Spraying system
By coordinating the control unit and solenoid valve of the spray system, the spray parameters are adjusted according to the thickness of the copper surface, which solves the etching quality problem caused by uneven copper surface thickness and achieves high-precision and stable etching effect.
Patent Information
- Application Number
- CN202423261592.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2034-12-28
AI Technical Summary
Existing etching technology cannot perform differentiated spraying according to different copper thicknesses, resulting in insufficient or excessive etching in areas with uneven copper thickness, which affects circuit quality and yield.
The control unit and solenoid valve in the spray system work together to precisely control the opening and closing status and spraying time of each spray head. The spraying parameters are adjusted according to the copper thickness to ensure that areas with thick copper are fully etched and areas with thin copper have reduced spraying time.
It improves etching accuracy, reduces burrs and interconnection issues, ensures product quality consistency and stability, and meets high-precision processing requirements.
Smart Images

Figure CN223915665U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board manufacturing, and more specifically to a spray system. Background Technology
[0002] In the etching process of electronic circuit boards, the uniformity of the copper surface has a crucial impact on the etching effect. However, current etching technology has a significant drawback: it cannot perform differentiated etching based on varying copper thicknesses. Because fixed parameters are often used during etching, areas with thicker copper are prone to burrs due to insufficient etching time, severely affecting circuit quality and subsequent safety. Conversely, thinner copper areas may experience interconnection problems due to over-etching, significantly reducing the yield rate of the circuit board. This instability in etching quality caused by the inability to precisely control etching time to match variations in copper thickness has become a key technical obstacle restricting the further development of circuit board manufacturing technology, urgently requiring an innovative solution to improve this situation. Utility Model Content
[0003] In view of the above, it is necessary to propose a spraying system to solve the above technical problems.
[0004] A spraying system includes: a feeding assembly, a spraying assembly, and a control unit. The feeding assembly and the spraying assembly are arranged at intervals relative to each other. The control unit is electrically connected to the spraying assembly. The feeding assembly is used to drive the workpiece to be processed through the bottom of the spraying assembly. The spraying assembly is used to spray chemical solution onto the workpiece. The spraying assembly includes multiple spray heads arranged side by side. Each spray head is equipped with a solenoid valve. The control unit is electrically connected to the solenoid valve of each spray head to control the opening or closing of each spray head.
[0005] In some possible implementations, the spray head further includes a main body, a liquid inlet, and a nozzle. The main body is provided with a first flow channel, one end of which is connected to the liquid inlet and the other end of which is connected to the nozzle. The solenoid valve is located in the main body, and the valve core of the solenoid valve is movably inserted through the first flow channel to block the flow of medicine through the first flow channel.
[0006] In some possible implementations, the spray head further includes an air inlet, and the main body is also provided with a second flow channel. One end of the second flow channel is connected to the air inlet, and the other end is connected to the nozzle. The air inlet and the liquid inlet are staggered. The valve core of the solenoid valve can be movably inserted through the second flow channel to block the gas flowing through the second flow channel.
[0007] In some possible implementations, the nozzle is detachably connected to one end of the main body, the nozzle having a cavity and an outlet communicating with the cavity, the cavity communicating with the first flow channel and the second flow channel.
[0008] In some possible implementations, the end of the first flow channel away from the liquid inlet is connected to the end of the second flow channel away from the air inlet.
[0009] In some possible implementations, the main body also includes a plurality of anti-reverse units connected in sequence. Each anti-reverse unit includes a main channel and a branch channel connected to the main channel. One end of the branch channel branches off from the main channel and the other end returns to the main channel.
[0010] In some possible implementations, the solenoid valve further includes a housing, coil groups, a fixed iron core, a moving iron core, and an elastic element. The housing defines an installation space, the coil groups are spaced apart in the installation space, the fixed iron core is disposed between two adjacent coil groups, the moving iron core is movably disposed between two adjacent coil groups, the two ends of the elastic element are respectively connected to the fixed iron core and the moving iron core, and one end of the valve core is connected to the end of the moving iron core away from the elastic element.
