Glue spraying equipment and glue spraying system

Abstract

The utility model provides a glue spraying device and a glue spraying system, and the glue spraying device comprises a first supply device which is used for providing a first photoresist; the first supply device is used for supplying first photoresist, the second supply device is used for supplying second photoresist, the first supply device and the second supply device supply photoresist independently, and the supply amount of the second photoresist is smaller than that of the first photoresist; the processor is electrically connected with the first supply device and the second supply device respectively and is used for switching the working states of the first supply device and the second supply device so as to provide the first photoresist and the second photoresist in a time-sharing manner; wherein the first supply device and the second supply device are connected through a connecting part. By adopting the technical scheme, the verification cost of the photoresist can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a glue spraying device and glue spraying system. Background Technology

[0002] In the photolithography process of semiconductors, photoresist needs to be applied to the surface of the wafer to transfer the pattern on the mask onto the wafer.

[0003] In some applications, there are photoresists that have not been used for a long time or are of new types, thus requiring verification to ensure they meet process requirements. However, the verification process involves a large quantity of photoresist, increasing verification costs.

[0004] Against this backdrop, how to provide technical solutions to reduce verification costs has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, the present invention provides a glue spraying device and glue spraying system, which can reduce verification costs.

[0006] This utility model provides a photoresist spraying device, comprising: a first supply device for providing a first photoresist; a second supply device for providing a second photoresist, wherein the first supply device and the second supply device supply photoresist independently, and the amount of the second photoresist supplied is less than the amount of the first photoresist supplied; and a processor electrically connected to the first supply device and the second supply device respectively, for switching the operating states of the first supply device and the second supply device to provide the first photoresist and the second photoresist in a time-sharing manner; wherein the first supply device and the second supply device are connected by a connecting component.

[0007] Optionally, the first supply device includes: a liquid supply assembly electrically connected to the processor, the liquid supply assembly being used to supply the first photoresist; a transmission pipe, the first end of the transmission pipe being connected to the liquid supply assembly, being used to provide a transmission path for the first photoresist to flow; and a nozzle assembly connected to the second end of the transmission pipe, being used to spray the first photoresist.

[0008] Optionally, the second end of the transmission pipe has multiple branch pipes, the nozzle assembly has multiple nozzles, one branch pipe corresponds to one nozzle, and each branch pipe is independent of the others.

[0009] Optionally, the second supply device includes a pipette, in which the second photoresist is contained.

[0010] Optionally, the connecting component includes: a snap-fit ​​portion for detachable connection with the first supply device; and a fixing portion having a channel for the second supply device to pass through, the fixing portion being used to adjust the position of the second supply device within the channel; wherein the snap-fit ​​portion and the fixing portion are connected by a connector.

[0011] Optionally, the adhesive spraying equipment satisfies one or more of the following:

[0012] The snap-fit ​​part has a through hole, and the first supply device has a threaded hole. The snap-fit ​​part is detachably connected to the first supply device through the through hole and a threaded part that is adapted to the threaded hole.

[0013] The first supply device is provided with a clamping part, and the snap-fit ​​part is detachably connected to the first supply device through the clamping part.

[0014] Optionally, the inner wall of the channel is provided with an internal thread, and the second supply device is provided with an external thread. The position of the second supply device relative to the first supply device can be adjusted by screwing it in or out.

[0015] This utility model also provides a glue spraying system, including: a process chamber; a glue spraying device disposed in the process chamber, the glue spraying device including the glue spraying device as described in any of the foregoing embodiments; and a stage, the stage being disposed in the process chamber and located below the glue spraying device, for supporting wafers.

[0016] Optionally, the stage includes: a support portion for supporting the wafer; and a rotating assembly connected to the bottom of the support portion, the rotating assembly being used to drive the support portion to rotate, wherein the axis of rotation of the support portion is perpendicular to the surface of the support portion.

[0017] Optionally, the carrier portion has a carrier surface, the carrier surface has adsorption through holes, and an adsorption component disposed through the adsorption through holes to adsorb the wafer during the wafer's movement.

