Silicon rod squaring equipment

Abstract

The silicon rod squaring equipment comprises a cutting machine base with a cutting machining platform, the cutting machining platform is provided with one or more cutting station sets, and each cutting station set comprises a first cutting station and a second cutting station; a first silicon rod cutting device is arranged on the first cutting station and is used for carrying out first cutting operation on a silicon rod with a circular section, so that the silicon rod forms two parallel first side sections; the second cutting station is provided with a second silicon rod cutting device used for conducting second cutting operation on the silicon rod with the two first side tangent planes, so that the silicon rod forms two parallel second side tangent planes to obtain a square silicon rod with the rectangular cross section, and the second side tangent planes are perpendicular to the first side tangent planes. The equipment is high in overall integration level and simple in structure, the production efficiency is improved, the cost is saved, and the quality of product machining operation is improved.

Description

[0001] This application is a divisional application in accordance with the Implementing Regulations of the Patent Law Article 48, the parent application of this application is Chinese Utility Model Application No. 202421350692.8, the filing date of which is June 13, 2024, the priority date of which is July 14, 2023, the priority number of which is 202310862351.2, and the title of which is Silicon Rod Cutting and Grinding Integrated Machine, the applicant of which is Shanghai Rijin Machine Tool Co., Ltd. The entire contents of the parent application are incorporated herein in their entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of silicon workpiece processing, in particular to a silicon rod squaring device. BACKGROUND

[0003] The existing silicon wafer manufacturing process takes single crystal silicon products as an example, and the general operation process can include: first, using a silicon rod cutting machine to cut a long silicon rod (the whole silicon rod is cylindrical) with a circular cross section to form multiple short silicon rods; after cutting, using a silicon rod squaring machine to square the short silicon rods after cutting to form square silicon rods with a rectangular cross section; then, performing grinding operations such as surface grinding, rounding / corner rounding on the squared square silicon rods to shape the surface of the silicon rod to meet the corresponding flatness and dimensional tolerance requirements; and then, performing slicing operations on the square silicon rods to obtain silicon wafers.

[0004] The silicon wafers obtained by slicing operations can be used to make photovoltaic modules, which can convert light energy into electrical energy. With the development of battery technology, the demand for small silicon wafers is increasing, and the demand for thin wafers is also relatively large. The thickness of silicon wafers has been reduced from the original 180 microns to 150 microns, 120 microns and 110 microns, and the mass production process of 120 microns and 110 microns has also been completed. Even silicon wafers with a thickness of 100 microns or less are expected, but the thinner the silicon wafer, the more difficult it is to cut, and the more difficult it is to ensure the cutting quality. For example, slicing operations on larger square silicon rods are more likely to cause damage and defects to the cross section of the silicon wafer. In related silicon rod processing technologies, the structure of the squaring processing equipment is complex and the equipment scalability is poor, and it can only be used for squaring and cutting of a single silicon rod or a small number of silicon rods, which has the problems of low efficiency, etc. SUMMARY

[0005] In view of the various deficiencies of the above-mentioned related art, the purpose of the present application is to disclose a silicon rod squaring device to solve the problems of complex equipment, inconvenient operation, poor cutting quality and low efficiency in the prior art.

[0006] To achieve the above and other related objectives, this application discloses a silicon rod squaring device, comprising: a cutting machine base having a cutting processing platform; the cutting processing platform having one or more cutting station groups, each cutting station group including a first cutting station and a second cutting station; a first silicon rod cutting device is configured on the first cutting station, the first silicon rod cutting device being used to perform a first cutting operation on a silicon rod with a circular cross-section, such that the silicon rod forms two parallel first side cut surfaces; a second silicon rod cutting device is configured on the second cutting station, the second silicon rod cutting device being used to perform a second cutting operation on the silicon rod having two first side cut surfaces, such that the silicon rod, after forming two parallel second side cut surfaces, becomes a square silicon rod with a rectangular cross-section, the second side cut surfaces being perpendicular to the first side cut surfaces.

[0007] In summary, the silicon rod squaring equipment disclosed in this application is used to squaring silicon rods with circular cross-sections to form square silicon rods with rectangular cross-sections, thereby completing the integrated operation of multiple processes such as squaring, cutting, and transferring silicon rods with circular cross-sections. The equipment of this application has a high degree of integration and a simple structure, which improves production efficiency and saves costs. Attached Figure Description

[0008] The specific features involved in this application are shown in the appended claims. A better understanding of the features and advantages of the invention can be achieved by referring to the exemplary embodiments and accompanying drawings described in detail below. A brief description of the drawings is as follows:

[0009] Figure 1 The diagram shown is a structural schematic of one embodiment of the silicon rod cutting and grinding machine of this application.

[0010] Figure 2 and Figure 3 Displayed as Figure 1 A schematic diagram of the structure of a silicon rod squaring equipment.

[0011] Figure 4 The diagram shown is a structural schematic of the first wire cutting unit in a first silicon rod cutting apparatus in one embodiment.

[0012] Figure 5 The diagram shows a structural schematic of a first silicon rod transfer device and a first edge-skin anti-chipping device in one embodiment.

[0013] Figure 6 Displayed as Figure 5 A schematic diagram of the edge clamp of the first edge anti-splitting device in one embodiment.

[0014] Figures 7-9 Displayed as Figure 5 A schematic diagram of the state of the edge-skin anti-splitting device holding the silicon rod in one embodiment.

[0015] Figure 10 and Figure 11 Structure schematic diagram of the first silicon rod cutting device, the first edge skin anti-collapse device and the edge skin unloading conveying mechanism in an embodiment is shown.

[0016] Figure 12 Structure schematic diagram of the silicon rod grinding equipment in an embodiment is shown. Figure 1

[0017] Figure 13 Structure schematic diagram of the first square silicon rod clamping device in an embodiment is shown.

[0018] Figure 14 Structure schematic diagram of the edge skin bearing device and the chamfering device in an embodiment is shown. Figure 12 DETAILED DESCRIPTION

[0019] In related technical fields of silicon rod processing, several processes such as square cutting, surface grinding, rounding / chamfering, etc. are involved. Generally, the existing silicon rods are mostly cylindrical in structure. The silicon rods are cut into squares by a silicon rod square cutting device, so that the cross section of the silicon rod after square cutting is rectangular (including square), and the whole silicon rod after square cutting is cuboid (including cubic). The rectangular shape includes a rectangle with orthogonal adjacent sides or a rectangle with an angle range within a predetermined angle, a rectangle with rounded corners between adjacent sides, a rectangle with connecting short sides between adjacent sides, etc.

[0020] Taking a single crystal silicon rod as an example, in some related technologies, the forming process of the single crystal silicon rod can include: first, using a silicon rod cutting machine to cut an original long silicon rod into multiple short silicon rods; and then, using a silicon rod square cutting machine to cut the short silicon rods into single crystal silicon rods with a rectangular cross section. The specific implementation of using the silicon rod cutting machine to cut the original long silicon rod into multiple short silicon rods can be referred to, for example, CN105856445A, CN105946127A, and CN105196433A, and the specific implementation of using the silicon rod square cutting machine to cut the short silicon rods into single crystal silicon rods with a rectangular cross section can be referred to CN105818285A. However, the forming process of the single crystal silicon rod is not limited to the foregoing technologies. In alternative examples, the forming process of the single crystal silicon rod can also include: first, using a full silicon rod square cutting machine to cut the original long silicon rod into a long single crystal silicon rod with a rectangular cross section; and then, using a silicon rod cutting machine to cut the long single crystal silicon rod after square cutting into a short single crystal silicon rod. The specific implementation of using the full silicon rod square cutting machine to cut the original long silicon rod into a long single crystal silicon rod with a rectangular cross section can be referred to, for example, CN106003443A.​​

[0021] After the cylindrical single crystal silicon rod is cut by the squaring device to form a square silicon rod with a rectangular cross section, the square silicon rod can be subjected to surface grinding, rounding or chamfering by a grinding device. The specific implementation of the grinding device for surface grinding, rounding or chamfering of the square silicon rod can be referred to, for example, CN105835247A and other patent publications.

[0022] The inventors of the present application found that in the related silicon rod processing operation technology, the structure of the squaring device or the grinding device involved is complex and has poor device expandability, and can only be used for squaring cutting or grinding chamfering of a single silicon rod or a small number of silicon rods, which has problems such as low efficiency. In addition, generally, the squaring device and the grinding device for silicon rods are independent and separate, and there are many operations such as silicon rod unloading, transfer, loading, and debugging in multiple steps, which increases labor costs and affects processing efficiency.

[0023] Therefore, the present application provides a silicon rod cutting and grinding all-in-one machine, a silicon rod cutting and grinding method, a silicon rod squaring device, and a silicon rod grinding device. The silicon rod cutting and grinding all-in-one machine includes a silicon rod squaring device and a silicon rod grinding device that are connected to each other. The silicon rod squaring device is used to cut a silicon rod with a circular cross section to form a square silicon rod with a rectangular cross section. The silicon rod grinding device is used to grind the surface of the square silicon rod and chamfer the square silicon rod. Thus, the cutting, grinding, and chamfering of the silicon rod with a circular cross section are integrated into one operation. The device has high integration, a simple structure, high production efficiency, and low cost, and improves the quality of product processing operations.

[0024] In the embodiments disclosed in the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined to clarify the definitions of directions and the operation modes of different structures. The first direction, the second direction, and the third direction are all straight lines and perpendicular to each other. The depth extension direction of the silicon rod cutting and grinding all-in-one machine, i.e., the length direction of the silicon rod placed thereon, is defined as the first direction (i.e., the front-rear direction or the transfer direction). The width extension direction of the silicon rod cutting and grinding all-in-one machine, i.e., the left-right direction, is defined as the second direction (i.e., the left-right direction or the transposition direction). The vertical direction, i.e., the perpendicular direction, the perpendicular line direction, the up-down direction, or the lifting direction, is defined as the third direction.

[0025] The present application discloses a silicon rod cutting and grinding method, which includes the following steps: cutting a silicon rod with a circular cross section to form a square silicon rod with a rectangular cross section; and grinding the surface of the square silicon rod and chamfering the square silicon rod.

[0026] The step of cutting the silicon rod with a circular cross section to form a square silicon rod with a rectangular cross section includes: performing a first cutting operation on the silicon rod with a circular cross section along the length direction of the silicon rod to form two parallel first side surfaces; and performing a second cutting operation on the silicon rod with the two first side surfaces along the length direction of the silicon rod to form a square silicon rod with a rectangular cross section by forming two parallel second side surfaces perpendicular to the first side surfaces and at least one parting surface parallel to the second side surfaces.

[0027] The step of performing the surface grinding operation and the chamfering operation on the square silicon rod includes: performing the surface grinding operation on the two first side surfaces of the square silicon rod; performing the surface grinding operation on the two second side surfaces of the square silicon rod; and performing the chamfering operation on the four edge portions of the square silicon rod.

[0028] The application further discloses a silicon rod cutting and grinding all-in-one machine which can complete the cutting of a silicon rod with a circular cross section into a square silicon rod with a rectangular cross section and the surface grinding and chamfering operations. The silicon rod cutting and grinding all-in-one machine is described in detail below.

[0029] Please refer to Figure 1 which shows the structural schematic diagram of the silicon rod cutting and grinding all-in-one machine in an embodiment. As shown in Figure 1 , the silicon rod cutting and grinding all-in-one machine comprises a square silicon rod cutting device 1 and a silicon rod grinding device 2 which are connected to each other, wherein the square silicon rod cutting device 1 is used for cutting a silicon rod with a circular cross section to form a square silicon rod with a rectangular cross section, and the silicon rod grinding device 2 is used for performing the surface grinding operation and the chamfering operation on the square silicon rod transferred from the square silicon rod cutting device 1.

[0030] Please refer to Figure 2 which shows the structural schematic diagram of the square silicon rod cutting device in Figure 1 . In combination with Figure 1 and Figure 2 , the square silicon rod cutting device 1 comprises a cutting machine base 11, a first silicon rod transferring device 12, a first silicon rod cutting device 13, a second silicon rod transferring device 14, and a second silicon rod cutting device 15.

[0031] It should be noted that in the embodiment shown in Figure 1 , the first direction, the second direction, and the third direction are arranged as shown in the figure, the first direction is the X axis in Figure 1 , the second direction is the Y axis in Figure 1 , and the third direction is the Z axis in Figure 1 .

[0032] The cutting machine base is a main component of the silicon rod squaring device and is used to provide a machining platform. In practical applications, the cutting machine base has a large volume and weight to provide a large mounting surface and firm stability of the entire machine. It should be understood that the cutting machine base can be a base body of different structures or components in the silicon rod squaring device that perform different machining operations, and the specific structure of the cutting machine base can be changed based on different functional requirements or structural requirements. In some examples, the cutting machine base includes a fixing structure or a limiting structure such as a base, a column, a rack, etc. for receiving different components in the silicon rod squaring device.

[0033] Meanwhile, in some examples, the cutting machine base can be an integrated base, and in some examples, the cutting machine base can include a plurality of independent bases.

[0034] The cutting machine base has a cutting machining platform that can be divided into a plurality of functional areas according to the specific operation content of the silicon rod machining operation. In some embodiments, the cutting machining platform is provided with one or more cutting station groups, and each cutting station group includes a first cutting station and a second cutting station arranged in parallel. Therefore, in the embodiments as shown in Figure 1 and Figure 2 , the cutting machining platform is provided with one cutting station group, and the cutting station group includes a first cutting station and a second cutting station arranged in parallel along the second direction, wherein each cutting station includes a loading and unloading area and a cutting area, i.e., the first cutting station includes a first loading and unloading area and a first cutting area, and the second cutting station includes a second loading and unloading area and a second cutting area. However, this is not the case, and in some embodiments, the cutting machining platform of the silicon rod squaring device is provided with two or more cutting station groups, and each cutting station group includes a first cutting station and a second cutting station arranged in parallel along the second direction. In the embodiments as shown in Figure 1 and Figure 2 , a first silicon rod transfer device 12 and a first silicon rod cutting device 13 are configured corresponding to the first cutting station, and a second silicon rod transfer device 14 and a second silicon rod cutting device 15 are configured corresponding to the second cutting station.

[0035] The first cutting station comprises a first loading and unloading area and a first cutting area, and is provided with a first silicon rod transfer device configured to transfer a silicon rod with a circular cross section along a transfer direction between the first loading and unloading area and the first cutting area. The first silicon rod cutting device is arranged in the first cutting area and is provided with at least one first cutting wire saw arranged in a vertical plane and vertically or at an angle with the vertical. The first silicon rod cutting device and the first silicon rod transfer device are relatively moved along the transfer direction to perform first cutting on the silicon rod with a circular cross section by the at least one first cutting wire saw, so that the silicon rod forms two parallel first side surfaces. The vertical plane is composed of the first direction and the third direction.

[0036] The first silicon rod transfer device is configured to transfer a silicon rod along a transfer direction between the first loading and unloading area and the first cutting area of the first cutting station. The silicon rod with a circular cross section is horizontally arranged on the first silicon rod transfer device, and the axis of the silicon rod is consistent with the transfer direction, which is consistent with the first direction.

[0037] The first silicon rod transfer device can comprise a first transfer channel, a first bearing platform, and a first transfer driving mechanism.

[0038] The first transfer channel is arranged along the transfer direction. In some implementations, the first transfer channel comprises a first transfer rail. The length of the first transfer channel in the transfer direction is greater than the length of the silicon rod to be cut.

[0039] The first bearing platform is arranged on the first transfer channel and is configured to bear the silicon rod. After being borne by the first bearing platform, the silicon rod is horizontally arranged, i.e., the axis of the silicon rod is consistent with the transfer direction (i.e., the first direction).

[0040] The first transfer driving mechanism is configured to drive the first bearing platform and the silicon rod borne thereby to move along the transfer direction on the first transfer channel.

[0041] In some embodiments, the first bearing platform comprises at least two first bearing members arranged at intervals along the transfer direction.

[0042] In some embodiments, the first bearing member comprises a first bearing support and a first bearing structure. The first bearing support is arranged on the first transfer rail of the first transfer channel, and the first bearing structure is configured to bear the silicon rod to be cut and contact the arc surface of the silicon rod to be cut.

[0043] In some implementations, please refer to Figure 5 , which shows a structural schematic diagram comprising the first silicon rod transfer device. As shown inFigure 5 As shown, the whole of the first carrier 121 is a Y-shaped carrier structure. The first carrier can adopt a Y-shaped carrier structure. The bottom of the Y-shaped carrier structure serves as a carrier support, and the upper fork of the Y-shaped carrier structure serves as a first carrier structure, with the inner side slopes of the upper fork in contact with the curved surface of the silicon rod to be cut. The top of the upper fork of the Y-shaped carrier structure can also have a certain width. When the Y-shaped carrier structure is used to carry a horizontally placed silicon rod to be cut, the upper fork (i.e., the V-shaped part) of the Y-shaped carrier structure carries the silicon rod to be cut, with the two inner side slopes of the upper fork in contact with the curved surface of the silicon rod to be cut, so that the silicon rod to be cut with a circular cross section can also be centered, i.e., the axis of the silicon rod to be cut corresponds to the center of the upper intersection (i.e., the bottom groove of the V-shaped part).

[0044] As described above, the first carrier platform includes at least two first carriers arranged at intervals along the transfer direction, and the carrier surface formed by the first carriers is adapted to the length of the silicon rod to be carried.

[0045] In some embodiments, the first carrier platform further includes a first carrier driving mechanism for driving at least one first carrier to move along the transfer direction to adjust the carrier spacing between the two first carriers to accommodate silicon rods of different lengths.

[0046] In some embodiments, the first carrier driving mechanism includes a first carrier movement guide rail arranged along the transfer direction, and a first carrier driving unit for driving at least one first carrier to move along the first carrier movement guide rail.

[0047] In some embodiments, the first carrier driving unit can include an adjustment toothed rail arranged along the transfer direction, an adjustment gear associated with the first carrier to be moved, and the adjustment gear is in mesh with the adjustment toothed rail, and an adjustment driving source for driving the adjustment gear to rotate to move the associated first carrier along the transfer direction. When at least two first carriers in the first carrier platform are to be provided with a carrier driving unit, a common adjustment toothed rail can be shared, for example, when two first carriers are to be provided with the above-mentioned first carrier driving unit, a common adjustment toothed rail, a first adjustment gear and a first adjustment driving source associated with the first first carrier, and a second adjustment gear and a second adjustment driving source associated with the second first carrier can be included.