[0011] In some possible implementations, the feeding assembly includes a drive unit and a plurality of roller groups arranged side by side, the drive unit being drive-connected to the roller groups, each roller group including two rollers spaced apart for clamping the workpiece.
[0012] In some possible implementations, the drive element is electrically connected to the control unit, which stores a preset speed value, and the drive element adjusts the rotation speed of the roller assembly according to the preset speed value.
[0013] In some possible implementations, the spray system further includes a position sensor electrically connected to the control unit. The position sensor is used to feed back the position information of the workpiece to the control unit. The control unit receives the position information and controls the opening or closing of the spray head based on the position information.
[0014] The spray system provided in this application, by connecting the control unit to the solenoid valve of each spray head, can precisely control the opening and closing status and spraying duration of a single spray head according to the processing requirements of different parts of the workpiece, such as different copper thickness areas of an electronic circuit board. For areas with thicker copper, the working time of the corresponding spray head can be extended to ensure sufficient etching and effectively avoid burr formation; while for areas with thinner copper, the spraying time can be reduced in a timely manner to prevent wiring problems, thereby greatly improving etching accuracy, ensuring the consistency and stability of product quality, and meeting the process requirements of high-precision machining. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of a spray head provided in one embodiment of this application.
[0016] Figure 2 for Figure 1 The diagram shows a partial exploded view of the spray head.
[0017] Figure 3 for Figure 1 The spray head shown is a cross-sectional view along line III-III.
[0018] Figure 4 This is a schematic diagram of a spray system provided in an embodiment of this application.
[0019] Figure 5 for Figure 4 The diagram shows the connection relationships between the control unit, drive components, and solenoid valves of the sprinkler system.
[0020] Explanation of main component symbols
[0021] Sprinkler system 100
[0022] Circuit board 200
[0023] Feeding assembly 10
[0024] Spray assembly 20
[0025] Control Unit 30
[0026] Spray head 21
[0027] Solenoid valve 22
[0028] Valve core 221
[0029] Casing 222
[0030] Coil group 223
[0031] Stator core 224
[0032] 225 moving iron core
[0033] Elastic element 226
[0034] Main body 23
[0035] First flow channel 231
[0036] Second flow channel 232
[0037] Anti-reverse unit 233
[0038] Main Channel 233a
[0039] Diversion channel 233b
[0040] Inlet 24
[0041] Nozzle 25
[0042] Cavity 251
[0043] 252 nozzles
[0044] Air intake 211
[0045] Drive component 11
[0046] Roller group 12
[0047] Roller 121
[0048] Position sensor 40. Detailed Implementation
[0049] The embodiments of this application are described in detail below. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application; it should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; where there is no conflict, the implementation methods and features of the implementation methods of this application can be combined with each other; many specific details are set forth in the following description to provide a full understanding of this application, and the described implementation methods are only a part of the implementation methods of this application, and not all of the implementation methods.
[0050] Please see Figure 1 , Figure 4 as well as Figure 5This application provides a spraying system 100 for spraying chemicals onto a circuit board 200. The spraying system 100 includes a feeding assembly 10, a spraying assembly 20, and a control unit 30. The feeding assembly 10 and the spraying assembly 20 are spaced apart. The control unit 30 is electrically connected to the spraying assembly 20. The feeding assembly 10 carries the circuit board 200 to be processed as it passes under the spraying assembly 20. The spraying assembly 20 sprays chemicals onto the circuit board 200. The spraying assembly 20 includes multiple spray heads 21 arranged side-by-side. Each spray head 21 is equipped with a solenoid valve 22. The control unit 30 is electrically connected to the solenoid valve 22 of each spray head 21 to control the opening or closing of each spray head 21.
