Semiconductor shape correcting device

Abstract

A semiconductor shape righting device comprises a plurality of pressing pieces, an opening plate and a mounting table. And the pressing piece acts on the pin and is matched with the mounting table to shape the similar Z-shaped structure of the pin. And the opening plate is inserted between two adjacent pins, so that the two pins are separated to form a required structure. A groove is formed in the upper end of the mounting table, filler strips are arranged on the two sides of the mounting table, the inner wall of the groove plays a role in limiting the plastic package body, and the outer wall of the groove and the filler strips play a role in supporting and limiting the pins, so that the pins can be corrected conveniently. During shape correction, a semiconductor is arranged in the groove, the opening plate is located between every two adjacent pins, the pressing piece acts on the outer walls of the pins, the inner walls of the transverse sections of the lower ends of the pins of a Z-shaped structure are tightly attached to the filler strip, the inner walls of the vertical sections of the pins are tightly attached to the outer wall of the mounting table, and the inner walls of the transverse sections of the upper ends of the pins are tightly attached to the upper end face of the mounting table.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, especially relates to a semiconductor orthopaedic device. BACKGROUND

[0002] The common semiconductor shape structure is the structure as shown in the figure, that is, including plastic package body 8 and the pin 80 arranged at the both sides of plastic package body 8, wherein in order to facilitate the fixation of semiconductor device and the contact area of pin and circuit board etc., the pin 80 is usually processed into the structure of Z-shaped structure, and the structure is composed of two horizontal sections parallel to each other and vertical section connected between the horizontal sections. Figure 1 In the processing, due to the low positioning accuracy of semiconductor device or in the transfer process, the two adjacent pins on the lead frame deviate from each other, or the pin 80 is not the required Z-shaped structure. UTILITY MODEL CONTENTS

[0003] The utility model provides a semiconductor orthopaedic device to solve the insufficient of prior art, solve the inconvenient pin orthopaedic problem, have stronger practicality.

[0004] In order to realize the utility model's purpose, the following technology is adopted:

[0005] A semiconductor orthopaedic device, including two pairs of vertical boards, the upper and lower ends of vertical board are respectively welded with mounting seat, the mounting seat at lower end is installed with lower seat, the mounting seat at upper end is installed with upper plate, the upper plate is installed with hydraulic cylinder, the lower end of hydraulic cylinder is installed with lower pressing plate, the both ends of lower pressing plate are respectively installed with side plate, the lower end of side plate is installed with multiple pressing pieces.

[0006] Multiple vertical rods are arranged on the lower pressing plate, springs are arranged on the vertical rods, the springs are located on the lower side of lower pressing plate, the upper end of vertical rod is provided with end cap, the lower end of vertical rod is installed with lifting plate, the lower end of spring acts on lifting plate, multiple opening plates are installed on lifting plate, the opening plates are inserted between adjacent two pins, so that the two pins are separated and formed into the required structure.

[0007] The mounting table is installed on the lower seat through screw, the upper end of mounting table is provided with recess, the both sides of mounting table are provided with pad strip, the inner wall of recess plays the role of limiting plastic package body, and the outer wall and pad strip of recess play the role of supporting and limiting pin, so as to facilitate the orthopaedic operation of pin.

[0008] When the orthopedic, the semiconductor is placed in the groove, the expansion plate is located between two adjacent pins, the pressing piece acts on the outer wall of the pin, and the inner wall of the horizontal section of the lower end of the Z-shaped pin abuts against the pad strip, the inner wall of the vertical section of the pin abuts against the outer wall of the mounting table, and the inner wall of the horizontal section of the upper end of the pin abuts against the upper end face of the mounting table.

[0009] Further, in order to improve the effect of orthopedic, the inner wall of the pressing piece is formed with a pressing groove, the inner wall of the pressing groove acts on the outer wall of the pin, and the lower end face of the pressing piece acts on the outer wall of the horizontal section of the lower end of the pin.

[0010] Further, in order to separate the two pins close to each other and avoid unnecessary damage to the pin when expanding, the lower end of the expansion plate is provided in a wedge-shaped structure, and the lower end of the expansion plate is small.

[0011] Further, in order to enable the expansion plate to complete the orthopedic operation, the inner wall of the expansion plate is formed with a avoiding slot, and when the expansion plate is expanded, the upper end face of the avoiding slot acts on the upper end face of the mounting table.