[0048] In some embodiments, the first carrier driving unit can include an adjusting screw disposed along the transfer direction and associated with the first carrier, and a screw driving source for driving the transfer screw to rotate to move the associated first carrier along the transfer direction. When at least two first carriers in the first carrier platform are to be provided with the first carrier driving unit, a common adjusting screw can be used, which can be a bidirectional screw, for example. When two first carriers are to be provided with the first carrier driving unit described above, the common adjusting screw can include a bidirectional screw and a screw driving source, the bidirectional screw having threads at opposite ends with opposite directions, and the opposite ends of the bidirectional screw being associated with the opposite two first carriers, respectively. In actual applications, the bidirectional screw is driven by the screw driving source (such as a servo motor) to rotate to move the associated opposite two first carriers along the bidirectional screw in opposite directions (the two first carriers moving towards each other) or in the same direction (the two first carriers moving away from each other).

[0049] The first transfer driving mechanism is configured to drive the first carrier platform and the silicon rod carried thereby to move along the transfer direction on the first transfer channel.

[0050] In some embodiments, the first transfer driving mechanism includes a first platform transfer rail disposed along the transfer direction, and a first transfer driving unit configured to drive the first carrier platform to move along the first platform transfer rail.

[0051] In some embodiments, the first transfer driving unit includes a transfer rack, a transfer gear, and a gear driving source. The transfer rack is disposed along the transfer direction. The transfer gear is associated with the first carrier platform and engages with the transfer rack. In some embodiments, the transfer gear is associated with at least two first carriers in the first carrier platform. The transfer gear can be associated with at least two first carriers in the first carrier platform by connecting the at least two first carriers through a connecting structure (such as a frame, a connecting plate, a connecting rack, etc.), and the driving gear is disposed on the connecting structure. The gear driving source is configured to drive the transfer gear to rotate to move the associated first carrier platform along the transfer direction. The gear driving source can be a servo motor, for example.

[0052] In some embodiments, the first transfer driving unit comprises a transfer screw rod and a screw rod driving source. The transfer screw rod is arranged along a transfer direction and is associated with the first carrying platform. In some embodiments, the transfer screw rod is associated with at least two first carriers in the first carrying platform. The association between the transfer screw rod and the at least two first carriers in the first carrying platform can be achieved by means of connecting structure (e.g. frame, connecting plate, connecting frame, etc.) that combines the at least two first carriers, and the transfer screw rod is associated with the connecting structure. The screw rod driving source is used to drive the transfer screw rod to rotate so as to move the associated first carrying platform along the transfer direction. The screw rod driving source may, for example, be a servo motor.

[0053] In practical applications, the first carrier driving mechanism and the first transfer driving mechanism overlap in part of their functions, and therefore, in some embodiments, the function of the first carrier driving mechanism to drive at least one first carrier to move along the transfer direction to adjust the carrying interval between the two first carriers can be accomplished by the first transfer driving mechanism.

[0054] The first silicon rod cutting device is arranged on the first cutting station and is used to perform first cutting operation on the silicon rod to be cut carried by the first silicon rod transfer device at the first cutting position of the first cutting station, so as to cut off the opposite two side skins of the silicon rod to be cut with circular cross section, so that the silicon rod forms two parallel first side cutting surfaces.

[0055] The first silicon rod cutting device comprises at least one first wire cutting unit, which comprises a plurality of first cutting wheels and a first cutting wire. The first cutting wire is sequentially arranged around the plurality of first cutting wheels to form at least one first wire saw. The at least one first wire saw is located in a vertical plane and is arranged along the vertical direction or at an angle with the vertical direction. The first cutting operation on the silicon rod to be cut carried by the first silicon rod transfer device is performed by the relative movement between the at least one first wire saw and the first silicon rod transfer device and the silicon rod to be cut carried thereby at the first cutting station. In some embodiments, the first cutting wire is arranged in a ring shape with the head connected to the tail, and at this time, the first cutting wire can also be referred to as a closed loop cutting wire.

[0056] In some embodiments, as shown in Figure 1 and Figure 2 The first silicon rod cutting device 13 comprises two first wire cutting units 131 arranged in parallel. Each first wire cutting unit comprises a plurality of first cutting wheels and a first cutting wire. The first cutting wire is arranged around the plurality of first cutting wheels to form at least one first wire saw, wherein the first wire saw is arranged along the vertical direction or at an angle with the vertical direction.

[0057] Referring to Figure 4 , a schematic diagram of a first wire cutting unit in a first silicon rod cutting device is shown. As shown, the first silicon rod cutting device 13 includes two first wire cutting units 131. The first wire cutting unit 131 includes a plurality of first cutting wheels 132 and a first cutting wire 134, the first cutting wire 134 being wound around the plurality of first cutting wheels 132 to form at least one first cutting wire saw 135, wherein the first cutting wire saw 135 is arranged along a vertical direction or at an angle to the vertical direction. In addition, the first silicon rod cutting device 13 can also include a first cutting mounting structure 130, and the plurality of first cutting wheels 132 are arranged on the first cutting mounting structure 130.

[0058] In some embodiments, the plurality of first cutting wheels in the first wire cutting unit are connected to the first cutting mounting structure, or the plurality of first cutting wheels are arranged on the first cutting mounting structure through a support, a connecting plate, or a mounting frame, the first cutting mounting structure serving as a carrier for associating the plurality of first cutting wheels in the first wire cutting unit with the first cutting frame or the first cutting seat. The specific form of the first cutting mounting structure can be a beam body, a plate frame, a support, etc., and the present application does not make any limitation.

[0059] In the silicon rod cutting and grinding all-in-one machine, the first cutting wire saw in the first wire cutting unit of the first silicon rod cutting device is arranged along a vertical direction or at an angle to the vertical direction.

[0060] In the first wire cutting unit, at least one first cutting wire groove for winding the cutting wire is arranged in the first cutting wheel, the first cutting wire groove can define the position of the first cutting wire to control the cutting accuracy. Any first cutting wire saw is formed between two oppositely arranged first cutting wheels by winding the first cutting wire around the two first cutting wheels, and the positions of the two first cutting wheels and the positional relationship between the two first cutting wheels can be used to determine the direction of the first cutting wire saw.

[0061] As Figure 4As shown, in some embodiments, the first cutting installation structure 130 is a rectangular frame as a whole, the first cutting unit includes a plurality of first cutting wheels 132, for example, four first cutting wheels 132, which are respectively arranged near the four corners of the first cutting installation structure 130, and the wheel surface of each first cutting wheel 132 is located in a vertical plane (the vertical plane is composed of the first direction and the third direction), wherein two first cutting wheels 132 are arranged in front (relatively closer to the first loading and unloading area) and in parallel in the up-down direction, and the other two first cutting wheels 132 are arranged in the rear (relatively farther away from the first loading and unloading area) and in parallel in the up-down direction, and the first cutting wire 134 is wound around the four first cutting wheels 132 to form at least one first cutting wire saw 135 (for example, the first cutting wire saw 135 is formed between the two first cutting wheels 132 arranged in parallel in the up-down direction), and the first cutting wire saw 135 is arranged along the third direction (i.e., the vertical direction). In addition, in order to enable the first cutting wire saw 135 to effectively cut the silicon rod, the first cutting wire saw 135 interferes with the silicon rod in the vertical direction.

[0062] In some embodiments, the first cutting wire is wound between each first cutting wheel in a head-to-tail manner to form a ring-shaped cutting wire (also referred to as a closed-loop cutting wire). Figure 2 and Figure 3 In the embodiment shown, the first cutting wire 134 is wound between the plurality of first cutting wheels 132 in a head-to-tail manner to form a ring-shaped cutting wire (also referred to as a closed-loop cutting wire).

[0063] The plurality of first cutting wheels in the first cutting unit are wound by a ring-shaped cutting wire. In this example, the first silicon rod cutting device can dispense with the wire storage drum. The ring-shaped cutting wire can be driven by the cutting wire driving device to maintain high-speed operation, and at the same time, the ring-shaped cutting wire can run in the same running direction during the cutting operation. In this way, the first silicon rod cutting device can achieve high-precision first cutting operation, avoiding the problems of the cutting surface having ripples and the like caused by the running direction reversal or running speed of the cutting wire in the existing cutting method; at the same time, the ring-shaped cutting wire can effectively reduce the total length of the cutting wire required by the first wire cutting unit, thereby reducing production costs.

[0064] In some embodiments, the cutting wire driving device is a motor having a power output shaft, and the power output shaft is connected to the first cutting wheel. In this way, the first cutting wire can be driven by the second cutting wheel to run in the winding direction. Of course, in specific embodiments, the cutting wire driving device can also be another driving source such as a hydraulic motor, as long as it can drive the first cutting wire to run, which is not limited in the present application.

[0065] The first wire cutting unit in this application may further include a first transition wheel, which is used to reverse or guide the first cutting wire, or the first transition wheel can be used to adjust the tension of the first cutting wire. The number of the first transition wheels may be one or more depending on the layout requirements.

[0066] The first transition wheel, while guiding and tractioning the first cutting line, also serves as a tensioning wheel for adjusting the tension of the first cutting line. The tensioning wheel is used to adjust the tension of the first cutting line, which can reduce the probability of the first cutting line breaking and thus reduce material consumption.

[0067] like Figure 4 As shown, in the first wire cutting unit, the first cutting mounting structure 130 is a rectangular frame. Each first wire cutting unit 131 includes multiple first cutting wheels 132 and multiple first transition wheels 133, for example, two first cutting wheels 132 and two first transition wheels 133, which are respectively located near the four corners of the first cutting mounting structure 130. The wheel surfaces of the two first cutting wheels 132 and the two first transition wheels 133 are located in the vertical plane. The two first cutting wheels 132 are arranged in front and parallel vertically, and the two first transition wheels 133 are arranged in the back and parallel vertically. The first cutting line 134 is wound around the two first cutting wheels 132 and the two first transition wheels 133 to form at least one first cutting wire saw 135 (for example, the first cutting wire saw 135 is formed between the two first cutting wheels 132). The at least one first cutting wire saw 135 is arranged vertically.

[0068] As mentioned above, the first cutting line 134 is wound around a plurality of first cutting wheels 132 or a plurality of first cutting wheels 132 and a plurality of first transition wheels 133 to form a first cutting line saw 135 between the two preceding first cutting wheels 132. Therefore, to adjust the line length of the first cutting line saw 135, the spacing between the two first cutting wheels 132 can be adjusted, which can be achieved by changing the position of at least one of the two first cutting wheels 132.

[0069] The first wire saw is located in the vertical plane and is arranged along the vertical direction or at an angle to the vertical direction. The silicon rod to be cut, carried by the first silicon rod transfer device at the corresponding first cutting station, is placed horizontally (the axis of the silicon rod to be cut is arranged along the transfer direction). Therefore, in order to cut the silicon rod to be cut, the length of the first wire saw is adapted to the size of the end face of the silicon rod to be cut. For example, the length of the first wire saw should be greater than or equal to the diameter of the silicon rod to be cut or the chord length of the silicon rod to be cut at the cutting position.

[0070] The direction of the first cutting wheel surface has a corresponding relationship with the running direction of the first cutting wire saw. It should be understood that the first cutting wheel surface is parallel to the plane in which any first cutting wire groove in the first cutting wheel is located. In order to control the cutting accuracy and the stability of the cutting process, the first cutting wire saw should be located in the plane in which the first cutting wire groove for winding the first cutting wire is located. Meanwhile, during the cutting process, the force direction of the silicon rod to the first cutting wire should be parallel to the cutting wire groove, that is, the cutting wheel surface is parallel to the cutting direction, and the cutting direction in the first cutting operation is the axial direction of the silicon rod, that is, the transfer direction (i.e., the first direction X-axis).

[0071] The first silicon rod cutting device comprises two first wire cutting units arranged in parallel, and each first wire cutting unit has a first cutting wire saw. Therefore, the two first wire cutting units form two parallel cutting wire saws. Figure 3 In the embodiment shown in the figure, the first silicon rod cutting device comprises two first wire cutting units arranged in parallel along the second direction, and each first wire cutting unit has a first cutting wire saw arranged vertically. Therefore, the two first wire saws belonging to the two first wire cutting units are both arranged vertically.

[0072] In fact, the first cutting wire saw can still have other variations. In some embodiments, the first cutting wire saw is arranged vertically, but it is not limited thereto. In other embodiments, the first cutting wire saw can be arranged in a vertical plane formed by the first direction and the third direction (i.e., the vertical direction) at an angle of less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with respect to the third direction (i.e., the vertical direction). That is, the first cutting wire saw can be arranged in a vertical plane with respect to the third direction (i.e., the vertical direction) at an angle of less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with respect to the third direction (i.e., the vertical direction). The angle here is not limited to an integer angle, but can be any angle within a limited range, such as 0.09°, 1.3°, 2.5°, 3°, etc. In some embodiments, two first cutting wheels arranged above and below to form the first cutting wire saw, the upper first cutting wheel is in front in the first direction and the lower first cutting wheel is behind in the first direction, and the first cutting wire saw formed thereby can form a positive angle with respect to the vertical direction. In some embodiments, two first cutting wheels arranged above and below to form the first cutting wire saw, the upper first cutting wheel is behind in the first direction and the lower first cutting wheel is in front in the first direction, and the first cutting wire saw formed thereby can form a negative angle with respect to the vertical direction. The angle of the angle (including the positive angle and the negative angle) can be changed according to the cutting process requirements and the size specifications of the silicon rod, for example, by changing the position of one or both of the two first cutting wheels arranged above and below in relation to the first cutting wire saw to adjust the angle of the angle.

[0073] In some embodiments, the first wire cutting unit further comprises a first tension adjusting mechanism. In wire cutting processing, the size of the cutting wire tension affects the yield and processing accuracy in cutting, and the first tension adjusting mechanism detects the tension and adjusts the tension to make the tension of the first cutting wire reach a certain threshold value and remain a constant value or a certain range allowed as the numerical center of the constant value.

[0074] The first tension adjusting mechanism is associated with the first transition wheel 133 or the first cutting wheel. The first transition wheel 133 in the wire cutting unit functions as a tension wheel for adjusting the tension of the cutting wire while achieving the guiding and pulling of the first cutting wire 134.

[0075] The tensioning wheel is used to adjust the tension of the cutting wire, which can reduce the probability of cutting wire breakage to reduce consumables. In the cutting operation, the cutting wire plays a crucial role, but even the best cutting wire has limited extension and wear resistance, that is, the cutting wire will gradually thin out during continuous operation until it is eventually pulled apart. Therefore, the current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the extension of the cutting wire during the round trip, and the tensioning wheel is one of the implementation means.

[0076] In some embodiments, taking the tensioning wheel as an example, the tension adjusting mechanism at least includes: a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel, continuously senses the tension value of the cutting wire on the transition wheel, and sends a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and starts to work after receiving the driving signal sent by the tension sensor; one end of the lead screw is connected to the transition wheel, and the other end is connected to the servo motor, and when the servo motor works, it drags the transition wheel to move unidirectionally to adjust the tension of the cutting wire.

[0077] In some embodiments, the tension adjusting mechanism includes: a linkage assembly and a tension driving unit, the linkage assembly is associated with the transition wheel as the tensioning wheel and the tension driving unit, and the linkage assembly is controlled by the tension driving unit, that is, the linkage assembly is driven by the tension driving unit to drive the transition wheel to change position to adjust the tension of the closed loop cutting wire.

[0078] Regarding the tension driving unit, in some implementations, the tension driving unit can include a counterweight part, which can be associated with the linkage assembly. For example, taking a certain transition wheel as a tensioning wheel as an example, when the tension of the closed loop cutting wire needs to be increased, the counterweight part is released, the counterweight part descends, and the linkage assembly drives the associated tensioning wheel to move under the action of the gravity of the counterweight part, thereby expanding the circumference of the figure surrounded by each cutting wheel and the transition wheel, and increasing the tension of the closed loop cutting wire. When the tension of the closed loop cutting wire needs to be reduced, the counterweight part is lifted, and the linkage assembly drives the associated tensioning wheel to move in the opposite direction under the action of the gravity of the counterweight part, thereby expanding the circumference of the figure surrounded by each cutting wheel and the transition wheel, and reducing the tension of the closed loop cutting wire.

[0079] The counterweight part can include counterweight blocks, wherein the number of counterweight blocks can vary according to the requirements of the closed loop cutting wire tension adjustment, for example, the number of counterweight blocks can be increased when the tension of the closed loop cutting wire needs to be increased, and the number of counterweight blocks can be reduced when the tension of the closed loop cutting wire needs to be reduced.

[0080] In some embodiments, the counterweight portion can include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting mounting structure, so that the counterweight portion and the cutting mounting structure are switched from a movable state to a locked state. In some examples, the locking mechanism can be, for example, a latch.

[0081] The tension drive unit can still be varied in other ways. For example, in some implementations, the tension drive unit can include a tension cylinder.

[0082] In some embodiments, the first silicon rod cutting device further includes at least one first distance adjusting mechanism disposed in the at least one first wire cutting unit, for driving the plurality of first cutting wheels in the first wire cutting unit to move in a direction perpendicular to the cutting wheel surface. The first silicon rod cutting device can switch the first cutting wire between different cutting grooves of the first cutting wheels, or adjust the position of the first cutting wire saw to change the cutting position (or machining specification) relative to the silicon rod, based on the distance adjusting mechanism.

[0083] In some implementations, taking one first wire cutting unit in the first silicon rod cutting device as an example, the first wire cutting unit includes a plurality of first cutting wheels and a plurality of first transition wheels. The carrier for carrying the plurality of first cutting wheels and the first transition wheels is, for example, a first cutting mounting structure, and the first distance adjusting mechanism can be used to drive the first cutting mounting structure as a whole to move in a direction perpendicular to the cutting wheel surface. The first transition wheels and the first cutting wheels jointly follow the first cutting mounting structure to move in the direction perpendicular to the cutting wheel surface (i.e., the transposition direction or the second direction Y-axis), and in this state, the plurality of first cutting wheels and the first transition wheels are relatively stationary, i.e., the positional relationship between the first transition wheels and the first cutting wheels does not change. At this time, the first distance adjusting mechanism is used to adjust the cutting position of the at least one first wire cutting saw in the at least one first wire cutting unit relative to the silicon rod.

[0084] In some implementations, each first cutting wheel has at least two first cutting wire grooves, different first cutting wire grooves are parallel to each other, and different first cutting wire grooves have a cutting offset in the direction perpendicular to the cutting wheel surface. When the first distance adjusting mechanism is used to drive the plurality of first cutting wheels in the first wire cutting unit to move relative to the first cutting mounting structure, the position of the first cutting wire around the wire groove on the first cutting wheel can be changed. In some implementations, the plurality of first cutting wheels in the first wire cutting unit can be connected to a support, where the support is movably arranged on the first cutting mounting structure and is driven by the first distance adjusting mechanism to move in the direction perpendicular to the cutting wheel surface.

