Wafer bonding positioning and clamping device
By using a wafer bonding positioning and clamping device with an arc-groove push rod and a spring structure, the problem of wafer damage in traditional methods is solved, and a high-precision and high-efficiency wafer bonding process is achieved.
Patent Information
- Application Number
- CN202423324160.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Traditional mechanical alignment methods can easily damage wafers during wafer bonding, affecting the quality and yield of bonded products.
The wafer is pushed and calibrated using a push rod and spring structure with arc grooves. It is clamped on both sides or in multiple directions by an active push clamping assembly and a driven support assembly. The elastic compensation force of the spring is used to disperse the impact, and the position is adjusted by tilting and shaking.
It improves the positioning accuracy and strength of wafer bonding, reduces the possibility of wafer fragmentation, and ensures efficient concentric calibration and a stable bonding process.
Smart Images
Figure CN223912845U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer bonding equipment technical field especially a wafer bonding positioning and clamping device. BACKGROUND
[0002] In the current semiconductor technology, for the number of stacked chips, wafer-to-wafer bonding is a key process, and the alignment accuracy of wafer bonding is a core parameter for measuring wafer bonding process. The alignment accuracy defect of wafer bonding will seriously affect the yield performance of the wafer.
[0003] In the wafer whole piece bonding process, the traditional mechanical alignment method is to apply centripetal pressure to the edge of the wafer, which requires accurate force direction, appropriate force size, and prevention of damage caused by rigid impact between the force application part and the wafer. Any link problem can easily cause wafer damage and affect the quality of bonded products. UTILITY MODEL CONTENTS
[0004] The applicant provides a wafer bonding positioning and clamping device with a reasonable structure to address the above-mentioned shortcomings in existing production technology. The push rod with an arc-shaped groove is used to push and calibrate the wafer, and a spring is added to the push rod to provide positioning deviation compensation for the wafer profile.
[0005] The technical solution adopted by the utility model is as follows:
[0006] A wafer bonding positioning and clamping device clamps and limits the wafer to be bonded from both sides or in multiple directions, including a workbench surface, which is provided with:
[0007] A stage is rotatably arranged on the workbench surface, and the wafer to be bonded is placed on the stage,
[0008] An active push clamping assembly reciprocally slides towards the wafer center position to apply a push clamping force and an elastic compensation force to the wafer; the active push clamping assembly is formed with a receiving groove or a flexible contact concave surface,
[0009] A driven supporting clamping assembly is located on the side of the wafer away from the active push clamping assembly; in single bonding conditions, the relative position between the driven supporting clamping assembly and the workbench remains constant.
[0010] As a further improvement of the above technical solution:
[0011] The active push clamping assembly includes:
[0012] A gas cylinder is fixedly installed on the workbench surface,
[0013] A push rod arm is driven by the gas cylinder and reciprocally extends and retracts parallel to the workbench surface,
[0014] The limiting head is connected to the extending end of the push rod arm, and a containing groove or a flexible abutting concave surface is arranged on the side of the limiting head facing the wafer,
[0015] The elastic connecting piece is located between the limiting head and the push rod arm.
[0016] The thickness of the limiting head is greater than the thickness of the two wafers in the preparation condition.
[0017] The elastic connecting piece is a spring, and the two ends of the spring are embedded in the limiting head and the push rod arm respectively, and the spring is symmetrically arranged with the push rod arm as the center of symmetry.
[0018] The three-way moving seat is arranged on the workbench surface, and the active push clamping assembly is installed on the three-way moving seat.
[0019] The relative position of the driven supporting clamping assembly on the object table is adjustable in the radial direction; at least one abutting block is arranged on the circumference of the abutting block.
[0020] The object table is provided with an adjusting groove falling on the radius, and the abutting block and the positioning block are slidably arranged in the adjusting groove.
[0021] The workbench surface is an adjustable inclination surface.
[0022] The object table is provided with a swing gasket, and the movement path of the swing gasket passes through the wafers to be bonded.
