Water falling prevention device for cleaning electroplating process cavity

Abstract

The utility model belongs to the technical field of semiconductor packaging, and particularly relates to an electroplating process cavity cleaning anti-water-dropping device which comprises an electroplating assembly, an electroplating pool and deionized water nozzles arranged on the two sides of an inner cavity of the electroplating pool. The anti-falling assembly comprises a mounting plate arranged on the inner side wall of the electroplating tank, a through hole formed in the middle of the mounting plate, a fixed shaft arranged at the top of the mounting plate, a baffle arranged on the surface of the fixed shaft and rotating along the fixed shaft, a movable groove formed in the edge of the top of the mounting plate, and a movable motor arranged in an inner cavity of the movable groove and moving along the movable groove; one end of the movable motor is connected with one end of a baffle through a connecting rod; the structure is reasonable, the chip can be prevented from falling into a plating solution again in the using process, and the production and maintenance cost can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically to a plating process cavity cleaning anti -water falling device. BACKGROUND

[0002] In the field of advanced semiconductor packaging, they have the common characteristics that horizontal operation and multiple metal continuous operation, and the intermediate water washing action is carried out in each process cavity. When the deionized water cleans the wafer and wafer carrier, there is a problem that the ionized water falls into the plating solution again. Although they all have corresponding treatment measures, such as increasing the evaporation device, in fact, there are problems such as high use and maintenance cost, and the ionized water cannot be completely prevented from entering the plating solution.

[0003] Based on the above problems, we propose a plating process cavity cleaning anti -water falling device. CONTENT OF THE UTILITY MODEL

[0004] The purpose of this part is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the utility model name to avoid obscuring the purpose of this part, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the problems existing in the prior art, the utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide a plating process cavity cleaning anti -water falling device, which can prevent the chip from falling into the plating solution again during use, and help to reduce the production and maintenance cost.

[0007] In order to solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme:

[0008] A plating process cavity cleaning anti -water falling device, comprising:

[0009] The plating assembly comprises a plating tank, a deionized water nozzle arranged on both sides of the inner cavity of the plating tank, and a plating solution tank arranged on one side of the plating tank.

[0010] The anti -falling assembly comprises a mounting plate arranged on the inner wall of the plating tank, a through hole arranged in the middle of the mounting plate, a fixed shaft arranged on the top of the mounting plate, a baffle arranged on the surface of the fixed shaft and rotating along the fixed shaft, a movable slot arranged on the edge of the top of the mounting plate, and a movable motor arranged in the inner cavity of the movable slot and moving along the movable slot. One end of the movable motor is connected with one end of the baffle through a connecting rod.

[0011] As a preferred scheme of the plating process cavity cleaning anti -water falling device, one side of the plating tank is provided with a liquid discharge port.

[0012] As a preferred scheme of the electroplating process cavity cleaning anti-dropping water device, the mounting plate is circularly arranged.

[0013] As a preferred scheme of the electroplating process cavity cleaning anti-dropping water device, the movable groove is arranged in a curved manner.

[0014] As a preferred scheme of the electroplating process cavity cleaning anti-dropping water device, the connecting shaft is arranged at both ends of the connecting rod, and the connecting rod is connected with the movable motor and the baffle through the connecting shaft.

[0015] As a preferred scheme of the electroplating process cavity cleaning anti-dropping water device, the baffle is arranged in a fan shape.

[0016] As a preferred scheme of the electroplating process cavity cleaning anti-dropping water device, the baffle is arranged in a fan shape.

[0017] Compared with the prior art, the beneficial effects of the utility model are that: by opening the movable motor, the movable motor moves in the movable groove, the movable motor drives the connecting rod to move in the moving process, the connecting rod drives the baffle to rotate along the fixed shaft, the through hole is shielded, the chip can be prevented from falling into the plating solution again, and the production and maintenance costs are reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the utility model will be described in detail below in combination with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor. Wherein:

[0019] Figure 1 It is the electroplating assembly structure schematic diagram of the utility model;

[0020] Figure 2 It is the front and back structure schematic diagram of the utility model anti-falling assembly unfolded state;

[0021] Figure 3 It is the front and back structure schematic diagram of the utility model anti-falling assembly closed state;

[0022] Figure 4 It is the baffle structure schematic diagram of the utility model.

[0023] In the figure; 100 electroplating assembly, 110 electroplating tank, 120 DI water nozzle, 200 anti-falling assembly, 210 mounting plate, 211 through hole, 220 fixed shaft, 230 baffle, 240 movable groove, 250 movable motor, 260 connecting rod, 270 connecting shaft. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purpose, features and advantages of the utility model more apparent, obvious and easy to understand, the specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0025] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the utility model, but the utility model can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the utility model, therefore the utility model is not limited by the specific embodiments disclosed below.