[0085] When the at least one first lead adjusting mechanism is used to realize the transformation of the first cutting line winding around the cutting line grooves of the plurality of first cutting wheels in the at least one first wire cutting unit, in an actual scenario, the first cutting line grooves respectively corresponding to the first cutting line before and after the groove replacement can be determined in advance, for example, the first cutting line is located at the first cutting line groove a1 before the groove replacement, and the first cutting line is wound around the first cutting line groove a2 after the groove replacement. The displacement amount of the plurality of first cutting wheels in the first wire cutting unit driven by the first lead adjusting mechanism to move is determined based on the cutting offset amount between the first cutting line groove a1 and the first cutting line groove a2, that is, the displacement amount is set as the cutting offset amount between the first cutting line groove a1 and the first cutting line groove a2, so as to realize the replacement of the first cutting line from the first cutting line groove a1 to the first cutting line groove a2. It should be noted that the direction of the plurality of first cutting wheels in the first wire cutting unit driven by the at least one first lead adjusting mechanism to move along the perpendicular direction of the first cutting wheel surface is the direction in which the cutting line groove a2 points to the cutting line groove a1. After the groove replacement, the cutting position of the first wire saw in space is unchanged, so that the step of further calibrating the position of the first cutting wheel or other components can be omitted, and the silicon rod can be cut according to the preset cutting amount, so that the groove replacement process is simplified.

[0086] To further illustrate the implementation manner of the at least one first lead adjusting mechanism to realize the movement of the plurality of first cutting wheels in the first wire cutting unit along the direction perpendicular to the surface of the first cutting wheel, the present application discloses the following embodiments. When the number of the first wire cutting units in the first silicon rod cutting device is different, the specific form of the at least one first lead adjusting mechanism can be changed accordingly.

[0087] In some embodiments, the first silicon rod cutting device includes a single wire cutting unit, where the single wire cutting unit is a first wire cutting unit. The first lead adjusting mechanism includes a lead screw arranged along the orthogonal direction of the surface of the first cutting wheel and threadedly connected with the single wire cutting unit; and a lead screw driving source for driving the lead screw to rotate.

[0088] The first single-wire cutting unit includes a plurality of first cutting wheels, and a first cutting wire is wound around the plurality of first cutting wheels to form at least one first cutting wire saw. The lead screw of the first lead adjusting mechanism has a distal end and a proximal end. In specific implementations, the proximal end of the lead screw can be connected to a lead screw driving source and rotated under the driving of the lead screw driving source, and the distal end of the lead screw is threadedly connected to the first single-wire cutting unit. Through the connection of the two ends of the lead screw, the lead screw can be rotated based on the transmission of the lead screw driving source and convert the rotation of the lead screw into axial displacement by means of the threaded connection. The axial displacement direction is the setting direction of the lead screw, that is, the orthogonal direction of the wheel surface of the cutting wheel. The displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the first cutting wheel can be realized by driving the rotation of the lead screw of the first lead adjusting mechanism by the lead screw driving source. The advancing or retreating of the first cutting wheel of the single-wire cutting unit in the orthogonal direction of the wheel surface of the first cutting wheel can be realized by the rotation direction of the lead screw driven to rotate.

[0089] In some embodiments, the first silicon rod cutting device includes a single-wire cutting unit, where the single-wire cutting unit is a first wire cutting unit. The first lead adjusting mechanism includes a telescopic member arranged in the orthogonal direction of the wheel surface of the first cutting wheel and associated with the single-wire cutting unit, and a telescopic member driving source for driving the telescopic member to perform telescopic movement in the orthogonal direction of the wheel surface of the first cutting wheel. In this case, the telescopic member can be arranged in the form of a rod body, and the extension direction of the rod body is the orthogonal direction of the wheel surface of the first cutting wheel. The telescopic member can be driven to perform telescopic movement in the extension direction thereof by the telescopic member driving source. One end of the telescopic member can be connected to the telescopic member driving source, and the freely extendable end is associated with the single-wire cutting unit. The first cutting wheel of the single-wire cutting unit can be moved in the orthogonal direction of the wheel surface of the first cutting wheel under the action of the telescopic member driving source. The telescopic member can be, for example, an electric telescopic rod or a connecting rod connected to an air cylinder, which can serve as the telescopic member driving source. The application is not limited in this regard. The telescopic rod can be directly connected to the first cutting mounting structure of the single-wire cutting unit or indirectly connected to the first single-wire cutting unit through a support or a bearing. It should be understood that the extension or contraction of the telescopic member can correspond to the advancing or retreating of the single-wire cutting unit in the orthogonal direction of the wheel surface of the first cutting wheel.

[0090] In this case, in the embodiments disclosed in the present application, the association can be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above-mentioned embodiments, the telescopic rod can be associated with the first wire cutting unit by one or more of clamping, screwing, bonding, and welding. Of course, the implementation of the association is not limited to this, but is intended to achieve transmission in the second direction.

[0091] In some embodiments, the first silicon rod cutting device comprises a single wire cutting unit, and the single wire cutting unit is one wire cutting unit. The first distance adjusting mechanism comprises a rack arranged in the orthogonal direction of the first cutting wheel surface of the first single wire cutting unit, a transmission gear meshing with the rack, and a gear driving source for driving the transmission gear to rotate. The transmission gear rotates under the driving of the gear driving source, and the rack meshing with the transmission gear moves in the rack step direction accordingly. In this example, the rotation movement driven by the gear driving source is converted into linear movement in the rack direction through the cooperation of the rack and the transmission gear. The rack arranged in the orthogonal direction of the first cutting wheel surface of the first single wire cutting unit can drive the first cutting wheel of the single wire cutting unit to move in the orthogonal direction of the first cutting wheel surface. At the same time, the rotation direction of the transmission gear is controlled by the gear driving source, so that the plurality of first cutting wheels of the single wire cutting unit can advance or retreat in the orthogonal direction of the first cutting wheel surface.

[0092] In some embodiments, as shown in Figure 4 The first silicon rod cutting device comprises two first wire cutting units arranged in parallel and opposite directions. At least one of the two first wire cutting units can be driven to move in the orthogonal direction of the first cutting wheel surface by the at least one distance adjusting mechanism, so as to adjust the wire saw distance between the first wire saws in the two first wire cutting units or change the cutting wire slot of the first cutting wire around the plurality of first cutting wheels in a certain first wire cutting unit.

[0093] The at least one first distance adjusting mechanism can be connected to a certain first wire cutting unit, or simultaneously associated with the two first wire cutting units, so as to drive the plurality of first cutting wheels in the connected or associated first wire cutting unit or units to move in the orthogonal direction of the first cutting wheel surface.

[0094] In some embodiments, the first distance adjusting mechanism comprises a lead screw arranged in the orthogonal direction of the first cutting wheel surface and threadedly connected to a certain first wire cutting unit, and a lead screw driving source for driving the lead screw to rotate. The plurality of first cutting wheels in the first wire cutting unit connected to the lead screw driving source move in the orthogonal direction of the first cutting wheel surface in a similar manner as in the foregoing embodiments. The first wire cutting unit connected to the lead screw driving source can be regarded as a single wire cutting unit, which will not be described here. It should be understood that the first distance adjusting mechanism arranged on any first wire cutting unit can increase and decrease the parallel first wire saw distance between the two first wire cutting units, and the first silicon rod cutting device can cut silicon rods into different specifications.

[0095] In some embodiments, the first distance adjusting mechanism comprises a telescopic member and a telescopic member driving source, the telescopic member is arranged along the normal direction of the first cutting wheel surface and is associated with one of the first wire cutting units; the telescopic member driving source is used to drive the telescopic member to perform telescopic movement along the normal direction of the first cutting wheel surface. Here, the first wire cutting unit associated with the first distance adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation manner can refer to the foregoing embodiments, which will not be described here again.

[0096] In some embodiments, the first distance adjusting mechanism comprises a distance adjusting rack, a transmission gear and a gear driving source, the distance adjusting rack is arranged along the normal direction of the first cutting wheel surface and is associated with one of the first wire cutting units; the transmission gear is engaged with the distance adjusting rack; the gear driving source is used to drive the transmission gear to rotate. Through the transmission gear and the distance adjusting rack engaged with each other, the gear driving source can control the distance adjusting rack to move along the rack direction line, and the first wire cutting unit associated with the distance adjusting rack can drive a plurality of first cutting wheels to move along the normal direction of the first cutting wheel surface through the distance adjusting rack.

[0097] In some embodiments, the distance adjusting mechanism comprises a bidirectional screw rod and a screw rod driving source, the bidirectional screw rod is arranged along the normal direction of the first cutting wheel surface and is threadedly connected with two first wire cutting units; the screw rod driving source is used to drive the screw rod to rotate so that the two first wire cutting units move towards each other or move away from each other along the normal direction of the first cutting wheel surface. In an implementation, the bidirectional screw rod is a double-thread screw rod, the bidirectional screw rod is respectively provided with threads at two ends and the threads at the two ends are opposite in direction, and the screw rod driving source can be arranged at any one end of the bidirectional screw rod to drive the bidirectional screw rod to rotate along the screw rod shaft. Through the threads at the two ends of the bidirectional screw rod opposite in direction, the movement of the two ends of the bidirectional screw rod is converted into axial linear movement opposite in direction when the bidirectional screw rod is driven to rotate by the screw rod driving source, and the axis direction is the normal direction of the first cutting wheel surface where the bidirectional screw rod is arranged. When the screw rod driving source is driven, a plurality of first cutting wheels corresponding to the two first wire cutting units respectively can move towards each other or move away from each other.

[0098] In some embodiments, the first adjustment mechanism includes a servo motor disposed on at least one first wire cutting unit. In practical scenarios, a servo motor is disposed on at least one or each first wire cutting unit of the first silicon rod cutting device, and the servo motor controls the displacement of the corresponding first wire cutting unit in the orthogonal direction of the first cutting wheel surface. The first wire cutting unit can be driven by a predetermined cutting offset for slotting or an adjustment amount for changing the cutting position of the cutting line, and the servo motor precisely positions multiple first cutting wheels in the first wire cutting unit to move along the orthogonal direction of the first cutting wheel surface with a preset displacement. For example, the first silicon rod cutting device has two first wire cutting units, and at least one of the two first wire cutting units moves relatively independently along the orthogonal direction of the first cutting wheel surface under the drive of its corresponding servo motor. In some examples, the servo motor can also be replaced by a travel motor and a travel screw. It should be understood that the first adjustment mechanism is a driving device for driving the relative movement of multiple first cutting wheels in the first wire cutting unit, and its specific form is not limited in this application.

[0099] As mentioned above, in the first silicon rod cutting device, the first cutting wire saws of two parallel first wire cutting units are arranged vertically or at an angle to the vertical, driving the first silicon rod transfer device and the silicon rod it carries to move along the transfer direction. Through the relative movement of the first wire cutting unit and the first silicon rod transfer device along the transfer direction, the first cutting wire saws of the two first wire cutting units perform the first cutting operation on the silicon rod carried by the first silicon rod transfer device. By using the first wire cutting unit to cut the silicon rod, the silicon rod forms a cutting surface and an edge. That is, by cutting the silicon rod with one cutting wire saw in one first wire cutting unit, a cutting surface can be formed on the silicon rod, leaving an edge. Therefore, by using the first cutting wire saws of the two parallel first wire cutting units in the first silicon rod cutting device to perform the first cutting operation on a silicon rod with a circular cross-section, the silicon rod can form two parallel first side cut surfaces.

[0100] The silicon rod squaring equipment includes a first edge anti-splitting device that cooperates with the first silicon rod transfer device, used to stabilize the edge when the first silicon rod cutting device performs the first cutting operation on the silicon rod.

[0101] It should be understood that the silicon rod carried by the first silicon rod transfer device is horizontal, that is, the axis of the silicon rod is aligned with the transfer direction (i.e., the first direction X-axis). Therefore, the edge formed by the first silicon rod cutting device performing the first cutting operation on the silicon rod is also horizontal.

[0102] In some embodiments, the first edge-skin anti-splitting device includes a clamping support and an edge-skin clamp, wherein the edge-skin clamp is disposed on the clamping support and is used to clamp the edge-skin.

[0103] The edge clamp includes: a clamping base, at least one pair of end face clamps, and a clamp driving mechanism. The at least one pair of end face clamps are arranged opposite each other along the transfer direction and are used to clamp the two end faces of the silicon rod. The first silicon rod transfer device includes a first edge anti-splitting device, which cooperates with the first silicon rod transfer device to clamp the end faces of the silicon rod during the first cutting operation to prevent edge splitting.

[0104] In some embodiments, the first edge-skin anti-splitting device includes: a clamping support and an edge-skin clamp. Figure 4 and Figure 5 In the illustrated embodiment, the first edge-skin anti-splitting device 16 includes a clamping support 161 and an edge-skin clamp 162. The clamping support of the first edge-splitting device is associated with the first bearing platform of the first silicon rod transfer device, that is, the clamping support of the first edge-splitting device and the first bearing platform of the first silicon rod transfer device can move forward and backward together.

[0105] The edge leather clamp is mounted on the clamping support. In some embodiments, the edge leather clamp includes a clamping base, at least one pair of end face clamps, and a clamp drive mechanism. Figure 5 In the embodiment shown, the edge clamp 162 includes a clamp base 1621, a pair of end face clamps 1622 arranged opposite each other along the clamping direction, and a clamp drive mechanism.

[0106] The chuck driving mechanism is used to drive at least one of the at least one pair of end face chucks to move along the clamping direction to adjust the clamping distance between the at least one pair of end face chucks. In some embodiments, the chuck driving mechanism includes: a chuck moving guide rail arranged along the clamping direction; and a chuck driving unit for driving at least one of the at least one pair of end face chucks to move along the chuck moving guide rail.

[0107] In some embodiments, a chuck moving guide rail may be provided between the first end face chuck and the second end face chuck in at least one pair of end face chucks. For example... Figure 5 As shown, a moving guide assembly is provided between the first end face chuck and the second end face chuck in at least one pair of end face chucks. The moving guide assembly includes one or more moving guide rods or moving guide beams 1623, and a moving guide rail is provided on the moving guide rods or moving guide beams 1623.

[0108] In some embodiments, the chuck drive unit includes at least one chuck telescopic assembly. For example... Figure 5As shown, the chuck telescopic assembly includes a chuck telescopic rod and a chuck telescopic cylinder, the chuck telescopic rod is arranged along the clamping direction and associated with the corresponding one of the end face chucks, and the chuck telescopic cylinder is associated with the chuck telescopic rod. In some embodiments, the chuck driving mechanism is configured to drive two of the pair of end face chucks to move towards or away from each other along the clamping direction, and the chuck driving mechanism includes a pair of chuck telescopic assemblies, each of which corresponds to one of the end face chucks, the chuck telescopic rod in the chuck telescopic assembly is arranged along the clamping direction and associated with the corresponding one of the end face chucks, and the chuck telescopic cylinder in the chuck telescopic assembly is associated with the chuck telescopic rod. The chuck telescopic cylinder in the pair of chuck telescopic assemblies is controlled to retract or extend the corresponding chuck telescopic rod, thereby driving the pair of end face chucks to move towards or away from each other along the movement guide rail on the movement guide rod or the movement guide beam. In some embodiments, the chuck driving mechanism is configured to drive one of the pair of end face chucks to move towards or away from the other end face chuck along the clamping direction, and the chuck driving mechanism includes a chuck telescopic assembly corresponding to the end face chuck to be moved, the chuck telescopic rod in the chuck telescopic assembly is arranged along the clamping direction and associated with the corresponding one of the end face chucks, and the chuck telescopic cylinder in the chuck telescopic assembly is associated with the chuck telescopic rod. The chuck telescopic cylinder in the chuck telescopic assembly is controlled to retract or extend the corresponding chuck telescopic rod, thereby driving the corresponding one of the end face chucks to move towards or away from the other end face chuck along the movement guide rail on the movement guide rod or the movement guide beam.

[0109] In some embodiments, the chuck driving unit includes at least one pair of clamping racks, a driving gear, and a gear driving source. The at least one pair of clamping racks are respectively associated with the at least one pair of end face chucks, i.e., a first clamping rack in the at least one pair of clamping racks is arranged along the clamping direction and associated with a first end face chuck in the at least one pair of end face chucks, a second clamping rack in the at least one pair of clamping racks is arranged along the clamping direction and associated with a second end face chuck in the at least one pair of end face chucks, and the first clamping rack and the second clamping rack in the at least one pair of clamping racks are arranged in a tooth-tooth opposite manner. The driving gear is engaged with the pair of clamping racks, i.e., the driving gear is located between the first clamping rack and the second clamping rack of the pair of clamping racks and engaged with the first clamping rack and the second clamping rack respectively. The gear driving source is configured to drive the driving gear to rotate to drive the engaged at least one pair of clamping racks to drive the associated at least one pair of end face chucks to move towards or away from each other along the clamping direction, wherein the gear driving source can be, for example, a servo motor, and an output shaft of the servo motor is associated with the driving gear.

[0110] In practical application, the servo motor as the gear driving source rotates forward to drive the associated driving gear to rotate forward, so that the first clamping rack and the second clamping rack meshing with the driving gear move towards each other, that is, the first end face chuck associated with the first clamping rack and the second end face chuck associated with the second clamping rack move towards each other, and the clamping interval between the first end face chuck and the second end face chuck is reduced. The servo motor as the gear driving source rotates reversely to drive the associated driving gear to rotate reversely, so that the first clamping rack and the second clamping rack meshing with the driving gear move away from each other, that is, the first end face chuck associated with the first clamping rack and the second end face chuck associated with the second clamping rack move away from each other, and the clamping interval between the first end face chuck and the second end face chuck is increased.