[0023] The beneficial effects of the utility model are as follows:
[0024] The utility model has the advantages of compact structure, reasonable design, convenient operation, etc., by setting the limiting groove as an arc surface completely matching the wafer curvature, directly increasing the effective contact area of the limiting groove and the two wafers, and compensating for the positioning deviation caused by the telescopic push rod acting on the edges of the two wafers.
[0025] The utility model introduces a spring structure between the limiting head and the push rod arm, utilizes the rigidity of the spring for connection, simultaneously utilizes the elastic deformation of the spring to disperse the impact on the two wafers when the push rod acts, and reduces the risk of cracking caused by the impact.
[0026] The active push clamping assembly and the driven supporting clamping assembly are utilized to strictly control and clamp the positioning of the single wafer, so as to improve the concentricity of the two wafers. DRAWINGS
[0027] Figure 1 It is a schematic diagram of the whole machine structure of the utility model.
[0028] Figure 2 It is an enlarged view of part A of the utility model, and is used for reflecting the driven supporting clamping assembly.
[0029] Figure 3 The utility model discloses an active pushing and clamping assembly.
[0030] Figure 4 For Figure 3 The B part enlarged view for embodying elastic connecting structure.
[0031] Figure 5 For Figure 4 The sectional view of structure.
[0032] Wherein: 1, workbench surface, 2, object table, 3, active pushing and clamping assembly, 4, abutting block, 5, positioning block, 6, swing gasket,
[0033] 201, adjusting groove,
[0034] 301, air cylinder, 302, push rod arm, 303, limit head, 304, elastic connecting piece, 305, three-way moving seat. DETAILED DESCRIPTION
[0035] The specific implementation of the utility model will be described below in combination with the drawings.
[0036] As Figures 1-5 The wafer bonding positioning and clamping device of the embodiment is used for double-side or multi-direction clamping and limiting of the wafer to be bonded, and comprises a workbench surface 1, and the workbench surface 1 is provided with:
[0037] An object table 2 is rotatably arranged on the workbench surface 1, and the wafer to be bonded is arranged on the object table 2,
[0038] An active pushing and clamping assembly 3 is arranged on the object table 2, and the active pushing and clamping assembly 3 reciprocally slides towards the center of the wafer to apply a pushing force and an elastic compensation force to the wafer; the active pushing and clamping assembly 3 is formed with an accommodating groove or a flexible abutting concave surface,
[0039] A driven supporting and clamping assembly is arranged on the side of the wafer away from the active pushing and clamping assembly 3; in single bonding conditions, the relative position between the driven supporting and clamping assembly and the workbench is kept constant.
[0040] The active pushing and clamping assembly 3 comprises:
[0041] An air cylinder 301 is fixedly arranged on the workbench surface 1,
[0042] A push rod arm 302 is driven by the air cylinder 301 and reciprocally extends and retracts parallel to the workbench surface 1,
[0043] A limit head 303 is connected to the extending end of the push rod arm 302, and the accommodating groove or the flexible abutting concave surface is arranged on the side of the limit head 303 facing the wafer,
[0044] An elastic connecting piece 304 is arranged between the limit head and the push rod arm 302.
[0045] The thickness of the limiting head 303 is greater than the thickness of the two wafers to be bonded under the preparation conditions.
[0046] The elastic connector 304 uses a spring, with both ends of the spring embedded in the limiting head 303 and the push rod arm 302 respectively, and the spring is symmetrically arranged with the push rod arm 302 as the center of symmetry.
[0047] The worktable 1 is provided with a three-way movable seat 305, and the active push clamping component 3 is installed on the three-way movable seat 305.
[0048] The relative position of the driven support and clamping assembly on the stage 2 is adjustable in the radial direction; it includes at least one abutment block 4, and a positioning block 5 is provided on the circumference of the abutment block 4.
[0049] An adjustment groove 201 is provided on the stage 2. The adjustment groove 201 falls on the radius. The abutment block 4 and the positioning block 5 fall in the adjustment groove 201 and can be slidably set.
