Integrated workbench for semiconductor special gas equipment

Abstract

The utility model relates to an integrated working table for semiconductor special gas equipment. The integrated working table comprises an operation table component, a detection component, a first test component, a second test component and a cleaning component, the semiconductor special gas equipment assembling device has the advantages that the detection component is arranged on the operation table component, so that a worker can complete assembling of semiconductor special gas equipment on the detection component and adjust the inclination angle of the semiconductor special gas equipment through the detection component, the worker can conveniently observe the flatness of the assembling position of the semiconductor special gas equipment, and efficiency is improved; through the arrangement of the first test component and the second test component, the test of the switching function of the semiconductor special gas equipment and the low-pressure test, the pressure maintaining test and the purging operation of the semiconductor special gas equipment can be realized, the diversity of the test is improved, and the applicability is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor specialty gas equipment testing technology, and in particular to an integrated workbench for semiconductor specialty gas equipment. Background Technology

[0002] Specialty gases play a crucial role in semiconductor manufacturing, being widely used in core processes such as photolithography, etching, doping, and chemical vapor deposition. Semiconductor specialty gas equipment is used to store, transport, and precisely control parameters such as flow rate and pressure of specialty gases. The stability and reliability of its performance directly affect the quality of semiconductor products and production efficiency. As semiconductor technology continues to evolve towards higher integration and smaller dimensions, increasingly higher demands are being placed on the precision, safety, and automation of specialty gas equipment.

[0003] Most existing workbenches are simply single tables where installation tools are placed directly on the surface. This not only takes up valuable workspace and looks cluttered, but also easily traps dirt and grime, affecting product cleanliness. Furthermore, the assembled products are very heavy and inconvenient to move. Laying them flat on the workbench makes it difficult to inspect the flatness of pipes and valves, potentially leading to undetected problems and rework. Additionally, the purging, pressure-holding, and testing gas circuits are separate from the workbench, resulting in messy and inconvenient piping. Finally, the installation and testing workbenches are separate, requiring the product to be moved after installation, which may damage the product and cause quality issues. This is also time-consuming, labor-intensive, and detrimental to production efficiency.

[0004] Currently, no effective solutions have been proposed for the problems existing in related technologies, such as the inability of the control panel to check the flatness of pipelines and valves, the inability to perform purging, pressure holding, testing and other operations, and low efficiency. Utility Model Content

[0005] The purpose of this utility model is to address the shortcomings of existing technologies by providing an integrated workbench for semiconductor specialty gas equipment, thereby solving problems such as the inability of the workbench to check the flatness of pipelines and valves, the inability to perform purging, pressure holding, testing, and other operations, as well as low efficiency.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] This utility model provides an integrated workbench for semiconductor specialty gas equipment, comprising:

[0008] A control panel component, which is used to mount parts and allow operators to operate them;

[0009] A detection component is provided on the operating table component, with one end of the detection component being vertically connected to the operating table component and the other end of the detection component being slidably connected to the operating table component, for placing semiconductor special gas equipment and adjusting the angle of semiconductor special gas equipment;

[0010] A first test component is disposed on the operating table component and is used to test the switching function of the semiconductor special gas device.

[0011] The second test component is disposed on the operating table component and is used to perform low-pressure testing, pressure holding testing and purging operations on semiconductor special gas equipment.

[0012] A cleaning component is disposed on the operating table component and communicates with the second testing component for connecting an external dust blower.

[0013] In some embodiments, the console component includes:

[0014] The main body of the operating table is used to place the semiconductor special gas equipment and to install the detection component, the first test component, the second test component and the cleaning component;

[0015] A storage component is vertically mounted on the main body of the operating table and is used to store tools and to install some components of the first test component and the second test component.

[0016] In some embodiments, the detection component includes:

[0017] A detection panel is disposed on the operating table component and is used to place semiconductor specialty gas equipment and to allow personnel to test the semiconductor specialty gas equipment.

[0018] A rotating connector is disposed between one end of the detection panel component in the width direction and the operating table component, for rotatingly connecting the detection panel component and the operating table component.