[0111] In some embodiments, the chuck driving unit comprises at least one pair of clamping racks, a linkage gear, and a chuck driving source. The at least one pair of clamping racks are respectively associated with at least one pair of end face chucks, that is, a first clamping rack in the at least one pair of clamping racks is arranged in the clamping direction and is associated with a first end face chuck in the at least one pair of end face chucks, a second clamping rack in the at least one pair of clamping racks is arranged in the clamping direction and is associated with a second end face chuck in the at least one pair of end face chucks, and the first clamping rack and the second clamping rack in the at least one pair of clamping racks are arranged in a tooth opposite manner. The linkage gear is meshed with the pair of clamping racks, that is, the linkage gear is located between the first clamping rack and the second clamping rack of the pair of clamping racks and is respectively meshed with the first clamping rack and the second clamping rack. The chuck driving source is associated with the at least one pair of end face chucks and is used to drive the at least one pair of end face chucks to move towards each other or away from each other in the clamping direction in cooperation with the at least one pair of clamping racks and the linkage gear, wherein the chuck driving source may, for example, be a telescopic cylinder, and two ends of the telescopic cylinder are respectively connected with the first end face chuck and the second end face chuck.

[0112] In practical application, the telescopic cylinder as the chuck driving source contracts, the contracted cylinder can drive the first clamping rack or the second clamping rack to move, through the first clamping rack, the second clamping rack, and the linkage gear between the first clamping rack and the second clamping rack, the associated first end face chuck and the second end face chuck are driven to move towards each other, and the clamping interval between the first end face chuck and the second end face chuck is reduced. The telescopic cylinder as the chuck driving source extends, the extended cylinder can drive the first clamping rack or the second clamping rack to move, through the first clamping rack, the second clamping rack, and the linkage gear between the first clamping rack and the second clamping rack, the associated first end face chuck and the second end face chuck are driven to move away from each other, and the clamping interval between the first end face chuck and the second end face chuck is increased.

[0113] In some embodiments, the chuck driving unit comprises at least one chuck clamping assembly, the chuck clamping assembly comprising a clamping screw rod and a screw rod driving source, the clamping screw rod being arranged along a clamping direction and associated with a corresponding one of the end face chucks, and the screw rod driving source being associated with the clamping screw rod. In some embodiments, the chuck driving mechanism is configured to drive two of the pair of end face chucks to move towards or away from each other along the clamping direction, and the chuck driving mechanism comprises a pair of chuck clamping assemblies, each of the chuck clamping assemblies corresponding to one of the end face chucks, the clamping screw rod of the chuck clamping assembly being arranged along the clamping direction and associated with the corresponding one of the end face chucks, and the screw rod driving source of the chuck clamping assembly being associated with the clamping screw rod. In some embodiments, the chuck driving mechanism is configured to drive one of the pair of end face chucks to move towards or away from the other one of the end face chucks along the clamping direction, and the chuck driving mechanism comprises a chuck clamping assembly corresponding to the end face chuck to be moved, the clamping screw rod of the chuck clamping assembly being arranged along the clamping direction and associated with the corresponding one of the end face chucks, and the screw rod driving source of the chuck clamping assembly being associated with the clamping screw rod. The screw rod driving source can be, for example, a servo motor.

[0114] In some embodiments, the chuck driving unit comprises a bidirectional screw rod and a screw rod driving source, the bidirectional screw rod being arranged along a clamping direction, the bidirectional screw rod having threads at two ends thereof with opposite thread directions, the two ends of the bidirectional screw rod being associated with at least one pair of end face chucks, and the screw rod driving source being associated with the bidirectional screw rod. In actual applications, the bidirectional screw rod is driven to rotate by the screw rod driving source (e.g. a servo motor) so as to cause the associated opposite end face chucks to move towards or away from each other along the clamping direction.

[0115] The at least one pair of end face chucks are arranged opposite to each other along the clamping direction, and are configured to clamp two end faces of the silicon rod.

[0116] In some embodiments, for each of the at least one pair of end face chucks, the end face chuck comprises a clamping base and a kerf pressing member provided on the clamping base, the kerf pressing member being configured to press against a kerf of the silicon rod to be cut.

[0117] The clamping base serves as a main body of the end face chuck, and is configured to provide a basis for the kerf pressing member. In some embodiments, the clamping base can be, for example, a clamping base plate, the size of which is adapted to the kerf to be cut, i.e. at least part or all of the clamping base plate covers the kerf to be cut.

[0118] In the end face chuck, the edge skin pressing member comprises an edge skin pressing screw arranged on the clamping base plate, and the number of the edge skin pressing screw can be one or more. In actual application, the edge skin pressing screw is used to press the edge skin to be cut, so as to ensure that the edge skin to be cut in the silicon rod remains stable in the first cutting operation.

[0119] Of course, in some embodiments, in the end face chuck, the edge skin pressing member can also comprise an edge skin pressing elastic member arranged on the clamping base plate. For example, the edge skin pressing elastic member comprises an edge skin pressing rod sleeved with a compression spring.

[0120] Therefore, when the first cutting operation is performed on the silicon rod by the first silicon rod cutting device, the silicon rod to be cut is carried by the first silicon rod transfer device, and at least one end face chuck in the at least one pair of end face chucks is driven to move along the clamping direction by the chuck driving mechanism in the edge skin anti-collapse device, so that the at least one pair of end face chucks clamps the two end faces of the silicon rod, and the edge skin pressing member in the end face chuck presses the edge skin to be cut in the silicon rod, so as to ensure that the edge skin to be cut in the silicon rod remains stable in the first cutting operation, and the edge skin falling or the edge skin deviating from the main body of the silicon rod to cause edge collapse and other phenomena can be avoided when the first cutting wire saw in the first wire cutting unit completely cuts through the silicon rod.

[0121] In some embodiments, for any end face chuck in the at least one pair of end face chucks, the end face chuck comprises a silicon rod pressing member, an edge skin pressing member, and an edge skin clamping reinforcing member, wherein the silicon rod pressing member is used to press the main body of the silicon rod, the edge skin pressing member is used to press the edge skin to be cut in the silicon rod, and the edge skin clamping reinforcing member is used to apply additional clamping force to the edge skin. In this application, the silicon rod with a circular cross section is subjected to square cutting operation to form a square silicon rod with a rectangular cross section, wherein the main body of the silicon rod refers to at least the part of the square silicon rod, that is, the main body of the silicon rod is relative to the edge skin, and the main body of the silicon rod is the part of the square silicon rod, which varies in different square cutting operations. In the following description, the main body of the silicon rod is referred to as the silicon rod main body.

[0122] Please refer to Figure 6 , which shows a structural schematic diagram of the edge skin clamp in an embodiment. In Figure 5 and Figure 5 and Figure 6 , the end face chuck comprises a clamping base plate 1624, a silicon rod pressing member 1625 and an edge skin pressing member 1626 arranged on the clamping base plate 1624, and an edge skin clamping reinforcing member 1627 which moves in and out along the clamping direction relative to the clamping base plate 1624.

[0123] The clamping base 1624 serves as the main body of the end face chuck, providing a foundation for the silicon ingot pressing member 1625, the edge pressing member 1626, and the edge clamping reinforcement member 1627. In some embodiments, the clamping base may be, for example, a clamping substrate, the size of which is adapted to the end face of the silicon ingot and the edge to be cut; that is, the clamping substrate must cover at least a portion of the silicon ingot body and a portion of the edge. The clamping substrate must cover a portion of the silicon ingot body so that the silicon ingot pressing member disposed thereon can act on the silicon ingot body. The clamping substrate must also cover a portion of the edge so that the edge pressing member and the edge clamping reinforcement member disposed thereon can act on the edge.

[0124] In such Figure 6 In the illustrated embodiment, the silicon rod pressing member 1625 in the end face chuck includes a silicon rod pressing screw disposed on the clamping substrate 1624, and the edge pressing member 1626 includes an edge pressing screw disposed on the clamping substrate 1624. The number of silicon rod pressing screws and the number of edge pressing screws can be one or more. In practical applications, the silicon rod pressing screw is used to press the silicon rod body, and the edge pressing screw is used to press the edge to be cut. With both the silicon rod pressing screw pressing the silicon rod body and the edge pressing screw pressing the edge to be cut, relative stability between the silicon rod body and the edge can be ensured. This avoids edge chipping or other phenomena that occur when the wire saw in the wire cutting unit passes through the silicon rod to completely remove it, causing the edge to fall off or the edge to shift from the silicon rod body.

[0125] It is easy to see that in some cases, the end face of the silicon rod is not an ideal flat surface, and one of the silicon rod pressing component and the edge pressing component may not be able to effectively abut and press against the corresponding silicon rod body or edge.

[0126] To ensure that the silicon rod pressing elements and edge pressing elements arranged on the clamping substrate can adapt to the end face of the silicon rod to achieve effective pressing, in some embodiments, the end face chuck further includes an offset fine-tuning structure for adjusting the position of the clamping substrate. Using this offset fine-tuning structure, the position of the clamping substrate can be locally adjusted, thereby changing the position of the silicon rod pressing elements and edge pressing elements arranged on the clamping substrate. In such cases... Figure 6 In the embodiment shown, the end face chuck further includes a biasing fine-tuning structure for adjusting the clamping substrate 1624. Using the biasing fine-tuning structure, the position of the clamping substrate 1624 can be locally adjusted, thereby changing the position of the silicon rod pressing screw and the edge pressing screw arranged on the clamping substrate 1624.

[0127] In some embodiments, the biasing fine-tuning structure employs a ball-head structure or a similar structure, and the clamping base is configured via a ball-head structure. For example... Figure 6As shown, the clamping base 1624 is arranged on the mounting structure by a ball head structure 1629. In this way, the clamping base 1624 can be finely adjusted by the ball head structure 1629 relative to the mounting structure, so as to change the position of the clamping base 1624, the silicon rod pressing screw 1625 and the edge pressing screw 1626 arranged thereon, thereby adapting to the end face of the silicon rod, even if the end face of the silicon rod is not flat to a certain extent. In some embodiments, the ball head structure is a spherical steel ball which is embedded in a receiving cavity and exposes a small part in contact with the clamping base. In some embodiments, the ball head or the semi-ball head is connected to the clamping base by a connecting rod, and the ball head or the semi-ball head is embedded in a receiving cavity.

[0128] In some embodiments, the biasing fine adjustment structure adopts a hinged structure, and the clamping base is arranged by the hinged structure. For example, the clamping base is associated with the mounting structure by the hinged structure, and can be biased relative to the mounting structure to a certain extent.

[0129] In addition, in some embodiments, in the end face chuck, the silicon rod pressing member includes a silicon rod pressing elastic member arranged on the clamping base, and the edge pressing member includes an edge pressing elastic member arranged on the clamping base. For example, in some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing rod sleeved with a compression spring, and the edge pressing elastic member includes an edge pressing rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing block with a compression spring arranged at the rear end thereof, and the edge pressing elastic member includes an edge pressing block with a compression spring arranged at the rear end thereof.

[0130] In the end face chuck, an edge clamping reinforcing member is further included, which can be advanced and retreated relative to the clamping base along the clamping direction. When the edge clamping reinforcing member is advanced relative to the clamping base, the edge clamping reinforcing member can provide a strong clamping force to the corresponding edge. Generally, the clamping force applied to the edge by the edge clamping reinforcing member is greater than the pressing force applied to the silicon rod body by the silicon rod pressing member and the pressing force applied to the edge by the edge pressing member.

[0131] In some embodiments, the edge clamping reinforcing member includes a telescopic pressing rod or a telescopic pressing block which is controlled to advance and retreat relative to the clamping base. For example, the telescopic pressing rod or the telescopic pressing block is arranged in a receiving cavity and exposes a small part in contact with the clamping base. Figure 6In the shown embodiment, the edge clamping reinforcement includes a retractable top rod or a retractable top block 1627 and a retractable driving source 1628, which drives the retractable top rod or the retractable top block 1627 to advance and retreat relative to the clamping base plate 1624. In some embodiments, the clamping base plate 1624 is provided with a through hole, and the retractable driving source 1628 and the retractable top rod or the retractable top block 1627 are arranged on a mounting structure. The retractable driving source 1628 can drive the retractable top rod or the retractable top block 1627 to extend out of the clamping base plate 1624 and press against the corresponding edge, or drive the retractable top rod or the retractable top block 1627 to retract into the clamping base plate 1624. The retractable driving source may, for example, be a retractable pneumatic cylinder.

[0132] The end face chuck can still be changed in other embodiments. In some embodiments, the end face chuck includes a first clamping base and a second clamping base, wherein a silicon rod pressing member is arranged on the first clamping base, an edge pressing member and an edge clamping reinforcement that advances and retreats relative to the second clamping base in the clamping direction are arranged on the second clamping base.

[0133] In some embodiments, the first clamping base may, for example, be a clamping base plate, which is sized to fit the end face of the silicon rod body, i.e., at least covers a portion of the silicon rod body, so that the silicon rod pressing member arranged thereon can act on the silicon rod body. The second clamping base may, for example, be a clamping base plate, which is sized to fit the end face of the edge to be cut, i.e., at least covers a portion of the edge, so that the edge pressing member arranged thereon can act on the edge.

[0134] In the end face chuck, the silicon rod pressing member includes a silicon rod pressing screw arranged on the first clamping base, and the number of the silicon rod pressing screw can be one or more. The edge pressing member includes an edge pressing screw arranged on the second clamping base, and the number of the edge pressing screw can be one or more. In actual application, the silicon rod pressing screw is used to press the silicon rod body, and the edge pressing screw is used to press the edge to be cut. In the condition that the silicon rod pressing screw presses the silicon rod body and the edge pressing screw presses the edge to be cut, the relative stability between the silicon rod body and the edge can be ensured, and the phenomenon of edge falling or edge and silicon rod body deviating to cause edge collapse can be avoided when the cutting wire saw in the wire cutting unit completely cuts off the silicon rod.

[0135] In some embodiments, the silicon rod pressing member comprises a silicon rod pressing elastic member arranged on the first clamping base, and the edge skin pressing member comprises an edge skin pressing elastic member arranged on the second clamping base. For example, in some embodiments, the silicon rod pressing elastic member comprises a silicon rod pressing rod sleeved with a compression spring, and the edge skin pressing elastic member comprises an edge skin pressing rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member comprises a silicon rod pressing block with a compression spring arranged at the rear end thereof, and the edge skin pressing elastic member comprises an edge skin pressing block with a compression spring arranged at the rear end thereof.

[0136] In the end face chuck, an edge skin clamping reinforcing member is further included, which is capable of advancing and retreating relative to the second clamping base along the clamping direction. When the edge skin clamping reinforcing member advances relative to the second clamping base, the edge skin clamping reinforcing member can provide a strong clamping force to the corresponding edge skin. Generally, the clamping force exerted on the edge skin by the edge skin clamping reinforcing member is greater than the pressing force exerted on the silicon rod body by the silicon rod pressing member and the pressing force exerted on the edge skin by the edge skin pressing member.

[0137] In some embodiments, the edge skin clamping reinforcing member comprises a telescopic pressing rod or a telescopic pressing block capable of advancing and retreating relative to the second clamping base. For example, the edge skin clamping reinforcing member comprises a telescopic pressing rod or a telescopic pressing block and a telescopic driving source, and the telescopic driving source drives the telescopic pressing rod or the telescopic pressing block to advance and retreat relative to the second clamping base. In some embodiments, a through hole is arranged on the second clamping base, and the telescopic driving source and the telescopic pressing rod or the telescopic pressing block are arranged on a mounting structure. The telescopic driving source can drive the telescopic pressing rod or the telescopic pressing block to protrude from the second clamping base and press against the corresponding edge skin, or to retract into the second clamping base. The telescopic driving source can be, for example, a telescopic pneumatic cylinder.

[0138] Thus, when the first cutting operation is performed on the silicon rod by the first silicon rod cutting device, the silicon rod to be cut is carried by the first silicon rod transfer device, at least one end face chuck of the at least one pair of end face chucks is driven by the chuck driving mechanism in the first edge skin anti-collapse device to move along the clamping direction, so that the at least one pair of end face chucks clamps the two end faces of the silicon rod, wherein the silicon rod pressing part in the end face chuck presses on the main body of the silicon rod, the edge skin pressing part in the end face chuck presses on the edge skin to be cut of the silicon rod, and the edge skin clamping reinforcement in the end face chuck is in a retracted state (in the retracted state, the edge skin clamping reinforcement is recessed in the clamping base, or protrudes from the clamping base but the protrusion height relative to the clamping base is also less than the protrusion height of the silicon rod pressing part and the edge skin pressing part relative to the clamping base), so that the edge skin and the main body of the silicon rod remain relatively stationary, and the cutting wire saw in the wire cutting unit can avoid cutting through the silicon rod to be cut to completely cut off, so as to avoid the edge skin from falling off or the edge skin and the main body of the silicon rod from deviating to cause edge collapse and other phenomena. After the edge skin cutting is completed, the edge skin clamping reinforcement in the end face chuck is driven to protrude relative to the clamping base and press on the cut edge skin, and the clamping force of the edge skin clamping reinforcement on the edge skin is greater than the pressing force of the silicon rod pressing part on the main body of the silicon rod and the pressing force of the edge skin pressing part on the edge skin, at which time the at least one pair of end face chucks can be operated to move the cut edge skin.

[0139] In the present application, the first edge skin anti-collapse device can further include an edge skin clamp advancing and retreating mechanism for driving the edge skin clamp to advance and retreat along the advancing and retreating direction.

[0140] In the embodiment in which the end face chuck includes the clamping base and the edge skin pressing part provided on the clamping base, after the edge skin cutting is completed, the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to retreat along the advancing and retreating direction, and the pressing force of the edge skin pressing part on the edge skin can drive the clamped edge skin to separate from the main body of the silicon rod.

[0141] In the embodiment in which the end face chuck includes the clamping base, the silicon rod pressing part and the edge skin pressing part provided on the clamping base, and the edge skin clamping reinforcement that advances and retreats relative to the clamping base along the clamping direction, after the edge skin cutting is completed, the edge skin clamping reinforcement in the end face chuck is driven to protrude relative to the clamping base and press on the cut edge skin, at which time the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to retreat along the advancing and retreating direction, and the clamping force of the edge skin clamping reinforcement on the edge skin is greater than the pressing force of the silicon rod pressing part on the main body of the silicon rod and the pressing force of the edge skin pressing part on the edge skin, so as to drive the clamped edge skin to separate from the main body of the silicon rod.

[0142] In some embodiments, the edge clamp advancing / retracting mechanism comprises: a clamp advancing / retracting rail arranged along the advancing / retracting direction; and an edge clamp advancing / retracting unit for driving the edge clamp to move along the clamp advancing / retracting rail. Figure 5 In the illustrated embodiment, the edge clamp advancing / retracting mechanism 163 comprises a clamp advancing / retracting rail 1631 and an edge clamp advancing / retracting unit.

