Conductive member
By using conductive components with an integrated outer layer and inner core structure on high-frequency connectors, the problem of outer layer detachment of conductive components is solved, resulting in a longer service life and a more stable connection.
Patent Information
- Application Number
- CN202520482753.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-19
AI Technical Summary
The conductive components in existing high-frequency connectors are prone to detachment and breakage due to the simple adhesive bonding between the outer and inner layers, resulting in a short service life.
The conductive component adopts an integrated structure of outer layer and inner core. The outer layer is wrapped around the inner core and sprayed before the inner core is formed to form an integrated composite layered structure. The outer layer and the inner core are tightly connected and can be connected end to end to form a ring structure, which is then fitted onto a high-frequency connector.
It improves the service life of conductive components, reduces the occurrence of outer layer peeling and cracking, and enhances the stability and durability of the connection.
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Figure CN223912005U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present disclosure relate to the field of conductive elements, and in particular, to a conductive part. BACKGROUND
[0002] High-frequency connectors are widely used in the fields of 5G communication, high-speed data transmission, etc. However, high-frequency signals are easily affected by electromagnetic interference (EMI), resulting in signal attenuation or distortion. Most of the conductive parts used for signal shielding on high-frequency connectors are currently of a separate structure, i.e., the conductive layer and the shielding layer are in a layered structure.
[0003] However, when the above conductive part is used for signal shielding, the following technical problems often exist:
[0004] The connection between the outer layer and the inner layer of most conductive parts is often a simple adhesion, which is prone to cause the outer layer to fall off and break during use, resulting in a relatively short service life of the conductive part.
[0005] The above information disclosed in the background section is only intended to enhance the understanding of the background of the present disclosure concept, and therefore, it can include information that does not form the prior art known to those of ordinary skill in the art. SUMMARY
[0006] The summary section is provided to introduce the concepts briefly in a simplified form, which will be described in detail in the specific embodiments section. The summary section is not intended to identify key or essential features of the claimed technology nor is it intended to be used to limit the scope of the claimed technology.
[0007] Some embodiments of the present disclosure propose a conductive part to solve one or more of the technical problems mentioned in the background section.
[0008] In a first aspect, some embodiments of the present disclosure provide a conductive part, characterized in that the conductive part comprises an outer layer and an inner core, wherein the outer layer wraps the inner core; the outer layer and the inner core are in an integrated structure; the conductive part is configured to be connected end to end to form a ring structure; and the conductive part in the ring structure is configured to be sleeved on a high-frequency connector.
[0009] Optionally, the thickness of the outer layer is between 0.01 and 0.04 mm.
[0010] Optionally, the inner core is configured to be deformed under stress.
[0011] Optionally, the surface of the outer layer is a wrinkled structure.
[0012] Optionally, the conductive part is configured to be elastically deformed.
[0013] Optionally, the cross section of the conductive part is rectangular.
[0014] Optionally, the side length of the rectangular cross section of the conductive part is between 2.36mm and 2.62mm.
[0015] Optionally, the conductive part is sleeved with at least one ring structure on the high frequency connector.
[0016] Optionally, the inner core is solid.
[0017] Optionally, the size of the conductive part is smaller than the size of the peripheral circumference of the high frequency connector.
[0018] Some embodiments of the present disclosure provide a conductive part, which can provide a conductive part with an integrated composite layered structure of a conductive layer and a shielding layer, thereby prolonging the service life. Specifically, the reason for the low service life of most conductive parts is that the connection between layers of most conductive parts is usually simple adhesion, which is prone to cause the outer layer to fall off and break during use, resulting in a short service life. Based on this, some embodiments of the present disclosure provide a conductive part, which includes an outer layer and an inner core, wherein the outer layer is wrapped outside the inner core; the outer layer and the inner core are integrated structures; the conductive part is configured to be connected end to end to form a ring structure; the conductive part in the ring structure is configured to be sleeved on a high frequency connector. The outer layer is sprayed on the outer layer of the inner core before the inner core is completely formed, so as to form an integrated composite layered structure of the inner core and the outer layer. Therefore, the connection between the outer layer and the inner core is more secure and less likely to fall off. Thus, a conductive part with an integrated composite layered structure can be provided, the connection between the outer layer and the inner core is more secure, and the outer layer is less likely to fall off, thereby increasing the service life. BRIEF DESCRIPTION OF DRAWINGS
[0019] The above and other features, advantages, and aspects of embodiments of the present disclosure will become more apparent by describing in detail some embodiments thereof with reference to the attached drawings. Throughout the drawings, the same or similar reference numerals refer to the same or similar elements. It should be understood that the drawings are schematic, and elements and elements are not necessarily drawn to scale.
