LED packaging support and integrated packaging device
By designing the matrix units and partition structure of the LED packaging bracket, the problems of electrical independence and thermoelectric separation of LED chips in the prior art are solved, realizing efficient and low-cost multi-pixel integrated packaging.
Patent Information
- Application Number
- CN202423285195.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing LED packaging methods cannot achieve electrical independence for each LED chip, are costly, and cannot achieve thermoelectric separation.
Design an LED packaging bracket including matrix units, die bond pads, wire bond pads, metal connecting ribs and a molding compound. Separate the wire bond pads from the die bond pads by partition pillars and set partition slots between matrix units to achieve electrical independence and thermoelectric separation of each LED chip.
It improves packaging efficiency and heat dissipation performance, reduces costs, and achieves electrical independence and thermoelectric separation for each LED chip, adapting to different electrical connection requirements.
Smart Images
Figure CN223912812U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED technical field, especially a kind of LED packaging support and integrated packaging device. BACKGROUND
[0002] Current interactive screen application development is relatively rapid, a screen usually needs more LED particles, PCB mounting time is longer, and mounting error problem is prone to appear;Limited by LED package size, the Pitch design of interactive screen PCB is also more limited;With the development of lighting technology, pixelization of LED light source, realizing intelligent matrix lighting becomes development trend.Current multi-pixel integrated device is mostly packaged using ceramic substrate, and the integration of multi-pixel LED is realized by designing EMC support multi-layer structure.However, although this packaging method has advantages in structure arrangement and heat dissipation, the cost is higher, and in addition, each LED chip cannot be electrically independent and the device cannot be thermoelectrically separated using this packaging method. SUMMARY
[0003] In view of the above shortcomings of the prior art, the purpose of the utility model is to provide a kind of LED packaging support and integrated packaging device, with the advantages that each LED chip is electrically independent by separating die bonding pad and wire bonding pad, and the device is thermoelectrically separated.
[0004] The above technical purpose of the utility model is realized by the following technical scheme:
[0005] A kind of LED packaging support, comprising a plurality of matrix units, the matrix unit comprises:
[0006] Die bonding pad;
[0007] Wire bonding pad, the wire bonding pad is arranged at the two sides of the die bonding pad;
[0008] Metal tie, two adjacent the matrix unit is connected by the metal tie, at least a part of the wire bonding pad is connected with the die bonding pad by the metal tie;
[0009] Plastic package, the plastic package is filled in the gap between the die bonding pad and the wire bonding pad, and covers the metal tie, the plastic package between the die bonding pad and the wire bonding pad forms partition column, the partition column is connected with the die bonding pad and the wire bonding pad;The plastic package is filled in the gap between two adjacent the matrix unit.
[0010] Compared with the prior art, the LED packaging support in the application contains a plurality of matrix units, the LED packaging support is designed in a matrix manner, provides a basis for subsequent multi-pixel LED chip integrated packaging, and helps to improve packaging efficiency and heat dissipation performance while reducing cost.
[0011] As a preferred scheme of the present application, the height of the upper surface of the partition column is higher than the height of the upper surface of the wire bonding pad and the height of the upper surface of the die bonding pad.
[0012] By the above scheme, the height of the upper surface of the partition column is higher than the wire bonding pad and the die bonding pad, which helps to improve the stability and reliability of the packaging structure and prevent short circuit between the wire bonding pad and the die bonding pad.
[0013] As a preferred scheme of the present application, the partition column covers at least a part of the die bonding pad, and the partition column covers at least a part of the wire bonding pad.
[0014] By the above scheme, the partition column covers part of the die bonding pad and the wire bonding pad, which helps to improve the overall strength and stability of the packaging structure and facilitate heat dissipation.
[0015] As a preferred scheme of the present application, the structure of the wire bonding pad is a square or rectangular three-dimensional structure.
[0016] By the above scheme, the shape of the wire bonding pad is designed as a square or a rectangle, which helps to optimize current distribution and improve welding quality and electrical performance.
[0017] As a preferred scheme of the present application, the width of the wire bonding pad is greater than or equal to the width of the metal tie.
[0018] By the above scheme, the width of the wire bonding pad is greater than or equal to the width of the metal tie, which helps to improve current transmission efficiency and reduce resistance loss.