[0143] In some embodiments, the edge clamp advancing / retracting unit comprises: a clamp seat telescopic rod arranged along the advancing / retracting direction and associated with a clamp seat of the edge clamp; and a clamp seat telescopic cylinder associated with the clamp seat telescopic rod. Figure 5 In the illustrated embodiment, the edge clamp advancing / retracting unit comprises a clamp seat telescopic rod 1633 arranged along the advancing / retracting direction and associated with a clamp seat 1621 of the edge clamp, and a clamp seat telescopic cylinder 1635 which can be arranged on a mounting structure and associated with the clamp seat telescopic rod 1633. The clamp seat telescopic cylinder 1635 drives the clamp seat telescopic rod to extend, thereby driving the edge clamp 162 to move towards the first silicon rod transfer device, so that the edge clamp 162 can hold the end face of the silicon rod. In some embodiments, the clamp seat telescopic cylinder 1635 drives the clamp seat telescopic rod to retract, thereby driving the edge clamp 162 to move away from the first silicon rod transfer device, so that the edge clamp 162 can drive the held edge to exit and separate from the main body of the silicon rod.

[0144] In some embodiments, the edge clamp advancing / retracting unit comprises: the edge clamp advancing / retracting mechanism comprises a clamp seat rack arranged along the advancing / retracting direction and associated with a clamp seat of the edge clamp; a clamp seat gear engaged with the clamp seat rack; and a gear driving source associated with the clamp seat gear for driving the clamp seat gear to rotate so as to drive the engaged edge clamp to move along the advancing / retracting direction. The gear driving source can be, for example, a servo motor. In actual application, the servo motor as the gear driving source rotates forward, thereby driving the associated clamp seat gear to rotate forward, so that the edge clamp associated with the clamp seat gear moves on the engaged clamp seat rack towards the silicon rod transfer device, so that the edge clamp can hold the end face of the silicon rod. Conversely, the servo motor as the gear driving source rotates reversely, thereby driving the associated clamp seat gear to rotate reversely, so that the edge clamp associated with the clamp seat gear moves on the engaged clamp seat rack away from the silicon rod transfer device, so that the edge clamp drives the held edge to exit and separate from the main body of the silicon rod.

[0145] In some embodiments, the edge scrap clamp advancing and retracting unit comprises a retracting screw rod and a screw rod driving source, the retracting screw rod is arranged along the advancing and retracting direction and is associated with the clamp base of the edge scrap clamp, and the screw rod driving source is associated with the retracting screw rod. In the actual application, the forward rotation of the servo motor as the screw rod driving source drives the forward rotation of the retracting screw rod, so that the edge scrap clamp associated with the retracting screw rod moves towards the silicon rod transferring device, so that the edge scrap clamp can clamp the end face of the silicon rod. On the contrary, the reverse rotation of the servo motor as the screw rod driving source drives the reverse rotation of the retracting screw rod, so that the edge scrap clamp associated with the retracting screw rod moves away from the silicon rod transferring device, so that the edge scrap clamp drives the retracted edge scrap to separate from the silicon rod body.

[0146] In the present application, the first edge scrap collapse prevention device can further comprise a clamp lifting mechanism for driving the edge scrap clamp to move up and down along the vertical direction. In some embodiments, the edge scrap clamp is driven by the clamp lifting mechanism to move up or down along the vertical direction to adapt to the size specification of the silicon rod carried by the silicon rod transferring device. For example, if the size of the silicon rod to be cut is large, the edge scrap clamp is driven by the clamp lifting mechanism to move up along the vertical direction, and if the size of the silicon rod to be cut is small, the edge scrap clamp is driven by the clamp lifting mechanism to move down along the vertical direction.

[0147] In some embodiments, the clamp lifting mechanism comprises a clamp lifting guide rail and a clamp lifting unit, wherein the clamp lifting guide rail is arranged along the vertical direction. The clamp lifting unit is used to drive the edge scrap clamp to move up and down along the clamp lifting guide rail. Figure 5 In the illustrated embodiment, the clamp lifting mechanism 164 comprises a clamp lifting guide rail 1641 and a clamp lifting unit.

[0148] In some embodiments, the edge scrap clamp lifting unit comprises a lifting screw rod and a screw rod driving source, the lifting screw rod is arranged along the vertical direction and is associated with the clamp base of the edge scrap clamp, and the screw rod driving source is associated with the lifting screw rod. In the actual application, the forward rotation of the servo motor as the screw rod driving source drives the forward rotation of the lifting screw rod, so that the edge scrap clamp associated with the lifting screw rod moves up. On the contrary, the reverse rotation of the servo motor as the screw rod driving source drives the reverse rotation of the lifting screw rod, so that the edge scrap clamp associated with the lifting screw rod moves down. Figure 5 In the illustrated embodiment, the edge scrap clamp lifting unit comprises a lifting screw rod 1643 and a screw rod driving source, wherein the lifting screw rod 1643 is arranged along the vertical direction and is associated with the mounting structure of the clamp base of the edge scrap clamp, and the screw rod driving source is associated with the lifting screw rod 1643. In the actual application, the forward rotation of the servo motor as the screw rod driving source drives the forward rotation of the lifting screw rod, so that the edge scrap clamp associated with the lifting screw rod moves up. On the contrary, the reverse rotation of the servo motor as the screw rod driving source drives the reverse rotation of the lifting screw rod, so that the edge scrap clamp associated with the lifting screw rod moves down.

[0149] In some embodiments, the clamp lifting unit comprises a lifting rack, a lifting gear, and a gear driving source, wherein the lifting rack is arranged along a vertical direction and associated with the clamp seat of the edge clamp, the lifting gear is engaged with the lifting rack, and the gear driving source is associated with the lifting gear for driving the lifting gear to rotate so as to make the engaged edge clamp move up and down along the vertical direction. The gear driving source may, for example, be a servo motor. In actual application, the servo motor as the gear driving source rotates forward to drive the associated lifting gear to rotate forward, so that the edge clamp associated with the clamp seat gear moves up on the engaged clamp seat rack. Conversely, the servo motor as the gear driving source rotates reversely to drive the associated clamp seat gear to rotate reversely, so that the edge clamp associated with the clamp seat gear moves down on the engaged clamp seat rack.

[0150] Thus, when the first edge collapse-preventing device 16 is applied, the silicon rod is horizontally placed on the silicon rod carrying platform of the silicon rod transfer device; the edge clamp 162 is driven by the clamp lifting mechanism 164 in the first edge collapse-preventing device 16 to move up and down along the vertical direction to adjust the position; the edge clamp is driven by the edge clamp advancing and retreating mechanism 163 in the first edge collapse-preventing device 16 to advance along the advancing and retreating direction and approach the silicon rod; at least one end face clamp in the at least one pair of end face clamps is driven by the clamp head driving mechanism 162 in the first edge collapse-preventing device 16 to move along the clamping direction until the silicon rod pressing member on the end face clamp presses on the main body of the silicon rod and the edge pressing member on the end face clamp presses on the edge to be cut (as shown in the state diagram in FIG. 6). Figure 5 Thus, when the first edge collapse-preventing device 16 is applied, the silicon rod is horizontally placed on the silicon rod carrying platform of the silicon rod transfer device; the edge clamp 162 is driven by the clamp lifting mechanism 164 in the first edge collapse-preventing device 16 to move up and down along the vertical direction to adjust the position; the edge clamp is driven by the edge clamp advancing and retreating mechanism 163 in the first edge collapse-preventing device 16 to advance along the advancing and retreating direction and approach the silicon rod; at least one end face clamp in the at least one pair of end face clamps is driven by the clamp head driving mechanism 162 in the first edge collapse-preventing device 16 to move along the clamping direction until the silicon rod pressing member on the end face clamp presses on the main body of the silicon rod and the edge pressing member on the end face clamp presses on the edge to be cut (as shown in the state diagram in FIG. 6). Figure 7 Thus, when the first edge collapse-preventing device 16 is applied, the silicon rod is horizontally placed on the silicon rod carrying platform of the silicon rod transfer device; the edge clamp 162 is driven by the clamp lifting mechanism 164 in the first edge collapse-preventing device 16 to move up and down along the vertical direction to adjust the position; the edge clamp is driven by the edge clamp advancing and retreating mechanism 163 in the first edge collapse-preventing device 16 to advance along the advancing and retreating direction and approach the silicon rod; at least one end face clamp in the at least one pair of end face clamps is driven by the clamp head driving mechanism 162 in the first edge collapse-preventing device 16 to move along the clamping direction until the silicon rod pressing member on the end face clamp presses on the main body of the silicon rod and the edge pressing member on the end face clamp presses on the edge to be cut (as shown in the state diagram in FIG. 6). Figure 8 Thus, when the first edge collapse-preventing device 16 is applied, the silicon rod is horizontally placed on the silicon rod carrying platform of the silicon rod transfer device; the edge clamp 162 is driven by the clamp lifting mechanism 164 in the first edge collapse-preventing device 16 to move up and down along the vertical direction to adjust the position; the edge clamp is driven by the edge clamp advancing and retreating mechanism 163 in the first edge collapse-preventing device 16 to advance along the advancing and retreating direction and approach the silicon rod; at least one end face clamp in the at least one pair of end face clamps is driven by the clamp head driving mechanism 162 in the first edge collapse-preventing device 16 to move along the clamping direction until the silicon rod pressing member on the end face clamp presses on the main body of the silicon rod and the edge pressing member on the end face clamp presses on the edge to be cut (as shown in the state diagram in FIG. 6). Figure 9 Thus, when the first edge collapse-preventing device 16 is applied, the silicon rod is horizontally placed on the silicon rod carrying platform of the silicon rod transfer device; the edge clamp 162 is driven by the clamp lifting mechanism 164 in the first edge collapse-preventing device 16 to move up and down along the vertical direction to adjust the position; the edge clamp is driven by the edge clamp advancing and retreating mechanism 163 in the first edge collapse-preventing device 16 to advance along the advancing and retreating direction and approach the silicon rod; at least one end face clamp in the at least one pair of end face clamps is driven by the clamp head driving mechanism 162 in the first edge collapse-preventing device 16 to move along the clamping direction until the silicon rod pressing member on the end face clamp presses on the main body of the silicon rod and the edge pressing member on the end face clamp presses on the edge to be cut (as shown in the state diagram in FIG. 6).

[0151] In the present application, the first edge collapse-preventing device further comprises an edge unloading and conveying mechanism connected with the edge clamp advancing and retreating mechanism.

[0152] In some embodiments, the edge unloading and conveying mechanism may comprise an edge carrying structure and a conveying driving mechanism. As shown in FIG. 6, the edge carrying structure may comprise a plurality of edge carrying members 165 arranged along the advancing and retreating direction of the edge clamp 162. Figure 4As shown, the edge skin feeding mechanism device can include an edge skin carrying structure 167 and a conveying driving mechanism 168.

[0153] The edge skin carrying structure 167 is used to carry the edge skin. As mentioned above, the edge skin clamped by the edge skin clamp is moved in the advancing and retreating direction by the edge skin clamp advancing and retreating mechanism to separate the edge skin from the main body of the silicon rod, and then the chuck driving mechanism in the edge skin clamp drives the chuck to move to release the clamped edge skin and make it fall on the edge skin carrying structure. In some embodiments, the edge skin carrying structure can be, for example, an edge skin placing groove. The edge skin placing groove can be, for example, a U-shaped structure.

[0154] In some embodiments, the conveying driving mechanism is used to drive the edge skin carrying structure to move in the transfer direction to move between the first loading and unloading area and the first cutting area. In the embodiment as shown, Figure 4 In the embodiment as shown, the edge skin feeding mechanism device includes two edge skin carrying structures 167 and a conveying driving mechanism 168 associated with the two edge skin carrying structures 167, which is used to drive the two edge skin carrying structures 167 to move between the first loading and unloading area and the first cutting area. In some embodiments, the conveying driving mechanism 168 can be, for example, a chain conveying mechanism.

[0155] Of course, in some embodiments, a transport driving mechanism can be configured for each of the edge strip carrying devices to drive the corresponding edge strip carrying structure. For example, the transport driving mechanism can be a chain transport mechanism, which includes a ring chain, a chain driving source, and a connecting member. The ring chain is a closed loop chain, which is arranged around a plurality of movable gears to form a preset shape, such as an inverted triangle, a rectangle, or a trapezoid. The edge strip carrying structure is associated with the ring chain through the connecting member. The chain driving source can be a servo motor, which is associated with one of the movable gears, for example, the output shaft of the servo motor is connected with the gear shaft of the movable gear. When the ring chain is driven to rotate by the servo motor, the connecting member can drive the edge strip carrying structure and the edge strip carried thereby to move in a transfer direction. In actual application, the servo motor drives the associated movable gear to rotate in a forward direction (or in a reverse direction), the movable gear rotating in the forward direction (or in the reverse direction) drives the engaged ring chain to move in a forward direction (or in a reverse direction), and the ring chain moving in the forward direction (or in the reverse direction) drives the edge strip carrying structure to move from the first loading and unloading area to the first cutting area through the connecting member. Conversely, the servo motor drives the associated movable gear to rotate in a reverse direction (or in a forward direction), the movable gear rotating in the reverse direction (or in the forward direction) drives the engaged ring chain to move in a reverse direction (or in a forward direction), and the ring chain moving in the reverse direction (or in the forward direction) drives the edge strip carrying structure and the edge strip carried thereby to move from the first cutting area to the first loading and unloading area through the connecting member.

[0156] In some embodiments, the transport driving mechanism is used to transport the edge strip on the edge strip carrying structure out. In some embodiments, the transport driving mechanism is a chain transport mechanism or a transmission belt mechanism. For example, the transport driving mechanism can be a chain transport mechanism, which includes a ring chain, a chain driving source, and a pushing member. The ring chain is a closed loop chain, which is arranged around a plurality of movable gears to form a preset shape, such as an inverted triangle, a rectangle, or a trapezoid. The chain driving source can be a servo motor, which is associated with one of the movable gears, for example, the output shaft of the servo motor is connected with the gear shaft of the movable gear. The pushing member can be fixedly arranged on the ring chain. When the ring chain is driven to rotate by the servo motor, the pushing member interferes with the edge strip carried by the edge strip carrying structure and pushes the edge strip. In actual application, the servo motor drives the associated movable gear to rotate in a forward direction, the movable gear rotating in the forward direction drives the engaged ring chain to move in a forward direction, and the pushing member on the ring chain moving in the forward direction contacts the edge strip and pushes the edge strip to move relative to the edge strip carrying structure until the edge strip is unloaded.

[0157] In the present application, the edge skin blanking and conveying mechanism further comprises an edge skin overturning mechanism for driving the edge skin carrying structure to overturn. Each edge skin carrying structure is provided with an edge skin overturning mechanism, and the corresponding edge skin carrying structure and the edge skin carried thereby can be driven to overturn by the edge skin overturning mechanism. In some embodiments, referring to Figure 10 and Figure 11 , in the embodiments as shown in Figure 10 and Figure 11 , the edge skin overturning mechanism comprises a pivot shaft and a telescopic assembly, the telescopic assembly comprises a telescopic rod 1691 and a telescopic cylinder 1692, the edge skin carrying structure 167 is pivotally installed by the pivot shaft, one end of the telescopic rod 1691 is associated with the corresponding edge skin carrying structure 167, and the other end of the telescopic rod 1691 is associated with the telescopic cylinder 1692. In actual application, the telescopic cylinder 1692 drives the telescopic rod 1691 to perform a contraction action, the edge skin carrying structure 167 is pulled by the telescopic rod 1691 to overturn toward the vertical direction and be arranged vertically by the pivot shaft; the telescopic cylinder 1692 drives the telescopic rod 1691 to perform an extension action, the edge skin carrying structure 167 is pushed by the telescopic rod 1691 to overturn away from the vertical direction and be arranged horizontally or obliquely by the pivot shaft, so that the edge skin carried by the edge skin carrying structure 167 is arranged horizontally or obliquely, facilitating subsequent unloading of the edge skin.

[0158] In the first silicon rod cutting device of the silicon rod cutting and grinding all-in-one machine, the silicon rod to be cut is placed in a horizontal manner on the first silicon rod transfer device at the first loading and unloading position; the first silicon rod carrying device and the silicon rod carried thereby are driven to move from the first loading and unloading position to the first cutting position along the transfer direction, the skin clamp is driven by the skin clamp advancing and retreating mechanism to advance to the silicon rod along the advancing and retreating direction, the skin clamp of the first skin anti-collapse device is driven to clamp the silicon rod to be cut, at this time, the two first cutting wire saws arranged in parallel in the first silicon rod cutting device are located between the silicon rod and the front skin clamp; the first silicon rod transfer device carrying the silicon rod is driven to advance along the transfer direction towards the first cutting position, the first silicon rod cutting device and the first silicon rod transfer device are relatively moved along the transfer direction to perform the first cutting operation on the silicon rod with a circular cross section by the two first cutting wire saws arranged in parallel in the first silicon rod cutting device, so that the silicon rod is cut to form two parallel first side surfaces after the two skins are cut off; the skin clamped by the skin clamp is withdrawn along the advancing and retreating direction by the skin clamp advancing and retreating mechanism in the first skin anti-collapse device, so as to drive the clamped skin to be separated from the silicon rod body; the skin clamp and the skin clamped thereby are lowered by the clamp lifting mechanism, the skin clamp is released, the skin is released onto the skin carrying structure, the skin carrying structure is driven by the conveying driving mechanism to move from the first cutting position to the first loading and unloading position along the transfer direction, the skin carrying structure and the skin carried thereby are turned over by the skin turning mechanism, so as to unload the turned-over skin; the first silicon rod carrying device and the silicon rod body carried thereby are driven to move from the first cutting position to the first loading and unloading position along the transfer direction, and the first cutting operation of the silicon rod is completed.

[0159] The second cutting station includes a second loading and unloading position and a second cutting position, and a second silicon rod transfer device is arranged on the second cutting station, the second silicon rod transfer device is used to carry the silicon rod with two first side surfaces to move along the transfer direction between the second loading and unloading position and the second cutting position, the second silicon rod cutting device is arranged at the second cutting position, the second silicon rod cutting device is provided with at least one second cutting wire saw, the at least one second cutting wire saw is located in the vertical plane and arranged along the vertical direction or arranged at an angle with the vertical direction, the second silicon rod cutting device and the second silicon rod transfer device are relatively moved along the transfer direction to perform the second cutting operation on the silicon rod with two first side surfaces by the at least one second cutting wire saw, and a square silicon rod with a rectangular cross section is obtained.

[0160] The second silicon rod transfer device is used to carry the silicon rod along a transfer direction between the second loading and unloading area and the second cutting area of the second cutting station, wherein the silicon rod (with two first side surfaces) is horizontally placed on the second silicon rod transfer device and the axial center line of the silicon rod is consistent with the transfer direction, and the transfer direction is consistent with the first direction.