[0019] A lifting assembly is disposed on the operating table component and connected to the bottom of the detection panel component, for driving the detection panel component to be tilted.

[0020] In some embodiments, the lifting assembly includes:

[0021] A lifting drive component is disposed on the operating platform component and is used to provide power;

[0022] A first connector is disposed at the bottom of the lifting drive component and is used to rotatably connect the lifting drive component to the operating table component.

[0023] The second connector is disposed on the output shaft of the lifting drive component and is used to rotatably connect the lifting drive component and the detection panel component.

[0024] In some embodiments, the detection component further includes:

[0025] A blocking member is provided on the detection panel near one end of the rotating connector to prevent items placed on the detection panel from slipping off.

[0026] In some embodiments, the first test component includes:

[0027] The first test pipeline component has its first end connected to a gas source for conveying gas;

[0028] A first valve body is disposed on the first test pipeline and is used to control the flow in the first test pipeline.

[0029] A first pressure regulating component is disposed on the first test pipeline component and located downstream of the first valve body component, and is used to regulate the gas pressure inside the first test pipeline component.

[0030] A plurality of first test interface components, each of which is connected to the second end of the first test pipeline component, for connection to semiconductor specialty gas equipment;

[0031] A plurality of control valves are respectively disposed between the corresponding first test interface and the first test pipeline, for controlling the flow between the first test interface and the first test pipeline.

[0032] In some embodiments, the first test component further includes:

[0033] A first pressure monitoring device is connected to the first test pipeline and is used to monitor the pressure inside the first test pipeline.

[0034] In some embodiments, the second test component includes:

[0035] The second test pipeline component has its first end connected to a gas source for conveying gas.

[0036] A third valve body is disposed on the second test pipeline and is used to control the flow in the second test pipeline.

[0037] The second pressure regulating component is disposed in the second test pipeline component and located downstream of the third valve body component, and is used to regulate the gas pressure inside the second test pipeline component.

[0038] The second test interface component is connected to the second end of the second test pipeline component and is used for connection of semiconductor specialty gas equipment.

[0039] In some embodiments, the second test component further includes:

[0040] A flow monitoring device is disposed on the second test pipeline and is used to adjust the gas flow rate out of the second test interface.

[0041] In some embodiments, the second test component further includes:

[0042] The second pressure monitoring device is connected to the second test pipeline and is used to monitor the pressure inside the second test pipeline.

[0043] In some embodiments, the cleaning component includes:

[0044] A cleaning pipeline component, the first end of which is connected to the second test component for conveying gas;

[0045] A cleaning connector is connected to the second end of the cleaning pipeline and is used to connect an external blow gun.

[0046] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0047] This utility model discloses an integrated workbench for semiconductor specialty gas equipment. By using a testing component on the workbench, operators can assemble the semiconductor specialty gas equipment on the testing component and adjust the tilt angle of the semiconductor specialty gas equipment through the testing component, thereby facilitating the operator's observation of the flatness of the assembled semiconductor specialty gas equipment and improving efficiency. By setting up a first testing component and a second testing component, the switching function of the semiconductor specialty gas equipment can be tested, as well as low-pressure testing, pressure holding testing, and purging operations can be performed on the semiconductor specialty gas equipment, improving the diversity of testing and enhancing applicability. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of an integrated workbench according to an embodiment of the present utility model;

[0049] Figure 2 This is a schematic diagram of the operating console component according to an embodiment of the present utility model;

[0050] Figure 3 This is a schematic diagram of the detection component according to an embodiment of the present utility model;

[0051] Figure 4 This is a schematic diagram (a) of the first test component and the second test component according to an embodiment of the present utility model;

[0052] Figure 5 yes Figure 4 The enlarged view of part A in the middle mainly shows the structure of the first test component, the second test component, and the cleaning component;

[0053] Figure 6 This is a schematic diagram (II) of the first test component and the second test component according to an embodiment of the present utility model;

[0054] Figure 7 yes Figure 6 The enlarged view of part B in the middle mainly shows the structure of the first test component, the second test component, and the cleaning component.