[0026] Secondly, the utility model is described in detail in combination with the schematic diagram, when detailing the utility model embodiments, for the convenience of description, the sectional view of the device structure will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the utility model herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual production.

[0027] In order to make the purpose, technical scheme and advantages of the utility model more clear, the embodiments of the utility model will be described in further detail below in combination with the drawings.

[0028] The utility model provides the following technical scheme: a kind of electroplating process cavity cleaning anti-falling device, in the process of using, it can prevent chip from falling into plating solution again, it is helpful to reduce production and maintenance cost;

[0029] Figures 1 to 4 It is shown that the structure schematic diagram of one embodiment of the utility model electroplating process cavity cleaning anti-falling device, its main part includes electroplating assembly 100 and anti-falling assembly 200;

[0030] Electroplating assembly 100 includes electroplating tank 110, deionized water nozzle 120 mounted on the two sides of the inner cavity of electroplating tank 110, and a liquid discharge port is mounted on one side of electroplating tank 110;

[0031] The anti-falling assembly 200 comprises a mounting plate 210 mounted on the inner side wall of the electroplating tank 110, a through hole 211 mounted in the middle of the mounting plate 210, a fixed shaft 220 mounted on the top of the mounting plate 210, a baffle 230 mounted on the surface of the fixed shaft 220 and rotating along the fixed shaft 220, a movable groove 240 mounted on the edge of the top of the mounting plate 210, a movable motor 250 mounted in the inner cavity of the movable groove 240 and moving along the movable groove 240, one end of the movable motor 250 being connected with one end of the baffle 230 through a connecting rod 260, the mounting plate 210 being in a circular ring shape, the movable groove 240 being in a curved shape, the two ends of the connecting rod 260 being provided with connecting shafts 270, the connecting rod 260 being connected with the movable motor 250 and the baffle 230 through the connecting shafts 270, the baffle 230 being in a fan shape, and the top of the baffle 230 being provided with an absorption pipeline.

[0032] In combination Figures 1-3 , the anti-falling device for cleaning the electroplating process cavity of the embodiment has the following specific actions: the movable motor 250 is started, the movable motor 250 moves in the movable groove 240, the movable motor 250 drives the connecting rod 260 to move in the process of moving, the connecting rod 260 drives the baffle 230 to rotate along the fixed shaft 220, the through hole 211 is shielded, the chips can be prevented from falling into the plating solution again, and the production and maintenance costs can be reduced.

[0033] Although the utility model has been described above with reference to the embodiments, various improvements can be made and equivalent parts can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, the features in the disclosed embodiments of the utility model can be combined in any way, and the combinations are not described in this specification due to the consideration of saving space and resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A water falling prevention device for cleaning a plating process chamber, characterized by, The application relates to an electroplating assembly (100) comprising an electroplating tank (110) and deionized water nozzles (120) arranged on both sides of the inner cavity of the electroplating tank (110). The anti-falling assembly (200) comprises a mounting plate (210) arranged on the inner side wall of the electroplating tank (110), a through hole (211) arranged in the middle of the mounting plate (210), a fixing shaft (220) arranged on the top of the mounting plate (210), a baffle (230) arranged on the surface of the fixing shaft (220) and rotating along the fixing shaft (220), a movable slot (240) arranged on the edge of the top of the mounting plate (210), and a movable motor (250) arranged in the inner cavity of the movable slot (240) and moving along the movable slot (240), wherein one end of the movable motor (250) is connected with one end of the baffle (230) through a connecting rod (260). One side of the electroplating tank (110) is provided with a liquid discharge port.

2. The water dropping prevention device for cleaning the electroplating process chamber according to claim 1, wherein: The mounting plate (210) is arranged in a circular ring shape.

3. The water dropping prevention device for cleaning the electroplating process chamber according to claim 1, wherein: The movable slot (240) is arranged in a curved shape.

4. The water dropping prevention device for cleaning the electroplating process chamber according to claim 1, wherein: Both ends of the connecting rod (260) are provided with connecting shafts (270), and the connecting rod (260) is connected with the movable motor (250) and the baffle (230) through the connecting shafts (270).

5. The water dropping prevention device for cleaning the electroplating process chamber according to claim 1, wherein: The baffle (230) is arranged in a fan shape.

6. The water dropping prevention device for cleaning the electroplating process chamber according to claim 1, wherein: The top of the baffle (230) is provided with an absorption pipeline.

7. The water falling prevention device for cleaning the electroplating process chamber according to claim 1, wherein: ​

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