[0020] Figure 1 is a structural schematic diagram of a conductive part of some embodiments of the present disclosure;
[0021] Figure 2 is a structural schematic diagram of a conductive part in a ring structure of some embodiments of the present disclosure;
[0022] Figure 3 is a schematic diagram of a conductive part in a ring structure of some embodiments of the present disclosure sleeved on a high frequency connector;
[0023] Figure 4 is a structural schematic diagram of a conductive component of some embodiments of the present disclosure. DETAILED DESCRIPTION
[0024] Embodiments of the present disclosure will be described below in greater detail with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms and should not be interpreted as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be more thoroughly and completely understood. It should be understood that the drawings and embodiments of the present disclosure are only for illustrative purposes and are not intended to limit the scope of protection of the present disclosure.
[0025] It should also be noted that only parts related to the present application are shown in the drawings for the purpose of description. The embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.
[0026] It should be noted that the terms "first", "second", and the like in the present disclosure are only used to distinguish different devices, modules or units, and are not intended to limit the order or interdependence of the functions performed by these devices, modules or units.
[0027] It should be noted that the terms "one", "multiple" in the present disclosure are illustrative and not restrictive, and those skilled in the art should understand that unless otherwise explicitly stated in the context, it should be understood as "one or more".
[0028] The names of the messages or information exchanged between the devices in the embodiments of the present disclosure are only for illustrative purposes, and are not intended to limit the scope of the messages or information.
[0029] The present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
[0030] Figure 1 is a structural schematic diagram of a conductive component of some embodiments of the present disclosure. Figure 1 comprises an outer layer 1 and an inner core 2.
[0031] Figure 2 is a structural schematic diagram of a conductive component of some embodiments of the present disclosure. Figure 2 comprises an outer layer 1.
[0032] Figure 3 is a structural schematic diagram of a conductive component of some embodiments of the present disclosure. Figure 3 comprises an outer layer 1 and a high-frequency connector 3.
[0033] In some embodiments, the conductive component can include an outer layer 1 and an inner core 2. The outer layer 1 can be a particle coating. The particle coating can be a gold particle coating or a silver particle coating. The outer layer 1 can be a conductive layer. The outer layer 1 can be used for signal / current transmission. The inner core 2 can be a foamed super-soft substrate (e.g., silicone rubber or polyurethane). The inner core 2 can be used for electromagnetic shielding and interference isolation.
[0034] In some embodiments, the outer layer 1 can be wrapped around the inner core 2 to ensure that the conductive layer of the conductive component is on the outside.
[0035] In some embodiments, the outer layer 1 and the inner core 2 can be a one-piece structure. The outer layer 1 can be formed by spraying silver particles onto the inner core 2 before curing to make the outer layer 1 more robust and less likely to fall off or break.
[0036] In some embodiments, the conductive component can be configured to be connected end-to-end to form a ring structure. The end-to-end connection can be by adhesion or fitting. The length of the conductive component before end-to-end connection can be adjusted according to actual conditions and is not limited.
[0037] In some embodiments, the conductive component of the ring structure can be configured to fit over a high-frequency connector 3. The high-frequency connector 3 can be a connector used for signal transmission in high-frequency circuits. High frequency can refer to a connector used in circuits with operating frequencies above 100 MHz. The conductive component can be used to form a Faraday cage effect to isolate external electromagnetic interference.
[0038] Optionally, the thickness of the outer layer 1 can be between 0.01 and 0.04 mm to significantly reduce material usage while ensuring conductive performance, balancing high-frequency signal transmission stability and cost-effectiveness.
[0039] Optionally, the inner core 2 can be configured to deform under stress to better adapt to the installation environment or objects (e.g., different models of high-frequency connectors).
[0040] Optionally, the outer layer 1 of the conductive component can have a wrinkled structure to increase friction and prevent the conductive component from slipping off the high-frequency connector 3 to some extent.
[0041] Optionally, the conductive component can be configured to elastically deform. The conductive component can elastically deform when subjected to external forces (e.g., tension) to better adapt to different models of high-frequency connectors 3.
[0042] Optionally, as Figure 1 and Figure 3As shown, the cross section of the conductive part can be rectangular, so that the conductive part is not easy to slide off the high-frequency connector 3.
[0043] Optionally, the side length of the rectangular cross section of the conductive part can be between 2.36-2.62mm, so as to better balance the electrical performance, structural stability and manufacturing process cost of the conductive part.
[0044] Optionally, as shown, Figure 3 As shown, the high-frequency connector 3 can be sleeved with at least one conductive part of annular structure. One conductive part of annular structure is the basic number to ensure signal integrity, and the number of conductive parts of annular structure can be adjusted according to actual conditions.
[0045] Optionally, as shown, Figures 1-2 As shown, the inner core 2 can be solid, so as to better form a continuous closed shielding body.
[0046] Optionally, the size of the conductive part is smaller than the size of the peripheral circumference of the high-frequency connector 3, so as to better fix the conductive part on the high-frequency connector 3 with the elastic deformation structure.
