Developing device

Abstract

The utility model provides a developing device which comprises an adsorption assembly and a vibration part, the adsorption assembly is used for adsorbing and bearing a wafer, the vibration part is connected with the adsorption assembly, and the vibration part is used for driving the wafer to vibrate, so that developing liquid on the wafer is diffused on the surface of the wafer. According to the developing device, the wafer can vibrate through the vibrating part, diffusion and reaction of a developing solution on the surface of the wafer are accelerated, damage to the motor caused by diffusion of the developing solution assisted by rapid rotation of the motor is prevented, the requirements of a developing process are met, and the stability and controllability of manufacturing are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment, especially relates to a developing device. BACKGROUND

[0002] With the continuous development of semiconductor technology, the line width of products is getting smaller and smaller. In order to fully develop the product, in the developing process, after the developing solution covers the wafer surface, in order to make the developing solution fully diffuse on the wafer surface and meet the developing process requirements, the wafer is usually rotated at a small angle after the developing solution covers the wafer surface, which can make the developing solution diffuse on the wafer surface faster and better, and then make the reaction of the developing solution and the wafer more sufficient.

[0003] In the prior art, the small angle rotation of the wafer is generally controlled by a motor. The motor usually gives a very large acceleration to the motor, so that the wafer rotates at a small angle instantaneously and then stops quickly, for example, the motor can accelerate from a static state at an acceleration of 30000rpm / S2 for 0.5S, and then make the motor vibrate clockwise or counterclockwise, so that the developing solution can diffuse better on the wafer surface. However, the frequent reciprocating instantaneous acceleration or stop of the motor will greatly damage the motor.

[0004] Therefore, for those skilled in the art, how to design a developing device that can avoid damaging the motor is a technical problem that needs to be solved at present. INVENTION CONTENTS

[0005] To solve the technical problems in the prior art, the purpose of the utility model is to provide a developing device, which can make the wafer vibrate by the vibration part, accelerate the diffusion and reaction of the developing solution on the wafer surface, prevent the damage of the motor caused by the rapid rotation of the motor to assist the diffusion of the developing solution, meet the developing process requirements, and improve the stability and controllability of the product.

[0006] To achieve the above purpose, the utility model provides a developing device, which comprises an adsorption assembly and a vibration part, the adsorption assembly is used for adsorbing and carrying a wafer, the vibration part is connected with the adsorption assembly, and the vibration part is used for driving the wafer to vibrate, so that the developing solution on the wafer diffuses on the wafer surface.

[0007] Optionally, the vibration part is a micro vibration motor, the micro vibration motor is fixed on the adsorption assembly, and is used for driving the wafer to move in the horizontal direction.

[0008] Optionally, the surface material of the vibration part used for contacting the wafer is PFA, and / or the shape of the vibration part is circular or elliptical.

[0009] Optionally, the number of the vibration parts is at least 3, and all the vibration parts are uniformly arranged on the adsorption assembly.

[0010] Optionally, the adsorption assembly comprises a chuck and a base, the chuck is arranged above the base and can be lifted or lowered relative to the base.

[0011] Optionally, the vibration part is fixed on the chuck and used to contact the wafer after the chuck adsorbs the wafer.

[0012] Optionally, the number of the vibration parts is 3 or 4, and all the vibration parts are uniformly distributed at the edge position of the chuck.

[0013] Optionally, the developing device comprises a connecting part, one end of the connecting part is connected with the vibration part, and the other end is connected with the base, and the vibration part is used to contact the wafer after the chuck adsorbs the wafer.

[0014] Optionally, the number of the vibration parts is 3 or 4, and all the vibration parts are uniformly distributed on the base.

[0015] Optionally, the vibration part is movably fixed on the base, and the vibration part is used to move relative to the base until contacting the wafer after the chuck adsorbs the wafer.

[0016] The utility model provides a kind of developing device, including adsorption assembly and vibration part, the adsorption assembly is used to adsorb and carry wafer, the vibration part is connected with the adsorption assembly, the vibration part is used to drive the wafer vibration, to make the developing solution on the wafer diffusion on the wafer surface.

[0017] The developing device can drive the wafer to vibrate through the vibration part, accelerate the diffusion and reaction of the developing solution on the wafer surface, prevent the damage to the motor caused by the rapid rotation of the motor to assist the diffusion of the developing solution, meet the developing process requirements, and improve the stability and controllability of the product.