[0018] In the adhesive spraying equipment provided by this utility model, the first supply device and the second supply device are independent of each other, so the first supply device and the second supply device can be selected in time to provide the first photoresist and the second photoresist. This will not occupy the first supply device, that is, it will not occupy the production line. Furthermore, the amount of photoresist supplied by the second supply device is less than the amount supplied by the first supply device. The verification process can be achieved with a smaller amount of photoresist, thus reducing the verification cost. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This diagram shows a structural schematic of a glue spraying device according to an embodiment of the present invention;

[0021] Figure 2 A top view of a connecting component according to an embodiment of the present invention is shown;

[0022] Figure 3 A schematic diagram of a spray adhesive system according to an embodiment of the present invention is shown. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] As described in the background art, a large amount of photoresist is used in the process of verifying whether the photoresist meets the process requirements. This is because: currently, when the photoresist spraying equipment is idle, the photoresist that has not been used for a long time or is a new type of photoresist is sprayed onto the surface of the wafer according to the normal photoresist test procedure.

[0025] However, the spraying equipment has long pipelines and a large internal capacity, requiring a large amount of photoresist (e.g., at least 7.5L of photoresist) to wet the pipelines and remove air bubbles, which increases the amount of photoresist used.

[0026] Furthermore, there is a possibility that it may occupy production lines, which could affect production capacity.

[0027] For example, in some application scenarios, if the adhesive spraying equipment is in the process of verifying the performance of the photoresist when urgent processing is required, it will delay the normal processing procedure.

[0028] To address the aforementioned issues, this invention provides a photoresist spraying device that, on the one hand, does not occupy the production line; and on the other hand, reduces the amount of photoresist used. These two aspects combined reduce the verification cost of photoresist.

[0029] In some embodiments, the first supply device and the second supply device in the adhesive spraying equipment provided by this utility model are independent of each other, so the first supply device and the second supply device can be selected in a time-sharing manner to provide the first photoresist and the second photoresist. This will not occupy the first supply device, that is, it will not occupy the production line. Furthermore, the amount of photoresist supplied by the second supply device is less than the amount supplied by the first supply device. The verification process can be achieved using a smaller amount of photoresist, thereby reducing the verification cost.

[0030] In addition, the adhesive spraying equipment provided by the utility model has a simple structure, is easy to implement, and can be easily adjusted according to actual application scenarios, making it highly versatile.

[0031] To enable those skilled in the art to more clearly understand and implement the concepts, implementation schemes, and advantages of this specification, the following description, with reference to the accompanying drawings, provides examples of the above content.

[0032] See Figure 1 The diagram shown is a structural schematic of a glue spraying device according to one embodiment of the present invention. Figure 1 As shown, the adhesive spraying equipment includes:

[0033] A first supply device (not shown in the figure) is used to supply a first photoresist.

[0034] In some embodiments, the first supply device refers to a type of supply device that can be used to spray a first photoresist that has been verified for performance onto the wafer surface in accordance with a predetermined scheme.

[0035] In some embodiments, a first supply device corresponds to a type of first photoresist. When the required first photoresist is determined, the corresponding first supply device is turned on.

[0036] In some other embodiments, the first supply device may have multiple supply containers, one of which stores a type of first photoresist.

[0037] In some other embodiments, the first photoresist may also be an unverified photoresist.

[0038] The second supply device 120 is used to provide the second photoresist, and the first supply device and the second supply device 120 supply the photoresist independently.

[0039] In some embodiments, the second supply device 120 refers to a type of supply device that can be used to spray photoresist to be verified onto the wafer surface according to a predetermined scheme, and the second supply device 120 is different from the first supply device.

[0040] The differences are as follows: First, the structures of the first supply device and the second supply device 120 are different; second, the connection relationships between the first supply device and the second supply device 120 and other equipment or circuits are different; third, the photoresists sprayed are different (for example, the first photoresist and the second photoresist are different). For example, the first photoresist sprayed by the first supply device has been verified, while the second photoresist sprayed by the second supply device 120 has not been verified.

[0041] In some embodiments, the amount of photoresist supplied by the second supply device 120 is less than that supplied by the first supply device. Thus, when verifying the performance of the second photoresist, only a small amount of the second photoresist is needed to complete the verification process.