[0019] As a preferred scheme of the present application, the structure of the die bonding pad is a square or rectangular three-dimensional structure.
[0020] By the above scheme, the shape of the die bonding pad is designed as a square or a rectangle, which helps to optimize the fixation and heat dissipation of the LED chip and improve packaging quality.
[0021] As a preferred scheme of the present application, the thickness of the die bonding pad is the same as the thickness of the wire bonding pad.
[0022] By the above scheme, the thickness of the die bonding pad and the wire bonding pad is the same, which helps to simplify the production process, reduce cost, and maintain good electrical connection performance.
[0023] As a preferred scheme of the utility model, the width of the die bonding pad is greater than twice the width of the wire bonding pad.
[0024] By the above scheme, the width of the die bonding pad is greater than the wire bonding pad, which helps to improve the heat dissipation efficiency of the LED chip and prolong the service life.
[0025] As a preferred scheme of the utility model, the area of the die bonding pad is greater than the area of the wire bonding pad.
[0026] The utility model also includes a kind of integrated encapsulation device, including above-mentioned LED encapsulation support, several LED chips, metal connecting line and encapsulation adhesive layer, the LED chip is arranged on the die bonding pad, the LED chip is connected with the wire bonding pad by metal connecting line, the connection mode of the LED chip whole is series connection, parallel connection or multiple string multiple parallel, the LED chip can be independently controlled electric quantity by the wire bonding pad, and also can be commonly lit by the wire bonding pad;The height of plastic package body filled between two adjacent matrix units is greater than the height of the metal connecting line;The encapsulation adhesive layer is covered in the LED chip, metal connecting line and wire bonding pad, and fills entire bowl cup support, after filling, the upper surface of the encapsulation adhesive layer is flush with the upper surface of the plastic package body;The bottom wall of the LED encapsulation support is provided with division groove, the position of the division groove corresponds the metal connecting rib between the die bonding pad and the wire bonding pad, the depth of the division groove is greater than the thickness of the metal connecting rib and less than the height of the partition column, so that the die bonding pad and the wire bonding pad in same matrix unit are cut off by the division groove, and the width of the division groove is less than the width of the metal connecting rib;
[0027] Among them, the LED chip is positive chip or vertical chip.
[0028] Compared with prior art, the above integrated encapsulation device integrates multiple LED chips by LED encapsulation support, not only improves production efficiency and heat dissipation performance, but also reduces manufacturing cost;The encapsulation structure supports independent or common lighting of LED chip, adapts to different electrical connection requirements, while the filling of encapsulation adhesive layer protects internal components, ensures the integrity and reliability of encapsulation;And by the setting of division groove, the die bonding pad and the wire bonding pad in each matrix unit are not connected, the die bonding pad and the wire bonding pad in each matrix unit are separately separated, which can effectively realize the electrical independence of LED chip, so that the positive and negative poles are cut off to prevent short circuit;At the same time, it is suitable for positive and vertical chip, effectively improves adaptability and flexibility. BRIEF DESCRIPTION OF DRAWINGS
[0029] Figure 1 It is the structure schematic view of LED encapsulation support and integrated encapsulation device in the utility model.
[0030] Figure 2 for Figure 1 sectional view at A-A in the middle;
[0031] Figure 3 for Figure 1 sectional view at B-B in the middle;
[0032] Figure 4 for
[0033] Figure 5 for Figure 4 sectional view at A-A in the middle;
[0034] Figure 6 for Figure 4 sectional view at B-B in the middle;
[0035] In the figure: 1, matrix unit; 2, die bonding pad; 3, wire bonding pad; 4, metal connecting rib; 5, plastic package body; 6, partition column; 7, LED chip; 8, metal connecting line; 9, encapsulation glue layer; 10, LED packaging support; 11, cutting groove.
[0036] The realization, functional features and advantages of the utility model will be further described by combining with embodiments and referring to the drawings. DETAILED DESCRIPTION
[0037] The technical solutions in the embodiments of the utility model will be clearly and completely described below by combining with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0038] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture, if the specific posture changes, the directional indications also change accordingly.
[0039] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.