[0055] The reference numerals in the attached drawings are as follows: 100, control panel component; 110, control panel body; 120, storage component; 130, mounting component;

[0056] 200. Detection component; 210. Detection panel component; 220. Rotating connector; 230. Lifting drive component; 240. First connector; 250. Second connector; 260. Blocking component;

[0057] 300, First test component; 310, First test piping component; 320, First valve body component; 330, First pressure regulating component; 340, First test interface component; 350, Control valve component; 360, First pressure monitoring component; 370, Second valve body component;

[0058] 400. Second test component; 410. Second test piping component; 420. Third valve body component; 430. Second pressure regulating component; 440. Flow monitoring component; 450. Fourth valve body component; 460. Second test interface component; 470. Fifth valve body component; 480. Second pressure monitoring component; 490. Sixth valve body component;

[0059] 500. Cleaning components; 510. Cleaning piping components; 520. Cleaning connectors. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0061] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0062] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0063] An illustrative embodiment of this utility model, such as Figure 1 As shown, an integrated workbench for semiconductor specialty gas equipment includes an operating table component 100, a testing component 200, a first testing component 300, a second testing component 400, and a cleaning component 500. The operating table component 100 is used to mount components and provide operating facilities for workers. The testing component 200 is disposed on the operating table component 100, with one end of the testing component 200 vertically connected to the operating table component 100 and the other end rotatably connected to the operating table component 100, used to place the semiconductor specialty gas equipment and adjust its angle. The first testing component 300 is disposed on the operating table component 100 and used to test the switching function of the semiconductor specialty gas equipment. The second testing component 400 is disposed on the operating table component 100 and used to perform low-pressure testing, pressure holding testing, and purging operations on the semiconductor specialty gas equipment. The cleaning component 500 is disposed on the operating table component 100 and communicates with the second testing component 400 for connecting an external dust gun.

[0064] like Figure 2As shown, the operating table component 100 includes an operating table body 110, a storage component 120, and a mounting component 130. The operating table body 110 is used to house semiconductor specialty gas equipment and to mount the testing component 200, the first testing component 300, the second testing component 400, and the cleaning component 500. The storage component 120 is vertically disposed on the operating table body 110 and is used to store tools and to mount some components of the first testing component 300 and the second testing component 400. The mounting component 130 is disposed on the operating table body 110 and is used to support the second testing component 400.

[0065] Specifically, the main body 110 of the operating table consists of a rectangular frame and a perforated plate. The perforated plate is installed on the rectangular frame by means of riveting, bolting, or integral molding.

[0066] In some of these embodiments, the console body 110 includes, but is not limited to, a stainless steel table.

[0067] Specifically, the storage component 120 is installed on one side edge of the width of the main body 110 of the worktable by means of welding, riveting or bolting, and the length of the storage component 120 is the same as the length of the main body 110 of the worktable.

[0068] In some embodiments, the housing 120 includes, but is not limited to, a perforated plate.

[0069] Specifically, the mounting component 130 is installed on the underside of the tabletop of the main body 110 of the operating table by means of welding, riveting or bolting on both sides along its length. The mounting component 130 has multiple round holes through which some parts of the second test component 400 can pass, thereby providing support for some parts of the second test component 400.

[0070] In some embodiments, the mounting element 130 includes, but is not limited to, a U-shaped plate.

[0071] like Figure 2 and Figure 3 As shown, the detection component 200 includes a detection panel 210, a rotating connector 220, and a lifting assembly. The detection panel 210 is disposed on the operating table component 100 and is used to place semiconductor specialty gas equipment and for personnel to test the semiconductor specialty gas equipment. The rotating connector 220 is disposed between one end of the detection panel 210 in the width direction and the operating table component 100, and is used to rotatably connect the detection panel 210 and the operating table component 100. The lifting assembly is disposed on the operating table component 100 and connected to the bottom of the detection panel 210, and is used to drive the detection panel 210 to an inclined position.

