanism; 61, metal cone; 62, hollow tube; 63, conical tube; 64, flow guide pipe; 65, collection box; 66, fixing ring; 67, temperature control box; 68, semiconductor refrigeration sheet; 69, heat conduction plate; 610, fan; 611, air inlet; 612, dust screen; 613, opening; 7, placing plate;

[0019] The drawings in the utility model are schematic diagrams, and the size does not represent the actual size.

[0020] The utility model will be described below in combination with the embodiments of the utility model in detail with reference to the drawings. DETAILED DESCRIPTION

[0021] The utility model will be described below in combination with the embodiments of the utility model in detail with reference to the drawings.

[0022] As Figures 1 to 6 Indicated, a kind of polyimide film drying process volatile solvent's recovery device, comprising: drying tank 1, the surface of drying tank 1 is fixedly installed with support frame 2, the top of drying tank 1 is connected with exhaust pipe 3, the top of exhaust pipe 3 is connected with condensing box 4, the left side of condensing box 4 is fixedly connected with support plate 5, condensing box 4 is provided with condensing mechanism 6 in its inside, condensing mechanism 6 is used to recover volatile solvent of drying tank 1, the surface of drying tank 1 is fixedly connected with placing plate 7, condensing mechanism 6 recovers solvent volatilized by drying tank 1, effectively reduces the emission of harmful gas, meets environmental protection requirement, and recovered solvent can also be reused, reduce production cost, the recovery of volatile solvent not only reduces resource waste, but also improves resource utilization efficiency, so that entire production process is more economic and efficient, improve production environment, reduce the health hazard to worker.

[0023] The condensing mechanism 6 comprises metal cones 61 fixedly installed on the surface of the inner wall of the condensing box 4, the inside of the metal cone 61 is fixedly connected with a hollow tube 62, the bottom of the hollow tube 62 is fixedly connected with a conical tube 63, the bottom of the condensing box 4 is communicated with a flow guide pipe 64, the materials of the hollow tube 62, the conical tube 63 and the flow guide pipe 64 are metal, the design of the metal cone 61 and the hollow tube 62 increases the condensing area and improves the condensing efficiency. When the volatile solvent passes through the metal cone 61 and the hollow tube 62, it can fully contact with the tube wall, so that it can be condensed into liquid faster. The hollow tube 62, the conical tube 63 and the flow guide pipe 64 are all made of metal material, which has good corrosion resistance and high temperature resistance, can adapt to the high temperature environment that may be produced in the drying process, and can ensure the long-term stable operation of the device. The structure of the metal cone 61 and the hollow tube 62 is relatively simple, easy to clean and maintain. The bottom of the flow guide pipe 64 is communicated with a collection box 65, the surface of the collection box 65 is movably connected with a fixing ring 66, the inside of the fixing ring 66 is fixedly connected with the surface of the drying tank 1, the number of the fixing ring 66 is two, the collection box 65 is installed on the top of the placing plate 7, the setting of the collection box 65 facilitates the efficient storage of the collected liquid solvent, and the setting of the fixing ring 66 makes the stability of the collection box 65 on the top of the placing plate 7 better. The top of the supporting plate 5 is fixedly connected with a temperature control box 67, the surface of the metal cone 61 is fixedly connected with a metal plate, the outside of the metal plate is fixedly connected with a semiconductor refrigeration piece 68, the outside of the semiconductor refrigeration piece 68 is fixedly connected with a heat conduction plate 69, the outside of the heat conduction plate 69 is fixedly connected with a fan 610. The addition of the temperature control box 67 enables the whole condensing process to realize accurate temperature control. By adjusting the parameters in the temperature control box 67, the condensing efficiency can be optimized to ensure that the solvent is condensed within the optimal temperature range, avoiding the decrease of the recovery efficiency caused by excessive condensation or insufficient condensation. The metal plate fixed on the surface of the metal cone 61, the semiconductor refrigeration piece 68 and the heat conduction plate 69 outside form an efficient refrigeration system. The semiconductor refrigeration piece 68 can quickly reduce the temperature of the metal plate and the heat conduction plate 69, thereby speeding up the condensation process of the solvent, improving the condensing efficiency and reducing energy consumption. The fan 610 outside the heat conduction plate 69 can accelerate heat dissipation, timely discharge the heat generated in the condensation process, and maintain the stable operation of the condensing system.