[0018] The application preferably sets the vibration part as a micro vibration motor, which only generates horizontal transverse wave vibration, similar to a mobile phone vibrator, and does not generate vertical longitudinal wave vibration, so as not to affect the pattern on the wafer surface during vibration, preventing the pattern on the wafer surface from falling off. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure schematic view of the developing device in a preferred embodiment of the utility model;

[0020] Figure 2 It is a structure schematic view of the developing device in another preferred embodiment of the utility model;

[0021] Figure 3 It is a structure schematic view of the developing device in another preferred embodiment of the utility model;

[0022] Figure 4 It is a structure schematic view of the developing device in another preferred embodiment of the utility model;

[0023] Figure 5 It is a use scene schematic view of the developing device in the preferred embodiment of the utility model.

[0024] Among them, the sign explanation is as follows:

[0025] Adsorption assembly 1;Suction cup 11;Base 12;Rotary shaft 13;Vibration part 2;Connecting part 21;Wafer 3. Specific implementation

[0026] The utility model will be explained further in detail below in combination with the drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be more clear. It should be noted that the drawings all adopt very simplified form and all use non-precise proportion, only to facilitate, clear and assist the purpose of explaining the embodiment of the utility model.

[0027] The orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated mechanism or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0028] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "fixing" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral;Can be mechanical connection, can also be electrical connection or communication with each other;Can be directly connected, can also be connected through intermediate medium, can be the communication inside two elements or the interaction relationship of two elements, unless otherwise explicitly limited. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0029] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0030] Herein, the term "axial" refers to the direction of the central axis of the chuck or the base; the term "radial" refers to the direction perpendicular to the central axis of the chuck or the base; and the term "circumferential" refers to the direction around the central axis of the chuck or the base.

[0031] In addition, the different embodiments or examples described in the specification and the features of the different embodiments or examples can be combined and combined by those skilled in the art without contradiction.

[0032] As shown in Figures 1-5 The utility model provides a developing device, including adsorption subassembly 1 and vibration part 2, adsorption subassembly 1 is used for adsorbing and carrying wafer 3, vibration part 2 is connected with adsorption subassembly 1, and vibration part 2 is used for driving wafer 3 vibration to make the developing solution on wafer 3 spread on the surface of wafer 3.

[0033] In the prior art, after wafer 3 is exposed, the developing solution needs to be covered on the surface of wafer 3 to realize developing, and then a specified pattern is formed on the surface of wafer 3. As a conventional method for developing, first, wafer 3 is kept on chuck 11, and the developing solution is sprayed from the upper side of wafer 3 while wafer 3 rotates around the vertical axis. Chuck 11 is connected with a motor (not shown) arranged below chuck 11 through rotating shaft 13, and the motor can drive chuck 11 to rotate forward and reverse.

[0034] Further, to realize the uniform spreading of the developing solution on the surface of wafer 3, the motor needs to first drive wafer 3 to rotate at a high speed, and in this process, the rotating speed of motor 3 needs to be rapidly increased (for example, from 10 rpm to 1500 rpm), at which time the developing solution on the surface of wafer 3 can spread from the center of wafer 3 to the periphery. After the high-speed rotation of the motor for a short time, the rotating speed needs to be immediately reduced, so that wafer 3 rotates at a low speed, to prevent the developing solution from overflowing to the outside of wafer 3 due to centrifugal force. After the low-speed rotation of the motor for a very short time, the motor needs to stop working, so that wafer 3 stops rotating, to make the developing solution on the surface of wafer 3 stand still for a period of time for developing. After the developing process is completed, the motor needs to drive wafer 3 to rotate again to spin off the developing solution on the surface of wafer 3. The frequent reciprocating instantaneous acceleration or stop of the motor can greatly damage the motor and reduce the service life of the motor.

[0035] The application provides a developing device, which can drive the wafer 3 to vibrate through the vibration part 2, accelerate diffusion and reaction of the developing liquid on the surface of the wafer 3, prevent damage of the motor caused by rapid rotation of the motor to assist diffusion of the developing liquid, meet the requirement of the developing process, and improve stability and controllability of production.

[0036] Preferably, the vibration part 2 is a micro vibration motor, which is fixed on the adsorption assembly 1 and used for driving the wafer 3 to move in the horizontal direction. The wafer 3 is driven to vibrate through the micro vibration motor in the developing process, which can further accelerate diffusion and reaction of the developing liquid on the surface of the wafer 3, and meet the requirement of the developing process.

[0037] In actual work, the size of the vibration pulse emitted by the micro vibration motor can be controlled by controlling the size of the input current voltage, and controllability of the micro vibration motor in the process is increased. When the developing liquid covers the surface of the wafer 3 and is at rest for reaction, the micro vibration motor can be started to emit pulse vibration to drive the wafer 3 to vibrate and accelerate diffusion of the developing liquid according to requirements. After a period of time, the micro vibration motor is stopped to wait for reaction of the developing liquid and the wafer 3. After the reaction is completed, the developing liquid is spun off through the motor.