[0042] In some embodiments, the first supply device and the second supply device 120 are independent of each other, so the first supply device and the second supply device can be selected in a time-sharing manner to provide the first photoresist and the second photoresist, which does not occupy the first supply device, that is, it does not occupy the production line.

[0043] The processor is electrically connected to the first supply device and the second supply device 120 respectively, and switches the working state of the first supply device and the second supply device 120 to provide the first photoresist and the second photoresist in a time-sharing manner.

[0044] In some embodiments, the processor can send a trigger signal to the second supply device 120 when it is determined that the first supply device is not in operation and a verification process is required. The second supply device 120 can spray a second photoresist onto the surface of the wafer to perform the verification process.

[0045] In other words, the second supply device 120 performs the verification process for the second photoresist only when the current production environment is not occupied. When the first supply device is used to perform the normal photolithography process, the second supply device 120 is prohibited from operating.

[0046] In some embodiments, the processor may include, but is not limited to, hardware circuits implemented with application-specific integrated circuits (ASICs), programmable logic devices (PLDs), microcontroller units (MCUs), microprocessor units (MPUs), digital signal processors (DSPs), or central processing units (CPUs). For example, hardware circuits implemented with PLDs may include field-programmable gate arrays (FPGAs).

[0047] When multiple processors are included, the types of processors can be the same or different. For example, processors can include MCUs and FPGAs. Processors can include MCUs, FPGAs, and CPUs. Processors can include MCUs, DSPs, and FPGAs. Or, processors can include CPUs and FPGAs, and so on. When a processor includes multiple processors, these processors can be configured separately, partially integrated, or fully integrated. For example, processors can be implemented as a system-on-chip (SOC) or an ASIC.

[0048] It should be noted that the processor can use general-purpose computer equipment to communicate and perform data operations with the first and second supply devices. This embodiment of the invention does not involve any improvement to the specific operating method of the computing device. The process of acquiring and comparing data using the computing device can be implemented using existing or conventional techniques in the field.

[0049] In short, through the coordinated operation of the processor, the first supply device, and the second supply device, the verification process of photoresist performance can be completed while meeting the processing requirements of the production line, and the amount of photoresist used can be reduced.

[0050] In some embodiments, the first supply device and the second supply device 120 are connected by a connecting component.

[0051] In other words, by connecting the first supply device and the second supply device 120, the second supply device 120 and the first supply device are located in the same process chamber, and thus the test and verification environment in which the second supply device 120 is located is consistent with the actual processing and production environment, and the collected verification data is more accurate.

[0052] In some embodiments, the first supply device includes: a liquid supply assembly 112 electrically connected to the processor, the liquid supply assembly 112 being used to supply the first photoresist; a transmission conduit 114, the first end of the transmission conduit 114 being connected to the liquid supply assembly 112 and being used to provide a transmission path for the first photoresist to flow; and a nozzle assembly connected to the second end of the transmission conduit 114 and being used to spray the first photoresist.

[0053] In some embodiments, the liquid supply component 112 stores a first photoresist, which can be provided when a normal photolithography development process is required.

[0054] It should be pointed out that, Figure 1 The shape of the schematic liquid supply assembly 112 is merely an example and is only used to characterize a device for storing and providing the first photoresist, and should not be construed as a limitation of this application.

[0055] In some embodiments, there are multiple liquid supply components 112, and the types of first photoresist stored in the multiple liquid supply components 112 can be different, so that any one of the liquid supply components 112 can be selected to perform the photoresist supply operation based on actual needs.

[0056] In some embodiments, when there are multiple liquid supply components 112, the type of first photoresist stored in each liquid supply component can be distinguished by setting tag information.

[0057] In some embodiments, the transmission pipe 114 serves as a connection, extending the transmission path between the liquid supply component 112 and the main body, allowing the liquid supply component 112 and the main body to be in different spatial positions.

[0058] It should be pointed out that, Figure 1 The shape of the schematic transmission pipe 114 is merely an example and is only used to characterize the pipe that provides the transmission path, and should not be construed as a limitation of this application.

[0059] In some embodiments, the second end of the transmission conduit 114 may be connected to a nozzle assembly, which receives the first photoresist and can spray the first photoresist onto the wafer surface.