[0051] Specifically, in the circuit etching process of circuit board 200, copper surface uniformity is one of the key factors affecting etching quality. Traditional etching spray systems 100 struggle to perform targeted spraying operations based on different copper thickness areas. This spray system 100, through the coordinated action of control unit 30 and solenoid valve 22, can precisely control the opening and closing state of individual spray heads 21 based on pre-set or real-time detected copper thickness information. For example, when circuit board 200 passes through the spraying area, if a region with a large copper thickness is detected, control unit 30 can instruct the corresponding spray head 21 to extend its opening time to ensure sufficient etching solution and effectively reduce burr formation; conversely, for regions with a smaller copper thickness, the opening time of spray head 21 is shortened to prevent wiring problems. Simultaneously, the parallel arrangement of multiple spray heads 21 enables comprehensive spraying of circuit board 200, ensuring spray uniformity.
[0052] In addition, the spray system 100 can also be applied to other surface treatment processes, such as metal surface cleaning and pretreatment before coating. Through the flexible control strategy of the spray head 21, it can meet the diverse needs of different processes for workpiece surface treatment, improve the accuracy and efficiency of process processing, reduce the scrap rate of workpieces caused by uneven or inaccurate spraying, reduce production costs and improve product quality.
[0053] Please see Figure 1 , Figure 2 as well as Figure 3In this embodiment, the spray head 21 also includes a main body 23, an inlet 24, and a nozzle 25. The main body 23 is provided with a first flow channel 231, one end of which is connected to the inlet 24, and the other end is connected to the nozzle 25. A solenoid valve 22 is provided in the main body 23, and the valve core 221 of the solenoid valve 22 is movably inserted through the first flow channel 231 to block the flow of chemicals through the first flow channel 231. Through this precise solenoid valve 22 control mechanism, the spray volume and spray timing of chemicals can be accurately controlled according to different process requirements and the condition of the circuit board 200. For example, for areas with large differences in copper thickness in the circuit board 200, the flow rate of chemicals in the corresponding spray head 21 can be adjusted instantly to reduce etching defects caused by too much or too little chemicals and improve the accuracy and stability of the etching process.
[0054] In this embodiment, the spray head 21 also includes an air inlet 211. The main body 23 is also provided with a second flow channel 232. One end of the second flow channel 232 is connected to the air inlet 211, and the other end is connected to the nozzle 25. The air inlet 211 and the liquid inlet 24 are staggered. The valve core 221 of the solenoid valve 22 is movably inserted through the second flow channel 232 to block the gas flowing through the second flow channel 232. Through the dual-channel design combined with the flexible control of the solenoid valve 22, the gas and liquid can be independently regulated. In actual operation, the gas can enter the cavity 251 of the nozzle 25 through the second flow channel 232 and mix with the liquid entering from the first flow channel 231 to form a two-fluid spray effect. The introduction of gas can not only enhance the spray pressure and coverage of the liquid, but also agitate the liquid to a certain extent, so that its components act more evenly on the surface of the circuit board 200. In addition, the precise blocking function of the solenoid valve 22 for the gas flow channel further expands the operability of the spray system 100. For example, in certain special process steps, the gas supply can be stopped separately while only the chemical spraying is maintained, or the gas-liquid ratio can be dynamically adjusted according to the changes in the surface characteristics of the circuit board 200, thereby achieving a high degree of adaptability to various circuit boards 200 and complex processes. This greatly improves the application efficiency and process flexibility of the spray system 100 in different industrial scenarios, and effectively reduces the product quality risks and increased production costs caused by the limitations of the spray system 100.