[0161] In some embodiments, the second silicon rod transfer device can include a second transfer channel, a second bearing platform, and a second transfer driving mechanism. The second transfer channel is arranged along the transfer direction. In some implementations, the second transfer channel includes a second transfer rail. The length of the second transfer channel in the transfer direction is greater than the length of the silicon rod to be cut. The second bearing platform is arranged on the second transfer channel and is used to bear the silicon rod. After being borne by the second bearing platform, the silicon rod is horizontally placed, i.e., the axial center line of the silicon rod is consistent with the transfer direction (i.e., the first direction). The second transfer driving mechanism is used to drive the second bearing platform and the silicon rod borne thereby to move along the transfer direction on the second transfer channel. In some embodiments, the second bearing platform is arranged on the second transfer rail of the second transfer channel, and the second bearing platform is used to bear the silicon rod and is in contact with the first side surface of the silicon rod. The second transfer driving mechanism is used to drive the second bearing platform and the silicon rod borne thereby to move along the transfer direction on the second transfer channel.

[0162] In some embodiments, the second transfer driving mechanism includes a second platform transfer rail arranged along the transfer direction and a second transfer driving unit used to drive the second bearing platform to move along the second platform transfer rail. In some implementations, the second transfer driving unit includes a transfer rack rail, a transfer gear, and a gear driving source. The transfer rack rail is arranged along the transfer direction. The transfer gear is associated with the second bearing platform and is in mesh with the transfer rack rail. The gear driving source is used to drive the transfer gear to rotate so as to drive the associated second bearing platform to move along the transfer direction. The gear driving source can be, for example, a servo motor.

[0163] In some implementations, the second transfer driving unit includes a transfer lead screw and a lead screw driving source. The transfer lead screw is arranged along the transfer direction and is associated with the second bearing platform. The lead screw driving source is used to drive the transfer lead screw to rotate so as to drive the associated second bearing platform to move along the transfer direction. The lead screw driving source can be, for example, a servo motor.

[0164] The second silicon rod cutting device is arranged on the second cutting station and is used to perform a second cutting operation on the silicon rod at the second cutting area of the second cutting station by the second silicon rod transfer device, so that the silicon rod becomes a square silicon rod with a rectangular cross section after forming two parallel second side surfaces.

[0165] The second silicon rod cutting device includes at least one second wire cutting unit, which includes multiple second cutting wheels and a second cutting wire. The second cutting wire is sequentially wound around the multiple second cutting wheels to form at least one second wire saw. The second wire cutting unit moves relative to the second silicon rod transfer device and the silicon rod it carries at the second cutting station, and the at least one second wire saw performs a second cutting operation on the silicon rod carried by the second silicon rod transfer device. In some embodiments, the second cutting wire is wound in a loop between the second cutting wheels, where the ends meet. In this case, the second cutting wire can also be referred to as a closed-loop cutting wire.

[0166] In some embodiments, such as Figure 1 As shown, the second silicon rod cutting device 15 includes two second wire cutting units arranged in parallel. Each second wire cutting unit includes: a plurality of second cutting wheels and a second cutting line. The second cutting line is wound around the plurality of second cutting wheels to form at least one second wire saw. The second wire saw is arranged along the vertical direction or at an angle to the vertical direction.

[0167] The structure of the second silicon rod cutting device 15 is similar to that of the first silicon rod cutting device 13; for details, please refer to [link to relevant documentation]. Figures 4-11 And its related descriptions.

[0168] The second silicon rod cutting device 15 includes two second wire cutting units. Each second wire cutting unit includes a plurality of second cutting wheels and a second cutting wire, the second cutting wire being wound around the plurality of second cutting wheels to form at least one second wire saw, wherein the second wire saw is arranged vertically or at an angle to the vertical. Furthermore, the second wire cutting unit may also include a second cutting mounting structure, on which the aforementioned plurality of second cutting wheels are mounted.

[0169] In some embodiments, a plurality of second cutting wheels in the second wire cutting unit are connected to the second cutting mounting structure. Alternatively, a plurality of second cutting wheels are mounted on the second cutting mounting structure via a bracket, connecting plate, or mounting frame. The second cutting mounting structure serves as a carrier for associating the plurality of second cutting wheels in the second wire cutting unit with the second cutting frame or the second cutting seat. The specific form of the second cutting mounting structure can be a beam, a plate frame, a bracket, etc., and this application does not impose any limitations.

[0170] In the silicon rod cutting and grinding integrated machine of this application, the second wire saw in the second wire cutting unit of the second silicon rod cutting device is arranged along the vertical direction or at an angle to the vertical direction.

[0171] In the second wire cutting unit, at least one second wire slot for winding the second cutting wire is arranged in the second cutting wheel, and the second wire slot can define the position of the second cutting wire to control the cutting accuracy. Any of the second wire saws is formed between two oppositely arranged second cutting wheels after the second cutting wire is wound around the two second cutting wheels, and the positions of the two second cutting wheels and the positional relationship between the two second cutting wheels can be used to determine the direction of the second wire saw.

[0172] In some embodiments, the second cutting installation structure is a rectangular frame as a whole, the second wire cutting unit includes a plurality of second cutting wheels, for example, four second cutting wheels, which are arranged near the four corners of the second cutting installation structure respectively, and the wheel surface of each second cutting wheel is located in a vertical plane (the vertical plane is composed of the first direction and the third direction), wherein two second cutting wheels are arranged in front (relatively closer to the second loading and unloading area) and in parallel, and the other two second cutting wheels are arranged in back (relatively farther away from the second loading and unloading area) and in parallel, the second cutting wire is wound around the four second cutting wheels to form at least one second wire saw (for example, a second wire saw is formed between the two second cutting wheels arranged in parallel), and the second wire saw is arranged along the third direction (i.e., the vertical direction). In addition, in order to enable the second wire saw to effectively cut the silicon rod, the second wire saw interferes with the silicon rod in the vertical direction.

[0173] In some embodiments, the second cutting wire is wound between each second cutting wheel in a head-to-tail manner to form a ring-shaped cutting wire (also referred to as a closed-loop cutting wire). The second cutting wire is wound between a plurality of second cutting wheels in a head-to-tail manner to form a ring-shaped cutting wire (also referred to as a closed-loop cutting wire).

[0174] The plurality of second cutting wheels in the second wire cutting unit are wound by a ring-shaped cutting wire. In this example, the second silicon rod cutting device can dispense with the wire storage drum. The ring-shaped cutting wire is driven by the cutting wire driving device to maintain high-speed operation, and at the same time, the ring-shaped cutting wire can run in the same running direction during the cutting operation. In this way, the second silicon rod cutting device can realize high-precision second cutting operation, avoiding the problems of the cutting surface having ripples and the like caused by the running direction change or the running speed of the cutting wire in the existing cutting method; at the same time, the ring-shaped cutting wire can effectively reduce the total length of the cutting wire required by the second wire cutting unit, thereby reducing the production cost.

[0175] In some embodiments, the cutting wire driving device is an electric motor having a power output shaft connected to the second cutting wheel, so that the second cutting wire is driven to run in the winding direction by the second cutting wheel. Of course, in specific embodiments, the cutting wire driving device can also be another driving source such as a hydraulic motor, as long as it can drive the second cutting wire to run, which is not limited in the present application.

[0176] The second wire cutting unit in the present application can also include a second transition wheel for reversing or guiding the second cutting wire, or the second transition wheel can be used to adjust the tension of the second cutting wire. The number of the second transition wheel can be one or more according to the layout requirements.

[0177] The second transition wheel, when used to guide the second cutting wire, also serves as a tensioning wheel for adjusting the tension of the second cutting wire, which can reduce the probability of breaking the second cutting wire to reduce the consumption of materials.

[0178] For example, in some embodiments, in the second wire cutting unit, the second cutting mounting structure is a rectangular frame, each second wire cutting unit includes a plurality of second cutting wheels and a plurality of second transition wheels, for example, two second cutting wheels and two second transition wheels, which are respectively arranged near the four corners of the second cutting mounting structure, and the wheel surfaces of the two second cutting wheels and the two second transition wheels are located in the vertical plane, wherein the two second cutting wheels are in front and arranged in parallel from top to bottom, and the two second transition wheels are behind and arranged in parallel from top to bottom, and the second cutting wire is wound around the two second cutting wheels and the two second transition wheels to form at least one second cutting wire saw (for example, a second cutting wire saw is formed between the two second cutting wheels), and the at least one second cutting wire saw is arranged along the vertical direction.

[0179] As mentioned above, the second cutting wire is wound around the plurality of second cutting wheels or the plurality of second cutting wheels and the plurality of second transition wheels to form a second cutting wire saw between the two second cutting wheels in front, so that to adjust the length of the second cutting wire saw, the distance between the two second cutting wheels can be adjusted, for example, the position of at least one of the two second cutting wheels is changed.

[0180] The second cutting wire saw is located in the vertical plane and arranged along the vertical direction or at an angle with the vertical direction, and the silicon rod carried by the second silicon rod transfer device at the corresponding second cutting station is placed horizontally (the center line of the silicon rod is arranged along the transfer direction), so that to realize the cutting of the silicon rod, the length of the second cutting wire saw is adapted to the size of the end surface of the silicon rod, for example, the length of the second cutting wire saw is greater than or equal to the diameter of the silicon rod or the chord length of the position to be cut of the silicon rod.

[0181] The direction of the second cutting wheel surface has a corresponding relationship with the second cutting wire saw, and it is understood that the second cutting wheel surface is parallel to the plane of any second cutting wire groove in the second cutting wheel. In order to control the cutting accuracy and the stability of the cutting process, the second cutting wire saw should be located in the plane of the second cutting wire groove for winding the second cutting wire. At the same time, during the cutting process, the force direction of the silicon rod to the second cutting wire should be parallel to the cutting wire groove, that is, the cutting wheel surface is parallel to the cutting direction, and the cutting direction in the second cutting operation is the axial direction of the silicon rod, that is, the transfer direction (i.e. the first direction X axis).

[0182] The second silicon rod cutting device includes two second wire cutting units arranged in parallel, and each second wire cutting unit has a second cutting wire saw. Therefore, the two second wire cutting units form two parallel cutting wire saws. In some embodiments, the second silicon rod cutting device includes two second wire cutting units arranged in parallel along the second direction, and each second wire cutting unit has a second cutting wire saw arranged vertically. Therefore, the two second wire saws belonging to the two second wire cutting units are both arranged vertically.

[0183] In fact, the second wire saw can have other variations. In some embodiments, the second wire saw is arranged vertically, but it is not limited thereto. In other embodiments, the second wire saw can be arranged in a vertical plane formed by the first direction and the third direction (i.e., the vertical direction) at an angle of less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with respect to the third direction (i.e., the vertical direction). That is, the second wire saw can be arranged in the vertical plane at an angle of less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with respect to the third direction (i.e., the vertical direction). The angle is not limited to an integer angle, but can be any angle within a limited range, such as 0.09°, 1.3°, 2.5°, 3°, etc. In some embodiments, the two second cutting wheels arranged above and below to form the second wire saw, the upper second cutting wheel is ahead in the first direction and the lower second cutting wheel is behind in the first direction, and the second wire saw formed thereby can form a positive angle with respect to the vertical direction. In some embodiments, the two second cutting wheels arranged above and below to form the second wire saw, the upper second cutting wheel is behind in the first direction and the lower second cutting wheel is ahead in the first direction, and the second wire saw formed thereby can form a negative angle with respect to the vertical direction. The angle (including the positive angle and the negative angle) can be changed according to the cutting process requirements and the size specifications of the silicon rod, for example, by changing the position of one or both of the two second cutting wheels arranged above and below in relation to the second wire saw to adjust the angle of the angle.

[0184] In some embodiments, the second wire cutting unit further comprises a second tension adjusting mechanism. In wire cutting processing, the size of the cutting wire tension affects the yield and processing accuracy in cutting, and the second tension adjusting mechanism detects the tension and adjusts the tension to make the tension of the second cutting wire reach a certain threshold value and remain a constant value or a certain range allowed as the numerical center of the constant value.

[0185] In some embodiments, the second tension adjusting mechanism is associated with the second transition wheel or the second cutting wheel. The second transition wheel in the wire cutting unit functions as a tension wheel for adjusting the tension of the cutting wire while achieving the guiding and pulling of the second cutting wire.

[0186] The tensioning wheel is used to adjust the tension of the cutting wire, which can reduce the probability of cutting wire breakage to reduce consumables. In the cutting operation, the cutting wire plays a crucial role, but even the best cutting wire has limited extension and wear resistance, that is, the cutting wire will gradually thin out during continuous operation until it is eventually pulled apart. Therefore, the current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the extension of the cutting wire during the round trip, and the tensioning wheel is one of the implementation means.

[0187] Taking the tensioning wheel as an example, the tension adjusting mechanism at least includes a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel and continuously senses the tension value of the cutting wire on the transition wheel, and sends a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and starts to work after receiving the driving signal sent by the tension sensor; one end of the lead screw is connected to the transition wheel, and the other end is connected to the servo motor, and the transition wheel is pulled to move unidirectionally when the servo motor works to adjust the tension of the cutting wire.

[0188] The tension adjusting mechanism includes a linkage assembly and a tension driving unit, the linkage assembly is associated with the transition wheel as the tensioning wheel and the tension driving unit, and the linkage assembly is controlled by the tension driving unit, that is, the linkage assembly is driven by the tension driving unit to drive the transition wheel to change position to adjust the tension of the closed loop cutting wire.

[0189] Regarding the tension driving unit, in some implementations, the tension driving unit can include a counterweight part, which can be associated with the linkage assembly. For example, taking a certain transition wheel as a tensioning wheel as an example, when the tension of the closed loop cutting wire needs to be increased, the counterweight part is released, the counterweight part descends, and the linkage assembly drives the associated tensioning wheel to move under the action of the gravity of the counterweight part, thereby expanding the circumference of the figure surrounded by each cutting wheel and the transition wheel, and increasing the tension of the closed loop cutting wire. When the tension of the closed loop cutting wire needs to be reduced, the counterweight part is lifted, and the linkage assembly drives the associated tensioning wheel to move in the opposite direction under the action of the gravity of the counterweight part, thereby expanding the circumference of the figure surrounded by each cutting wheel and the transition wheel, and reducing the tension of the closed loop cutting wire.

[0190] The counterweight part can include counterweight blocks, wherein the number of counterweight blocks can vary according to the requirements of the closed loop cutting wire tension adjustment, for example, the number of counterweight blocks can be increased when the tension of the closed loop cutting wire needs to be increased, and the number of counterweight blocks can be reduced when the tension of the closed loop cutting wire needs to be reduced.

[0191] In some embodiments, the counterweight portion can include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting mounting structure, so that the counterweight portion and the cutting mounting structure are switched from the active state to the locked state. In some examples, the locking mechanism can be, for example, a latch.

[0192] The tension driving unit can still be varied in other ways. For example, the tension driving unit can include a tension cylinder.

[0193] In some embodiments, the second silicon rod cutting device further includes at least one second distance adjusting mechanism arranged in the at least one second wire cutting unit, for driving the plurality of second cutting wheels in the second wire cutting unit to move in a direction perpendicular to the cutting wheel surface. The second silicon rod cutting device can switch the second cutting wire between different cutting grooves of the second cutting wheels based on the distance adjusting mechanism, or adjust the position of the second cutting wire saw to change the cutting position (or machining specification) relative to the silicon rod.

[0194] In some embodiments, the second wire cutting unit in the second silicon rod cutting device is taken as an example for illustration, and the second wire cutting unit includes a plurality of second cutting wheels and a plurality of second transition wheels. The carrier for carrying the plurality of second cutting wheels and the second transition wheels is, for example, a second cutting mounting structure, and the second distance adjusting mechanism is used to drive the second cutting mounting structure as a whole to move in a direction perpendicular to the cutting wheel surface. The second transition wheels and the second cutting wheels jointly follow the second cutting mounting structure to move in the direction perpendicular to the cutting wheel surface (i.e., the transposition direction or the second direction Y-axis), and in this state, the plurality of second cutting wheels and the second transition wheels are relatively stationary, that is, the positional relationship between the second transition wheels and the second cutting wheels does not change. At this time, the second distance adjusting mechanism is used to adjust the cutting position of the at least one second wire cutting saw relative to the silicon rod.

[0195] In some embodiments, each second cutting wheel has at least two second cutting wire grooves, different second cutting wire grooves are parallel to each other, and different second cutting wire grooves have a cutting offset in the direction perpendicular to the cutting wheel surface. When the second distance adjusting mechanism is used to drive the plurality of second cutting wheels in the second wire cutting unit to move relative to the second cutting mounting structure, the position of the second cutting wire wound on the second cutting wheel can be changed. In some embodiments, the plurality of second cutting wheels in the second wire cutting unit can be connected to a support, wherein the support is movably arranged in the second cutting mounting structure and is driven by the second distance adjusting mechanism to move in the direction perpendicular to the cutting wheel surface.

[0196] When the at least one second lead adjusting mechanism is used to realize the transformation of the second cutting line winding around the cutting line grooves of the plurality of second cutting wheels in the at least one second wire cutting unit, in an actual scenario, the second cutting line grooves respectively corresponding to the second cutting line before and after the groove replacement can be determined in advance, for example, the position of the second cutting line before the groove replacement is the second cutting line groove a1, and the second cutting line after the groove replacement winds around the second cutting line groove a2. The displacement amount of the plurality of second cutting wheels in the second wire cutting unit driven by the second lead adjusting mechanism to move is determined based on the cutting offset amount between the second cutting line groove a1 and the second cutting line groove a2, that is, the displacement amount is set as the cutting offset amount between the second cutting line groove a1 and the second cutting line groove a2, so as to realize the replacement of the second cutting line from the second cutting line groove a1 to the second cutting line groove a2. It should be noted that the direction in which the plurality of second cutting wheels in the second wire cutting unit moves along the perpendicular direction of the second cutting wheel surface is the direction in which the cutting line groove a2 points to the cutting line groove a1. After the groove replacement, the cutting position of the second wire saw in space does not change, so that the step of further calibrating the positions of the second cutting wheels or other components can be omitted, and the silicon rod can be cut according to the preset cutting amount, so that the groove replacement process is simplified.