[0040] Embodiment 1
[0041] Reference Figures 1 to 6 In an embodiment of the present application, a LED packaging support 10 is provided for integrated packaging device, the LED packaging support 10 includes a plurality of matrix units 1, the matrix unit 1 includes die bonding pad 2, wire bonding pad 3, metal connecting rib 4 and EMC plastic encapsulation 5, in the embodiment, the number of wire bonding pad 3 in a single matrix unit 1 is four, which is distributed on both sides of the die bonding pad 2, and two wire bonding pads 3 are distributed on each side; two adjacent matrix units 1 are connected by the metal connecting rib 4, specifically, the two ends of the metal connecting rib 4 are connected with one wire bonding pad 3 in the two adjacent matrix units 1 respectively, and at least two wire bonding pads 3 located on the same side are connected with the die bonding pad 2 through the metal connecting rib 4; the EMC plastic encapsulation 5 is filled in the gap between the die bonding pad 2 and the wire bonding pad 3, and covers the metal connecting rib 4, the EMC plastic encapsulation 5 located between the die bonding pad 2 and the wire bonding pad 3 forms a partition column 6, the partition column 6 is connected with the die bonding pad 2 and the wire bonding pad 3; the EMC plastic encapsulation 5 is filled in the gap between the two adjacent matrix units 1. By arranging a plurality of matrix units 1 on the EMC plastic encapsulation 5, the LED packaging support 10 is designed in matrix, which provides a basis for subsequent multi-pixel LED chip integrated packaging, and helps to improve the packaging efficiency and heat dissipation performance, while reducing the cost.
[0042] In this embodiment, the height of the upper surface of the separator 6 is higher than the height of the upper surface of the wire bonding pad 3 and the upper surface of the die bonding pad 2, and the separator 6 covers at least a portion of the die bonding pad 2 and at least a portion of the wire bonding pad 3. The structures of the wire bonding pad 3 and the die bonding pad 2 are both square or rectangular three-dimensional structures, and the thickness of the wire bonding pad 3 is the same as the thickness of the die bonding pad 2. The width of the die bonding pad 2 is greater than twice the width of the wire bonding pad 3, and the area of the die bonding pad 2 is greater than the area of the wire bonding pad 3. Specifically, the structure of the wire bonding pad 3 is a square three-dimensional structure, and the structure of the die bonding pad 2 is a square three-dimensional structure. The width of the wire bonding pad 3 is greater than or equal to the width of the metal connecting rib 4. In this embodiment, the width of the wire bonding pad 3 is equal to the width of the metal connecting rib 4.
[0043] In this embodiment, the wire bonding pad 3, die bonding pad 2, and metal connecting rod 4 are made of one or more of Cu, Ni, Pd, Ag, and Au.
[0044] Example 2
[0045] like Figures 1 to 3 As shown, this utility model also includes an integrated packaging device, including the LED packaging bracket 10 as in Embodiment 1. The integrated packaging device also includes a plurality of LED chips 7, metal connecting wires 8, and a packaging adhesive layer 9. To better illustrate this embodiment, the LED packaging bracket 10 has eight matrix units 1 arranged in a 2*4 matrix, containing eight pixels, corresponding to eight LED chips 7. The bonding pads 3 in the same matrix unit 1 are all connected to the die bonding pads 2 through metal connecting ribs 4, but the bonding pads 3 are not connected to each other. It is worth noting that the height of the encapsulation body 5 filling between two adjacent matrix units 1 in the LED packaging bracket 10 should be greater than the height of the metal connecting wires 8, and the height of the separator 6 should be less than the height of the metal connecting wires 8. In each matrix unit 1, a die-bonding pad 2 holds an LED chip 7 in the center. The LED chip 7 is a front-mounted chip and is connected to the bonding pad 3 in the same matrix unit 1 via metal connecting wires 8. Specifically, the LED chips 7 in the three lower left matrix units 1 of the LED package bracket 10 are connected to the left bonding pad 3 in the same matrix unit 1 via two metal connecting wires 8. The LED chip 7 in the upper left matrix unit 1 is connected to the lower left bonding pad 3 in the same matrix unit 1 via one metal connecting wire 8, and to the upper right bonding pad 3 in the same matrix unit 1 via another metal connecting wire 8. The connection method of the metal connecting wires 8 for the LED chips 7 in the right matrix unit 1 is a mirror image of the LED chips 7 in the left matrix unit 1. The overall connection method of the LED chips 7 is an eight-chip series connection. The LED chips 7 can be independently controlled to light up via the bonding pads 3, or they can be lit together.
