Supporting lead structure and thermoelectric separation LED module

Abstract

The utility model provides a support lead structure of a thermoelectric separation LED module, the thermoelectric separation LED module comprises an LED device and a PCB which are transversely separated and arranged, the support lead structure comprises a groove and a support body used for supporting and connecting the LED device and a lead of the PCB; the groove is formed between the LED device and the PCB; the supporting body comprises a first supporting body and a second supporting body, the first supporting body is arranged in the groove, and the second supporting body is arranged on the first supporting body. The utility model also provides a thermoelectric separation LED module. Through the above structure, the lead protection of the thermoelectric separation LED module can be realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to thermoelectric power light emitting module structure technical field especially, relates to a kind of support lead structure and thermoelectric separation LED module. BACKGROUND

[0002] The existing thermoelectric separation LED module, due to module separation, the lead is obviously suspended, so it is easy to be affected by line collapse. The current mainstream solution is divided into two kinds: one, after soldering, the protective colloid is formed by dispensing; the second, a shielding structure is arranged above the lead for protection. Although the lead can be completely wrapped by the dispensing scheme to form protection, the gravity of the colloid itself will cause the lead to be crushed during the dispensing process or after the colloid solidifies and wraps, which poses an additional risk. The scheme of setting a shielding structure does not directly apply stress to the lead compared to the above scheme, but this scheme can only be used after soldering to make the shielding structure, which has a risk of damaging the lead structure and the protection effect is generally poor. Therefore, there is a lack of simple and effective protection scheme for the lead. SUMMARY

[0003] To solve the problems in the prior art, the utility model aims to provide a support lead structure that effectively protects the lead.

[0004] The second object of the utility model is to provide a thermoelectric separation LED module.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0006] A support lead structure for a thermoelectric separation LED module, the thermoelectric separation LED module includes LED devices and a PCB board arranged transversely and separated, the support lead structure includes a groove and a support body for supporting the lead connecting the LED devices and the PCB board; the groove is formed between the LED devices and the PCB board; the support body includes a first support body and a second support body, the first support body is arranged in the groove, and the second support body is arranged on the first support body.

[0007] Preferably, the depth of the groove is 2mm, and / or the width of the groove is 0.7mm, and / or the height of the second support body is 0.2-0.5mm.

[0008] Preferably, the length of the groove is 1-1.5 times the length of the bottom of the LED device.

[0009] Preferably, the support body is made of insulating material.

[0010] A thermoelectric separation LED module, comprising a heat sink, a boss, an LED device, a PCB board, a lead wire and a support lead wire structure; the heat sink is provided with the boss on the surface, the LED device is arranged on the boss, the PCB board and the LED device are arranged on the upper surface of the heat sink, and the support lead wire structure is arranged between the PCB board and the LED device; the heat sink is provided with a diffusion prevention structure, the diffusion prevention structure is located at the two side corners of the LED device; the lead wire is connected with the PCB board and the LED device, and a certain distance exists between the lead wire arc top of the lead wire and the support body.

[0011] As preferred, the boss thickness is 0.8mm.

[0012] As preferred, the solder balls at the two ends of the lead wire are respectively connected to the reserved pads of the PCB board and the LED device.

[0013] As preferred, the lead wire arc top is 0.8mm away from the second support body.

[0014] The beneficial effects of the utility model are as follows:

[0015] The utility model reduces the risk of lead wire collapse by arranging the support body structure below the module lead wire. The insulating support gel below the lead wire provides stress support for the lead wire under external pressure, reducing the risk of electrical circuit breakage. The pre-gluing process avoids the additional risk of lead wire collapse introduced by post-gluing. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model will be further described in detail below according to the drawings and examples.

[0017] Figure 1 The structure diagram of the thermoelectric separation LED module is shown in the utility model.

[0018] Figure 2 The top view structure diagram of the thermoelectric separation LED module is shown in the utility model.

[0019] Wherein: 1-heat sink; 2-boss; 3-LED device; 4-diffusion prevention structure; 5-lead wire; 6-support body 7-PCB board. DETAILED DESCRIPTION

[0020] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model example will be further described in detail below. Obviously, the described examples are only a part of the examples of the utility model, not all the examples. Based on the examples in the utility model, all other examples obtained by the skilled person in the art without creative labor belong to the scope of protection of the utility model.

[0021] Referring to Figure 1 The support lead structure of the heat-electricity separation LED module, as shown in the utility model, first, the heat-electricity separation LED module includes the LED device and the PCB board arranged transversely and separated.

[0022] The support lead structure includes the groove and the support body for supporting the lead connecting the LED device and the PCB board. The groove is formed between the LED device and the PCB board; the support body includes the first support body and the second support body, the first support body is arranged in the groove, and the second support body is arranged on the first support body, and the second support body is not located in the groove. The support body is made of insulating material, and specifically can be made of high-reflectivity thermosetting material. As an embodiment, the first support body and the second support body of the support body can be integrally formed; as an embodiment, the support body is formed in the manner of the support body in the manufacturing method of the heat-electricity separation LED module described below; as an embodiment, the first support body and the second support body of the support body are an inseparable whole. The length of the groove is 1-1.5 times the length of the bottom of the LED device, and the specific length depends on the size of the selected LED device substrate, because the center of the bottom of the support body is in line with the midpoint of the bottom of the LED, the total length of 1-1.5 times can make the support body maintain the shape after forming stably. The length direction of the groove refers to the direction perpendicular to the arrangement direction of the LED device and the PCB board. The support body still extends an additional height upward after filling the groove depth, and the additional height is within the range of 0.2-0.5 mm, wherein the part of the support body in the groove is the first support body, and the part of the support body extending upward is the second support body.