[0038] In a specific example, the micro vibration motor can be fixed on the adsorption assembly 1, and the upper surface or the lower surface thereof can be attached to the wafer, that is, the wafer 3 is attached to the upper surface or the lower surface of the micro vibration motor after being adsorbed on the adsorption assembly 1. In this way, the micro vibration motor can only drive the wafer 3 to vibrate in the horizontal direction after working, and cannot drive the wafer 3 to vibrate in the vertical direction, so that the pattern on the surface of the wafer 3 can be prevented from being damaged.

[0039] It should be noted that the micro vibration motor is a direct current brush motor, and the motor shaft has an eccentric wheel. When the micro vibration motor rotates, the center of the eccentric wheel is not on the center of the motor, so that the motor is in a state of losing balance all the time, and vibration is caused due to inertia. Since the micro vibration motor can only generate horizontal transverse wave vibration, similar to a mobile phone vibrator, and cannot generate vertical longitudinal wave vibration, the pattern on the surface of the wafer 3 will not be affected during vibration, and the pattern on the surface of the wafer 3 can be prevented from falling off.

[0040] Preferably, the surface material of the vibration part 2 used for contacting the wafer 3 is PFA (i.e. a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene), which is soft in texture, not easy to damage the surface of the wafer, and has good wear resistance, and is not easy to produce grinding dust after long-time friction with the wafer, and can better protect the wafer.

[0041] In addition, the shape of the vibration part 2 is preferably circular or elliptical, so as to avoid scratching the surface of the wafer by the vibration part 2.

[0042] The number of the vibration parts 2 is not limited in the present application. As an optional solution, one or two vibration parts 2 can be fixed on the adsorption assembly 1, and the vibration parts 2 can drive the wafer 3 to vibrate in a predetermined range to meet the diffusion requirement of the developing liquid on the surface of the wafer 3.

[0043] Generally, each vibration part 2 can only drive the wafer 3 to vibrate in a small range, so that the developing liquid on the surface of the wafer 3 can be uniformly diffused to the entire surface of the wafer 3. Preferably, the number of the vibration parts 2 is set to be at least three, and all the vibration parts 2 are uniformly arranged on the adsorption assembly 1 to realize uniform vibration of the wafer 3, so that the developing liquid on the surface of the wafer 3 can be uniformly diffused to the entire surface of the wafer 3.

[0044] Continuing to refer to Figures 1-4 As shown in the figure, the adsorption assembly 1 includes a chuck 11 and a base 12, and the chuck 11 is arranged above the base 12 and can be raised or lowered relative to the base 12.

[0045] Further, the chuck 11 is connected with a rotating shaft 13, the rotating shaft 13 penetrates through the base 12 and is connected with a motor, and the motor is used to drive the chuck 11 to be raised or lowered relative to the base 12 through the rotating shaft 13.

[0046] As a preferred embodiment, the vibration parts 2 are fixed on the chuck 11 and used to contact the wafer 3 after the chuck 11 adsorbs the wafer 3.

[0047] Preferably, the vibration parts 2 are fixed on the edges of the chuck 11 to make the vibration parts 2 contact the edges of the wafer 3 as much as possible, so as to facilitate the diffusion of the developing liquid to the edges of the wafer 3.

[0048] Of course, in other embodiments, the vibration parts 2 can also be fixed on other positions of the chuck 11, for example, the vibration parts 2 can be fixed on the center position of the chuck 11, or fixed on any position between the center and the edge of the chuck 11. The present application does not limit the fixed position of the vibration parts 2 on the surface of the chuck 11.

[0049] In a preferred case, the number of the vibration parts 2 is three or four, and all the vibration parts 2 are uniformly distributed on the edge position of the chuck 11, so that the vibration parts 2 are uniformly arranged on the wafer 3 to make the developing liquid uniformly diffuse on the surface of the wafer 3.

[0050] Referring to Figure 1 and Figure 2 In a preferred solution, the vibration parts 2 are micro vibration motors, and the number of the micro vibration motors is three or four, and all the micro vibration motors are uniformly fixed on the edge of the chuck 11, so that the micro vibration motors can be distributed in a triangular shape (referring to Figure 1 ) or a square shape (referring toFigure 2 )。

[0051] As another preferred embodiment, the developing device further comprises a connecting part 21, one end of the connecting part 21 is connected with the vibrating part 2, and the other end is connected with the base 12. The vibrating part 2 is used to contact the wafer 3 after the wafer 3 is adsorbed by the suction plate 11.

