Sealing structure based on integrated circuit
By designing a combined structure of a first and a second sealing shell, the problems of poor sealing effect and low heat dissipation efficiency of integrated circuits are solved, achieving efficient sealing and rapid heat dissipation.
Patent Information
- Application Number
- CN202520405791.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-10
AI Technical Summary
Existing integrated circuits have poor sealing performance and low heat dissipation efficiency, making it impossible to effectively dissipate the heat generated during operation.
Design a sealing structure including a first sealing shell and a second sealing shell, using components such as limiting grooves, thermally conductive silicone pads and heat dissipation fins to form a sealed space and achieve rapid heat transfer and dissipation.
The sealing effect of the integrated circuit is improved, ensuring that it is not affected by external moisture and dust. At the same time, the combination of thermally conductive silicone pads and heat dissipation fins enables rapid heat dissipation and improves the performance.
Smart Images
Figure CN223912872U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a sealing structure technical field especially relates to a sealing structure based on integrated circuit. BACKGROUND
[0002] Integrated circuit adopts specific craft, and the transistor, resistance, condenser, inductance and so on component and wiring interconnection needed by circuit are connected together, and are made on a small piece or several small pieces semiconductor wafer or dielectric substrate.
[0003] The existing integrated circuit is generally installed in the inside of the case or other equipment preset installation in the part when using, and the integrated circuit is sealed only by setting the cover outside, but only can seal the integrated circuit single face, and the sealing effect is poor, and the integrated circuit will produce heat in the working process, and the heat will be blocked by the cover, resulting in the slow heat dissipation speed, and the use effect is poor. UTILITY MODEL CONTENTS
[0004] The utility model discloses a sealing structure based on integrated circuit to solve the above-mentioned shortcoming in prior art.
[0005] In order to realize the above-mentioned purpose, the utility model discloses the following technical scheme: design a sealing structure based on integrated circuit, including first sealing shell and second sealing shell, and the integrated circuit body is arranged between the first sealing shell and the second sealing shell, and the limit groove is arranged on the similar surface of the first sealing shell and the second sealing shell, when the similar surface of the first sealing shell and the second sealing shell abuts, two limit grooves form the containing cavity, and the integrated circuit body is located in the containing cavity.
[0006] The bottom edge of the first sealing shell extends the second surrounding edge, and the top edge of the second sealing shell extends the first surrounding edge, the second surrounding edge is stacked on the first surrounding edge, and the similar surface of the second surrounding edge and the first surrounding edge is connected with the sealing frame, and the similar surface of the two sealing frames abuts.
[0007] The inner surface of the first sealing shell and the inner surface of the limit groove arranged in the bottom of the first sealing shell are equipped with the second heat-conducting silica gel pad, and a plurality of heat dissipation grooves are arranged on the outer surface of the first sealing shell, and a plurality of first heat dissipation fins are arranged on the top of the first sealing shell.
[0008] The bottom of the second sealing shell is equipped with a plurality of second heat dissipation fins, and the inner surface of the limit groove arranged on the top of the second sealing shell is equipped with the first heat-conducting silica gel pad, when the integrated circuit body is located in the limit groove, the first heat-conducting silica gel pad contacts the surface of the circuit board on the integrated circuit body.
[0009] Preferably, the top edge of the second surrounding edge is provided with a plurality of screws, the top edge of the first surrounding edge is provided with a plurality of threaded holes, one end of each screw penetrates through the second surrounding edge and extends into the corresponding threaded hole, and each screw is threadedly connected with the threaded hole.
[0010] Preferably, the first sealing shell and the second sealing shell are made of copper or aluminum.
[0011] Preferably, the first sealing shell and one side of the second surrounding edge are provided with wiring grooves, and the wires connected with the integrated circuit body penetrate through the wiring grooves.
