Manual wafer cleaning device

Abstract

The utility model discloses a manual wafer cleaning device which comprises a cleaning table, a scrubbing tank, a soaking tank and an air drying tank, the scrubbing tank, the soaking tank and the air drying tank are arranged on the cleaning table, the scrubbing tank and the soaking tank are arranged on the same side, an air drying assembly and a rotating assembly are arranged in the air drying tank, and the rotating assembly is arranged in the cleaning table. The rotating assembly is installed on the inner bottom wall of the air drying groove, and the air drying assembly is installed on the side wall of the air drying groove. According to the manual cleaning device for the wafer, the scrubbing tank and the soaking tank are both arranged on the cleaning table, the soaking tank is filled with corresponding soaking solutions, and the solutions can dissolve or neutralize cleaning liquid on the surface of the wafer, so that the wafer can be immediately placed in the soaking tank after scrubbing, and the bad risk of smudginess caused by air drying of the cleaning solvent is avoided; and the air drying tank, the air drying assembly and the rotating assembly are arranged, so that air drying can be performed immediately after soaking, and the cleaning efficiency of the wafer is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of wafer manual cleaning device, belong to wafer technical field. BACKGROUND

[0002] Wafer surface has cleaning solvent residue after brush washing, still have a small amount of residue after centrifugal cleaning machine wash, wafer surface exists dirty defect.Cleaning procedure is brush washing and centrifuge flushing combination, brush washing capacity is much greater than cleaning machine, if not flushing in time after brush washing, cleaning solvent air dry can have a large amount of dirty residue on wafer surface;

[0003] It can be seen, to avoid cleaning solvent air dry can have a large amount of dirty residue on wafer surface, a wafer manual cleaning device is urgently needed. UTILITY MODEL CONTENT

[0004] The utility model aims at overcoming the deficiency in the prior art, provide a kind of wafer manual cleaning device, by being arranged on cleaning table with brush washing groove and soaking groove, there is corresponding soaking solution in soaking groove, these solutions can dissolve or neutralize the cleaning liquid on wafer surface, so that wafer can be placed in soaking groove immediately after brush washing, there is no dirty defect risk caused by cleaning solvent air dry, and the setting of air dry groove, air dry component and rotating component can immediately air dry after soaking, guarantee the cleaning efficiency of wafer.

[0005] To achieve the above-mentioned purpose / To solve the above-mentioned technical problems, the utility model is realized by the following technical scheme:

[0006] A kind of wafer manual cleaning device, including cleaning table, brush washing groove, soaking groove and air dry groove, wherein,

[0007] The brush washing groove, soaking groove and air dry groove are opened on the cleaning table, the brush washing groove and the soaking groove are arranged on the same side, the air dry groove is provided with an air dry component and a rotating component, the rotating component is installed on the inner bottom wall of the air dry groove, and the air dry component is installed on the side wall of the air dry groove.

[0008] Further, the air dry component includes a hot air blower and a linear drive module, the hot air blower is installed on the inner wall of the air dry groove near the brush washing groove by the linear drive module, and a plurality of strip grooves are formed in the inner wall of the air dry groove away from the air dry component.

[0009] Further, the linear drive module includes a drive motor, a threaded shaft, a mounting plate, a limiting plate and a mounting seat, wherein,

[0010] The mounting plate is fixed on the inner wall of the air dry groove, the drive motor is fixed on the side of the mounting plate away from the inner wall of the air dry groove, the output shaft of the drive motor is fixed with the threaded shaft, the other end of the threaded shaft is rotatably connected with the limiting plate, and the limiting plate is fixed with the mounting plate.

[0011] The mounting seat is screwed on a threaded shaft, and one side of the mounting seat is slidably connected with the mounting plate, and the other side of the mounting seat is fixed with the air blower.

[0012] Further, the rotating assembly comprises a rotating table, a supporting frame, supporting columns and a rotating motor, wherein,

[0013] The rotating motor is fixed on the inner bottom wall of the air-drying groove, the output shaft of the rotating motor is fixed with the rotating table, and the top end of the rotating table is fixed with the supporting frame through the supporting columns.

[0014] Further, the number of the supporting columns is four, and the four supporting columns are symmetrically arranged between the supporting frame and the rotating table.

[0015] Further, a filter groove is formed in the supporting frame, and a plurality of filter grooves are uniformly distributed on the supporting frame.