[0197] To further illustrate the implementation manner of the at least one second lead adjusting mechanism for moving the plurality of second cutting wheels in the second wire cutting unit in the direction perpendicular to the surface of the second cutting wheel, the present application discloses the following embodiments. When the number of the second wire cutting units in the second silicon rod cutting device is different, the specific form of the at least one second lead adjusting mechanism can be changed accordingly.

[0198] In some embodiments, the second silicon rod cutting device includes a single wire cutting unit, where the single wire cutting unit is a second wire cutting unit. The second lead adjusting mechanism includes a lead screw arranged in the orthogonal direction of the surface of the second cutting wheel and threadedly connected with the single wire cutting unit; and a lead screw driving source for driving the lead screw to rotate.

[0199] The second single-wire cutting unit includes a plurality of second cutting wheels, and a second cutting wire is wound around the plurality of second cutting wheels to form at least one second cutting wire saw. The lead screw of the second lead adjusting mechanism has a distal end and a proximal end. In specific implementations, the proximal end of the lead screw can be connected to a lead screw driving source and rotated under the driving of the lead screw driving source, and the distal end of the lead screw is threadedly connected to the second single-wire cutting unit. Through the connection of the two ends of the lead screw, the lead screw can be rotated based on the transmission of the lead screw driving source and convert the rotation of the lead screw into axial displacement through the threaded connection. The axial displacement direction is the orthogonal direction of the wheel surface of the cutting wheel. The rotation of the lead screw driven by the lead screw driving source of the second lead adjusting mechanism can realize the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the second cutting wheel. The rotation direction of the lead screw driven to rotate is different, which can realize the forward movement or backward movement of the second cutting wheel of the single-wire cutting unit in the orthogonal direction of the wheel surface of the second cutting wheel.

[0200] In some embodiments, the second single-wire cutting unit is a second wire cutting unit. The second lead adjusting mechanism includes an extension and contraction member arranged in the orthogonal direction of the wheel surface of the second cutting wheel and associated with the single-wire cutting unit, and an extension and contraction member driving source for driving the extension and contraction member to extend and contract in the orthogonal direction of the wheel surface of the second cutting wheel. The extension and contraction member can be arranged in a rod structure, and the extension direction of the rod body is the orthogonal direction of the wheel surface of the second cutting wheel. The extension and contraction member can extend and contract in the extension direction under the driving of the extension and contraction member driving source. One end of the extension and contraction member can be connected to the extension and contraction member driving source, and the freely extendable end is associated with the single-wire cutting unit. Under the action of the extension and contraction member driving source, the second cutting wheel of the single-wire cutting unit can be moved in the orthogonal direction of the wheel surface of the second cutting wheel. The extension and contraction member can be an electric telescopic rod, or a connecting rod connected to an air cylinder, which can be used as the extension and contraction member driving source. The application is not limited in this regard. The extension and contraction rod can be directly connected to the second cutting installation structure of the single-wire cutting unit, or indirectly connected to the second single-wire cutting unit through a support or a bearing. It should be understood that the extension and contraction of the extension and contraction member can correspond to the forward movement or backward movement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the second cutting wheel.

[0201] In the embodiments disclosed in the present application, the association can be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above-mentioned embodiments, the extension and contraction rod can be associated with the second wire cutting unit by one or more of clamping, screwing, bonding, and welding. Of course, the implementation of the association is not limited to this, but aims to achieve transmission in the second direction.

[0202] In some embodiments, the second silicon rod cutting device comprises a single wire cutting unit, where the single wire cutting unit is a wire cutting unit. The second distance adjusting mechanism comprises a rack arranged in the orthogonal direction of the second cutting wheel surface of the second single wire cutting unit, a transmission gear meshing with the rack, and a gear driving source for driving the transmission gear to rotate. The transmission gear rotates under the driving of the gear driving source, and the rack meshing with the transmission gear moves in the rack direction accordingly. In this example, the rotation movement driven by the gear driving source is converted into linear movement in the rack direction through the cooperation of the rack and the transmission gear. The rack arranged in the orthogonal direction of the second cutting wheel surface of the second single wire cutting unit can drive the second cutting wheel of the single wire cutting unit to move in the orthogonal direction of the second cutting wheel surface. At the same time, the rotation direction of the transmission gear is controlled by the gear driving source, so that the plurality of second cutting wheels of the single wire cutting unit can move forward or backward in the orthogonal direction of the second cutting wheel surface.

[0203] In some embodiments, the second silicon rod cutting device comprises two second wire cutting units arranged in parallel and opposite directions. At least one of the two second wire cutting units can be driven to move in the orthogonal direction of the second cutting wheel surface by the at least one distance adjusting mechanism, so as to adjust the wire saw distance between the second wire saws in the two second wire cutting units or change the cutting wire slot of the second cutting wire wound around the plurality of second cutting wheels in a certain second wire cutting unit.

[0204] The at least one second distance adjusting mechanism can be connected to a certain second wire cutting unit, or simultaneously associated with both second wire cutting units, so as to drive the plurality of second cutting wheels in the connected or associated one or both second wire cutting units to move in the orthogonal direction of the second cutting wheel surface.

[0205] In some embodiments, the second distance adjusting mechanism comprises a lead screw arranged in the orthogonal direction of the second cutting wheel surface and threadedly connected to a certain second wire cutting unit, and a lead screw driving source for driving the lead screw to rotate. The plurality of second cutting wheels in the second wire cutting unit connected to the lead screw driving source move in the orthogonal direction of the second cutting wheel surface in a similar manner as in the previous embodiments. The second wire cutting unit driven by the distance adjusting mechanism can be regarded as a single wire cutting unit, which will not be described here. It should be understood that arranging the second distance adjusting mechanism on any second wire cutting unit can increase and decrease the parallel second wire saw distance between the two second wire cutting units, and the second silicon rod cutting device can cut silicon rods into different specifications.

[0206] In some embodiments, the second distance adjusting mechanism comprises: a telescopic member arranged along the normal direction of the second cutting wheel surface and associated with one of the second wire cutting units; and a telescopic member driving source for driving the telescopic member to perform telescopic movement along the normal direction of the second cutting wheel surface. In this case, the second wire cutting unit associated with the second distance adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation manner can refer to the foregoing embodiments, which will not be described here again.

[0207] In some embodiments, the second distance adjusting mechanism comprises: a distance adjusting rack arranged along the normal direction of the second cutting wheel surface and associated with one of the second wire cutting units; a transmission gear meshing with the distance adjusting rack; and a gear driving source for driving the transmission gear to rotate. Through the meshing transmission gear and distance adjusting rack, the gear driving source can control the distance adjusting rack to move along the rack direction line, and the second wire cutting unit associated with the distance adjusting rack can drive multiple second cutting wheels to move along the normal direction of the second cutting wheel surface through the rack.

[0208] In some embodiments, the distance adjusting mechanism comprises: a bidirectional screw rod arranged along the normal direction of the second cutting wheel surface and threadedly connected with two second wire cutting units; and a screw rod driving source for driving the screw rod to rotate so that the two second wire cutting units move towards each other or move away from each other along the normal direction of the second cutting wheel surface. In an implementation, the bidirectional screw rod is a double-thread screw rod, the bidirectional screw rod is respectively provided with threads at two ends and the threads at the two ends are opposite in direction, and the screw rod driving source can be arranged at any one end of the bidirectional screw rod to drive the bidirectional screw rod to rotate along the screw rod shaft. Through the threads at the two ends of the bidirectional screw rod opposite in direction, the movement of the two ends of the bidirectional screw rod is converted into axial linear movement opposite in direction when the bidirectional screw rod is driven to rotate by the screw rod driving source, and the axial direction is the normal direction of the second cutting wheel surface where the bidirectional screw rod is arranged. Under the driving of the screw rod driving source, multiple second cutting wheels corresponding to the two second wire cutting units respectively can move towards each other or move away from each other.

[0209] In some embodiments, the second distance adjusting mechanism comprises a servo motor arranged at the at least one second wire cutting unit. In actual scenarios, a servo motor is arranged at or each of the at least one second wire cutting unit of the second silicon rod cutting device, and the corresponding second wire cutting unit is controlled by the servo motor to move in the orthogonal direction of the second cutting wheel surface. The second wire cutting unit can have a pre-determined cutting offset amount of slot changing or adjustment amount of cutting wire changing cutting position, and the plurality of second cutting wheels in the second wire cutting unit are driven by the servo motor to move in the orthogonal direction of the second cutting wheel surface by a pre-determined displacement amount. For example, two second wire cutting units are arranged in the second silicon rod cutting device, and at least one of the two second wire cutting units moves independently in the orthogonal direction of the second cutting wheel surface under the driving of the corresponding servo motor. In some examples, the servo motor can also be replaced by a travel motor and a travel lead screw. It should be understood that the second distance adjusting mechanism is a driving device for driving the relative movement of the plurality of second cutting wheels in the second wire cutting unit, and the specific form of the second distance adjusting mechanism is not limited in the present application.

[0210] As described above, in the second silicon rod cutting device, the second cutting wiresaws of the two parallel arranged second wire cutting units are arranged vertically or at an angle to the vertical direction. The second silicon rod transfer device and the silicon rod carried thereby are driven to move in the transfer direction, and the second cutting operation is performed on the silicon rod carried by the second silicon rod transfer device by the relative movement of the second wire cutting units and the second silicon rod transfer device in the transfer direction. The second cutting operation is performed on the silicon rod by the second wire cutting units, so that the silicon rod forms a cutting surface and a kerf, i.e., the cutting of the silicon rod by a cutting wiresaw in a second wire cutting unit can form a cutting surface and leave a kerf. Therefore, the second cutting operation performed on the silicon rod with a circular cross-section by the second cutting wiresaws in the two parallel arranged second wire cutting units in the second silicon rod cutting device can form two parallel second side cutting surfaces.

[0211] The silicon rod squaring device comprises a second kerf anti-collapse device cooperating with the second silicon rod transfer device, which is used to stabilize the kerf when the second cutting operation is performed on the silicon rod by the second silicon rod cutting device.

[0212] It should be understood that the silicon rod carried by the second silicon rod transfer device is in a horizontal position, i.e., the axis of the silicon rod is consistent with the transfer direction (i.e., the first direction X-axis). Therefore, the kerf formed by the second cutting operation performed on the silicon rod by the second silicon rod cutting device is also in a horizontal position.

[0213] In some embodiments, the second edge collapse prevention device comprises a clamping support and an edge clamp, wherein the edge clamp is arranged on the clamping support for clamping the edge. The edge clamp comprises a clamping seat, at least one pair of end face chucks, and a chuck driving mechanism. The at least one pair of end face chucks are arranged opposite to each other in the transfer direction for clamping two end faces of the silicon rod. The second silicon rod transfer device comprises a second edge collapse prevention device which cooperates with the second silicon rod transfer device to clamp the end faces of the silicon rod during the second cutting operation to prevent edge collapse.

[0214] In the present application, the second edge collapse prevention device can be the same as the first edge collapse prevention device described above. Therefore, the specific structure and working principle of the second edge collapse prevention device can be referred to the description of the first edge collapse prevention device above, and only a brief description is given here.

[0215] In some embodiments, the second edge collapse prevention device comprises a clamping support and an edge clamp. The clamping support of the second edge collapse prevention device is associated with the second carrying platform of the second silicon rod transfer device, i.e., the clamping support of the second edge collapse prevention device can advance and retreat together with the second carrying platform of the second silicon rod transfer device. The edge clamp is arranged on the clamping support. In some embodiments, the edge clamp comprises a clamping seat, at least one pair of end face chucks, and a chuck driving mechanism. The chuck driving mechanism is used to drive at least one end face chuck of the at least one pair of end face chucks to move in the clamping direction to adjust the clamping distance between the at least one pair of end face chucks.

[0216] In some embodiments, the chuck driving mechanism comprises a chuck moving guide rail arranged in the clamping direction, and a chuck driving unit used to drive at least one end face chuck of the at least one pair of end face chucks to move along the chuck moving guide rail. The second end face chuck and the second end face chuck of the at least one pair of end face chucks can be provided with a chuck moving guide rail therebetween.

[0217] In some embodiments, the chuck driving unit comprises at least one chuck telescopic assembly. The chuck telescopic assembly comprises a chuck telescopic rod and a chuck telescopic cylinder, the chuck telescopic rod is arranged along the clamping direction and associated with a corresponding one of the end face chucks, and the chuck telescopic cylinder is associated with the chuck telescopic rod. In some embodiments, the chuck driving mechanism is configured to drive two of the pair of end face chucks to move towards or away from each other along the clamping direction, and the chuck driving mechanism comprises a pair of chuck telescopic assemblies, each of which corresponds to one of the end face chucks, the chuck telescopic rod of each of the chuck telescopic assemblies is arranged along the clamping direction and associated with a corresponding one of the end face chucks, and the chuck telescopic cylinder of each of the chuck telescopic assemblies is associated with the chuck telescopic rod. The chuck telescopic cylinder of each of the pair of chuck telescopic assemblies is configured to control the chuck telescopic rod to retract or extend, thereby driving the corresponding one of the pair of end face chucks to move towards or away from the other one of the pair of end face chucks along the movement guide rail on the movement guide rod or the movement guide beam. In some embodiments, the chuck driving mechanism is configured to drive one of the pair of end face chucks to move towards or away from the other one of the pair of end face chucks along the clamping direction, and the chuck driving mechanism comprises a chuck telescopic assembly corresponding to the end face chuck to be moved, the chuck telescopic rod of the chuck telescopic assembly is arranged along the clamping direction and associated with the corresponding one of the end face chucks, and the chuck telescopic cylinder of the chuck telescopic assembly is associated with the chuck telescopic rod. The chuck telescopic cylinder of the chuck telescopic assembly is configured to control the chuck telescopic rod to retract or extend, thereby driving the corresponding one of the pair of end face chucks to move towards or away from the other one of the pair of end face chucks along the movement guide rail on the movement guide rod or the movement guide beam.

[0218] The chuck driving unit comprises at least one pair of clamping racks, a linkage gear, and a chuck driving source.

[0219] In some embodiments, the chuck driving unit comprises at least one chuck clamping assembly, the chuck clamping assembly comprises a clamping lead screw and a lead screw driving source.

[0220] In some embodiments, the chuck driving unit comprises a bidirectional lead screw and a lead screw driving source, the bidirectional lead screw is arranged along the clamping direction, the two ends of the bidirectional lead screw are respectively provided with threads with opposite directions, the two ends of the bidirectional lead screw are respectively associated with at least one pair of end face chucks, and the lead screw driving source is associated with the bidirectional lead screw.

[0221] The at least one pair of end face chucks are arranged opposite to each other along the clamping direction, and are configured to clamp the two end faces of the silicon rod.

[0222] In some embodiments, for each of the at least one pair of end face chucks, the end face chuck comprises a clamping base and a side skin pressing member arranged on the clamping base, the side skin pressing member being configured to press the side skin to be cut in the silicon rod.

[0223] In some embodiments, the clamping base may, for example, be a clamping plate, which is sized to cover the side skin to be cut.

[0224] In some embodiments, the side skin pressing member comprises a side skin pressing screw arranged on the clamping plate, the number of the side skin pressing screw may be one or more. In practical applications, the side skin pressing screw is configured to press the side skin to be cut, which can ensure that the side skin to be cut in the silicon rod remains stable during the second cutting operation.

[0225] Of course, in the end face chuck, the side skin pressing member may also comprise a side skin pressing elastic member arranged on the clamping base. For example, in some embodiments, the side skin pressing elastic member comprises a side skin pressing rod, which is sleeved with a compression spring.

[0226] Thus, when the second cutting operation is performed on the silicon rod by the second silicon rod cutting device, the silicon rod is carried by the second silicon rod transfer device, at least one of the at least one pair of end face chucks is moved along the clamping direction by the chuck driving mechanism in the second side skin anti-collapse device, so that the at least one pair of end face chucks clamps the two end faces of the silicon rod, and the side skin pressing member in the end face chuck presses the side skin to be cut in the silicon rod, which can ensure that the side skin to be cut in the silicon rod remains stable during the second cutting operation, and can avoid the phenomena that the side skin falls off or the side skin deviates from the main body of the silicon rod to cause the side skin to collapse when the second cutting wire saw in the second wire cutting unit completely cuts through the silicon rod.

[0227] In some embodiments, for each of the at least one pair of end face chucks, the end face chuck comprises a silicon rod pressing member, a side skin pressing member, and a side skin clamping reinforcing member, wherein the silicon rod pressing member is configured to press the main body of the silicon rod, the side skin pressing member is configured to press the side skin to be cut in the silicon rod, and the side skin clamping reinforcing member is configured to apply additional clamping force to the side skin. In this application, the silicon rod with a circular cross section is subjected to the square cutting operation to form a square silicon rod with a rectangular cross section, wherein the main body of the silicon rod refers to at least the part containing the square silicon rod, i.e., the main body of the silicon rod is relative to the side skin, the main body of the silicon rod contains the square silicon rod, and the main body of the silicon rod varies in different square cutting operations. In the following description, the main body of the silicon rod is referred to as the silicon rod main body.

[0228] In some embodiments, the clamping base can be a clamping substrate, which is sized to fit the end face of the silicon rod and the edge skin to be cut, i.e. the clamping substrate covers at least part of the silicon rod body and part of the edge skin. The clamping substrate covers part of the silicon rod body so that the silicon rod pressing member provided thereon can act on the silicon rod body. The clamping substrate also covers part of the edge skin so that the edge skin pressing member and the edge skin clamping reinforcement provided thereon can act on the edge skin.

[0229] In some embodiments, the silicon rod pressing member includes a silicon rod pressing screw provided on the clamping substrate, and the edge skin pressing member includes an edge skin pressing screw provided on the clamping substrate. The number of the silicon rod pressing screws can be one or more, and the number of the edge skin pressing screws can be one or more. In practical applications, the silicon rod pressing screws are used to press the silicon rod body, and the edge skin pressing screws are used to press the edge skin to be cut. When the silicon rod pressing screws press the silicon rod body and the edge skin pressing screws press the edge skin to be cut, the relative stability between the silicon rod body and the edge skin can be ensured, and the edge skin falling or the edge skin deviating from the silicon rod body to cause edge collapse can be avoided when the cutting wire saw in the wire cutting unit completely cuts through the silicon rod.

[0230] It is known that in some cases, the end face of the silicon rod is not an ideal flat surface, and one of the silicon rod pressing member and the edge skin pressing member cannot effectively abut and press the corresponding silicon rod body or edge skin.