[0060] In some embodiments, the nozzle assembly may include a body portion 116 and a nozzle 118 that is connected through the body portion 116.

[0061] The main body 116 serves to distribute the transmission pipe 114, and the nozzle 118 is connected to the second end of the transmission pipe 114 for spraying the first photoresist.

[0062] In some embodiments, the second end of the transmission conduit 114 has a plurality of branch conduits (not shown), the nozzle assembly has a plurality of nozzles 118, one branch conduit corresponds to one nozzle, and each branch conduit is independent of the others.

[0063] Specifically, multiple branch pipes are respectively arranged in the internal space of the main body 116. When the first photoresist in the transmission pipe 114 reaches the connection between the transmission pipe 114 and each branch pipe, the first photoresist can be diverted by the multiple branch pipes. Since the branch pipes and nozzles 118 are in one-to-one correspondence, the first photoresist can be sprayed onto the wafer surface through the corresponding nozzles 118, so that each nozzle 118 sprays the first photoresist in its corresponding branch pipe onto the wafer surface.

[0064] In some embodiments, the branch pipes are not connected to each other and are isolated from each other. This allows the nozzle 118 to only acquire the first photoresist flowing in its corresponding branch pipe, thereby reducing the difference between the first photoresist at different locations on the wafer surface and improving the accuracy of the verification data.

[0065] In some embodiments, when the nozzle assembly has multiple nozzles 118, the orifice diameter of the nozzles 118 may be different, which can reduce the difference in the second photoresist sprayed by different nozzles 118 at the same time.

[0066] For example, the nozzle 118 located at the center of the main body 116 has the smallest aperture, while the apertures on both sides of the main body 116 gradually increase.

[0067] In some embodiments, only one nozzle may be provided, and this nozzle is connected to the second end of the transmission pipe 114.

[0068] It should be noted that this application only illustrates a part of the structure of the first supply device. For more details about the first supply device, please refer to the description in the existing solutions.

[0069] In some embodiments, the second supply device 120 may include a pipette in which the second photoresist is contained.

[0070] A pipette is an instrument used to precisely pick up and transfer liquids. With a pipette, the amount of second photoresist sprayed onto the wafer surface can be quantitatively controlled, reducing human error.

[0071] Furthermore, compared to the first supply device in this solution, the second supply device 120 has a simpler structure, further reducing implementation costs without occupying the production line.

[0072] In some embodiments, the pipette can be an electric pipette, which enables remote control of the pipette's operation, reduces the impact on the testing environment, makes the testing environment closer to the actual processing and production environment, and verifies the accuracy of the data.

[0073] In some embodiments, combined with Figure 1 See Figure 2 The diagram shows a top view of a connecting component in one embodiment of the present invention. The connecting component may include: a snap-fit ​​part 132, which is detachably connected to the first supply device; and a fixing part 134, which has a channel K for the second supply device 120 to pass through, and the fixing part 134 is used to adjust the position of the second supply device 120 relative to the first supply device; wherein, the snap-fit ​​part 132 and the fixing part 134 are connected by a connector 136.

[0074] In some embodiments, the snap-fit ​​part 132 is used to connect the connecting component as a whole to the first supply device, and the snap-fit ​​connection method enables quick disassembly and loading between the connecting component and the first supply device, reducing the verification time.

[0075] In some embodiments, the snap-fit ​​portion 132 has a through hole, and the first supply device has a threaded hole. The snap-fit ​​portion 132 is detachably connected to the first supply device through the through hole and a threaded part adapted to the threaded hole.

[0076] In other words, the through hole K is circular and fits into the threaded hole on the first supply device. During installation, a threaded component (e.g., a bolt that fits into the threaded hole) is inserted into the through hole, and then the threaded component is screwed into the threaded hole to achieve the connection between the first supply device and the connecting component, and the connection between the first supply device and the connecting component is more stable.

[0077] When it is necessary to disassemble the second supply unit, a different treatment method than that used for installing threaded parts is employed to unscrew the threaded parts from the threaded holes.

[0078] In some embodiments, the first supply device is provided with a clamping part (e.g., a gripper), and the snap-fit ​​part 132 is detachably connected to the first supply device through the clamping part.

