Displacement-preventing chip-mounting positioning device for SMT chip mounter

Abstract

The utility model belongs to the technical field of SMT chip mounters, and relates to an anti-displacement chip mounting positioning device for an SMT chip mounter, which comprises a support frame, conveying belts are mounted on two sides of the support frame, a chip mounter body is arranged on one side of one end of the support frame, and a containing groove is formed in the position, opposite to the chip mounter body, of one end of the support frame. According to the utility model, the direct clamping of a clamp is replaced by negative pressure adsorption, so that the physical pressure of the clamp on the PCB is reduced, the risk of breakage or layering of the PCB caused by overlarge clamping force is reduced, and the negative pressure pump is triggered to start or stop through the mutual extrusion of the first triangular sliding block and the second triangular sliding block, so that the production efficiency is improved. The automatic control of the negative pressure adsorption is realized, the manual intervention is reduced, the opening and closing of the valve are controlled through the meshing of the rack and the gear, the automatic management of the negative pressure adsorption is further realized, the whole chip mounting process is smoother, and the potential damage to the PCB is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to SMT paster machine technical field relates to a kind of anti-displacement paster positioning device for SMT paster machine. BACKGROUND

[0002] SMT paster machine is a kind of efficient electronic component installation equipment, commonly used in cooperation with conveyor belt, PCB board is conveyed to SMT paster machine by conveyor belt, and after being clamped and fixed to the both sides of PCB board by clamping member, to prevent PCB board from deviating when SMT paster machine is mounted resistance, capacitor and IC chip etc.

[0003] When clamping member clamps PCB board, its clamp will exert certain clamping force on both ends of PCB board, to prevent PCB board from deviating when paster, however, for some thin or fragile PCB board, clamping force generated during clamping is easy to cause PCB board to break or delaminate, thereby affecting the functionality of PCB board, and increasing manufacturing cost and delaying production progress. INVENTION CONTENTS

[0004] The utility model solves the technical problems that when clamping member clamps PCB board, its clamp will exert certain clamping force on both ends of PCB board, to prevent PCB board from deviating when paster, however, for some thin or fragile PCB board, clamping force generated during clamping is easy to cause PCB board to break or delaminate, thereby affecting the functionality of PCB board, and increasing manufacturing cost and delaying production progress.

[0005] The anti-displacement paster positioning device for SMT paster machine includes support frame, conveying belt is installed on both sides of the support frame, paster body is arranged at one end of the support frame, accommodating groove is arranged at the position opposite to the paster body at one end of the support frame.

[0006] Fixed adsorption assembly is arranged at one end of the support frame close to the accommodating groove, and is used in cooperation with the conveying belt.

[0007] The fixed adsorption assembly includes adsorption box, mounting bracket and negative pressure pump, the adsorption box is slidably installed in the accommodating groove, the mounting bracket is symmetrically installed at the bottom side of one end of the support frame, the electric push rod connected with the outer wall of the adsorption box is installed at one end of the mounting bracket, the negative pressure pump is installed at the bottom side of one end of the support frame, the air suction pipe is connected with one end of the negative pressure pump, the air suction pipe is communicated with the inside of the adsorption box, a plurality of adsorption holes are arranged at one end of the adsorption box, and the exhaust pipe is communicated with one end of the adsorption box.

[0008] The fixed adsorption assembly further comprises a connecting frame and a press switch, one end of the connecting frame is connected with the outer wall of the adsorption box, the press switch is installed on the bottom side of the supporting frame, a second triangular slider is installed on the pressing end of the press switch, and a first triangular slider is installed at the position opposite to the second triangular slider at one end of the connecting frame.

[0009] The fixed adsorption assembly further comprises a valve and a rack, the valve is installed at one end of the exhaust pipe, and the rack is installed at the bottom side of the supporting frame, and a gear meshing with the rack is installed on the rotating switch of the valve.

[0010] The fixed adsorption assembly further comprises a baffle, the baffle is provided in two groups and is slidably penetrated into the inside of the top end of the adsorption box, a connecting block is fixedly connected at one end of the baffle, a screw rod is screwed at the inside of one end of the connecting block, and the screw rod is rotatably connected with the outer wall of the adsorption box.