[0046] The encapsulation layer 9 covers the LED chip 7, the die-bonding pad 2, the metal connecting line 8 and the wire-bonding pad 3, and fills the whole bowl cup. The upper surface of the filled encapsulation layer 9 is flush with the upper surface of the EMC plastic package 5. The encapsulation layer 9 can be a transparent layer or a light conversion layer with fluorescent powder.
[0047] After the packaging process is completed, the bottom wall of the LED packaging support 10 is cut at the position corresponding to the metal connecting line 4 between the die-bonding pad 2 and the wire-bonding pad 3. After cutting, the inwardly recessed separation groove 11 is formed at the corresponding position. The depth of the separation groove 11 formed by cutting should be controlled to be greater than the thickness of the metal connecting line 4 but less than the height of the partition column 6, so as to cut off the metal connecting line 4 between the die-bonding pad 2 and the wire-bonding pad 3 but not cut off the partition column, to separate the die-bonding pad 2 and the wire-bonding pad 3 in the same matrix unit 1 through the separation groove 11, to separate the positive and negative electrodes in the same matrix unit 1 to realize the electrical independence of the LED chip and to avoid short circuit. In addition, the width of the separation groove 11 formed by cutting should be less than the width of the metal connecting line 4, to avoid damaging the die-bonding pad 2 or the wire-bonding pad 3 during cutting.
[0048] Example 3
[0049] As Figures 4 to 6As shown, the utility model still includes a kind of integrated packaging device, including the LED packaging support 10 of embodiment 1, integrated packaging device further include several LED chips 7, metal connecting wire 8 and encapsulation adhesive layer 9, to better illustrate this embodiment, LED packaging support 10 there are 8 matrix units 1, 2*4 matrix arrangement, contain eight pixel points, corresponding the number of LED chips 7 is 8, in the four matrix units 1 of left side of LED packaging support 10, two wire bonding pads 3 located right side of fixed crystal pad 2 are connected with fixed crystal pad 2 by metal connecting rib 4;In the four matrix units 1 of right side of LED packaging support 10, two wire bonding pads 3 located left side of fixed crystal pad 2 are connected with fixed crystal pad 2 by metal connecting rib 4, wherein it is worth mentioning that, the height of plastic package body 5 filled between two adjacent matrix units 1 in LED packaging support 10 should be greater than the height of metal connecting wire 8, and the height of partition column 6 should be less than the height of metal connecting wire 8, one LED chip 7 is fixed in the center of fixed crystal pad 2 in each matrix unit 1, LED chip 7 is vertical chip, and is connected with wire bonding pad 3 in same matrix unit 1 by metal connecting wire 8, specifically, the LED chip 7 in the three matrix units 1 under left side in LED packaging support 10 is connected with left upper wire bonding pad 3 of same matrix unit 1 by a metal connecting wire 8, the LED chip 7 in the uppermost matrix unit 1 of left side is connected with right upper wire bonding pad 3 in same matrix unit 1 by a metal connecting wire 8;The LED chip 7 in the right matrix unit 1 is connected with right lower wire bonding pad 3 in same matrix unit 1 by a metal connecting wire 8.The connection mode of the above-mentioned LED chip 7 whole is eight crystal series connection, and LED chip 7 can be independently controlled to light by wire bonding pad 3, and also can be commonly lighted.
[0050] Encapsulation adhesive layer 9 covers LED chip 7, fixed crystal pad 2, metal connecting wire 8 and wire bonding pad 3, and fills entire bowl cup, and the upper surface of encapsulation adhesive layer 9 after filling is flush with the upper surface of EMC plastic package body 5.Encapsulation adhesive layer 9 can be transparent adhesive layer, and also can be light conversion layer with fluorescent powder.