[0072] Specifically, the inspection panel 210 is mounted on the main body of the operating table 110 via a rotating connector 220, and the inspection panel 210 facilitates the inspection of the assembled product by the staff.

[0073] In some embodiments, the detection panel 210 includes, but is not limited to, a stainless steel plate.

[0074] Specifically, the rotating connector 220 is installed on both sides of the detection panel 210 in the width direction by means of welding, riveting or bolting, and is located on the side of the detection panel 210 away from the storage component 120 in the length direction.

[0075] In some embodiments, there are two rotating connectors 220, and the two rotating connectors 220 are located on both sides of the detection panel 210 in the width direction.

[0076] In some of these embodiments, the rotating connector 220 includes, but is not limited to, a rotating shaft.

[0077] Specifically, the lifting assembly includes a lifting drive component 230, a first connector 240, and a second connector 250. The lifting drive component 230 is disposed on the operating table component 100 and provides power; the first connector 240 is disposed at the bottom of the lifting drive component 230 and rotatably connects the lifting drive component 230 to the operating table component 100; the second connector 250 is disposed on the output shaft of the lifting drive component 230 and connects the lifting drive component 230 to the detection panel component 210.

[0078] More specifically, the lifting drive component 230 is installed on the main body 110 of the operating table by means of welding, riveting or bolting, and the output shaft of the lifting drive component 230 is vertically arranged.

[0079] In some embodiments, the lifting drive 230 includes, but is not limited to, a telescopic cylinder.

[0080] In some embodiments, there are two lifting drive components 230, and the two lifting drive components 230 are mounted on the main body 110 of the operating table and located on both sides of the detection panel component 210 in the width direction.

[0081] More specifically, the first connector 240 is installed at the bottom of the lifting drive component 230 by means of welding, riveting or bolting, and is rotatably connected to the main body of the operating table 110. The first connector 240 can rotatably connect the lifting drive component 230 to the main body of the operating table 110.

[0082] In some embodiments, the first connector 240 includes, but is not limited to, a rotating connecting bracket.

[0083] It should be noted that the number of first connecting members 240 is matched with the number of lifting drive members 230; it should be understood that the number of first connecting members 240 is the same as the number of lifting drive members 230.

[0084] More specifically, the second connector 250 is installed on the output shaft of the lifting drive 230 by means of welding, riveting or bolting, and is rotatably connected to the bottom of the detection panel 210.

[0085] In some embodiments, the second connector 250 includes, but is not limited to, a rotating connecting bracket.

[0086] It should be noted that the number of second connecting members 250 is matched with the number of lifting drive members 230; it should be understood that the number of second connecting members 250 is the same as the number of lifting drive members 230.

[0087] Furthermore, the detection component 200 also includes a blocking member 260. The blocking member 260 is disposed on the detection panel component 210 near the rotating connector 220 to prevent items placed on the detection panel component 210 from slipping off.

[0088] Specifically, the blocking member 260 is installed on the detection panel member 210 by means of welding, riveting or bolting, and the length of the blocking member 260 is the same as the width of the detection panel member 210.

[0089] In some embodiments, the blocking member 260 includes, but is not limited to, a long plate.

[0090] like Figure 5 , Figure 6 and Figure 7 As shown, the first test component 300 includes a first test pipeline 310, a first valve body 320, a first pressure regulating component 330, a plurality of first test interface components 340, and a plurality of control valve components 350. The first end of the first test pipeline 310 is connected to a gas source for transporting gas; the first valve body 320 is disposed in the first test pipeline 310 for controlling the flow within the first test pipeline 310; the first pressure regulating component 330 is disposed in the first test pipeline 310 and located downstream of the first valve body 320 for adjusting the gas pressure inside the first test pipeline 310; the plurality of first test interface components 340 are respectively connected to the second end of the first test pipeline 310 for connection to semiconductor special gas equipment; and the plurality of control valve components 350 are respectively disposed between the corresponding first test interface component 340 and the first test pipeline 310 for controlling the flow between the first test interface component 340 and the first test pipeline 310.