[0055] In this embodiment, the nozzle 25 is detachably connected to one end of the main body 23. The nozzle 25 has a cavity 251 and an outlet 252 communicating with the cavity 251. The cavity 251 communicates with the first flow channel 231 and the second flow channel 232. The cross-sectional width of the cavity 251 is greater than the cross-sectional width of the first flow channel 231 or the cross-sectional width of the second flow channel 232. The cavity 251 is used to pressurize the liquid with gas, providing a stable buffer space for the gas, thereby enabling the gas to pressurize the liquid more uniformly and efficiently. When the liquid is squeezed by the gas in the cavity 251, its pressure rises rapidly and forms a high-speed jet at the outlet 252, thereby enhancing the impact and coverage of the spray. This allows the chemical solution to be sprayed more effectively onto the fine details of the surface of the circuit board 200 to be processed, ensuring precise and sufficient chemical solution spraying even in processes such as electronic circuit board etching, even when facing complex circuit structures and areas with different copper thicknesses. Meanwhile, the detachable design of the nozzle 25 makes it easy to replace nozzles 25 of different specifications and shapes according to different process requirements. For example, for fine line etching, a nozzle 25 with a narrower spray outlet 252 can be replaced to achieve high-precision spraying, or in large-area cleaning processes, a nozzle 25 with a large-diameter spray outlet 252 can be replaced to improve work efficiency, further enhancing the adaptability and flexibility of the entire spray system 100 and meeting diverse industrial production requirements.
[0056] In this embodiment, the end of the first flow channel 231 furthest from the liquid inlet 24 is connected to the end of the second flow channel 232 furthest from the air inlet 211. This allows the gas and the etching solution to mix and interact fully in the area near the nozzle 25, forming a more stable and efficient two-fluid mixture. During mixing, the gas strongly agitates and pressurizes the etching solution, causing it to be ejected from the nozzle outlet 252 at a higher speed and with a more uniform dispersion. This ensures that the etching solution acts on the circuit board surface with appropriate impact force and coverage in areas with varying copper thicknesses, accurately removing excess copper layers and reducing defects such as burrs or interconnections. Simultaneously, because the gas and liquid mix in the area near the nozzle 25, the flow rate and on / off state of the gas and liquid can be independently and precisely controlled via the solenoid valve 22, further improving the flexibility and response speed of the entire spray system 100 in adjusting process parameters, thereby meeting diverse production needs and improving the consistency and stability of product quality.
[0057] In this embodiment, the main body 23 further includes a plurality of sequentially connected anti-reverse units 233. Each anti-reverse unit 233 includes a main channel 233a and a branch channel 233b connecting to the main channel 233a. The main channel 233a is streamlined, and the branch channel 233b is approximately teardrop-shaped. The branch channel 233b branches off from the main channel 233a and then returns to the main channel 233a. The plurality of anti-reverse units 233 are disposed in the second flow channel 232 to prevent gas from returning from the cavity 251 to the air inlet 211. Specifically:
[0058] When the gas flows from the inlet 211 towards the nozzle 25, i.e., during forward flow, the gas can advance at a relatively high speed within the main channel 233a. Upon encountering the branch channel 233b, due to the streamlined design of the main channel 233a, coupled with airflow inertia and local pressure differences, some gas can easily escape into the branch channel 233b. The gas entering the branch channel 233b forms a relatively stable flow state, without significant eddies or obstruction. Subsequently, this portion of gas smoothly flows back from the side channel to the downstream region of the main channel 233a and continues to advance towards the nozzle 25. Throughout the forward flow process, the local pressure drop within the channel is relatively small, and energy loss is limited. Therefore, the gas passes through smoothly with low resistance, demonstrating excellent forward flow performance.
[0059] However, when the gas attempts to flow in the reverse direction from nozzle 25 towards inlet 211, that is, when the gas flows in reverse, it is affected by the curved surface and arc structure of the channel as it enters the diversion channel 233b, resulting in numerous vortices and turbulent regions inside. In these regions, the gas flow path is complex and tortuous, energy is continuously lost, leading to a rapid decrease in local pressure. At the same time, the connection between the main channel 233a and the diversion channel 233b provides extremely unfavorable flow conditions for the reverse fluid, forcing the gas to be repeatedly affected by velocity gradients and pressure differences in a tortuous and narrow path. Moreover, the diversion channels 233b of multiple sequentially connected check valve units 233 are connected, further amplifying the resistance of the reverse airflow. In other words, the reverse-flowing gas encounters enhanced energy loss and disturbance in each check valve unit 233. After multiple superpositions, the overall pressure drop of the reverse flow increases significantly, making it almost impossible for the gas to flow backward through the main channel 233a and return to inlet 211.