[0051] After the packaging process is completed, the bottom wall of the LED packaging support 10 is cut, the cutting position corresponds to the metal connecting rib 4 between the die bonding pad 2 and the wire bonding pad 3, and after cutting, the inwardly recessed separation groove 11 is formed at the corresponding position. The depth of the separation groove 11 formed by cutting should be controlled to be greater than the thickness of the metal connecting rib 4 but less than the height of the partition column 6, so as to cut off the metal connecting rib 4 between the die bonding pad 2 and the wire bonding pad 3 but not cut off the partition column, so that the die bonding pad 2 and the wire bonding pad 3 in the same matrix unit 1 are separated by the separation groove 11, the positive and negative electrodes in the same matrix unit 1 are separated to realize the electrical independence of the LED chip, and short circuit is avoided. Secondly, the width of the separation groove 11 formed by cutting is smaller than the width of the metal connecting rib 4, so as to avoid damaging the die bonding pad 2 or the wire bonding pad 3 during cutting. The structure of the above embodiment, the EMC support is designed and matrixed, the packaging of the EMC support and multiple LED chips 7 is realized, different LED chips 7 can be independently controlled according to the lighting demand, and by cutting the transverse metal connecting rib 4, each LED chip 7 of the multiple-pixel integrated packaging device is electrically independent, the die bonding pad 2 and the wire bonding pad 3 are separated, the thermal and electrical separation of the device is realized, the manufacturing process is simple, the etching process is used to realize the EMC support manufacturing, and the existing cutting process is used to realize the packaging. The device structure is simple after packaging.
[0052] The above only describes the preferred embodiments of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by using the utility model specification and the drawings, or direct / indirect application in other related technical fields is included in the patent protection range of the utility model.
Claims
1. An LED package holder comprising a plurality of matrix units, characterized in that, The matrix unit comprises: a die-bonding pad; wire-bonding pads arranged on both sides of the die-bonding pad; a metal web connecting two adjacent matrix units, and at least part of the wire-bonding pads being connected to the die-bonding pad through the metal web; a plastic encapsulation filling the gap between the die-bonding pad and the wire-bonding pad and covering the metal web, the plastic encapsulation between the die-bonding pad and the wire-bonding pad forming a partition column connected to the die-bonding pad and the wire-bonding pad, and the plastic encapsulation filling the gap between two adjacent matrix units.
2. The LED package support of claim 1, wherein: The height of the upper surface of the partition column is higher than the height of the upper surface of the wire-bonding pad and the height of the upper surface of the die-bonding pad.
3. The LED package support of claim 1, wherein: The partition column covers at least part of the die-bonding pad and at least part of the wire-bonding pad.
4. The LED package support of claim 1, wherein: The wire-bonding pad has a square or rectangular three-dimensional structure.
5. The LED package support of claim 1, wherein: The width of the wire-bonding pad is greater than or equal to the width of the metal web.
6. The LED package support of claim 1, wherein: The die-bonding pad has a square or rectangular three-dimensional structure.
7. The LED package support of claim 1, wherein: The thickness of the die-bonding pad is the same as the thickness of the wire-bonding pad.
8. The LED package support of claim 1, wherein: The width of the die-bonding pad is greater than twice the width of the wire-bonding pad.
9. The LED package support of claim 1, wherein: The area of the die-bonding pad is greater than the area of the wire-bonding pad.
10. An integrated package device, comprising: The LED package bracket, a plurality of LED chips, a metal connecting wire and an encapsulation layer, the LED chip being arranged on the die-bonding pad, the LED chip being connected to the wire-bonding pad through the metal connecting wire, the connection mode of the LED chip as a whole being series connection, parallel connection or multiple series and multiple parallel connection, the LED chip being independently controlled to light up or collectively light up through the wire-bonding pad, the height of the plastic encapsulation between two adjacent matrix units being greater than the height of the metal connecting wire, the encapsulation layer covering the LED chip, the metal connecting wire and the wire-bonding pad and filling the entire bowl cup bracket, the upper surface of the encapsulation layer being flush with the upper surface of the plastic encapsulation after filling, the bottom wall of the LED package bracket being provided with a partition groove, the position of the partition groove corresponding to the metal web between the die-bonding pad and the wire-bonding pad, the depth of the partition groove being greater than the thickness of the metal web and less than the height of the partition column, so that the die-bonding pad and the wire-bonding pad in the same matrix unit are separated through the partition groove, and the width of the partition groove being less than the width of the metal web. The LED chip is a normal chip or a vertical chip.