[0047] Figure 4 is a structural schematic diagram of a conductive part of another embodiment of the disclosure. Figure 4 It comprises an outer layer 11, an inner core 22, a connecting protrusion 21 and a connecting groove 22.
[0048] Optionally, as shown, Figure 4 As shown, the cut conductive part can comprise a first end cross section and a second end cross section. The first end cross section and the second end cross section can be the planes of the two ends of the cut conductive part. The first end cross section can be provided with a connecting protrusion 21. The connecting protrusion 21 can be a rectangular protrusion structure consistent with the shape of the first end cross section, as shown. Figure 4 The central axis of the connecting protrusion 21 can be in the same straight line as the central axis of the conductive part. The shape of the connecting protrusion 21 can be consistent with the first end cross section. The second end cross section can be provided with a connecting groove 22. The connecting groove 22 can be a rectangular groove structure consistent with the shape of the second end cross section, as shown. Figure 4 The central axis of the connecting groove 22 can be in the same straight line as the central axis of the conductive part. The size of the connecting groove 22 can be greater than the size of the connecting protrusion 21. When the conductive part of the preset length is connected end to end, the connecting protrusion 21 can be configured to be embedded in the connecting groove 22, so that the interface edges of the conductive part of annular structure are aligned, to a certain extent, to prevent dislocation at the interface due to receiving torsion.
[0049] The optional embodiment above solves the technical problem of the interface of the mostly annular conductive component being prone to dislocation under force and then being disconnected as one of the inventive points of the embodiments of the present disclosure. The factors that cause the interface of the mostly annular conductive component to be prone to disconnection under force are as follows: the interface of the mostly annular conductive component is relatively flat, and the end faces are prone to dislocation under torsion during use, and then disconnected, affecting the user experience. If the above factors are solved, the effect of reinforcing the interface of the annular conductive component can be achieved. In order to achieve this effect, the present disclosure further provides a fitting structure arranged at the end faces of the conductive component, which can further reinforce the interface of the annular conductive component by fitting the ends, and to some extent, prevent the disconnection caused by the dislocation of the cross section under torsion. Thus, the strength of the interface is strengthened, and the user experience is improved.
[0050] Some embodiments of the present disclosure provide a conductive component, which can provide a conductive component with a one-piece composite layered structure of a conductive layer and a shielding layer, thereby prolonging the service life. Specifically, the reason for the low service life of most conductive components is that the connection between the layers of most conductive components is usually simple adhesion, which is prone to cause the outer layer to fall off and break during use, resulting in a short service life. Based on this, some embodiments of the present disclosure provide a conductive component, which includes an outer layer and an inner core, wherein the outer layer wraps the outer layer of the inner core; the outer layer and the inner core are a one-piece structure; the conductive component is configured to be connected end to end to form an annular structure; and the annular conductive component is configured to be sleeved on a high-frequency connector. The outer layer is sprayed on the outer layer of the inner core before the inner core is completely formed, so that the inner core and the outer layer form a one-piece composite layered structure. Therefore, the connection between the outer layer and the inner core is more secure and less likely to fall off. Thus, a conductive component with a one-piece composite layered structure can be provided, the connection between the outer layer and the inner core is more secure, and the outer layer is less likely to fall off, thereby increasing the service life.
[0051] The above description is only some of the preferred embodiments of the present disclosure and an explanation of the technical principles applied. Those skilled in the art should understand that the inventive scope of the embodiments of the present disclosure is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or equivalent features without departing from the above inventive concept. For example, the above features and technical features with similar functions disclosed in the embodiments of the present disclosure (but not limited to) are replaced with each other to form a technical solution.
Claims
1. An electrically conductive member characterized by comprising: The conductive component comprises an outer layer and an inner core, wherein The outer layer is wrapped outside the inner core; The outer layer and the inner core are in an integrated structure; The conductive component is configured to be connected head to tail to form a ring structure; The conductive component in the ring structure is configured to be sleeved on the high-frequency connector.
2. The electrically conductive component of claim 1, wherein, The thickness of the outer layer is between 0.01 and 0.04 mm.
3. The electrically conductive component of claim 1, wherein, The inner core is configured to be deformed under force.
4. The conductive member according to claim 1, characterized by The surface of the outer layer is a wrinkled structure.
5. The conductive member according to claim 1, wherein The conductive component is configured to be elastically deformed.
6. The conductive member according to claim 1, wherein The cross section of the conductive component is rectangular.
7. The electrically conductive component of claim 6, wherein, The side length of the rectangular cross section of the conductive component is between 2.36 and 2.62 mm.
8. The conductive member according to claim 1, wherein At least one conductive component in the ring structure is sleeved on the high-frequency connector.
9. The conductive member according to claim 1, wherein The inner core is solid.
10. The conductive member according to claim 5, wherein The size of the conductive component is smaller than the size of the peripheral circumference of the high-frequency connector.