Wafer thickness measuring system

Abstract

The utility model relates to the technical field of wafer thickness measurement, in particular to a wafer thickness measurement system, which comprises a bottom plate, a measurement unit and a test platform, the measurement unit and the test platform are mounted on the bottom plate, the test platform is used for placing a wafer and can move transversely and longitudinally, the measurement unit is positioned on one side of the test platform, and an ejection assembly is arranged on the other side of the test platform; the ejection assembly comprises a lifting mechanism and a bearing plate detachably connected with the top of the lifting mechanism, and a plurality of ejector pins are detachably arranged on the bearing plate and used for ejecting wafers. The bearing plate is divided into a connecting part, a first bearing part, an avoiding part and a second bearing part in the length direction. The connecting part is used for connecting a lifting mechanism, and avoiding grooves are formed in the two ends of the avoiding part relative to the first bearing part and the second bearing part; the receding part and the second bearing part are provided with a plurality of connecting hole sets used for installing ejector pins, each connecting hole set at least comprises three connecting holes, two connecting holes are located in the second bearing part, and the other connecting hole is located in the receding part. The utility model has the advantages of strong adaptability and high efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer thickness measurement technical field, specifically is a wafer thickness measurement system. BACKGROUND

[0002] In modern semiconductor manufacturing process, wafer as the basic material of integrated circuit manufacturing, its precision and quality in the processing process are very important. In the process of wafer processing, detection and other links, the wafer is often needed to be safely and accurately ejected from the test platform or other bearing device, so as to carry out the next operation or detection.

[0003] The utility model discloses a kind of wafer high-precision thickness grinding online control equipment disclosed in 2022, including rotating placement table, grinding head unit and controller, the rotating placement table includes vacuum chuck with adsorption hole and located in the vacuum cavity of limiting disc, the limiting disc is fixed on mounting frame, the bottom of the vacuum chuck is fixedly connected with rotating shaft, and the lower end of the rotating shaft penetrates the limiting disc and the mounting frame and is rotatably connected with the limiting disc and the mounting frame respectively by bearing, further include for double laser thickness gauge and wafer lifting unit. But the adaptability of this wafer lifting unit and test platform is not high, the flexibility when manual operation is low, the efficiency of lifting is poor, cannot meet the wafer ejection demand after wafer thickness test of large test platform UTILITY MODEL CONTENT

[0004] To solve the technical problems in the above background art, the utility model provides a wafer thickness measurement system.

[0005] The utility model technical scheme is as follows:

[0006] A wafer thickness measurement system, including bottom plate and the measuring unit and test platform installed on it, test platform is used to place wafer, can move along transverse and longitudinal direction, measuring unit is located at one side of test platform, and the other side of test platform is provided with ejecting assembly;

[0007] Ejecting assembly includes lifting mechanism and the support plate detachably connected at the top of lifting mechanism, the support plate is horizontally arranged at one end of test platform, and a plurality of ejector pins are detachably arranged on the support plate, for ejecting wafer;

[0008] The support plate is divided into connecting portion, first support portion, avoiding portion and second support portion along the length direction;

[0009] Connecting portion is used for connecting lifting mechanism, and avoiding portion forms avoiding groove at both ends relative to first support portion and second support portion;

[0010] The avoidance part and the second supporting part are provided with a plurality of groups of connecting holes for installing the ejector pins, and each group of connecting holes comprises at least three connecting holes, two of which are located on the second supporting part and one of which is located on the avoidance part.

[0011] The first supporting part, the avoidance part and the second supporting part form a H-shaped structure.

[0012] Further, the first supporting part, the avoidance part and the second supporting part are rectangular in shape.

[0013] The width of the first supporting part is smaller than that of the second supporting part.

[0014] The avoidance part is centrally arranged and is adapted to the bottom of the test platform, and can be well matched with the test platform after the test platform moves to complete the wafer ejection.

[0015] Each group of connecting holes is arranged in a triangle.

[0016] The connecting holes located on the second supporting part in each group of connecting holes are parallel to the edge of the second supporting part.

[0017] The connecting holes located on the avoidance part in each group of connecting holes are centrally arranged.

[0018] The connecting holes in different groups of connecting holes are nested with each other and have the same center line.

[0019] The measuring unit and the ejecting assembly are symmetrically arranged on the bottom plate.