[0012] The inner wall of the wiring groove and the top of the first surrounding edge are both provided with sealing pads, and when the first surrounding edge is connected with the second surrounding edge, the sealing pads are wrapped on the outer surface of the wires and are sealingly connected with the wires.
[0013] Preferably, when the integrated circuit body is located in the limiting groove, the inner top of the first sealing shell is spaced apart from the components mounted on the integrated circuit body.
[0014] Preferably, the bottom of each supporting leg is curved, and the bottom of each supporting leg extends to the outside of the first surrounding edge.
[0015] Preferably, the bottom of each supporting leg is curved, and the bottom of each supporting leg extends to the outside of the first surrounding edge.
[0016] The design scheme of the utility model has the advantages that in the application process, the utility model has the advantages that:
[0017] The integrated circuit body is covered by the first sealing shell and the second sealing shell, so that the integrated circuit body is located in a sealed space and is not affected by external moisture or dust, thereby improving the sealing effect.
[0018] The heat generated by the integrated circuit body during operation is quickly transferred to the second sealing shell and the first sealing shell through the first heat-conducting silica gel pad and the second heat-conducting silica gel pad, and is finally dissipated through the second heat dissipation fins and the first heat dissipation fins, thereby achieving good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 is a structural dispersion diagram of the utility model;
[0020] Figure 2 is a structural schematic diagram of the utility model;
[0021] Figure 3 is a first sealing shell internal structure schematic diagram of the utility model;
[0022] Figure 4 is a structural side view of the utility model.
[0023] Fig. 1, threaded hole; 2, first surrounding edge; 3, limiting groove; 4, integrated circuit body; 5, second surrounding edge; 6, screw; 7, heat dissipation groove; 8, first sealing shell; 9, first heat dissipation fin; 10, sealing gasket; 11, wiring groove; 12, sealing frame; 13, supporting leg; 14, second heat dissipation fin; 15, first heat-conducting silica gel pad; 16, second sealing shell; 17, second heat-conducting silica gel pad. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.
[0025] Referring to Figures 1-4 A sealing structure based on integrated circuits comprises a first sealing shell 8 and a second sealing shell 16, and an integrated circuit body 4 is arranged between the first sealing shell 8 and the second sealing shell 16. Limiting grooves 3 are arranged on the proximal surfaces of the first sealing shell 8 and the second sealing shell 16. When the proximal surfaces of the first sealing shell 8 and the second sealing shell 16 abut, the two limiting grooves 3 form a containing cavity, and the integrated circuit body 4 is located in the containing cavity. In actual use, the first sealing shell 8 and the second sealing shell 16 can cover the integrated circuit body 4, so that the integrated circuit body 4 is in a sealed environment, and the sealing effect is improved.
[0026] As shown in Figure 1 and Figure 2 , the bottom edge of the first sealing shell 8 extends and is provided with a second surrounding edge 5, and the top edge of the second sealing shell 16 extends and is provided with a first surrounding edge 2. The second surrounding edge 5 is stacked on the first surrounding edge 2, and the proximal surfaces of the second surrounding edge 5 and the first surrounding edge 2 are both connected with sealing frames 12. The proximal surfaces of the two sealing frames 12 abut, and the gap between the first sealing shell 8 and the second sealing shell 16 can be sealed under the action of the sealing frames 12, so that the sealing effect is improved.
[0027] As shown in Figure 1 and Figure 2 , the first sealing shell 8 and one side of the second surrounding edge 5 are both provided with wiring grooves 11. The wires connected with the integrated circuit body 4 penetrate through the wiring grooves 11. The inner walls of the wiring grooves 11 and the top of the first surrounding edge 2 are both provided with sealing gaskets 10. When the first surrounding edge 2 and the second surrounding edge 5 are stacked and connected, the sealing gaskets 10 are wrapped on the outer surfaces of the wires and are sealed with the wires. In actual use, the gap between the wires and the wiring grooves 11 can be sealed by the sealing gaskets 10, so that the sealing effect is further improved.