[0012] Further, in order to perform the orthopedic process, first perform the pin correction operation to make the pin located directly below the pressing groove, and then perform the orthopedic through the pressing groove, when the correction is completed, the orthopedic of the Z-shaped structure is performed, which can ensure the effectiveness of the orthopedic, therefore, the inclined hole is provided on the vertical plate, the upper and lower ends of the inclined hole are respectively provided with vertical holes, the upper end of the inclined hole is inclined inwardly, the inclined hole and the vertical plate are movably provided with an action rod, the T-shaped seat is provided on the action rod, the outer side end of the T-shaped seat penetrates between the vertical plates, the inner side end of the T-shaped seat is provided with an outer pull rod, the outer pull rod penetrates the side plate, the outer pull rod is provided with a limiting ring, the limiting ring is located on the inner side of the side plate, the outer pull rod is provided with a restoring spring, the restoring spring is located between the side plate and the limiting ring, the lifting plate is provided with two pairs of convex portions, and the inner side end of the outer pull rod is inserted into the insertion hole of the convex portion.

[0013] The above technical scheme has the following advantages:

[0014] The utility model discloses convenient can promote the efficiency of semiconductor pin orthopedic, can also ensure that the pin after orthopedic meets the factory requirement. DRAWINGS

[0015] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model will be described further in detail below with the drawings.

[0016] Figure 1 The three-dimensional structure diagram of one of the embodiments is shown.

[0017] Figure 2 The three-dimensional structure diagram of the mounting table is shown.

[0018] Figure 3 A three-dimensional structural diagram of the press component is shown.

[0019] Figure 4 A three-dimensional structural diagram of the open plate is shown. Detailed Implementation

[0020] like Figures 1-4 As shown, a semiconductor orthopedic device includes two pairs of vertical plates 1. Mounting seats 10 are welded to the upper and lower ends of the vertical plates 1 respectively. A lower seat 11 is mounted on the lower mounting seat 10, and an upper plate 19 is mounted on the upper mounting seat 10. A hydraulic cylinder 20 is mounted on the upper plate 19. A lower pressure plate 21 is mounted on the lower end of the hydraulic cylinder 20. Side plates 22 are mounted on both ends of the lower pressure plate 21 respectively. Multiple pressing members 23 are mounted on the lower end of the side plates 22. The inner wall of the pressing member 23 is formed with a pressing groove 24. The inner wall of the pressing groove 24 acts on the outer wall of the pin 80, and the lower end face of the pressing member 23 acts on the outer wall of the transverse section at the lower end of the pin 80.

[0021] Multiple vertical rods 25 are mounted on the lower pressure plate 21. Springs 26 are fitted on the vertical rods 25 and are located on the lower side of the lower pressure plate 21. The upper end of the vertical rod 25 is provided with an end cap. A lifting plate 27 is installed at the lower end of the vertical rod 25. The lower end of the spring 26 acts on the lifting plate 27. Multiple opening plates 30 are installed on the lifting plate 27. The lower end of the opening plate 30 has a wedge-shaped structure and is the smaller end. The inner wall of the opening plate 30 is formed with a relief groove 31.

[0022] A mounting platform 33 is installed on the lower base 11 by screws. The upper end of the mounting platform 33 has a groove 34, and the two sides of the mounting platform 33 have pads 32.

[0023] A slanted hole 12 is provided on the vertical plate 1. Vertical holes 13 are provided at the upper and lower ends of the slanted hole 12. The upper end of the slanted hole 12 extends inward at an incline. An actuating rod 14 is movably provided in the slanted hole 12 and the vertical plate 1. A T-shaped seat 15 is provided on the actuating rod 14. The outer end of the T-shaped seat 15 passes through the vertical plate 1. An outer pull rod 16 is provided on the inner end of the T-shaped seat 15. The outer pull rod 16 passes through the side plate 22. A limiting ring 17 is provided on the outer pull rod 16. The limiting ring 17 is located on the inner side of the side plate 22. A restoring spring 18 is sleeved on the outer pull rod 16. The restoring spring 18 is located between the side plate 22 and the limiting ring 17. Two pairs of protrusions 28 are provided on the lifting plate 27. The inner end of the outer pull rod 16 is inserted into the insertion hole 29 of the protrusion 28.

[0024] When the orthopedic, the semiconductor 8 is placed in the groove 34, the expansion plate 30 is located between two adjacent pins 80, the pressing piece 23 acts on the outer wall of the pin 80, and the inner wall of the horizontal section of the lower end of the Z-shaped pin 80 is tightly attached to the pad strip 32, the inner wall of the vertical section of the pin 80 is tightly attached to the outer wall of the mounting table 33, and the inner wall of the horizontal section of the upper end of the pin 80 is tightly attached to the upper end face of the mounting table 33.

[0025] In application, the semiconductor to be orthopedic is placed in the groove 34, and the plastic package 8 is limited through the groove 34, and the semiconductor after placement needs to align the two ends with the two ends of the groove 34, so as to ensure that the expansion plate 30 is located between two adjacent pins 80, and the pressing piece 23 is located above each pin 80.

[0026] The defects of the placed semiconductor pin may be that one or more pins 80 are deflected, that the Z-shaped structure of one or more pins 80 does not meet the factory requirements, or that both defects exist at the same time, in order to facilitate description, it is assumed that the semiconductor to be orthopedic has both defects.

