Riveting support for fixing multi-power amplifier IC
By designing a riveting bracket to fix the multi-amplifier IC, and utilizing the structure of heat sinks and guide plates, the problem of low heat dissipation efficiency of existing riveting brackets is solved, achieving efficient heat dissipation and signal stability for the multi-amplifier IC.
Patent Information
- Application Number
- CN202520376250.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-05
AI Technical Summary
The existing riveted bracket structure results in poor heat dissipation efficiency of the multi-amplifier IC, affecting signal processing and accelerating circuit aging.
Design a riveting bracket for fixing a multi-amplifier IC. The bracket adopts a structure in which the cover plate and the base plate are connected. It includes a heat sink and a guide plate. The elastic sheet ensures that the heat sink is in contact with the power amplifier IC, and the heat dissipation hole accelerates the heat dissipation.
This improves the heat dissipation efficiency of the multi-amplifier IC, avoids circuit aging caused by heat accumulation, and ensures the stability of signal processing.
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Figure CN223912737U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the sound technology field, in particular to a riveting support for fixing multiple power amplifier ICs. BACKGROUND
[0002] The power amplifier IC is an indispensable part of various sound equipment, and mainly functions to amplify a relatively weak signal input by a sound source equipment to generate a large enough current to drive a loudspeaker to play back sound. Due to the consideration of power, impedance, distortion, dynamic range and different use ranges and control adjustment functions, different power amplifiers are different in internal signal processing, circuit design and production process. At present, a single power amplifier IC is generally used on a car audio main machine. In order to meet the market customization demand, some car audio main machines have multiple channel circuits, and two or more power amplifier ICs are combined to form a power car audio main machine, which is generally referred to as a multiple power amplifier car audio main machine.
[0003] When the multiple power amplifier ICs are installed and fixed, a riveting support needs to be used. In the structure of the riveting support, the power amplifier IC is directly clamped and fixed, which leads to poor heat dissipation efficiency of the power amplifier IC, thereby affecting the signal processing of the power amplifier IC. The temperature cannot be dissipated in time, and the aging of the circuit is also accelerated. Therefore, the riveting support for fixing multiple power amplifier ICs is designed to solve the above problems. CONTENT OF THE INVENTION
[0004] In order to solve the problems, the application provides a riveting support for fixing multiple power amplifier ICs.
[0005] The riveting support for fixing multiple power amplifier ICs provided by the application adopts the following technical scheme:
[0006] The riveting support for fixing multiple power amplifier ICs comprises multiple support bottom plates connected front to back, a support cover plate slidably connected to one side of the upper end of the support bottom plate, a fixing groove formed in the middle of the support cover plate, a heat sink slidably connected in the fixing groove, a guide plate fixedly connected to the lower end of the heat sink, a power amplifier IC arranged at the lower end of the guide plate, mounting plates fixedly connected to the two sides of the guide plate, elastic sheets fixedly connected to the upper end of the mounting plates, and a lower end wall of the support cover plate fixedly connected to the upper end of the elastic sheets.
[0007] Preferably, sliding blocks are fixedly arranged on the two sides of the heat sink, and the sliding blocks are slidably connected to the inner wall of the fixing groove.
[0008] Preferably, a plurality of heat dissipation holes are formed in the upper end of the support cover plate.
[0009] Preferably, plug rods are fixedly connected to the front and rear parts of the upper end of the support bottom plate, and the plug rods are inserted into the support cover plate.
[0010] Preferably, a limiting slot is arranged on the upper end of the inserting rod, and a limiting rod is inserted into the limiting slot.
[0011] Preferably, the upper end of the limiting rod is fixedly connected with a fixed rod, and the upper end of the fixed rod is provided with a bracket cover plate.
[0012] Preferably, the lower end of the fixed rod is fixedly connected with a torsion spring, and the lower end of the torsion spring is fixedly connected with an end wall of the bracket cover plate.