[0091] Specifically, the first end of the first test pipeline component 310 is connected to the air source through a component such as an adapter, and the second end of the first test pipeline component 310 is connected to the first test interface component 340.

[0092] It should be noted that the first end and the second end of the first test conduit 310 are the two ends of its length direction, respectively.

[0093] In some of these embodiments, the first test conduit 310 includes, but is not limited to, a stainless steel pipe.

[0094] Specifically, the first valve body 320 is fixed to the main body 110 of the operating table by means of welding, riveting or bolting, and the first valve body 320 is set on the first test pipeline 310.

[0095] In some of these embodiments, the first valve body 320 includes, but is not limited to, a diaphragm valve.

[0096] Specifically, the first pressure regulating component 330 is fixed to the main body 110 of the operating table by means of welding, riveting or bolting, and the first pressure regulating component 330 is set on the first test pipeline component 310.

[0097] In some of these embodiments, the first pressure regulating element 330 includes, but is not limited to, a pressure regulating valve.

[0098] Specifically, the first test interface component 340 is installed on the housing component 120 by welding, riveting or bolting, and the first test interface component 340 is connected to the second end of the first test pipeline component 310 by bolting. The first test interface component 340 can be connected to the air valve, thereby enabling the testing of the air valve's opening and closing function.

[0099] In some of these embodiments, the first test interface 340 includes, but is not limited to, an adapter.

[0100] More specifically, there are 30 first test interface components 340, and the 30 first test interface components 340 are arranged in the receiving component 120 along its length.

[0101] It should be noted that the number of the first test interface components 340 can also be 20, 40, etc.; the number of the first test interface components 340 can be set according to actual needs, and no further restrictions are imposed here.

[0102] Specifically, the control valve 350 is installed on the housing 120 by means of welding, riveting or bolting, and the control valve 350 is located upstream of the first test interface 340 on the first test pipeline 310, thereby controlling the flow between the first test pipeline 310 and the first test interface 340.

[0103] In some of these embodiments, the control valve 350 includes, but is not limited to, a toggle valve.

[0104] More specifically, there are 30 control valves 350, and each of the 30 control valves 350 is located upstream of its corresponding first test interface 340.

[0105] It should be noted that the number of control valves 350 is matched with the number of first test interface components 340; it should be understood that the number of control valves 350 is the same as the number of first test interface components 340 or the number of control valves 350 is half the number of first test interface components 340.

[0106] Furthermore, the first test component 300 also includes a first pressure monitoring element 360 and a second valve body 370. The first pressure monitoring element 360 is connected to the first test pipeline 310 and is used to monitor the pressure inside the first test pipeline 310; the second valve body 370 is disposed in the pipeline connecting the first pressure monitoring element 360 and the first test pipeline 310 and is used to control the flow between the first test pipeline 310 and the first pressure monitoring element 360.

[0107] Specifically, the first pressure monitoring component 360 is connected to the first test pipeline component 310 through a pipeline, and the connection between the first pressure monitoring component 360 and the first test pipeline component 310 is located downstream of the first pressure regulating component 330 and upstream of the control valve component 350.

[0108] In some of these embodiments, the first pressure monitoring element 360 includes, but is not limited to, a pressure gauge.

[0109] In some of these embodiments, the second valve body 370 includes, but is not limited to, a ball valve.