[0079] In other words, the clamping part has a tightening and loosening function. By adjusting the state of the clamping part, the connection or disassembly between the first supply device and the connecting component can be achieved.

[0080] It should be noted that the above-described method of detachably connecting the snap-fit ​​part to the first supply device via the clamping part is merely illustrative and should not be construed as a limitation of this solution. In some other embodiments, other connection methods can also be used to achieve a detachable connection between the first supply device and the connecting component.

[0081] For example, the first supply device is provided with a magnetic component, and the snap-fit ​​part is detachably connected to the first supply device through the magnetic component.

[0082] In other words, both the first supply device and the snap-fit ​​part are made of metal, and the magnetic component can be attached to the first supply device. During installation, the snap-fit ​​part comes into contact with the magnetic component, and the snap-fit ​​part can be attracted to the magnetic component, thereby achieving the connection between the first supply device and the connecting component.

[0083] When it is necessary to disassemble the connecting parts, the snap-fit ​​part and the magnetic part can be separated by using the appropriate disassembly tools.

[0084] Furthermore, by adding magnetic components, there is no need to modify the first supply device, making the implementation simple.

[0085] In some embodiments, the magnetic component may be an electrically controlled magnetic component. By changing the energizing state of the electrically controlled magnetic component, the connection and disconnection between the first supply device and the connecting component can be achieved.

[0086] For example, when it is necessary to connect the first supply device and the connecting component, the electrically controlled magnetic component is made magnetic by connecting the path between the electrically controlled magnetic component and the power supply, so as to attract the connecting component. Alternatively, the connecting component can be detached by disconnecting the path between the electrically controlled magnetic component and the power supply.

[0087] In some embodiments, by making the magnetic element an electrically controlled magnetic element, the magnetic force of the electrically controlled magnetic element can be changed to more firmly connect the connecting components.

[0088] In some embodiments, the connection between the fixing part 134 and the snap-fit ​​part 132 can be fixedly connected by the connecting member 136.

[0089] In some embodiments, the connector 136 can be a plate or block structure of any shape, as long as it can achieve a fixed connection between the fixing part 134 and the snap-fit ​​part 132.

[0090] In some embodiments, the inner diameter of the channel K is adapted to the outer diameter of the second supply device, and the second supply device 120 can be inserted through the channel K. The second supply device 120 is installed through the provided channel K.

[0091] In some embodiments, the inner wall of the channel K is provided with an internal thread, and the second supply device 120 is provided with an external thread. The position of the second supply device relative to the first supply device can be adjusted by screwing in or out.

[0092] In other words, by using the internal and external threads, the position of the second supply device 120 within the channel K can be changed, thereby changing the relative distance between the nozzle of the second supply device 120 and the wafer surface, thus making it suitable for different application scenarios and improving the versatility of the second supply device 120.

[0093] In some embodiments, the position of the pipette can be adjusted up or down by about 40mm through the engagement of internal and external threads.

[0094] It should be noted that, in addition to using internal and external threaded connections, other methods can also be used to change the position of the second supply device 120 within the channel K.

[0095] The above examples describe multiple embodiments of the present invention. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as embodiments disclosed or made public by the present invention.

[0096] This utility model also provides a glue spraying system device corresponding to the glue spraying equipment described in any of the above embodiments, which will be described below. It should be noted that the content of the glue spraying system described below can be referred to in correspondence with the content of the glue spraying equipment described above.

[0097] In some embodiments, combined with Figure 1 and Figure 2 See Figure 3 The diagram shown is a structural schematic of a glue spraying system according to an embodiment of the present invention. Figure 3 As shown, the adhesive spraying system may include:

[0098] Process chamber 140.

[0099] In some embodiments, the process chamber 140 provides an application environment for the photolithography process of wafer W and the verification process of the second photoresist.

[0100] The adhesive spraying equipment is disposed in the process chamber, and the adhesive spraying equipment includes the adhesive spraying equipment as described in any of the foregoing embodiments.

[0101] In some embodiments, the specific details of the structure, connection relationships, functions, working principles, etc. of the adhesive spraying equipment can be found in the descriptions and figures above, and will not be repeated here.