[0013] To sum up, the application has the following beneficial technical effects:
[0014] In the utility model, the heat dissipation fin and the guide plate arranged on the bracket cover plate are contacted with the power amplifier IC, and the force of the elastic sheet is used to make the bracket cover plate and the bracket bottom plate be connected, so that the guide plate is continuously contacted with the upper surface of the power amplifier IC, thereby facilitating the absorption of the power amplifier, the heat dissipation hole and the space between the upper end of the power amplifier IC and the bracket cover plate are arranged, heat dissipation is facilitated, and the problem of slow heat dissipation caused by too close contact is avoided. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is the three-dimensional structure schematic diagram of the main body of the application embodiment;
[0016] Figure 2 is the front view cross section schematic diagram of the main body of the application embodiment;
[0017] Figure 3 is the structure schematic diagram of the heat dissipation fin of the application embodiment;
[0018] Figure 4 is the cross section schematic diagram of the inserting rod inserting and fixing the fixed rod of the application embodiment.
[0019] Mark explanation: 1, bracket bottom plate;3, bracket cover plate;31, heat dissipation hole;32, fixed slot;4, heat dissipation fin;41, sliding block;42, guide plate;5, elastic sheet;51, mounting plate;6, power amplifier IC;7, inserting rod;71, limiting slot;8, fixed rod;81, torsion spring;82, limiting rod. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings Figures 1-4 The application is further described in detail.
[0021] The application embodiment discloses a riveting bracket for fixing multiple power amplifier ICs. Figures 1-4A riveting bracket for fixing a multi-power amplifier IC includes multiple bracket base plates 1 connected front and rear. A bracket cover plate 3 is slidably connected to one side of the upper end of the bracket base plate 1. A fixing groove 32 is opened in the middle of the bracket cover plate 3. A heat sink 4 is slidably connected in the fixing groove 32. A guide plate 42 is fixedly connected to the lower end of the heat sink 4. A power amplifier IC 6 is provided at the lower end of the guide plate 42. Mounting plates 51 are fixedly connected to both sides of the guide plate 42. An elastic sheet 5 is fixedly connected to the upper end of the mounting plate 51. The upper end of the elastic sheet 5 is fixedly connected to the lower wall of the bracket cover plate 3.
[0022] Slider 41 is fixedly installed on both sides of the heat sink 4. The slider 41 slides to the inner wall of the fixing groove 32, so that the heat sink 4 can be driven by the elastic sheet 5 to descend and contact the power amplifier IC6, which is conducive to the heat sink 4 absorbing the heat of the power amplifier IC6.
[0023] By adopting the above technical solution, the upper end of the bracket cover plate 3 is provided with several heat dissipation holes 31, which are used to accelerate the heat dissipation of the power amplifier IC.
[0024] By adopting the above technical solution, the upper end of the bracket base plate 1 is fixedly connected to the front and rear parts of the upper part of the bracket base plate 1. The bracket cover plate 3 is inserted into the bracket base plate 3. The upper end of the bracket base plate 7 is provided with a limiting groove 71. The limiting rod 82 is inserted into the limiting groove 71. The upper end of the limiting rod 82 is fixedly connected to the fixing rod 8. The upper end of the fixing rod 8 is connected to the bracket cover plate 3. The lower end of the fixing rod 8 is fixedly connected to the torsion spring 81. The lower end of the torsion spring 81 is fixedly connected to the end wall of the bracket cover plate 3. The torsion spring 81 is used to drive the fixed rod 8 to return to its original position after rotation, so that the fixing rod 8 drives the limiting rod 82 to return to its original position, so that the limiting rod 82 is engaged with the limiting groove 71, and the bracket base plate 1 and the bracket cover plate 3 are connected and fixed by the bracket base plate 7.