[0110] like Figure 5 , Figure 6 and Figure 7As shown, the second test component 400 includes a second test pipeline component 410, a third valve body component 420, a second pressure regulating component 430, a flow monitoring component 440, a fourth valve body component 450, a second test interface component 460, and a fifth valve body component 470. The second test pipeline 410 has a first end connected to a gas source for transporting gas; a third valve body 420 is disposed on the second test pipeline 410 for controlling the flow in the second test pipeline 410; a second pressure regulating component 430 is disposed on the second test pipeline 410 and located downstream of the third valve body 420 for regulating the gas pressure inside the second test pipeline 410; a flow monitoring component 440 is connected to the second end of the second test pipeline 410 for monitoring gas flow; a fourth valve body 450 is disposed on the pipeline connecting the flow monitoring component 440 and the cleaning component 500 for controlling the flow between the flow monitoring component 440 and the cleaning component 500; a second test interface component 460 is connected to the second end of the second test pipeline 410 for connecting semiconductor special gas equipment; and a fifth valve body 470 is disposed on the pipeline connecting the fourth valve body 450 and the second test interface component 460 for controlling the flow between the fourth valve body 450 and the second test interface component 460.

[0111] Specifically, the first end of the second test pipeline component 410 is connected to the air source through a component such as an adapter, and the second end of the second test pipeline component 410 is connected to the second test interface component 460.

[0112] It should be noted that the first end and the second end of the second test conduit 410 are the two ends of its length direction, respectively.

[0113] In some of these embodiments, the second test conduit 410 includes, but is not limited to, a stainless steel tube.

[0114] Specifically, the third valve body 420 is fixed to the main body 110 of the operating table by means of welding, riveting or bolting, and the third valve body 420 is set on the second test pipeline 410.

[0115] In some of these embodiments, the third valve body 420 includes, but is not limited to, a diaphragm valve.

[0116] Specifically, the second pressure regulating component 430 is fixed to the main body 110 of the operating table by means of welding, riveting or bolting, and the second pressure regulating component 430 is set on the second test pipeline component 410.

[0117] In some of these embodiments, the second pressure regulating element 430 includes, but is not limited to, a pressure regulating valve.

[0118] Specifically, the flow monitoring component 440 is installed on the receiving component 120 by means of welding, riveting or bolting, and the flow monitoring component 440 is located downstream of the second pressure regulating component 430 and upstream of the fourth valve body component 450.

[0119] In some of these embodiments, the flow monitoring device 440 includes, but is not limited to, a flow meter.

[0120] In some of these embodiments, the fourth valve body 450 includes, but is not limited to, a three-way valve.

[0121] Specifically, the second test interface component 460 is installed on the housing component 120 by means of welding, riveting or bolting, and the second test interface component 460 is connected to the second end of the second test pipeline component 410 by means of bolting. The second test interface component 460 can be connected to the test panel, thereby enabling low-pressure testing, pressure holding testing and purging operations on the test panel.

[0122] In some of these embodiments, the second test interface 460 includes, but is not limited to, an adapter.

[0123] Specifically, the fifth valve body 470 is installed on the housing 120 by means of welding, riveting or bolting, and is connected to the flow monitoring component 440 and the second test interface component 460 respectively.

[0124] In some of these embodiments, the fifth valve body 470 includes, but is not limited to, a ball valve.

[0125] Furthermore, the second test component 400 also includes a second pressure monitoring element 480 and a sixth valve body 490. The second pressure monitoring element 480 is connected to the second test pipeline 410 and is used to monitor the pressure inside the second test pipeline 410; the sixth valve body 490 is disposed on the pipeline connecting the second test pipeline 410 and the second pressure monitoring element 480 and is used to control the flow between the second test pipeline 410 and the second pressure monitoring element 480.

[0126] Specifically, the second pressure monitoring component 480 is installed on the receiving component 120 by means of welding, riveting or bolting, and is connected to the second test pipeline component 410 through a pipeline. The connection between the second pressure monitoring component 480 and the second test pipeline component 410 is located downstream of the second pressure regulating component 430 and upstream of the flow monitoring component 440.

[0127] In some of these embodiments, the second pressure monitoring element 480 includes, but is not limited to, a pressure gauge.

[0128] In some of these embodiments, the sixth valve body 490 includes, but is not limited to, a ball valve.

[0129] like Figure 5and Figure 7 As shown, the cleaning component 500 includes a cleaning pipeline component 510 and a cleaning connector component 520. The first end of the cleaning pipeline component 510 is connected to the second test component 400 for conveying gas; the cleaning connector component 520 is connected to the second end of the cleaning pipeline component 510 for connecting an external dust blower.