[0060] In this embodiment, the solenoid valve 22 further includes a housing 222, coil groups 223, a fixed iron core 224, a moving iron core 225, and an elastic element 226. The housing 222 defines an installation space, the coil groups 223 are spaced apart in the installation space, the fixed iron core 224 is disposed between two adjacent coil groups 223, and the moving iron core 225 is movably disposed between two adjacent coil groups 223. The two ends of the elastic element 226 are respectively connected to the fixed iron core 224 and the moving iron core 225. One end of the valve core 221 is connected to the end of the moving iron core 225 away from the elastic element 226. The valve core 221 movably passes through a first flow channel 231 and a second flow channel 232. The elastic element 226 includes a spring.
[0061] In practical use, when the control unit 30 inputs current to the coil group 223 of the solenoid valve 22, a magnetic field is generated around the coil group 223. According to the principle of electromagnetic induction, the moving iron core 225 will be displaced under the action of the magnetic field force, overcoming the elastic force of the elastic element 226. For example, when it is necessary to open the spray head 21 for chemical spraying, the control unit 30 energizes a specific coil group 223, and the moving iron core 225 drives the valve core 221 to move, so that the first flow channel 231 is unobstructed, and the chemical can flow smoothly from the liquid inlet 24 through the first flow channel 231 to the nozzle 25 and be sprayed out. At the same time, if it is necessary to introduce gas to assist the two-fluid spraying, the energization of another set of related coil groups 223 can be controlled to make the moving iron core 225 move a suitable distance again, ensuring that the second flow channel 232 can also be opened as needed, so that the gas enters the nozzle 25 from the air inlet 211 through the second flow channel 232 and mixes with the chemical. When it is necessary to stop spraying or switch spraying modes, the control unit 30 stops supplying power to the corresponding coil group 223, and the elastic force of the elastic element 226 pulls the moving iron core 225 back to the initial position. The valve core 221 then moves to block the first flow channel 231 and / or the second flow channel 232, thereby achieving precise control of the medicine and gas.
[0062] Please see Figure 4 and Figure 5In this embodiment, the feeding assembly 10 includes a drive unit 11 and multiple roller groups 12 arranged side by side. The drive unit 11 is connected to the roller groups 12. Each roller group 12 includes two rollers spaced apart, with the circuit board 200 disposed between the two rollers 121. The two rollers 121 are used to push the circuit board 200 from opposite sides, causing the circuit board 200 to move in one direction. The drive unit 11 includes a stepper motor, a reducer connected to the output shaft of the stepper motor, a transmission chain connecting the reducer and the roller group 12, and a tensioning wheel assembly. The stepper motor, as a power source, can precisely control the rotation angle and speed according to the instructions of the control unit 30. The high-speed rotation of the stepper motor's output shaft is reduced and torque-increased by the reducer, making the output power more suitable for driving the roller group 12 to operate stably. The transmission chain transmits the power output by the reducer to each roller group 12, ensuring that the multiple roller groups 12 can operate synchronously and in coordination, achieving smooth and precise delivery of the circuit board 200. The tensioner assembly is used to adjust the tension of the drive chain, ensuring that the drive chain maintains appropriate tension during long-term operation and reducing phenomena such as tooth skipping and slippage caused by chain slack.
[0063] Furthermore, the drive unit 11 is electrically connected to the control unit 30. The control unit 30 stores preset values for the movement speed of the circuit board 200 corresponding to different copper thickness areas, as well as a control algorithm program that works in conjunction with the solenoid valve 22. This allows for control of the movement speed of the circuit board 200, ensuring that its movement speed in the spray area is precisely matched to the spraying operation of the spray head 21. Specifically, if a certain area of the circuit board 200 has a large copper thickness, the control unit 30 can instruct the drive unit 11 to slow down the movement speed of the circuit board 200. This extends the time the circuit board 200 receives spray etching as it passes under the spray head 21, ensuring that the copper layer in the thicker area is fully etched and effectively reducing defects such as burrs caused by insufficient etching. Conversely, for areas with thinner copper, the control unit 30 can instruct the drive unit 11 to accelerate the movement speed of the circuit board 200, reducing its dwell time in the spray area and preventing wiring problems due to over-etching. This ensures a precise and uniform etching effect across the entire surface of the circuit board 200.