[0020] The measuring unit comprises a U-shaped connecting frame and two measuring probes respectively installed at the two ends of the opening of the connecting frame, and the opening of the connecting frame faces the ejecting assembly.

[0021] The utility model has the following beneficial effects:

[0022] The ejector pin and the supporting plate of the utility model are detachably connected, have high flexibility, are convenient for manual operation to adjust the position of the ejector pin and match the test platform, can accurately align the wafer bottom by adjusting the position of the ejector pin no matter where the test platform moves, realize accurate ejection operation, and greatly improve the universality and adaptability of the equipment.

[0023] Since the ejector pin layout is flexible and adjustable, the wafer ejection equipment of the utility model can be applied to wafers of different specifications and different batches without frequent replacement of equipment or complex adjustment. This not only reduces production cost, but also reduces equipment adjustment time and improves production efficiency. Meanwhile, the measuring unit and the ejecting assembly are symmetrically arranged on the bottom plate, so that the equipment structure is more compact and reasonable, and is convenient for operation and maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0024] In the drawings:

[0025] Figure 1 It is a whole structure diagram of a wafer thickness measuring system;

[0026] Figure 2 It is a whole structure diagram of a wafer thickness measuring system;

[0027] Figure 3 It is a schematic diagram of the connection relationship of the ejection assembly;

[0028] Figure 4 It is a schematic diagram of the structure of the ejection assembly;

[0029] Figure 5 It is a schematic diagram of the structure of the ejection assembly;

[0030] The components represented by the respective reference numerals in the drawings are as follows:

[0031] 1, measuring unit; 2, test platform; 3, ejection assembly; 31, lifting mechanism; 32, support plate; 321, connecting part; 322, first support part; 323, avoiding part; 324, second support part; 33, ejector pin; 4, bottom plate. DETAILED DESCRIPTION

[0032] The technical scheme of the utility model is as follows:

[0033] Referring to Figure 1 and Figure 2 A wafer thickness measuring system comprises a bottom plate 4 and a measuring unit 1 and a test platform 2 mounted thereon, the test platform 2 is used for placing a wafer and can move in the lateral and longitudinal directions, the measuring unit 1 is located on one side of the test platform 2, and an ejection assembly 3 is arranged on the other side of the test platform 2;

[0034] The ejection assembly 3 comprises a lifting mechanism 31 and a support plate 32 detachably connected to the top of the lifting mechanism 31, one end of the support plate 32 horizontally faces the test platform 2, and a plurality of ejector pins 33 are detachably arranged on the support plate 32 and used for ejecting the wafer; for example Figure 3 For ease of understanding, the test platform 2 is hidden, and the display is clearer.

[0035] The support plate 32 is divided into a connecting part 321, a first support part 322, an avoiding part 323 and a second support part 324 along the length direction;

[0036] The connecting part 321 is used for connecting the lifting mechanism 31, and the avoiding part 323 forms an avoiding groove at both ends relative to the first support part 322 and the second support part 324;

[0037] A plurality of groups of connecting holes are formed on the avoiding part 323 and the second support part 324 and used for mounting the ejector pins 33, each group of connecting holes comprises at least three connecting holes, two of which are located on the second support part 324 and one of which is located on the avoiding part 323.

[0038] The hole position distribution in each group of connecting holes can be uniformly stressed when the wafer is ejected. The first supporting part 322 is connected with the connecting part 321 to provide stable connection for the avoiding part 323 and the second supporting part 324, and therefore no connecting hole is arranged on the first supporting part 322. In addition, the supporting plate 32 extends outward from the first supporting part 322, but no connecting hole is arranged on the first supporting part 322, and there is a certain space for cooperation with the wafer at a special position of the test platform 2 during operation, without interference.

[0039] The first supporting part 322, the avoiding part 323 and the second supporting part 324 form a H-shaped structure, as shown in Figure 4 and Figure 5 Such a shape design is more stable when connected with the lifting mechanism 31, and the connecting holes on the second supporting part 324 are more stable in structure when stressed, without deformation.

[0040] Further, the first supporting part 322, the avoiding part 323 and the second supporting part 324 are all rectangular in outer contour, facilitating processing and having high adaptability.