[0025] The implementation principle of a riveting bracket for fixing a multi-amplifier IC in this embodiment is as follows: The power amplifier IC to be installed is placed on the bracket base plate 1. Then, the bracket cover plate 3 is pushed down, causing it to descend. Simultaneously, the fixing rods 8 on both sides are rotated, causing the fixing rods 8 to drive the torsion spring 81 to twist and the limiting rod 82 to rotate. The continued descent of the bracket cover plate 3 causes the limiting rod 82 to enter the limiting groove 71 from the upper end, releasing the fixing rod 8. The fixing rod 8 is then restored by the torsion of the torsion spring 81, allowing the limiting rod 82 to enter the limiting groove 71 and rotate. Figure 4 As shown, after the limiting rod 82 rotates, the bracket cover plate 3 cannot be separated from the plug rod 7. After the bracket cover plate 3 and the bracket base plate 1 are connected and fixed by the plug rod 7, the guide plate 42 will contact the upper surface of the power amplifier IC 6 and be limited by the elastic sheet 5, so that the guide plate 42 at the lower end of the heat sink 4 always keeps in contact with the power amplifier IC, thereby ensuring that the heat sink 4 can absorb the heat dissipated by the power amplifier IC 6, so as to facilitate the heat dissipation of the power amplifier IC. In addition, the heat dissipation hole 31 and the space between the upper end of the power amplifier IC and the bracket cover plate 3 also facilitate the heat dissipation and avoid the problem of slow heat dissipation due to excessive contact.
[0026] Finally, it should be noted that: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connected", "connected" should be broadly understood, which can be mechanical connection or electrical connection, or the internal communication of two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change;
[0027] Secondly: the utility model discloses the embodiment in the drawing, only relate to the structure involved in the embodiment of the present disclosure, other structures can refer to the usual design, under the condition of no conflict, the same embodiment and different embodiments of the utility model can be combined with each other;
[0028] Finally: the above only for the preferred embodiment of the utility model has, and does not limit the utility model, any modification, equivalent replacement, improvement etc. made within the spirit and principle of the utility model, should be included in the protection scope of the utility model.
[0029] The above are the preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.
Claims
1. A riveting support for fixing a multi-amplifier IC, comprising a plurality of support bottom plates (1) connected front and back, characterized in that: The support bottom plate (1) upper end one side sliding connection support cover plate (3), the support cover plate (3) middle part is equipped with fixed slot (32), the fixed slot (32) is equipped with sliding connection fin (4), the fin (4) lower end fixed connection guide plate (42), the guide plate (42) lower end is equipped with power amplifier IC (6), the guide plate (42) both sides fixed connection mounting plate (51), the mounting plate (51) upper end fixed connection elastic sheet (5), the elastic sheet (5) upper end fixed connection support cover plate (3) lower end wall.
2. The rivet holder for fixing multiple power amplifier ICs according to claim 1, wherein: The fin (4) both sides are fixedly installed with sliding block (41), and the sliding block (41) is slidably connected with the inner wall of the fixed slot (32).
3. The rivet holder for fixing multiple power amplifier ICs according to claim 1, wherein: The upper end of the support cover plate (3) is provided with a plurality of heat dissipation holes (31).
4. The rivet holder for securing multiple power amplifier ICs according to claim 1, wherein: The upper end of the support bottom plate (1) is fixedly connected with the plug rod (7) on the front and rear parts.
5. The rivet holder for securing a multiple power amplifier IC according to claim 4, wherein: The upper end of the plug rod (7) is provided with a limiting slot (71), and the limiting slot (71) is inserted with a limiting rod (82).
6. The rivet holder for securing a multiple power amplifier IC according to claim 5, wherein: The upper end of the limiting rod (82) is fixedly connected with a fixed rod (8), and the upper end of the fixed rod (8) is connected with the support cover plate (3).
7. The rivet holder for securing a multiple power amplifier IC according to claim 6, wherein: The lower end of the fixed rod (8) is fixedly connected with a torsional spring (81), and the lower end of the torsional spring (81) is fixedly connected with the end wall of the support cover plate (3).