[0102] The stage, located within the process chamber 140 and below the adhesive spraying equipment, is used to support the wafer W.

[0103] In some embodiments, by changing the relative position between the adhesive spraying device and the stage, the photoresist sprayed by the adhesive spraying device can cover the entire surface of the wafer W.

[0104] In other words, in this invention, the adhesive spraying system may also include a transmission device, which can drive the adhesive spraying equipment to move so that the photoresist covers the surface of the wafer W.

[0105] In some embodiments, the stage may include: a support portion 152 for supporting the wafer W; and a rotating component 154 connected to the bottom of the support portion 152 and driving the support portion 152 to rotate, wherein the rotation axis of the support portion 152 is perpendicular to the surface of the support portion 152.

[0106] Specifically, the processing chamber 140 provides an application environment for the wafer W, and the carrier 152 can hold the wafer W so that photoresist can be sprayed onto the surface of the wafer W during the photolithography process.

[0107] By setting a rotating component 154 that drives the carrier part 152 to rotate along a surface perpendicular to the carrier part 152, the relative position between different positions of the wafer W and the photoresist can be changed, so that the amount of photoresist obtained at different positions of the wafer W is basically the same or the difference is small. This can reduce the difference of photoresist at different positions on the surface of the wafer W, and thus improve the processing quality of the wafer W.

[0108] It should be noted that, firstly, Figure 3 The schematic diagram of the processing chamber 140 is merely illustrative and does not represent the actual construction of the processing chamber 140. It is used to illustrate a device for accommodating wafers and providing an application environment for the wafers, and should not be construed as a limitation of this utility model; Second, Figure 3 The schematic diagram of the relative arrangement between the carrier portion 152 and the wafer W is also for illustrative purposes, used to show that the processing chamber 140 has a component for carrying the wafer; third, Figure 3 The schematic rotating component 154 is a simplified representation used to indicate the device or equipment that drives the carrier 152 to rotate.

[0109] In some embodiments, the rotating assembly 154 may include a rotating shaft (not shown) connected to the bottom of the support portion 152, and a driver (not shown) connected to the rotating shaft and the processor.

[0110] Specifically, the driver generates a driving force that causes the rotating shaft to rotate, thereby moving the carrier 152. Since the wafer W is placed on the carrier 152, the relative position between the wafer W and the photoresist can be changed.

[0111] In some embodiments, the driver adjusts the rotation parameters of the rotating shaft based on the drive signal received from the processor, so as to adjust the rotation state of the bearing 152.

[0112] It should be noted that, firstly, the rotation parameters of the rotating shaft may include at least one of the following: rotation method, rotation speed, and rotation angle; this invention does not impose any restrictions on the type of rotation parameters. Secondly, when the rotating assembly includes a rotating shaft and a driver, the rotating shaft is located inside the machining chamber (if present), while the driver may be located outside the machining chamber. In some other embodiments, the entire rotating assembly may be located inside the machining chamber.

[0113] In some embodiments, if the instantaneous movement speed is too fast during the rotation of wafer W or other movements (e.g., the lifting and lowering of wafer W), it may cause wafer W to slip.

[0114] In this case, the carrier portion has a carrier surface, the carrier surface has an adsorption through hole, and an adsorption component is provided through the adsorption through hole to adsorb the wafer during the wafer's movement.

[0115] Specifically, the top surface of the adsorption component can receive and adsorb the wafer, and the wafer W remains stable while moving along a direction perpendicular to the surface of the wafer W.

[0116] In some embodiments, there are multiple adsorption through holes, and these through holes are concentrically arranged along the circumference of the stage. Correspondingly, there are also multiple adsorption components, with one adsorption component corresponding to one adsorption through hole.

[0117] By having multiple adsorption vias and adsorption components, the adsorption components and the wafer can have multiple contact surfaces (the contact surface can be the top surface of the adsorption component) during the wafer lifting process. Thus, even when some adsorption components fail to work, the remaining adsorption components can still normally support and adsorb the wafer, improving the fault tolerance and stability of the wafer lifting process.

[0118] In some embodiments, the stage further includes a limiting member (not shown) disposed on the bearing surface to restrict relative movement between the wafer and the bearing surface.