[0130] Specifically, the first end of the cleaning pipe component 510 is connected to the second test pipe component 410, and the connection between the first end of the cleaning pipe component 510 and the second test pipe component 410 is located downstream of the flow monitoring component 440 and upstream of the second test interface component 460. The second end of the cleaning pipe component 510 extends to the first pressure regulating component 330 and the second pressure regulating component 430, and is connected to the cleaning connector component 520.

[0131] It should be noted that the first end and the second end of the cleaning pipe fitting 510 are the two ends of its length direction, respectively.

[0132] In some of these embodiments, the cleaning pipe fitting 510 includes, but is not limited to, a stainless steel pipe.

[0133] Specifically, the cleaning connector 520 is connected to the second end of the cleaning pipeline 510 by means of bolts or other methods, and the cleaning connector 520 can be connected to a dust gun to clean the table surface and tools of the operating table body 110.

[0134] In some of these embodiments, the cleaning connector 520 includes, but is not limited to, an adapter.

[0135] The usage method of this embodiment is as follows:

[0136] In actual use, the staff can assemble the semiconductor special gas equipment on the detection panel 210. After the assembly is completed, the lifting drive 230 can be activated. The lifting drive 230 will lift one side of the detection panel 210 in the width direction, so that the detection panel 210 is tilted, which makes it easier for the staff to observe the flatness of the semiconductor special gas equipment assembly.

[0137] The operator can connect multiple air valves to the corresponding first test interface 340, then open the first valve body 320 and adjust the pressure in the first test pipeline 310 through the first pressure regulating component 330. If the parameters displayed by the first pressure monitoring component 360 meet the standard, the corresponding control valve 350 is opened to complete the test of the air valve.

[0138] The operator can connect the test panel to the second test interface 460, then open the third valve body 420, and adjust the pressure in the second test pipeline 410 and the flow rate to the second test interface 460 through the second pressure regulating component 430 and the flow monitoring component 440. If the parameters displayed by the second pressure monitoring component 480 meet the standards, low-pressure testing, pressure holding testing or purging operations can be performed on the test panel.

[0139] The advantages of this embodiment are that by using the testing component on the operating table, the operator can complete the assembly of the semiconductor specialty gas equipment on the testing component, and adjust the tilt angle of the semiconductor specialty gas equipment through the testing component, thereby facilitating the operator to observe the flatness of the assembled semiconductor specialty gas equipment and improving efficiency; by setting the first test component and the second test component, the switching function of the semiconductor specialty gas equipment can be tested, as well as low-pressure testing, pressure holding testing, and purging operations can be performed on the semiconductor specialty gas equipment, improving the diversity of testing and enhancing applicability.

[0140] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0141] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An integrated worktable for a semiconductor process gas apparatus, characterized by comprising: The utility model provides a semiconductor special gas equipment test platform, which comprises an operating table part, a detection part, a first test part and a second test part. The operating table part is used for mounting parts and operating by workers. One end of the detection part is connected with the operating table part in a lifting mode, and the other end is connected with the operating table part in a rotating mode. The detection part is used for placing semiconductor special gas equipment and adjusting the angle of semiconductor special gas equipment. The first test part is arranged on the operating table part and is used for testing the switching function of semiconductor special gas equipment. The second test part is arranged on the operating table part and is used for low-voltage test, pressure maintaining test and purging operation of semiconductor special gas equipment.

2. The integrated worktable of claim 1, wherein, The cleaning part is arranged on the operating table part and is communicated with the second test part. The operating table part comprises an operating table main body, a storage part and a mounting part. The operating table main body is used for placing semiconductor special gas equipment and mounting the detection part, the first test part, the second test part and the cleaning part. The storage part is arranged on the operating table main body in a vertical mode and is used for storing tools and mounting parts of the first test part and the second test part.