[0041] The width of the first supporting part 322 is smaller than that of the second supporting part 324, and the second supporting part 324 is designed to have a larger width to accommodate the ejector pin 33, thereby providing stable support for the ejector pin 33. If the first supporting part 322 is too long, it is easy to bend during use.

[0042] The avoiding part 323 is arranged in the middle and is adapted to the bottom of the test platform 2, and can well cooperate with the test platform 2 after the test platform 2 moves to complete wafer ejection.

[0043] Each group of connecting holes is arranged in a regular triangle, which has stability, and the regular triangle has better stability. Considering the application of the test platform 2, the regular triangle has higher adaptability to the test platform 2, and the number of ejected wafers is larger, thereby improving the efficiency.

[0044] The connecting holes on the second supporting part 324 in each group of connecting holes are arranged in parallel to the edge of the second supporting part 324.

[0045] The ejector pin 33 can be aligned with the test platform 2, and the cooperation degree is higher. No matter where the test platform 2 moves, the position of the ejector pin 33 can be adjusted to accurately align the bottom of the wafer, thereby realizing precise ejection operation and greatly improving the universality and adaptability of the equipment.

[0046] The connecting holes on the avoiding part 323 in the connecting hole group are arranged in the middle.

[0047] The connecting hole groups of different groups have different graphic areas formed by the connecting lines, are nested with each other, and the center lines coincide.

[0048] The measuring unit 1 and the ejecting assembly 3 are symmetrically arranged on the bottom plate 4, so that the whole system is more compact and reasonable, and is convenient for operation and maintenance.

[0049] The measuring unit 1 comprises a U-shaped connecting frame and two measuring probes respectively arranged at two open ends of the connecting frame, and the connecting frame is open towards the ejecting assembly 3. The cooperation of the measuring unit 1 and the ejecting assembly 3 realizes the integration of wafer ejecting and measuring, and further improves the production efficiency and product quality.

Claims

1. A wafer thickness measurement system comprising a base plate (4) and a measurement unit (1) and a test platform (2) mounted thereon, the test platform (2) being used for placing a wafer and being movable in lateral and longitudinal directions, the measurement unit (1) being located at one side of the test platform (2), characterized in that, The other side of the test platform (2) is provided with an ejection assembly (3); The ejection assembly (3) comprises a lifting mechanism (31) and a detachably connected supporting plate (32) at the top of the lifting mechanism (31), the supporting plate (32) is arranged horizontally towards one end of the test platform (2), and a plurality of ejector pins (33) are detachably arranged on the supporting plate (32) for ejecting wafers; The supporting plate (32) is divided into a connecting part (321), a first supporting part (322), an avoiding part (323) and a second supporting part (324) along the length direction; The connecting part (321) is used for connecting the lifting mechanism (31), and the avoiding part (323) forms an avoiding groove at both ends relative to the first supporting part (322) and the second supporting part (324); A plurality of groups of connecting holes are formed on the avoiding part (323) and the second supporting part (324) for mounting the ejector pins (33), and each group of connecting holes comprises at least three connecting holes, two of which are located on the second supporting part (324) and one of which is located on the avoiding part (323).

2. The system of claim 1, wherein, The first supporting part (322), the avoiding part (323) and the second supporting part (324) form a I-shaped structure.

3. The system of claim 2, wherein, The width of the first supporting part (322) is smaller than the width of the second supporting part (324).

4. The system of claim 2, wherein, The avoiding part (323) is arranged in the middle.

5. The system of claim 4, wherein, Each group of connecting holes is arranged in a regular triangle.

6. The system of claim 5, wherein, The connecting holes located on the second supporting part (324) in each group of connecting holes are connected in parallel to the edge of the second supporting part (324).

7. The system of claim 5, wherein, The connecting holes located on the avoiding part (323) in the group of connecting holes are arranged in the middle.

8. The system of claim 5, wherein, The connecting holes in different groups of connecting holes are arranged in different areas and are nested with each other, and the middle lines coincide.

9. The system of claim 1, wherein, The measurement unit (1) and the ejection assembly (3) are symmetrically arranged on the bottom plate (4).

10. The system of claim 1, wherein, The measurement unit (1) comprises a U-shaped connecting frame and two measurement probes respectively mounted at the two openings of the connecting frame, and the openings of the connecting frame are towards the ejection assembly (3).

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