[0016] Further, the supporting assembly is inserted into the supporting frame and used for placing the wafer to be air-dried.

[0017] Further, the supporting assembly comprises supporting rings, connecting columns and mounting clamps, two supporting rings and two connecting columns are arranged, the two supporting rings are connected through the two connecting columns, the two connecting columns are symmetrically arranged between the two supporting rings, and a plurality of mounting clamps are arranged, and the plurality of mounting clamps are arranged in pairs and correspondingly arranged on the connecting columns.

[0018] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0019] The wafer manual cleaning device provided by the utility model sets the brushing groove and the soaking groove on the cleaning table, the soaking groove has corresponding soaking solutions, the solutions can dissolve or neutralize the cleaning liquid on the wafer surface, the wafer can be immediately placed in the soaking groove after brushing, there is no risk of dirt caused by the cleaning solvent air-drying, the air-drying groove, the air-drying assembly and the rotating assembly are arranged to enable air-drying immediately after soaking, and the cleaning efficiency of the wafer is ensured.

[0020] The wafer manual cleaning device provided by the utility model can place the wafer on the rotating assembly in the air-drying groove after completing the brushing and soaking of the wafer, start the air-drying assembly and the rotating assembly, drive the wafer to rotate through the rotating assembly, and the air-drying assembly reciprocally moves along the linear driving module to air-dry the wafer on the rotating assembly, so that the air-drying effect is effectively ensured, the supporting assembly is arranged on the supporting frame of the rotating assembly, the wafer is further supported, the state of the wafer during air-drying is ensured, and the air-drying effect is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic view of the wafer manual cleaning device provided by the utility model;

[0022] Figure 2 is Figure 1 is a structural top view of the wafer manual cleaning device shown in the figure;

[0023] Figure 3 is Figure 2 is a structural side view of the rotating assembly in the figure.

[0024] In the figure: 1, cleaning table; 2, scrubbing tank; 3, soaking tank; 4, air drying tank; 5, air drying assembly; 501, hot air blower; 502, strip-shaped groove; 503, driving motor; 504, threaded shaft; 505, mounting plate; 506, limiting plate; 507, mounting seat; 6, rotating assembly; 601, rotating table; 602, support frame; 603, support column; 604, rotating motor; 605, filter tank; 606, support ring; 607, connecting column; 608, mounting clamp. DETAILED DESCRIPTION

[0025] The utility model will be further described below in combination with the drawings. The following examples are only used for more clearly illustrating the technical scheme of the utility model, and cannot limit the protection scope of the utility model.

[0026] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or position relationship based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second" and the like are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.

[0027] In the description of the utility model, it is to be explained that, unless another explicit provision and limitation, the term "installation", "connection", "connect" should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication.For ordinary skilled in the art, the above-mentioned terms can be understood by the specific meaning in the utility model through specific circumstances. Embodiment one

[0028] As Figure 1 And Figure 2 The utility model provides a kind of wafer manual cleaning device, including cleaning table 1, brush washing groove 2, soaking groove 3 and air-drying groove 4, wherein,

[0029] The brush washing groove 2, soaking groove 3 and air-drying groove 4 are opened in cleaning table 1, the brush washing groove 2 and soaking groove 3 are arranged on the same side, the air-drying groove 4 is provided with air-drying assembly 5 and rotating assembly 6, the rotating assembly 6 is installed on the inner bottom wall of air-drying groove 4, and the air-drying assembly 5 is installed on the side wall of air-drying groove 4.

[0030] In the above technical solution, the brush washing groove 2 and the soaking groove 3 are arranged on the cleaning table 1 in the embodiment, after the wafer is manually cleaned in the brush washing groove 2, there is corresponding soaking solution in the soaking groove 3, which can dissolve or neutralize the cleaning solution on the surface of the wafer, so that the wafer can be placed in the soaking groove immediately after brushing, without the risk of dirt caused by cleaning solvent air-drying, and the air-drying groove 4, air-drying assembly 5 and rotating assembly 6 are arranged to enable air-drying immediately after soaking, to ensure the cleaning efficiency of the wafer;

[0031] It is worth mentioning that the embodiment is only applicable to small-scale wafer production, and the manual cleaning of the wafer through the brush washing groove 2 can effectively reduce the cleaning cost, and when the production scale is expanded and the manual cleaning efficiency is insufficient, a full-automatic cleaning machine on the market needs to be considered for cleaning the wafer. Embodiment two