[0024] The top of the temperature control box 67 is provided with an air inlet 611, and the top of the air inlet 611 is provided with a dust screen 612. The setting of the air inlet 611 facilitates the air to enter the inside of the temperature control box 67, thereby taking away the heat of the semiconductor refrigeration piece 68 by the fan 610. The surface of the metal cone 61 is provided with a plurality of through holes 613 which are evenly distributed in a ring shape. The setting of the through holes 613 effectively increases the contact area between the metal cone 61 and the volatile solvent, thereby improving the condensing efficiency.

[0025] Working principle: when using, the user controls the temperature of the semiconductor refrigeration sheet 68, so that the low temperature is transmitted to the inside of the metal cone 61 through the metal plate, so that the gaseous solvent is condensed into liquid state when encountering the surface of the metal cone 61, so as to flow to the bottom through the design of the metal cone 61, enter the inside of the flow guide pipe 64 through the hollow pipe 62 and the conical pipe 63, so as to enter the inside of the collecting box 65, so as to carry out efficient collection, and the temperature of the semiconductor refrigeration sheet 68 can make the condensation efficiency of the solvent higher, the heat generated by the semiconductor refrigeration sheet 68 is discharged through the heat dissipation plate and the fan 610, the gas circulates through the air inlet 611, which is convenient for the user to use.

[0026] The utility model has been described above in conjunction with the drawings, and obviously, the specific implementation of the utility model is not limited by the above-mentioned mode, as long as various improvements are made by adopting the method concept and technical scheme of the utility model, or direct application in other occasions without improvement, which are all within the protection scope of the utility model.

Claims

1. A device for recovering a volatile solvent during the drying of a polyimide film, comprising: The drying tank (1) is characterized in that: the surface of the drying tank (1) is fixedly installed with a support frame (2), the top of the drying tank (1) is communicated with an exhaust pipe (3), the top of the exhaust pipe (3) is communicated with a condensation box (4), the left side of the condensation box (4) is fixedly connected with a supporting plate (5), the inside of the condensation box (4) is provided with a condensation mechanism (6), the condensation mechanism (6) is used for recovering the volatile solvent of the drying tank (1), and the surface of the drying tank (1) is fixedly connected with a placing plate (7).

2. The apparatus for recovering the solvent evaporated during the drying process of the polyimide film according to claim 1, wherein: The condensation mechanism (6) comprises metal cones (61), two metal cones (61) are fixedly installed on the surface of the inner wall of the condensation box (4), the inside of the metal cone (61) is fixedly connected with a hollow tube (62), the bottom of the hollow tube (62) is fixedly connected with a tapered tube (63), and the bottom of the condensation box (4) is communicated with a flow guide pipe (64).

3. The apparatus according to claim 2, wherein the apparatus is characterized by: The bottom of the flow guide pipe (64) is communicated with a collection box (65), the surface of the collection box (65) is movably connected with a fixed ring (66), the inner side of the fixed ring (66) is fixedly connected with the surface of the drying tank (1), the number of the fixed ring (66) is two, and the collection box (65) is installed at the top of the placing plate.

4. The apparatus according to claim 2, wherein the apparatus is characterized by: The top of the supporting plate (5) is fixedly connected with a temperature control box (67), the surface of the metal cone (61) is fixedly connected with a metal plate, the outer side of the metal plate is fixedly connected with a semiconductor refrigeration piece (68), the outer side of the semiconductor refrigeration piece (68) is fixedly connected with a heat conduction plate (69), and the outer side of the heat conduction plate (69) is fixedly connected with a fan (610).

5. The apparatus according to claim 4, wherein: the polyimide film is a polyimide film for a flexible flat panel display. The top of the temperature control box (67) is provided with an air inlet (611), and the top of the air inlet (611) is provided with a dust screen (612).

6. The apparatus according to claim 2, wherein: The surface of the metal cone (61) is provided with a through hole (613), and the number of the through hole (613) is several and evenly distributed in a ring shape.