[0050] Workbench 1 is an adjustable tilt surface.
[0051] The stage 2 is provided with a swing pad 6 around its circumference, and the movement path of the swing pad 6 passes between the wafers to be bonded.
[0052] The specific structure and working process of this utility model are as follows:
[0053] like Figure 1 As shown, this is a schematic diagram of the overall machine structure. A worktable 1 is hinged to the top surface of the machine. The worktable 1 can be lifted by a cylinder 301 installed at the bottom according to the process requirements.
[0054] like Figure 2 The diagram shows the structure of the driven support clamping assembly. In this embodiment, the driven support clamping assembly uses two abutment blocks 4, which are larger than the positioning blocks 5, to abut against the side of the wafer away from the active push clamping assembly 3. Specifically, the four positioning blocks 5 are narrow L-shaped positioning blocks 5, installed symmetrically in pairs. The abutment blocks 4 are wide L-shaped positioning blocks 5, used to connect with the positioning edge of the wafer, and the wide surface is completely perpendicular to the extension and retraction direction of the cylinder 301 and parallel to the rotation axis of the worktable 1. To achieve the highest precision positioning effect for the two wafers when the worktable 1 is tilted, the wide L-shaped positioning blocks 5 are used.
[0055] like Figure 3As shown, the structure diagram of the active pushing clamping assembly 3, the cylinder 301 of the active pushing clamping assembly 3 is installed on the XYZ three-way moving seat 305. The piston rod of the cylinder 301 is connected with the push rod arm 302, and the end of the push rod arm 302 is provided with an arc limiting groove or a flexible concave surface. Taking the arc limiting groove as an example, a part of the cuboid is cut off on the basis of the cuboid, and the cut-off arc is matched with the size of the corresponding bonded wafer, so that the effect of closely fitting the edges of the two wafers is achieved. The plane side of the arc limiting groove parallel to the groove is connected with the push rod arm 302, and the two are connected through a spring. The spring is fixed to the two through rigid connection, and the two ends of the spring are respectively embedded in the counterbores opposite to the limiting head 303 and the push rod arm 302. The extension direction of the spring is consistent with the movement direction of the push rod arm 302, so that the buffer effect on the extension movement can be ensured. The push rod arm 302 performs one-dimensional horizontal movement, and the extension speed and extension position are accurately controlled through the cylinder 301.
[0056] As an optional optimization implementation, a guide rail is installed below the cylinder 301, and the guide rail is used for supporting and guiding the fixed sliding block with the push rod arm 302. The guide rail is installed on the three-way moving seat 305, the high-precision three-way moving seat 305 is used for calibrating the position of the arc limiting groove relative to the center of the object table 2, compensating for the system error caused by each element in the installation process, ensuring that the arc limiting groove is centered and the extension direction is completely perpendicular to the positioning edge of the wafer, and there is also a positioning connection hole on the three-way moving seat 305, which is fixed and locked with the workbench surface 1.
[0057] In use, the first bonded wafer is directly placed on the positioning block 5, at this time, the three swing gaskets 6 are controlled to move and extend into the upper side of the first bonded wafer,
[0058] Then the second bonded wafer is placed in the object table 2, the second bonded wafer is limited by the positioning block 5 and supported by the swing gasket 6,
[0059] The first bonded wafer is kept close to the second bonded wafer without contact, and after stabilization, the operation platform is slowly inclined to a set angle, and the object table 2 is slightly shaken by using a commercially available vibration motor, so that the two wafers slightly shake to adjust the position under the action of gravity, and the wafer positioning edge and the L-shaped positioning block 5 are perfectly fitted,
[0060] After the shaking is stopped, the cylinder 301 is started, and the limiting head 303 is slowly pushed to the edges of the two wafers. When the limiting head 303 is in contact with the edges of the two wafers, the first bonded wafer and the second bonded wafer are further adjusted in concentricity under the action of the arc limiting groove, until the arc limiting groove is perfectly fitted with the two wafers,
[0061] The forward movement of the cylinder 301 is stopped, and the pushing force is maintained, so that the two wafers are clamped under the positioning operation. After the clamping is stable, the workbench surface 1 is slowly lowered to the horizontal state, and the subsequent wafer bonding process is prepared.