[0028] It should be noted that the top edge of the second surrounding edge 5 is provided with a plurality of screws 6, the top edge of the first surrounding edge 2 is provided with a plurality of threaded holes 1, one end of each screw 6 penetrates the second surrounding edge 5 and extends into the corresponding threaded hole 1, and each screw 6 is threadedly connected with the threaded hole 1. In the actual installation process, after the staff covers the first sealing shell 8 and the second sealing shell 16 on the integrated circuit body 4, the first surrounding edge 2 and the second surrounding edge 5 can be fixed together by screwing the screw 6 into the corresponding threaded hole 1, and then the first sealing shell 8 and the second sealing shell 16 are fixed together.
[0029] As shown in Figure 1 and Figure 3 , the inner surface of the first sealing shell 8 and the inner surface of the limiting groove 3 provided at the bottom of the first sealing shell 8 are both provided with a second heat-conducting silica gel pad 17, and a plurality of heat dissipation grooves 7 are provided on the outer surface of the first sealing shell 8. The top of the first sealing shell 8 is also provided with a plurality of first heat dissipation fins 9. The first sealing shell 8 is made of copper or aluminum. In actual use, the heat generated by the integrated circuit body 4 can be transmitted to the first sealing shell 8 through the second heat-conducting silica gel pad 17 and dissipated to the external environment, and the contact area between the first sealing shell 8 and the external air can be increased under the action of the heat dissipation grooves 7, thereby accelerating the heat dissipation speed.
[0030] As shown in Figure 1 , the bottom of the second sealing shell 16 is provided with a plurality of second heat dissipation fins 14, and the inner surface of the limiting groove 3 provided at the top of the second sealing shell 16 is provided with a first heat-conducting silica gel pad 15. When the integrated circuit body 4 is located in the limiting groove 3, the first heat-conducting silica gel pad 15 is in contact with the surface of the circuit board on the integrated circuit body 4. The second sealing shell 16 is made of copper or aluminum. In actual use, the first heat-conducting silica gel pad 15 can quickly transmit the heat generated by the integrated circuit body 4 to the second sealing shell 16, and dissipate to the external environment through the second heat dissipation fins 14.
[0031] It should be noted that the first heat-conducting silica gel pad 15 and the second heat-conducting silica gel pad 17 can insulate and protect the integrated circuit body 4 from the first sealing shell 8 and the second sealing shell 16, so as to avoid short circuit between the integrated circuit body 4 and the first sealing shell 8 and the second sealing shell 16.
[0032] Specifically, the utility model discloses when installing, staff places integrated circuit body 4 in the limiting groove 3 of the top of second sealing shell 16, after again with first sealing shell 8 cover integrated circuit body 4's top, make first sealing shell 8 edge on the second surrounding edge 5 of second sealing shell 16's edge on the first surrounding edge 2 fold and align, after with screw 6 passes through second surrounding edge 5 and is screwed into threaded hole 1, with first sealing shell 8 and second sealing shell 16 are fixed together, like this can seal integrated circuit body 4, improve the use effect, when using, the part heat of integrated circuit body 4 work will be passed through first heat-conducting silica gel pad 15 and is transferred to second sealing shell 16, through second radiating fin 14 and is lost to the surrounding environment, and simultaneously the another heat of integrated circuit body 4 work will be transferred to first sealing shell 8 through second heat-conducting silica gel pad 17, through first radiating fin 9 and radiating groove 7 and are lost to the surrounding environment, improve the heat dissipation effect.
[0033] Further, when integrated circuit body 4 is located in limiting groove 3, the internal top end of first sealing shell 8 and the components installed on integrated circuit body 4 have a spacing, so that during installation, the components on integrated circuit body 4 will not collide with first sealing shell 8.