[0052] Referring to Figure 3 and Figure 4 , in a specific example, the vibrating part 2 is arranged at a position substantially parallel to the upper surface of the suction plate 11, and is fixedly connected with the base 12 through the connecting part 21. After the wafer 3 is adsorbed by the suction plate 11, the vibrating part 2 can contact the surface of the wafer 3, and further drive the wafer 3 to vibrate. In this way, the vibrating part 2 can be closer to the outer periphery of the wafer 3, and further facilitate the diffusion of the developing liquid to the edge of the wafer 3.

[0053] In another specific example, the vibrating part 2 is movably fixed on the base 12, and is used to move relative to the base 12 after the wafer 3 is adsorbed by the suction plate 11, until the vibrating part 2 contacts the wafer 3.

[0054] In an example, the vibrating part 2 is slidingly connected with the base 12, and is connected with a driving part (such as a motor). The driving part drives the vibrating part 2 to move after the wafer 3 is adsorbed by the suction plate 11, until the vibrating part 2 moves to a position contacting the wafer 3.

[0055] Preferably, the number of vibrating parts 2 is 3 or 4, and all the vibrating parts 2 are uniformly distributed on the base 12, at this time, the vibrating parts 2 are uniformly arranged on the wafer 3, so that the developing liquid is uniformly diffused on the surface of the wafer 3.

[0056] Referring to Figure 3 and Figure 4 , in a preferred case, the vibrating part 2 is a micro-vibration motor, and the number of micro-vibration motors is 3 or 4. All the micro-vibration motors are uniformly fixed on the edge of the base 12, and are fixed at a position parallel to the suction plate 11 through the connecting part 21, at this time, the micro-vibration motors are distributed in a triangular shape (referring to Figure 3 ) or a square shape (referring to Figure 4 ) on the outer periphery of the base 12.

[0057] Of course, in other embodiments, the vibrating part 2 can also be fixed at other positions on the base 12, for example, the vibrating part 2 can be fixed at any position between the rotating shaft 13 and the edge of the base 12. The application does not limit the fixed position of the vibrating part 2 on the surface of the base 12.

[0058] As yet another preferred embodiment, the number of vibrating parts 2 is multiple, and a part of the vibrating parts 2 can be fixed on the suction plate 11, and another part of the vibrating parts 2 can be fixed on the base 12.

[0059] In summary, the utility model provides a kind of developing device, the developing device can be driven wafer 3 by vibration part 2 to produce vibration, accelerate the diffusion and reaction of developing solution on the surface of wafer 3, prevent the damage of motor by motor rapid rotation auxiliary developing solution diffusion, satisfy developing process demand, improve the stability and controllability of manufacture.

[0060] The utility model discloses preferably set up vibration part as micro vibration motor, and micro vibration motor only generates horizontal direction's transverse wave vibration, similar to cell phone vibrator, and will not generate vertical direction's longitudinal wave vibration, so it will not affect the pattern on the surface of wafer 3 when vibrating, prevent the pattern on the surface of wafer 3 from falling off.

[0061] The above description is only the description of the preferred embodiment of the utility model, and not any limitation on the scope of the utility model, any change or modification of the above disclosure by the ordinary skill in the art belongs to the protection scope of the utility model.

Claims

1. A developing device characterized by comprising: The device comprises an adsorption assembly for adsorbing and carrying a wafer and a vibration part connected with the adsorption assembly, the vibration part is used to drive the wafer to vibrate so that the developing solution on the wafer diffuses on the wafer surface. The vibration part is a micro vibration motor fixed on the adsorption assembly and used to drive the wafer to move in the horizontal direction, the upper surface or the lower surface of the micro vibration motor is in contact with the wafer.

2. The developing device according to claim 1, wherein The surface material of the vibration part in contact with the wafer is PFA, and / or the shape of the vibration part is circular or elliptical.

3. The developing device according to claim 1, wherein The number of the vibration parts is at least three, and all the vibration parts are uniformly arranged on the adsorption assembly.

4. The developing device according to any one of claims 1 to 3, wherein The adsorption assembly comprises a chuck and a base, the chuck is arranged above the base and can be raised or lowered relative to the base.

5. The developing device according to claim 4, wherein The vibration part is fixed on the chuck and used to contact the wafer after the chuck adsorbs the wafer.

6. The developing device according to claim 5, wherein The number of the vibration parts is three or four, and all the vibration parts are uniformly distributed at the edge position of the chuck.

7. The developing device according to claim 4, wherein The device further comprises a connecting part, one end of the connecting part is connected with the vibration part, and the other end is connected with the base, the vibration part is used to contact the wafer after the chuck adsorbs the wafer.

8. The developing device according to claim 7, wherein The number of the vibration parts is three or four, and all the vibration parts are uniformly distributed on the base.

9. The developing device according to claim 4, wherein The vibration part is movably fixed on the base, the vibration part is used to move relative to the base until contacting the wafer after the chuck adsorbs the wafer.

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