[0064] In this embodiment, the spray system 100 also includes a position sensor 40. The position sensor 40 is electrically connected to the control unit 30. The position sensor 40 is used to provide feedback on the position information of the circuit board 200. The control unit 30 receives the position information and precisely controls the working state of the spray head 21 based on this information. For example, when the circuit board 200 is fed under the spray head 21 by the roller assembly 12, the position sensor 40 immediately detects the arrival signal of the circuit board 200 and transmits it to the control unit 30. The control unit 30 opens the solenoid valve 22 of the spray head 21 according to the preset program instruction, so that the chemical can be sprayed from the spray head 21 according to the predetermined parameters, thereby ensuring that the circuit board 200 is accurately and timely processed the moment it enters the spray area. When the circuit board 200 is fed out of the spray head 21 by the roller assembly 12, the position sensor 40 again captures the departure signal of the circuit board 200. The control unit 30 then controls the spray head 21 to close the solenoid valve 22, stopping the spraying of the chemical, avoiding waste of chemical and unnecessary spraying of non-processing areas. Specifically, the position sensor 40 includes one of the following: a linear variable differential transformer (LVDT), a rotary encoder, a potentiometer (POT), an ultrasonic sensor, or a Hall effect sensor.
[0065] In this embodiment, the control unit 30 includes one of the following: Programmable Logic Controller (PLC), Industrial Personal Computer (IPC), Single-Chip Microcomputer (SCM), Microcontroller (MCU), and Digital Signal Processor (DSP).
[0066] An embodiment of this application also provides a method of using a sprinkler system 100, specifically including the following steps:
[0067] S1: Input the dimensions of the circuit board 200 into the control unit 30. During the input process, accurately measure the length and width of the circuit board 200, use a high-precision measuring instrument to ensure the accuracy of the dimensional data, and then divide them by the number of nozzles 25 arranged in the horizontal and vertical directions, respectively.
[0068] Specifically, during the calculation process, considering the possible edge overlap or gaps in the spray coverage of the nozzle 25, the calculation results are appropriately corrected and compensated, so that the control unit 30 can more accurately define the area of the circuit board 200 affected by each nozzle 25, laying the foundation for subsequent precise spray control.
[0069] S2: When the circuit board 200 first enters below the spray assembly 20, all the spray heads 21 open simultaneously. At this time, the spray system 100 performs the chemical spraying operation according to the preset initial parameters.
[0070] Specifically, before starting the spraying process, the concentration, temperature, and pressure of the etching solution are tested and calibrated to ensure they are within the optimal etching range. During the etching process on the circuit board 200, the rate and status of the etching reaction are monitored in real time using equipment. For example, the degree of etching is indirectly judged by detecting changes in the composition and content of gases generated during the etching process. After etching is completed, the multiple lines formed on the circuit board 200 are meticulously inspected using professional high-precision testing equipment, such as optical microscopes and electron microscopes, to identify the locations where the line width is unqualified. This location information is accurately recorded into the control unit 30. The recorded information will serve as a key basis for subsequent adjustments to the spraying strategy, and the various process parameters during this etching process will be recorded as reference data for subsequent process optimization.
[0071] S3: When the circuit board 200 enters the area below the spray assembly 20 for the second time, the control unit 30 begins to perform its intelligent control function. Based on the etching tank line speed and the position information of the circuit board 200 fed back by the sensor, the control unit 30 precisely controls the solenoid valve 22 of the spray head 21 corresponding to the position where the line width of the circuit board 200 is unqualified.