[0034] Further, as shown in Figure 1 and Figure 4 , the bottom of second sealing shell 16 is provided with a support 13 on both sides, the bottom of each support 13 is curved, and the bottom of each support 13 extends to the outside of first surrounding edge 2. During actual use, after fixing integrated circuit body 4 in first sealing shell 8 and second sealing shell 16, the staff fixes the support 13 on the preset position of the equipment through a bolt, and the installation is completed, which is stable.
[0035] The above is only a preferred embodiment of the utility model, but the protection scope of the utility model is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.
Claims
1. A sealing structure for an integrated circuit, comprising a first sealing case (8) and a second sealing case (16), characterized in that: The integrated circuit body (4) is arranged between the first sealing shell (8) and the second sealing shell (16), and a limiting groove (3) is arranged on the adjacent surface of the first sealing shell (8) and the second sealing shell (16), when the adjacent surfaces of the first sealing shell (8) and the second sealing shell (16) abut, the two limiting grooves (3) form a containing cavity, and the integrated circuit body (4) is arranged in the containing cavity; The bottom edge of the first sealing shell (8) is extended with a second surrounding edge (5), the top edge of the second sealing shell (16) is extended with a first surrounding edge (2), the second surrounding edge (5) is overlapped on the first surrounding edge (2), and the adjacent surfaces of the second surrounding edge (5) and the first surrounding edge (2) are connected with sealing frames (12), and the adjacent surfaces of the two sealing frames (12) abut. The inner surface of the first sealing shell (8) and the inner surface of the limiting groove (3) arranged at the bottom of the first sealing shell (8) are both mounted with a second heat-conducting silica gel pad (17), and a plurality of heat dissipation grooves (7) are arranged on the outer surface of the first sealing shell (8), and a plurality of first heat dissipation fins (9) are mounted on the top of the first sealing shell (8). A plurality of second heat dissipation fins (14) are mounted on the bottom of the second sealing shell (16), and the inner surface of the limiting groove (3) arranged on the top of the second sealing shell (16) is mounted with a first heat-conducting silica gel pad (15), when the integrated circuit body (4) is arranged in the limiting groove (3), the first heat-conducting silica gel pad (15) is in contact with the surface of the circuit board on the integrated circuit body (4).
2. The sealing structure for an integrated circuit according to claim 1, wherein: The top edge of the second surrounding edge (5) is provided with a plurality of screws (6), the top edge of the first surrounding edge (2) is provided with a plurality of threaded holes (1), one end of each screw (6) penetrates through the second surrounding edge (5) and extends into the corresponding threaded hole (1), and each screw (6) is in threaded connection with the threaded hole (1).
3. The sealing structure for an integrated circuit according to claim 1, wherein: The first sealing shell (8) and the second sealing shell (16) are both made of copper or aluminum material.
4. The sealing structure for an integrated circuit according to claim 1, wherein: One side of the first sealing shell (8) and the second surrounding edge (5) is provided with a wiring groove (11), and the lead wire connected with the integrated circuit body (4) penetrates through the wiring groove (11); The inner wall of the wiring groove (11) and the top of the first surrounding edge (2) are both mounted with a sealing pad (10), when the first surrounding edge (2) is overlapped and connected with the second surrounding edge (5), the sealing pad (10) is wrapped on the outer surface of the lead wire and is in sealed connection with the lead wire.
5. The sealing structure for an integrated circuit according to claim 1, wherein: When the integrated circuit body (4) is arranged in the limiting groove (3), the top end of the inside of the first sealing shell (8) is spaced apart from the components arranged on the integrated circuit body (4).
6. The sealing structure for an integrated circuit according to claim 1, wherein: The bottom of each supporting leg (13) is curved, and the bottom of each supporting leg (13) extends to the outside of the first surrounding edge (2).
7. The sealing structure for an integrated circuit according to claim 6, wherein: The bottom of each supporting leg (13) is curved, and the bottom of each supporting leg (13) extends to the outside of the first surrounding edge (2).