[0027] Then the hydraulic cylinder 20 or the alternative air cylinder is started, and the side plate 22, the T-shaped seat 15 and the action rod 14 arranged on the T-shaped seat 15 are moved in the vertical hole 13 at the upper end and part of the inclined hole 12 under the drive of the hydraulic cylinder 20, at this time, since the vertical hole 13 at the upper end is located on the inner side, the inner end of the outer pull rod 16 is inserted into the insertion hole 29 of the protruding part 28, then when the action rod 14 moves in the vertical hole 13 at the upper end and part of the inclined hole 12, the deflection of each pin 80 is first corrected by the expansion plate 30, and when the correction is completed, the expansion plate 30 will stop moving due to the action of the mounting table 33. However, the lower pressing plate 21 will continue to move downward under the drive of the hydraulic cylinder 20, in this process, the spring 26 is compressed, and the pressing piece 23 will continue to move downward and complete the orthopedic operation of the Z-shaped structure of each pin 80. After completion, the pressing piece 23 and the expansion plate 30 will move upward, and the orthopedic semiconductor is taken out.

[0028] The above only describes the preferred embodiments of the present application, and is not used to limit the present application, and obviously, those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and changes of the present application belong to the scope of the claims of the present application and equivalent technologies, the present application also intends to include these modifications and changes.

Claims

1. A semiconductor orthopedic device, comprising: The utility model provides a kind of vertical plate (1) and the vertical plate (1) of two pairs of vertical plate (1) are included, and the upper and lower ends of vertical plate (1) are welded with mounting seat (10) respectively, and the mounting seat (10) located lower end is equipped with lower seat (11), and the mounting seat (10) located upper end is equipped with upper plate (19), and upper plate (19) is equipped with hydraulic cylinder (20), and the lower end of hydraulic cylinder (20) is equipped with lower pressing plate (21), and the both ends of lower pressing plate (21) are equipped with side plate (22) respectively, and the lower end of side plate (22) is equipped with multiple pressing pieces (23); Multiple vertical rods (25) are vertically arranged on the lower pressing plate (21), and springs (26) are sleeved on the vertical rods (25), and the springs (26) are located on the lower side of the lower pressing plate (21), and the upper ends of the vertical rods (25) are provided with end caps, and the lower ends of the vertical rods (25) are equipped with lifting plates (27), and the lower ends of the springs (26) act on the lifting plates (27), and the lifting plates (27) are equipped with multiple opening plates (30); The lower seat (11) is equipped with a mounting table (33) through screws, and the upper end of the mounting table (33) is provided with a groove (34), and the both sides of the mounting table (33) are provided with cushion strips (32); During rectification, the semiconductor (8) is placed in the groove (34), the opening plate (30) is located between the adjacent two pins (80), the pressing piece (23) acts on the outer wall of the pin (80), and the inner wall of the horizontal section at the lower end of the pin (80) in the Z-shaped structure is tightly attached to the cushion strip (32), the inner wall of the vertical section of the pin (80) is tightly attached to the outer wall of the mounting table (33), and the inner wall of the horizontal section at the upper end of the pin (80) is tightly attached to the upper end surface of the mounting table (33).

2. The semiconductor orthopedic device of claim 1, wherein, The inner wall of the pressing piece (23) is formed with a pressing groove (24), and the inner wall of the pressing groove (24) acts on the outer wall of the pin (80), and the lower end surface of the pressing piece (23) acts on the outer wall of the horizontal section at the lower end of the pin (80).

3. The semiconductor orthopedic device of claim 1, wherein, The lower end of the opening plate (30) is wedge-shaped, and the lower end of the opening plate (30) is small.

4. The semiconductor orthopedic device of claim 1, wherein, The inner wall of the opening plate (30) is formed with an avoiding groove (31).

5. The semiconductor orthopedic device of claim 1, wherein, The vertical plate (1) is provided with an inclined hole (12), and vertical holes (13) are arranged at the upper and lower ends of the inclined hole (12), respectively, and the upper end of the inclined hole (12) extends inwardly and obliquely, and the inclined hole (12) and the vertical plate (1) movably accommodate an action rod (14), and the action rod (14) is provided with a T-shaped seat (15), and the outer side end of the T-shaped seat (15) penetrates between the vertical plates (1), and the inner side end of the T-shaped seat (15) is provided with an outer pull rod (16), and the outer pull rod (16) penetrates the side plate (22), and the outer pull rod (16) is provided with a limiting ring (17), and the limiting ring (17) is located on the inner side of the side plate (22), and the outer pull rod (16) is sleeved with a restoring spring (18), and the restoring spring (18) is located between the side plate (22) and the limiting ring (17), and the lifting plate (27) is provided with two pairs of convex portions (28), and the inner side end of the outer pull rod (16) is inserted into the insertion hole (29) of the convex portion (28).

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