[0072] Specifically, when controlling the solenoid valve 22, a closed-loop control algorithm is used to adjust the opening degree and opening-closing time interval of the solenoid valve 22 in real time according to the linewidth deviation, so as to achieve more precise etching amount control. For example, if the linewidth of a certain area is too wide, it means that the etching in that area is insufficient. The control unit 30 will instruct the solenoid valve 22 of the corresponding spray head 21 to extend the opening time or increase the chemical flow rate. At the same time, it will further optimize and adjust the parameters according to the copper thickness of that area (which can be measured in advance or estimated through empirical data) so that the area receives more suitable etching. Conversely, if the linewidth is too narrow, it means that the etching is excessive. The control unit 30 will control the solenoid valve 22 to reduce the opening time or reduce the chemical flow rate, and take into account the influence of surrounding lines to reduce the risk of new problems caused by excessive adjustment to adjacent lines.
[0073] During the spraying process, the etching effect is continuously monitored. If the adjusted spraying strategy fails to effectively improve the linewidth issue, the cause is further analyzed, such as changes in the chemical composition or clogging of nozzle 25. Corresponding measures are then taken promptly, such as replenishing the chemical composition or cleaning nozzle 25. Through this dynamic and precise control method, the goal of ensuring consistent linewidth across the entire circuit board 200 is achieved, guaranteeing that the etching quality of the circuit board 200 meets high standards and improving product yield and performance stability.
[0074] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.
Claims
1. A sprinkler system characterized by, The application relates to a spraying system for a workpiece, which comprises a feeding assembly, a spraying assembly and a control unit. The spraying head further comprises a main body, an inlet and a nozzle, the main body is provided with a first flow channel, one end of the first flow channel is communicated with the inlet, the other end of the first flow channel is communicated with the nozzle, the electromagnetic valve is arranged on the main body, and a valve core of the electromagnetic valve is movably arranged on the first flow channel so as to block the medicine water flowing through the first flow channel.
2. The sprinkler system of claim 1, wherein The spraying head further comprises an air inlet, the main body is further provided with a second flow channel, one end of the second flow channel is connected with the air inlet, the other end of the second flow channel is communicated with the nozzle, the air inlet and the inlet are arranged in a staggered mode, and the valve core of the electromagnetic valve is movably arranged on the second flow channel so as to block the gas flowing through the second flow channel.
3. The sprinkler system of claim 2, wherein The nozzle is detachably connected with one end of the main body, the nozzle is provided with a cavity and a nozzle outlet communicated with the cavity, and the cavity is communicated with the first flow channel and the second flow channel.
4. The sprinkler system of claim 3, wherein One end of the first flow channel away from the inlet is communicated with one end of the second flow channel away from the air inlet.
5. The sprinkler system of claim 3, wherein The main body further comprises a plurality of sequentially connected check units, each check unit comprises a main channel and a branch channel communicated with the main channel, one end of the branch channel is branched from the main channel, and the other end of the branch channel returns to the main channel.
6. The sprinkler system of claim 3, wherein The electromagnetic valve further comprises a shell, a coil group, a fixed iron core, a movable iron core and an elastic member, the shell defines an installation space, the coil group is arranged between two adjacent fixed iron cores, the movable iron core is movably arranged between two adjacent coil groups, the elastic member is connected with the fixed iron core and the movable iron core, and one end of the valve core is connected with one end of the movable iron core away from the elastic member.
7. The sprinkler system of claim 3 wherein, The feeding assembly comprises a driving member and a plurality of roller groups arranged in parallel, the driving member is drivingly connected with the roller groups, each roller group comprises two rollers arranged in parallel, and the two rollers arranged in parallel are used for clamping the workpiece.
8. The sprinkler system of claim 1, wherein, The driving member is electrically connected with the control unit, the control unit stores a speed preset value, and the driving member adjusts the rotating speed of the roller groups according to the speed preset value.
9. The sprinkler system of claim 8, wherein, The spraying system further comprises a position sensor, the position sensor is electrically connected with the control unit, the position sensor is used for feeding position information of the workpiece to the control unit, the control unit receives the position information, and the opening and closing of the spraying head are controlled according to the position information.
10. The sprinkler system of claim 1, wherein