[0023] As an embodiment, the depth of the groove is 2 mm, the width of the groove is about 0.7 mm, and the height of the second support body is 0.2-0.5 mm.

[0024] The heat-electricity separation LED module, as shown in the utility model, includes the heat sink, the boss, the LED device, the PCB board, the lead and the support lead structure.

[0025] The boss is arranged on the surface of the heat sink, the LED device is arranged on the boss, and the LED device is directly arranged on the heat sink; the PCB board and the LED device are arranged on the upper surface of the heat sink. The support lead structure is arranged between the PCB board and the LED device, specifically, the groove is arranged between the PCB board and the LED device. The diffusion-preventing structure is arranged on the heat sink, and the diffusion-preventing structure is arranged at the two side corners of the LED device. There is a certain distance between the lead arc top of the lead connecting the LED device and the PCB board and the support body.

[0026] The boss thickness is about 0.8 mm, the boss thickness is set to 0.8 mm for reducing the height difference between the LED pad and the PCB pad surface, facilitating the welding process and the stability of the wire arc shape; the gap between the boss and the PCB board boundary forms a groove with a total depth of about 2 mm, the depth is calculated based on the pad surface as the reference surface, and the width of the groove is about 0.7 mm, which allows the glue in the groove to uniformly diffuse and fill while ensuring sufficient support for the upper wider glue, wherein the glue is a high-reflectivity thermosetting material.

[0027] The two ends of the lead are connected to the reserved pads of the PCB board and the LED device respectively; as an embodiment, the lead arc top is 0.8 mm away from the second support, wherein the lead arc top is 0.8 mm away from the top of the support, which comprehensively considers the risk of damaging the wire body due to the excessive height of the peak of the support, and the safety range of the support timely lifting when the lead collapses, so as not to break the wire due to the excessive height of the collapse.

[0028] The utility model discloses a kind of production methods of thermoelectric separation LED module, comprising the following steps:

[0029] S1, setting boss on radiator, setting LED device on boss;PCB board is connected and set on radiator;Forming recess between LED device and the PCB board;Recess can be made by chemical treatment or mechanical processing, not limited to etching, grinding etc.;

[0030] S2, filling high-reflectivity thermosetting material in recess and still extending additional height to form support after filling recess depth;High-reflectivity thermosetting material is uniformly filled in recess;Support material can be formed by high-reflectivity thermosetting material including silica gel, and its preparation mode is not limited to dispensing, molding etc.;

[0031] S3, setting diffusion-preventing structure at both sides of LED device respectively;Diffusion-preventing structure can be integrally formed on radiator surface, and its preparation mode is not limited to casting, molding etc.;

[0032] S4, the two ends of lead are connected with the reserved pads of PCB board and LED device respectively.Lead is prepared by welding process, and its material is not limited to high-conductivity metal such as gold, silver, aluminum etc.;And support is located at 0.8 mm below lead.

[0033] The utility model sets up support below module lead to reduce wire collapse risk.Supporting glue exists below lead, provides stress support for lead under external force, reduces electrical circuit breaking risk.Previously dispensing process avoids additional wire collapse risk introduced by dispensing after welding.

[0034] In the description herein, the description referring to the terms "an embodiment", "an example" and the like means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the present application. The illustrative appearances of the above-mentioned terms in this specification are not necessarily referring to the same embodiment or example.

[0035] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

[0036] The technical principles of the present application are described above in combination with specific embodiments. These descriptions are only for the purpose of explaining the principles of the present application, and cannot be interpreted in any way as a limitation on the scope of protection of the present application. Based on the explanation here, those skilled in the art can think of other specific embodiments of the present application without having to exert creative labor, and these ways will fall within the scope of protection of the present application.

Claims

1. A support lead structure of a thermoelectrically separated LED module, the thermoelectrically separated LED module comprising LED devices and a PCB board arranged in a lateral separation, characterized in that, The support lead structure comprises a groove, a support body for supporting the lead connecting the LED device and the PCB board; the groove is formed between the LED device and the PCB board; the support body comprises a first support body and a second support body, the first support body is arranged in the groove, and the second support body is arranged on the first support body.

2. The support lead structure according to claim 1, wherein, The depth of the groove is 2 mm, and / or the width of the groove is 0.7 mm, and / or the height of the second support body is 0.2-0.5 mm.

3. The support lead structure of claim 1 or 2, wherein, The length of the groove is 1-1.5 times the length of the bottom side of the LED device.

4. The support lead structure of claim 1, wherein, The support body is made of insulating material.

5. A thermoelectrically separated LED module, characterized by The support lead structure according to any one of claims 1-4, wherein the heat sink is provided with a boss, the LED device is arranged on the boss, the PCB board and the LED device are arranged on the upper surface of the heat sink, the support lead structure is arranged between the PCB board and the LED device, the heat sink is provided with a diffusion-preventing structure, the diffusion-preventing structure is arranged at the two side corners of the LED device, the lead connects the PCB board and the LED device, and a certain distance exists between the lead arc top of the lead and the support body.

6. The thermoelectrically separated LED module of claim 5, wherein, The thickness of the boss is 0.8 mm.

7. The thermoelectrically separated LED module of claim 5, wherein, The solder balls at the two ends of the lead are respectively connected to the reserved pads of the PCB board and the LED device.

8. The thermoelectrically separated LED module of claim 5, wherein, The lead arc top is 0.8 mm away from the second support body.

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