[0011] A gas conveying frame is installed at the end of the supporting frame away from the containing groove, a gas conveying pipe is communicated at the inside of one end of the gas conveying frame, and a plurality of jet heads are obliquely communicated on one side of the gas conveying frame.

[0012] Compared with the prior art, the beneficial effects of the present application are as follows: the direct clamping of the clamp is replaced by the negative pressure adsorption to reduce the physical pressure of the clamp on the PCB board, thereby reducing the risk of fracture or delamination of the PCB board caused by excessive clamping force, and the first triangular slider and the second triangular slider are pressed to trigger the negative pressure pump to open or close, thereby realizing the automatic control of the negative pressure adsorption, reducing the manual intervention, and further realizing the automatic management of the negative pressure adsorption by the meshing of the rack and the gear, so that the whole patching process is more smooth, and the potential damage to the PCB board is reduced.

[0013] The surfaces of the PCB boards conveyed on the conveying belt are blown by the plurality of jet heads to remove the dust and impurities possibly attached to the surfaces of the PCB boards, so that the cleanliness of the PCB boards is improved and the subsequent electronic component mounting effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0015] Figure 1 is the complete structure schematic view of the present application.

[0016] Figure 2 is the structure schematic view of the dismounting fixed adsorption assembly of the present application.

[0017] Figure 3 is the connection schematic view of the adsorption assembly and the support frame of the utility model.

[0018] Figure 4 is the structure schematic view of the adsorption assembly of the utility model.

[0019] Figure 5 is the A place partial enlarged view of the utility model Figure 4 .

[0020] Figure 6 is the sectional view of the adsorption box of the utility model.

[0021] In the figure: 1, support frame;2, conveying belt;3, patch machine body;4, containing groove;5, adsorption box;6, negative pressure pump;7, suction pipe;8, mounting frame;9, electric push rod;10, exhaust pipe;11, adsorption hole;12, connecting frame;13, first triangular slider;14, press switch;15, second triangular slider;16, valve;17, gear;18, rack;19, baffle;20, connecting block;21, screw;22, gas conveying frame;23, jet head;24, gas conveying pipe. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following is combined with the drawings and examples, and the utility model is further described in detail. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.

[0023] In order to make the person in the art better understand the utility model scheme, the following will be combined with the drawings, and the technical scheme in the embodiment of the utility model is described clearly and completely.

[0024] It should be noted that, in the case of no conflict, the examples in the utility model and the features and technical solutions in the examples can be combined with each other.

[0025] It should be noted that: similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. Example 1

[0026] As Figures 1-6As shown, a kind of anti-displacement patch positioning device for SMT patch machine, including support frame 1, support frame 1 two sides are equipped with conveying belt 2, for carrying PCB board, and conveying PCB board from initial position to designated patch position, play certain positioning effect, this is the common technical means of prior art, support frame 1 one end side is provided with patch machine body 3, for electronic components accurately mounted on PCB board, support frame 1 one end and patch machine body 3 position opposite place is equipped with accommodating groove 4.

[0027] Fixed adsorption assembly, it is used for cooperating conveying belt 2 and using, which is arranged at the end of the support frame 1 close to the accommodating groove 4. Embodiment 2

[0028] As shown in the figure, Figures 1-6 Fixed adsorption assembly includes adsorption box 5, mounting frame 8 and negative pressure pump 6, adsorption box 5 is slidably installed in the accommodating groove 4, mounting frame 8 is symmetrically installed at the bottom side of the one end of the support frame 1, the one end of the mounting frame 8 is provided with an electric push rod 9 connected with the outer wall of the adsorption box 5, the negative pressure pump 6 is installed at the bottom side of the one end of the support frame 1, the one end of the negative pressure pump 6 is connected with a suction pipe 7, the one end of the suction pipe 7 is communicated with the inside of the adsorption box 5, the one end of the adsorption box 5 is provided with a plurality of adsorption holes 11, and the one end of the adsorption box 5 is communicated with an exhaust pipe 10.