[0032] The wafer manual cleaning device provided by the embodiment is different from the wafer manual cleaning device provided by embodiment one in that:

[0033] As Figure 2As shown, to achieve the drying of wafers by the drying assembly 5 in the drying tank 4, the drying assembly 5 includes a hot air blower 501 and a linear drive module. The hot air blower 501 is installed on the inner wall of the drying tank 4 near the washing tank 2 via the linear drive module. Several strip grooves 502 are provided on the inner wall of the drying tank 4 away from the drying assembly 5. Through the cooperation of the hot air blower 501 and the strip grooves 502, and with the top of the drying tank 4 being open, the drying of moisture on the surface of the wafers placed on the rotating assembly 6 can be accelerated. Furthermore, the linear drive module can drive the hot air blower 501 to move in a straight line during drying, expanding the drying range of the hot air blower 501, thereby effectively ensuring the drying effect.

[0034] like Figure 2 As shown, to enable the linear drive module to drive the hot air blower 501, the linear drive module includes a drive motor 503, a threaded shaft 504, a mounting plate 505, a limiting plate 506, and a mounting base 507, wherein...

[0035] The mounting plate 505 is fixed on the inner wall of the drying trough 4, the drive motor 503 is fixed on the side of the mounting plate 505 away from the inner wall of the drying trough 4, the output shaft of the drive motor 503 is fixed to the threaded shaft 504, the other end of the threaded shaft 504 is rotatably connected to the limiting plate 506, and the limiting plate 506 is fixed to the mounting plate 505.

[0036] The mounting base 507 is threaded onto the threaded shaft 504, and one side of the mounting base 507 is slidably connected to the mounting plate 505. The other side of the mounting base 507 is fixed to the hot air blower 501. When the linear drive module drives the hot air blower 501, it drives the threaded shaft 504 to reciprocate through the drive motor 503. Specifically, when the threaded shaft 504 drives the hot air blower 501 on the mounting base 507 from the beginning to the end of the threaded shaft 504, the threaded shaft 504 begins to rotate in the opposite direction, driving the hot air blower 501 to reciprocate. 1. Move from the tail end to the head end of the threaded shaft 504. At this time, the drive motor 503 drives the threaded shaft 504 to rotate in the forward direction. This process is repeated to realize the linear reciprocating motion of the hot air blower 501 under the action of the linear drive module. Of course, the linear drive module can also use other methods to drive the reciprocating motion of the hot air blower, such as an electric push rod. Specifically, the fixed end of the electric push rod is fixed to the inner wall of the drying trough 4, and the hot air blower 501 is fixed to the telescopic end of the electric push rod, so that the electric push rod can drive the hot air blower.

[0037] like Figure 3As shown, the rotating assembly 6 is used to place the wafer to be air dried, and the rotating assembly 6 drives the wafer to rotate to improve the air drying effect of the air drying assembly, so as to realize the rotation of the rotating assembly, the rotating assembly 6 comprises a rotating table 601, a support frame 602, a support column 603 and a rotating motor 604, wherein,

[0038] The rotating motor 604 is fixed on the inner bottom wall of the air drying groove 4, the output shaft of the rotating motor 604 is fixed with the rotating table 601, and the top end of the rotating table 601 is fixed with the support frame 602 through the support column 603.

[0039] In order to realize the connection of the support column 603 between the support frame 602 and the rotating table 601 and ensure the stability of the support column 603 when supporting the support frame 602, the number of the support column 603 is four, and the four support columns 603 are symmetrically installed between the support frame 602 and the rotating table 601.

[0040] As shown in the figure, Figure 3 In order to improve the air drying effect, a filter groove 605 is formed on the support frame 602, and a plurality of filter grooves 605 are uniformly distributed on the support frame 602.

[0041] In order to place and support the wafer on the support frame 602, a support assembly is further included, the support assembly is inserted into the support frame 602, and the wafer to be air dried is placed.