3. The integrated worktable of claim 1, wherein, The mounting part is arranged on the operating table main body and is used for supporting the second test part. The detection part comprises a detection panel part, a rotating connecting part and a lifting assembly. The detection panel part is arranged on the operating table part and is used for placing semiconductor special gas equipment and detecting semiconductor special gas equipment by workers. The rotating connecting part is arranged between one end of the detection panel part in a width direction and the operating table part and is used for connecting the detection panel part with the operating table part in a rotating mode.

4. The integrated worktable of claim 3, wherein, The lifting assembly is arranged on the operating table part and is connected with the bottom of the detection panel part and is used for driving the detection panel part to be arranged in an inclined mode. The lifting assembly comprises a lifting drive part, a first connecting part and a second connecting part. The lifting drive part is arranged on the operating table part and is used for providing power. The first connecting part is arranged on the bottom of the lifting drive part and is used for connecting the lifting drive part with the operating table part in a rotating mode.

5. The integrated worktable of claim 3, wherein, The second connecting part is arranged on the output shaft of the lifting drive part and is used for connecting the lifting drive part with the detection panel part in a rotating mode. The detection part further comprises a blocking part.

6. The integrated worktable of claim 1, wherein, The blocking part is arranged on the detection panel part and is used for preventing articles placed on the detection panel part from falling off. The first test part comprises a first test pipeline part, a first valve body part and a first pressure regulating part. The first end of the first test pipeline part is communicated with a gas source and is used for conveying gas. The first valve body part is arranged on the first test pipeline part and is used for controlling the flow of the first test pipeline part. The first pressure regulating part is arranged on the first test pipeline part and is located downstream of the first valve body part and is used for adjusting the gas pressure in the first test pipeline part. A plurality of first test interface pieces, each of the plurality of first test interface pieces being in communication with the second end of the first test pipeline piece, for connecting with a semiconductor special gas equipment; A plurality of control valve pieces, each of the plurality of control valve pieces being arranged between a corresponding first test interface piece and the first test pipeline piece, for controlling the flow between the first test interface piece and the first test pipeline piece.

7. The integrated worktable of claim 6, wherein, The first test component further comprises: A first pressure monitoring piece in communication with the first test pipeline piece, for monitoring the pressure inside the first test pipeline piece; A second valve body piece arranged in a pipeline in which the first pressure monitoring piece is in communication with the first test pipeline piece, for controlling the flow between the first test pipeline piece and the first pressure monitoring piece.

8. The integrated worktable of claim 1, wherein, The second test component comprises: A second test pipeline piece, a first end of the second test pipeline piece being in communication with a gas source, for conveying gas; A third valve body piece arranged in the second test pipeline piece, for controlling the flow of the second test pipeline piece; A second pressure regulating piece arranged in the second test pipeline piece and located downstream of the third valve body piece, for regulating the pressure of the gas inside the second test pipeline piece; A flow monitoring piece in communication with a second end of the second test pipeline piece, for monitoring the flow of the gas; A fourth valve body piece arranged in a pipeline in which the flow monitoring piece is in communication with the cleaning component, for controlling the flow between the flow monitoring piece and the cleaning component; A second test interface piece in communication with the third valve body piece, for connecting with a semiconductor special gas equipment; A fifth valve body piece arranged in a pipeline in which the fourth valve body piece is in communication with the second test interface piece, for controlling the flow between the fourth valve body piece and the second test interface piece.

9. The integrated worktable of claim 8, wherein, The second test component further comprises: A second pressure monitoring piece in communication with the second test pipeline piece, for monitoring the pressure inside the second test pipeline piece; A sixth valve body piece arranged in a pipeline in which the second test pipeline piece is in communication with the second pressure monitoring piece, for controlling the flow between the second test pipeline piece and the second pressure monitoring piece.

10. The integrated worktable of claim 1, wherein, The cleaning component comprises: A cleaning pipeline piece, a first end of the cleaning pipeline piece being in communication with the second test component, for conveying gas; A cleaning joint piece in communication with a second end of the cleaning pipeline piece, for externally connecting a dust blowing gun.

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