[0029] As shown in the figure, Figures 1-6 Fixed adsorption assembly further includes connecting frame 12 and pressing switch 14, connecting frame 12 one end is connected with the outer wall of adsorption box 5, pressing switch 14 is installed at the bottom side of support frame 1, the pressing end of pressing switch 14 is provided with second triangular sliding block 15, and the one end of connecting frame 12 is provided with first triangular sliding block 13 opposite to second triangular sliding block 15.

[0030] As shown in the figure, Figures 1-6 Fixed adsorption assembly further includes valve 16 and rack 18, valve 16 is installed at one end of exhaust pipe 10, rack 18 is installed at the bottom side of support frame 1, and gear 17 meshing with rack 18 is installed at the rotating switch of valve 16.

[0031] As shown in the figure, Figures 1-6 Fixed adsorption assembly further includes baffle 19, baffle 19 is provided with two groups, two groups of baffle 19 are slidably penetrated into the inside of the top end of adsorption box 5, baffle 19 one end is fixedly connected with connecting block 20, connecting block 20 one end is internally screwed with screw rod 21, screw rod 21 one end is rotatably connected with the outer wall of adsorption box 5, by forward and reverse rotation of screw rod 21, the length of baffle 19 extending into the inside of adsorption box 5 can be adjusted, so as to control the shielding position of baffle 19 to a plurality of adsorption holes 11, so as to conveniently adjust according to the length of PCB board.

[0032] When working, the PCB is placed on the conveying belt 2, and the PCB is conveyed to the placement machine body 3 through the conveying belt 2, then the electric push rod 9 is started, the output end of the electric push rod 9 pushes the suction box 5 to continuously move towards the conveying belt 2, the PCB on the conveying belt 2 is lifted up, and the PCB is separated from the conveying belt 2, and then the electronic components are placed on the PCB through the placement machine body 3.

[0033] During the movement of the suction box 5 towards the conveying belt 2, the first triangular slider 13 moves synchronously with the suction box 5 through the connecting frame 12, so that the first triangular slider 13 and the side inclined surface of the second triangular slider 15 are in contact and extruded with each other, thereby pushing the press switch 14 to start the work of the negative pressure pump 6, at this time, the negative pressure pump 6 generates negative pressure in the suction box 5 through the suction pipe 7, and the PCB lifted up by the suction box 5 is adsorbed on one side of the PCB through a plurality of suction holes 11, so as to fix the PCB by using negative pressure, reduce the physical pressure of the PCB caused by the clamp, and reduce the risk of fracture or delamination of the PCB caused by excessive clamping force.

[0034] At the same time, the rack 18 moves synchronously with the suction box 5, engages and drives the gear 17 to rotate, thereby driving the valve 16 to rotate and open the valve 16 to reduce the entry of external gas into the suction box 5 through the exhaust pipe 10.

[0035] When the PCB is completed, the electronic component is placed, the output end of the electric push rod 9 drives the suction box 5 to continuously move away from the conveying belt 2, so that the PCB is in contact with the conveying belt 2 again, and the PCB is conveyed to the designated position through the conveying belt 2, in the process, the first triangular slider 13 and the side inclined surface of the second triangular slider 15 are in contact and extruded with each other again, thereby pushing the press switch 14 to close the negative pressure pump 6, and the rack 18 continuously moves and engages to drive the gear 17 to rotate, so as to open the valve 16 to make the external air enter the suction box 5, so as to quickly release the suction and fixation of the PCB by the plurality of suction holes 11.

[0036] In summary, the scheme uses negative pressure adsorption instead of direct clamping of the clamp to reduce the physical pressure of the PCB caused by the clamp, thereby reducing the risk of fracture or delamination of the PCB caused by excessive clamping force, and the mutual extrusion of the first triangular slider 13 and the second triangular slider 15 triggers the opening and closing of the negative pressure pump 6, so as to realize the automatic control of the negative pressure adsorption, reduce the manual intervention, and the engagement of the rack 17 and the gear 18 controls the opening and closing of the valve 16, further realizes the automatic management of the negative pressure adsorption, so that the whole placement process is more smooth, and the potential damage to the PCB is reduced. Embodiment 3

[0037] AsFigures 1-6 As shown, the support frame 1 is installed with a gas supply frame 22 away from one end of the accommodating groove 4, and the gas supply frame 22 is internally communicated with a gas supply pipe 24 at one end, and the gas supply pipe 24 is connected with an external pump machine at one end, and the pump machine is used for pumping the purge gas into the gas supply pipe 24, and a plurality of groups of gas jet heads 23 are obliquely communicated with one side of the gas supply frame 22.