[0062] The advantage of the utility model lies in, relative to traditional type limit groove push rod, the arc limit groove push rod of the utility model can use bigger effective contact surface to cope with impact, reduce the possibility of fragment, and utilize its and wafer surface perfect fit can significantly increase positioning accuracy, provide more favorable condition for subsequent wafer bonding, introduce spring at the same time, buffer the pressure of mechanical air cylinder 301 telescopic rod to wafer edge, further combine the action of tilt shake, to preliminary align the position of two wafers, reduce the position deviation caused by the film, and ensure that two wafers are in the separated state before the arc limit groove works.Therefore, the arc limit groove push rod device of the utility model can improve bonding positioning accuracy and strength through simple and efficient means.
[0063] The above description is the explanation of the utility model, not the limitation of the utility model, the range defined by the utility model is seen the claim, within the protection scope of the utility model, can make any form of modification.
Claims
1. A wafer bonding positioning and clamping device, characterized in that: The wafer to be bonded is clamped and limited from both sides or in multiple directions, including a worktable (1), on which are provided: The stage (2) is rotatably mounted on the worktable (1). The wafer to be bonded is placed on the stage (2), and the active push clamping assembly (3) slides back and forth toward the center of the wafer, applying a pushing force and elastic compensation force to the wafer. The active push clamping assembly (3) has a receiving groove or a flexible contact concave surface. The driven support clamping assembly is located on the side of the wafer away from the active push clamping assembly (3). In a single bonding operation, the relative position of the driven support clamping assembly and the worktable remains constant.
2. The wafer bonding positioning and clamping device as described in claim 1, characterized in that: The active propulsion clamping assembly (3) includes: Cylinder (301) is fixedly mounted on the worktable (1). The push rod arm (302), driven by the cylinder (301), reciprocates parallel to the worktable surface (1). A limiting head (303) is connected to the extended end of the push rod arm (302), and a receiving groove or flexible abutment concave surface is provided on the side of the limiting head (303) facing the wafer. The flexible connector (304) is located between the limit head (303) and the push rod arm (302).
3. The wafer bonding positioning and clamping device as described in claim 2, characterized in that: The thickness of the limiting head (303) is greater than the thickness of the two wafers to be bonded under the preparation conditions.
4. The wafer bonding positioning and clamping device as described in claim 2, characterized in that: The elastic connector (304) uses a spring, with the two ends of the spring embedded in the limiting head (303) and the push rod arm (302) respectively, and the spring is symmetrically arranged with the push rod arm (302) as the center of symmetry.
5. The wafer bonding positioning and clamping device as described in claim 1, characterized in that: A three-way movable seat (305) is provided on the worktable (1), and an active push clamping assembly (3) is installed on the three-way movable seat (305).
6. The wafer bonding positioning and clamping device as described in claim 1, characterized in that: The relative position of the driven support clamping assembly on the stage (2) is adjustable in the radial direction; it includes at least one abutment block (4), and a positioning block (5) is provided on the circumference of the abutment block (4).
7. The wafer bonding positioning and clamping device as described in claim 6, characterized in that: The stage (2) is provided with an adjustment groove (201) that falls on the radius. The abutment block (4) and the positioning block (5) fall in the adjustment groove (201) and can be slidably set.
8. The wafer bonding positioning and clamping device as described in claim 1, characterized in that: The work surface (1) is an adjustable tilt surface.
9. The wafer bonding positioning and clamping device as described in claim 1, characterized in that: The stage (2) is provided with a swing pad (6) around its circumference, and the movement path of the swing pad (6) passes between the wafers to be bonded.