[0042] As shown in the figure, Figure 3 In order to realize the placement and support of the wafer by the support assembly, the support assembly comprises a support ring 606, a connecting column 607 and an installation card 608, the support ring 606 and the connecting column 607 are both provided with two, the two support rings 606 are connected through the two connecting columns 607, the two connecting columns 607 are symmetrically installed between the support rings 606, the installation card 608 is provided with a plurality of, and the installation card 608 is installed on the connecting column 607 in pairs, and the side of the support ring 606 facing the support frame 602 is further fixed with an insertion column, and the support frame 602 is provided with an insertion hole matched with the insertion column;

[0043] The support ring 606 is used for supporting, and because the area of the support ring 606 itself is small, the hot air dryer 501 can dry the wafer through the inner hole of the support ring 606 in the rotating state of the rotating assembly 6, without affecting the air drying effect of the wafer;

[0044] The connecting column 607 is arranged between the support rings 606 from top to bottom, so as to avoid the interference of the connecting column 607 with the air drying.

[0045] In summary, the wafer manual cleaning device provided by the embodiment can place the wafer on the rotating assembly 6 in the air-drying groove 4 after the brushing and soaking of the wafer are completed, start the air-drying assembly 5 and the rotating assembly 6, drive the wafer to rotate through the rotating assembly 6, and reciprocate the air-drying assembly 5 along the linear driving module to dry the wafer on the rotating assembly 6, so that the drying effect can be effectively ensured, the support assembly is arranged on the support frame 602 of the rotating assembly 6, the wafer can be further supported, and thus the state of the wafer during the air drying and the drying effect can be ensured.

[0046] The above merely describes preferred embodiments of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the technical principles of the present application, and these improvements and modifications should also be considered as falling within the protection scope of the present application.

Claims

1. A wafer manual cleaning apparatus characterized by comprising: Including cleaning platform (1), brushing groove (2), soaking groove (3) and air drying groove (4), wherein, The brushing groove (2), the soaking groove (3) and the air drying groove (4) are opened on the cleaning platform (1), the brushing groove (2) and the soaking groove (3) are arranged on the same side, the air drying groove (4) is provided with an air drying assembly (5) and a rotating assembly (6), the rotating assembly (6) is installed on the inner bottom wall of the air drying groove (4), and the air drying assembly (5) is installed on the side wall of the air drying groove (4).

2. The wafer manual cleaning apparatus according to claim 1, wherein The air drying assembly (5) includes a hot air machine (501) and a linear drive module, the hot air machine (501) is installed on the inner wall of the air drying groove (4) close to the brushing groove (2) by the linear drive module, and a plurality of strip-shaped grooves (502) are formed in the inner wall of the air drying groove (4) away from the air drying assembly (5).

3. The wafer manual cleaning apparatus according to claim 2, wherein The linear drive module includes a driving motor (503), a threaded shaft (504), a mounting plate (505), a limiting plate (506) and a mounting seat (507), wherein The mounting plate (505) is fixed on the inner wall of the air drying groove (4), the driving motor (503) is fixed on the side of the mounting plate (505) away from the inner wall of the air drying groove (4), the output shaft of the driving motor (503) is fixed with the threaded shaft (504), the other end of the threaded shaft (504) is rotatably connected with the limiting plate (506), and the limiting plate (506) is fixed with the mounting plate (505); The mounting seat (507) is threadedly installed on the threaded shaft (504), one side of the mounting seat (507) is slidably connected with the mounting plate (505), and the other side of the mounting seat (507) is fixed with the hot air machine (501).

4. The wafer manual cleaning apparatus according to claim 3, wherein The rotating assembly (6) includes a rotating table (601), a support frame (602), a support column (603) and a rotating motor (604), wherein The rotating motor (604) is fixed on the inner bottom wall of the air drying groove (4), the output shaft of the rotating motor (604) is fixed with the rotating table (601), and the top end of the rotating table (601) is fixed with the support frame (602) through the support column (603).

5. The wafer manual cleaning apparatus according to claim 4, wherein The number of support columns (603) is four, and the four support columns (603) are symmetrically installed between the support frame (602) and the rotating table (601).

6. The wafer manual cleaning apparatus according to claim 5, wherein The support frame (602) is provided with a filter groove (605), a plurality of filter grooves (605) are arranged on the support frame (602).

7. The wafer manual cleaning apparatus according to claim 6, wherein It also includes a supporting assembly, the supporting assembly is inserted into the support frame (602), and is used for placing the wafer to be dried.

8. The wafer manual cleaning apparatus according to claim 7, wherein The support assembly comprises support rings (606) and connecting columns (607), both of which are provided with two, two support rings (606) are connected through two connecting columns (607), and two connecting columns (607) are symmetrically installed between the support rings (606); the installation card (608) is provided with a plurality of, and the installation card (608) is installed in pairs on the connecting column (607).

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