[0038] In work, the purge gas can be delivered to the inside of the gas supply frame 22 through the gas supply pipe 24, and the surface of the PCB board to be pasted on the conveying belt 2 is blown through the plurality of groups of gas jet heads 23 to remove the dust impurities possibly adhered to the surface of the PCB board, and the cleanliness of the PCB board is achieved.

[0039] The preferred embodiments disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details, and the utility model is not limited to the specific implementation described. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the utility model, so that the person skilled in the art can well understand and use the utility model. The utility model is limited by the claims and the whole scope and equivalents.

Claims

1. A displacement-proof patch positioning device for an SMT patch machine, characterized in that: Including support frame (1), both sides of the support frame (1) are provided with conveying belt (2), one end of the support frame (1) is provided with patch body (3), and the position opposite to the patch body (3) of one end of the support frame (1) is provided with containing groove (4); The fixed adsorption assembly is arranged at one end of the support frame (1) close to the containing groove (4), and the fixed adsorption assembly is used in cooperation with the conveying belt (2).

2. The anti-displacement patch positioning device for SMT patch machine according to claim 1, characterized in that: The fixed adsorption assembly includes an adsorption box (5), a mounting frame (8) and a negative pressure pump (6), the adsorption box (5) is slidably installed in the containing groove (4), the mounting frame (8) is symmetrically installed on the bottom side of one end of the support frame (1), one end of the mounting frame (8) is provided with an electric push rod (9) connected with the outer wall of the adsorption box (5), the negative pressure pump (6) is installed on the bottom side of one end of the support frame (1), one end of the negative pressure pump (6) is connected with the suction pipe (7), one end of the suction pipe (7) is communicated with the inside of the adsorption box (5), a plurality of adsorption holes (11) are formed in one end of the adsorption box (5), and the adsorption box (5) is communicated with the exhaust pipe (10).

3. The anti-displacement patch positioning device for SMT patch machine according to claim 2, characterized in that: The fixed adsorption assembly further comprises a connecting frame (12) and a pressing switch (14), one end of the connecting frame (12) is connected with the outer wall of the adsorption box (5), the pressing switch (14) is installed on the bottom side of the support frame (1), the pressing end of the pressing switch (14) is provided with a second triangular sliding block (15), one end of the connecting frame (12) is provided with a first triangular sliding block (13) opposite to the second triangular sliding block (15).

4. The anti-displacement patch positioning device for SMT chip mounter according to claim 3, characterized in that: The fixed adsorption assembly further comprises a valve (16) and a rack (18), the valve (16) is installed at one end of the exhaust pipe (10), the rack (18) is installed at one end of the bottom side of the support frame (1), and the valve (16) is installed at one end of the exhaust pipe (10). The gear (17) engaged with the rack (18) is installed at the rotating switch.

5. The anti-displacement patch positioning device for SMT chip mounter according to claim 4, characterized in that: The fixed adsorption assembly further comprises a baffle (19), the baffle (19) is provided with two groups, and the two groups of baffles (19) are slidably penetrated into the inside of the top end of the adsorption box (5), one end of the baffle (19) is fixedly connected with a connecting block (20), a screw rod (21) is screwed into the inside of one end of the connecting block (20), and one end of the screw rod (21) is rotatably connected with the outer wall of the adsorption box (5).

6. The anti-displacement patch positioning device for SMT chip mounter according to claim 1, characterized in that: One end of the support frame (1) away from the containing groove (4) is provided with a gas conveying frame (22), one end of the gas conveying frame (22) is communicated with a gas conveying pipe (24), and the gas conveying frame (22) is communicated with a plurality of jet heads (23) on one side.

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