[0119] Specifically, when a wafer is placed on a stage, it can be confined within the area enclosed by the limiting members, thereby reducing or preventing the wafer from falling off the carrier.

[0120] In some embodiments, when a limiting member is provided on the stage, the shape of the side of the limiting member that contacts the wafer is adapted to the shape of the wafer.

[0121] For example, the side of the limiting component that contacts the wafer can be arc-shaped, which allows the limiting component to better fit the wafer and provide more uniform contact pressure, reducing the problem of local pressure concentration.

[0122] It is understood that in the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0123] It is understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0124] It is understood that, in this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0125] It is understood that, in this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0126] Understandably, when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0127] It is understandable that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0128] It is understood that the above description provides multiple embodiment solutions, and the optional methods described in each embodiment solution can be combined and cross-referenced with each other without conflict, thereby extending to a variety of possible embodiment solutions, all of which can be considered as the embodiment solutions disclosed in this disclosure.

[0129] While the embodiments disclosed in this specification are as described above, the utility model is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this utility model; therefore, the scope of protection of this utility model should be determined by the scope defined in the claims.

Claims

1. A glue spraying device, characterized in that, include: A first supply device, the first supply device being used to provide a first photoresist; The second supply device is used to supply the second photoresist. The first supply device and the second supply device supply photoresist independently, and the amount of the second photoresist supplied is less than the amount of the first photoresist supplied. The processor is electrically connected to the first supply device and the second supply device respectively, and switches the working state of the first supply device and the second supply device to provide the first photoresist and the second photoresist in a time-sharing manner; The first supply device and the second supply device are connected by a connecting component.

2. The adhesive spraying equipment according to claim 1, characterized in that, The first supply device includes: A liquid supply assembly, electrically connected to the processor, is used to supply the first photoresist; A transport pipe, the first end of which is connected to the liquid supply assembly, is used to provide a transport path for the first photoresist to flow. The nozzle assembly is connected to the second end of the transmission pipe and is used to spray the first photoresist.

3. The adhesive spraying equipment according to claim 2, characterized in that, The second end of the transmission pipe has multiple branch pipes, and the nozzle assembly has multiple nozzles. Each branch pipe corresponds to one nozzle, and each branch pipe is independent of the others.

4. The adhesive spraying equipment according to claim 1, characterized in that, The second supply device includes a pipette, in which the second photoresist is contained.

5. The adhesive spraying equipment according to claim 1, characterized in that, The connecting component includes: The snap-fit ​​part is detachably connected to the first supply device; The fixing part has a channel for the second supply device to pass through, and the fixing part is used to adjust the position of the second supply device within the channel; The snap-fit ​​part and the fixing part are connected by a connector.

6. The adhesive spraying equipment according to claim 5, characterized in that, Meet one or more of the following: The snap-fit ​​part has a through hole, and the first supply device has a threaded hole. The snap-fit ​​part is detachably connected to the first supply device through the through hole and a threaded part that is adapted to the threaded hole. The first supply device is provided with a clamping part, and the snap-fit ​​part is detachably connected to the first supply device through the clamping part.

7. The adhesive spraying equipment according to claim 5, characterized in that, The inner wall of the channel is provided with an internal thread, and the second supply device is provided with an external thread. By screwing in or out, the position of the second supply device relative to the first supply device can be adjusted.

8. A spray adhesive system, characterized in that, include: Process chambers; The adhesive spraying equipment is disposed in the process chamber, and the adhesive spraying equipment includes the adhesive spraying equipment as described in any one of claims 1 to 7; A stage, located within the process chamber and below the adhesive spraying equipment, is used to support the wafer.

9. The adhesive spraying system according to claim 8, characterized in that, The platform includes: The support portion is used to support the wafer; A rotating assembly is connected to the bottom of the support portion. The rotating assembly is used to drive the support portion to rotate, wherein the axis of rotation of the support portion is perpendicular to the surface of the support portion.

10. The adhesive spraying system according to claim 9, characterized in that, The carrier portion has a carrier surface, an adsorption through hole on the carrier surface, and an adsorption component disposed through the adsorption through hole to adsorb the wafer during the wafer's movement.

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