[0231] In order to adapt the silicon rod pressing member and the edge skin pressing member provided on the clamping base to the end face of the silicon rod to achieve effective pressing, in some embodiments, the end face chuck further includes a biasing fine adjustment structure for adjusting the position of the clamping base. By using the biasing fine adjustment structure, the position of the clamping base can be locally adjusted, thereby changing the position of the silicon rod pressing member and the edge skin pressing member provided on the clamping base.

[0232] In some embodiments, the biasing fine adjustment structure adopts a ball head structure or a similar structure, and the clamping base is provided through the ball head structure. In some embodiments, the ball head or the semi-ball head is connected to the clamping substrate through a connecting rod, and the ball head or the semi-ball head is embedded in a receiving cavity.

[0233] In some embodiments, the biasing fine adjustment structure adopts a hinged structure, and the clamping base is provided through the hinged structure. For example, the clamping substrate is associated with the mounting structure through the hinged structure, and can be biased relative to the mounting structure within a certain amplitude.

[0234] In some embodiments, the silicon rod pressing member comprises a silicon rod pressing spring provided on the clamping base, and the edge skin pressing member comprises an edge skin pressing spring provided on the clamping base. For example, in some embodiments, the silicon rod pressing spring comprises a silicon rod pressing rod sleeved with a compression spring, and the edge skin pressing spring comprises an edge skin pressing rod sleeved with a compression spring. In some embodiments, the silicon rod pressing spring comprises a silicon rod pressing block with a compression spring provided at the rear end thereof, and the edge skin pressing spring comprises an edge skin pressing block with a compression spring provided at the rear end thereof.

[0235] In the end face chuck, an edge skin clamping reinforcing member is further included, which is capable of advancing and retreating relative to the clamping base along the clamping direction. When the edge skin clamping reinforcing member advances relative to the clamping base, the edge skin clamping reinforcing member can provide a strong clamping force to the corresponding edge skin. Generally, the clamping force exerted on the edge skin by the edge skin clamping reinforcing member is greater than the pressing force exerted on the silicon rod body by the silicon rod pressing member and the pressing force exerted on the edge skin by the edge skin pressing member.

[0236] In some embodiments, the edge skin clamping reinforcing member comprises a telescopic pressing rod or a telescopic pressing block and a telescopic driving source, and the telescopic pressing rod or the telescopic pressing block is controlled by the telescopic driving source to advance and retreat relative to the clamping base. A through hole is provided on the clamping base, and the telescopic driving source and the telescopic pressing rod or the telescopic pressing block are arranged on a mounting structure. The telescopic driving source can drive the telescopic pressing rod or the telescopic pressing block to extend out of the clamping base and press against the corresponding edge skin, or to retract into the clamping base. The telescopic driving source may, for example, be a telescopic pneumatic cylinder.

[0237] The end face chuck can still be changed in other embodiments.

[0238] In some embodiments, the end face chuck comprises a second clamping base and a second clamping base, wherein a silicon rod pressing member is arranged on the second clamping base, an edge skin pressing member is arranged on the second clamping base, and an edge skin clamping reinforcing member capable of advancing and retreating relative to the second clamping base along the clamping direction is arranged.

[0239] In some embodiments, the second clamping base may, for example, be a clamping base plate, the size of which is adapted to the end face of the silicon rod body, i.e., at least a part of the silicon rod body is covered by the second clamping base, so that the silicon rod pressing member arranged thereon can act on the silicon rod body. The second clamping base may, for example, be a clamping base plate, the size of which is adapted to the end face of the edge skin to be cut, i.e., at least a part of the edge skin is covered by the second clamping base, so that the edge skin pressing member arranged thereon can act on the edge skin.

[0240] In the end face chuck, the silicon rod pressing member comprises a silicon rod pressing screw arranged on the second clamping substrate, and the number of the silicon rod pressing screw can be one or more. The edge skin pressing member comprises an edge skin pressing screw arranged on the second clamping substrate, and the number of the edge skin pressing screw can be one or more. In actual application, the silicon rod pressing screw is used to press the silicon rod body, and the edge skin pressing screw is used to press the edge skin to be cut. When the silicon rod pressing screw presses the silicon rod body and the edge skin pressing screw presses the edge skin to be cut, the relative stability between the silicon rod body and the edge skin can be ensured, and the edge skin falling or the edge skin and the silicon rod body deviating to cause edge collapse and other phenomena can be avoided when the cutting wire saw in the wire cutting unit completely cuts off.

[0241] In addition, in some embodiments, in the end face chuck, the silicon rod pressing member comprises a silicon rod pressing elastic member arranged on the second clamping substrate, and the edge skin pressing member comprises an edge skin pressing elastic member arranged on the second clamping substrate. For example, in some embodiments, the silicon rod pressing elastic member comprises a silicon rod pressing rod sleeved with a compression spring, and the edge skin pressing elastic member comprises an edge skin pressing rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member comprises a silicon rod pressing block with a compression spring arranged at the rear end of the silicon rod pressing block, and the edge skin pressing elastic member comprises an edge skin pressing block with a compression spring arranged at the rear end of the edge skin pressing block.

[0242] In the end face chuck, the edge skin clamping reinforcing member can be advanced and retreated relative to the second clamping substrate. When the edge skin clamping reinforcing member is advanced relative to the second clamping substrate, the edge skin clamping reinforcing member can provide strong clamping force to the corresponding edge skin. Generally, the clamping force applied to the edge skin by the edge skin clamping reinforcing member is greater than the pressing force applied to the silicon rod body by the silicon rod pressing member and the pressing force applied to the edge skin by the edge skin pressing member.

[0243] In some embodiments, the edge skin clamping reinforcing member comprises a telescopic pressing rod or a telescopic pressing block which is controlled to be advanced and retreated relative to the second clamping substrate. For example, the edge skin clamping reinforcing member comprises a telescopic pressing rod or a telescopic pressing block and a telescopic driving source, and the telescopic driving source drives the telescopic pressing rod or the telescopic pressing block to be advanced and retreated relative to the second clamping substrate. In some embodiments, a through hole is arranged on the second clamping substrate, the telescopic driving source and the telescopic pressing rod or the telescopic pressing block are arranged on a mounting structure, and the telescopic driving source can drive the telescopic pressing rod or the telescopic pressing block to protrude out of the second clamping substrate and press the corresponding edge skin, or drive the telescopic pressing rod or the telescopic pressing block to retract into the second clamping substrate. The telescopic driving source can be, for example, a telescopic pneumatic cylinder.

[0244] Thus, when the second cutting operation is performed on the silicon rod by the second silicon rod cutting device, the silicon rod is carried by the second silicon rod transfer device, at least one of the at least one pair of end face chucks is driven by the chuck driving mechanism in the second edge skin anti-collapse device to move along the clamping direction, so that the at least one pair of end face chucks clamps the two end faces of the silicon rod, wherein the silicon rod pressing part in the end face chuck presses on the main body of the silicon rod, the edge skin pressing part in the end face chuck presses on the edge skin to be cut of the silicon rod, and the edge skin clamping reinforcement in the end face chuck is in a retracted state (in the retracted state, the edge skin clamping reinforcement is recessed in the clamping base, or protrudes from the clamping base but the protrusion height relative to the clamping base is also less than the protrusion height of the silicon rod pressing part and the edge skin pressing part relative to the clamping base), so that the edge skin and the main body of the silicon rod remain relatively stationary, and the phenomenon of edge skin falling or edge skin and main body of the silicon rod deviating to cause edge collapse and the like can be avoided when the cutting wire saw in the wire cutting unit completely cuts through the silicon rod. After the edge skin cutting is completed, the edge skin clamping reinforcement in the end face chuck is driven to protrude relative to the clamping base and press on the cut edge skin, and the clamping force of the edge skin clamping reinforcement on the edge skin is greater than the pressing force of the silicon rod pressing part on the main body of the silicon rod and the pressing force of the edge skin pressing part on the edge skin, at which time the at least one pair of end face chucks can be operated to move the cut edge skin.

[0245] In the present application, the second edge skin anti-collapse device can further include an edge skin clamp advancing and retreating mechanism for driving the edge skin clamp to advance and retreat along the advancing and retreating direction.

[0246] In the embodiment in which the end face chuck includes the clamping base and the edge skin pressing part provided on the clamping base, after the edge skin cutting is completed, the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to retreat along the advancing and retreating direction, and the pressing force of the edge skin pressing part on the edge skin can drive the clamped edge skin to separate from the main body of the silicon rod.

[0247] In the embodiment in which the end face chuck includes the clamping base, the silicon rod pressing part and the edge skin pressing part provided on the clamping base, and the edge skin clamping reinforcement that advances and retreats relative to the clamping base along the clamping direction, after the edge skin cutting is completed, the edge skin clamping reinforcement in the end face chuck is driven to protrude relative to the clamping base and press on the cut edge skin, at which time the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to retreat along the advancing and retreating direction, and the clamping force of the edge skin clamping reinforcement on the edge skin is greater than the pressing force of the silicon rod pressing part on the main body of the silicon rod and the pressing force of the edge skin pressing part on the edge skin, so that the clamped edge skin can be driven to separate from the main body of the silicon rod.

[0248] In some embodiments, the edge clamp advancing and retreating mechanism comprises: an advancing and retreating guide rail arranged along the advancing and retreating direction; and an edge clamp advancing and retreating unit for driving the edge clamp to move along the advancing and retreating guide rail.

[0249] In some embodiments, the edge clamp advancing and retreating unit comprises: an edge clamp seat telescopic rod arranged along the advancing and retreating direction and associated with the edge clamp seat of the edge clamp; and an edge clamp seat telescopic cylinder associated with the edge clamp seat telescopic rod.

[0250] In some embodiments, the edge clamp advancing and retreating unit comprises: an edge clamp advancing and retreating mechanism comprising: an edge clamp seat rack arranged along the advancing and retreating direction and associated with the edge clamp seat of the edge clamp; an edge clamp seat gear engaged with the edge clamp seat rack; and a gear driving source associated with the edge clamp seat gear for driving the edge clamp seat gear to rotate so as to move the engaged edge clamp along the advancing and retreating direction. The gear driving source may, for example, be a servo motor.

[0251] In some embodiments, the edge clamp advancing and retreating unit comprises: an edge clamp seat rack arranged along the advancing and retreating direction and associated with the edge clamp seat of the edge clamp; and an edge clamp seat gear engaged with the edge clamp seat rack; and a gear driving source associated with the edge clamp seat gear for driving the edge clamp seat gear to rotate so as to move the engaged edge clamp along the advancing and retreating direction. The gear driving source may, for example, be a servo motor.

[0252] In the present application, the second edge collapse prevention device may further comprise an edge clamp lifting mechanism for driving the edge clamp to move up and down along the vertical direction. In some embodiments, the edge clamp is driven by the edge clamp lifting mechanism to move up or down along the vertical direction so as to adapt to the size of the silicon rod carried by the silicon rod transfer. For example, when the size of the silicon rod is large, the edge clamp is driven by the edge clamp lifting mechanism to move up along the vertical direction, and when the size of the silicon rod is small, the edge clamp is driven by the edge clamp lifting mechanism to move down along the vertical direction.

[0253] In some embodiments, the edge clamp lifting mechanism comprises: an edge clamp lifting guide rail arranged along the vertical direction; and an edge clamp lifting unit for driving the edge clamp to move up and down along the edge clamp lifting guide rail.

[0254] In some embodiments, the edge clamp lifting unit comprises: a lifting screw rod arranged along the vertical direction and associated with the edge clamp seat of the edge clamp; and a screw rod driving source associated with the lifting screw rod.

[0255] In some embodiments, the clamp lifting unit comprises a lifting rack, a lifting gear, and a gear driving source, wherein the lifting rack is arranged along a vertical direction and associated with the clamp seat of the edge clamp, the lifting gear is engaged with the lifting rack, and the gear driving source is associated with the lifting gear for driving the lifting gear to rotate so as to make the engaged edge clamp move up and down along the vertical direction. The gear driving source may, for example, be a servo motor.

[0256] Thus, when the second edge collapse-preventing device is applied, the silicon rod is horizontally placed on the silicon rod bearing platform of the silicon rod transfer device; the edge clamp is driven by the clamp lifting mechanism in the second edge collapse-preventing device to move up and down along the vertical direction for position adjustment; the edge clamp is driven by the edge clamp advancing and retreating mechanism in the second edge collapse-preventing device to advance along the advancing and retreating direction and approach the silicon rod; at least one of the end face clamps in the at least one pair of end face clamps is driven by the clamp driving mechanism in the second edge collapse-preventing device to move along the clamping direction until the silicon rod pressing member on the end face clamp presses against the main body of the silicon rod and the edge pressing member on the end face clamp presses against the edge to be cut. Then, the silicon rod is cut by the silicon rod cutting device to form the main body of the silicon rod and the edge. After the edge is cut, the edge pressing member in the end face clamp is driven to protrude relative to the clamping base and press against the cut edge, at which time, the edge clamp is driven by the edge clamp advancing and retreating mechanism to retreat along the advancing and retreating direction, and the clamping force exerted on the edge by the edge pressing member is greater than the pressing force exerted on the main body of the silicon rod by the silicon rod pressing member and the pressing force exerted on the edge by the edge pressing member, so that the clamped edge can be separated from the main body of the silicon rod.

[0257] In the present application, the second edge collapse-preventing device further comprises an edge unloading and conveying mechanism connected with the edge clamp advancing and retreating mechanism.

[0258] In some embodiments, the edge unloading and conveying mechanism may, for example, comprise an edge bearing structure and a conveying driving mechanism.

[0259] The edge bearing structure is used for bearing the edge. As described above, the edge clamped by the edge clamp is driven by the edge clamp advancing and retreating mechanism to retreat along the advancing and retreating direction so as to separate the edge from the main body of the silicon rod, and then the clamp driving mechanism in the edge clamp drives the clamps to move to release the clamped edge and make it fall on the edge bearing structure. In some embodiments, the edge bearing structure may, for example, be an edge placing groove. The edge placing groove may, for example, have a U-shaped structure.

[0260] In some embodiments, the conveying drive mechanism is configured to move the drive edge carrier structure in a transfer direction to move between the second loading and unloading zone and the second cutting zone. In some embodiments, the conveying drive mechanism can be, for example, a chain conveying mechanism, which includes an endless chain, a chain drive source, and a connecting member. The endless chain is a closed loop chain that is arranged around a plurality of movable gears to form a predetermined shape, such as, for example, an inverted triangle, a rectangle, or a trapezoid. The edge carrier structure is associated with the endless chain by the connecting member. The chain drive source can be, for example, a servo motor, which is associated with one of the movable gears, such as, for example, the output shaft of the servo motor is connected to the gear shaft of the movable gear. When the endless chain is driven to rotate by the servo motor, the edge carrier structure and the edge carried thereby can be moved in the transfer direction by the connecting member. In actual applications, when the servo motor operates to drive the associated movable gear to rotate in a forward direction (or in a reverse direction), the movable gear rotating in the forward direction (or in the reverse direction) drives the engaged endless chain to move in a forward direction (or in a reverse direction), and the endless chain moving in the forward direction (or in the reverse direction) drives the edge carrier structure and the edge carried thereby to move from the second loading and unloading zone to the second cutting zone by the connecting member. Conversely, when the servo motor operates to drive the associated movable gear to rotate in a reverse direction (or in a forward direction), the movable gear rotating in the reverse direction (or in the forward direction) drives the engaged endless chain to move in a reverse direction (or in a forward direction), and the endless chain moving in the reverse direction (or in the forward direction) drives the edge carrier structure and the edge carried thereby to move from the second cutting zone to the second loading and unloading zone by the connecting member.

[0261] In the present application, the edge feeding and conveying mechanism further includes an edge flipping mechanism configured to drive the edge carrier structure to flip. Each edge carrier structure is provided with an edge flipping mechanism, which is configured to drive the corresponding edge carrier structure and the edge carried thereby to flip. In some embodiments, the edge flipping mechanism includes a pivot shaft and a telescopic assembly, which includes a telescopic rod and a telescopic cylinder. The edge carrier structure is pivotally mounted by the pivot shaft. One end of the telescopic rod is associated with the corresponding edge carrier structure, and the other end of the telescopic rod is associated with the telescopic cylinder. In actual applications, the telescopic cylinder drives the telescopic rod to retract, and the edge carrier structure is pulled by the telescopic rod to flip towards the vertical direction and to be arranged vertically. The telescopic cylinder drives the telescopic rod to extend, and the edge carrier structure is pushed by the telescopic rod to flip away from the vertical direction and to be arranged horizontally or obliquely, so that the edge carried by the edge carrier structure is arranged horizontally or obliquely, which facilitates subsequent unloading of the edge.

[0262] In the second cutting operation of the silicon rod by the second silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine, the silicon rod with two first side cutting surfaces is placed in a horizontal manner on the second silicon rod transfer device at the second loading and unloading position (the first side cutting surface of the silicon rod is in contact with the second silicon rod transfer device); the second silicon rod carrying device and the silicon rod carried thereby are driven to transfer from the second loading and unloading position to the second cutting position along the transfer direction, the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to advance to the silicon rod along the advancing and retreating direction, the edge skin clamp of the second edge skin anti-collapse device is driven to clamp the silicon rod, at this time, the two second cutting wire saws arranged in parallel in the second silicon rod cutting device are located between the front edge skin clamp and the silicon rod; the second silicon rod transfer device carrying the silicon rod is driven to advance along the transfer direction towards the second cutting position, the two second cutting wire saws arranged in parallel in the second silicon rod cutting device are used to perform the second cutting operation on the silicon rod with a circular cross section by relative movement of the second silicon rod cutting device and the second silicon rod transfer device along the transfer direction, and after the two edge skins of the silicon rod are cut off by the two second cutting wire saws, the silicon rod forms two parallel second side cutting surfaces to obtain a square silicon rod with a rectangular cross section, and the second side cutting surface is perpendicular to the first side cutting surface; the edge skin clamped by the edge skin clamp is retreated along the advancing and retreating direction by the edge skin clamp advancing and retreating mechanism in the second edge skin anti-collapse device, so as to drive the clamped edge skin to separate from the silicon rod body; the edge skin clamp and the edge skin clamped thereby are lowered by the clamp lifting mechanism, the edge skin clamp is released, the edge skin is released onto the edge skin carrying structure, the edge skin carrying structure is transferred from the second cutting position to the second loading and unloading position along the transfer direction by the conveying driving mechanism, and the edge skin carrying structure and the edge skin carried thereby are turned over by the edge skin turning mechanism to unload the turned-over edge skin; the second silicon rod carrying device and the silicon rod body carried thereby are driven to transfer from the second cutting position to the second loading and unloading position along the transfer direction, and the second cutting operation of the silicon rod is completed.

[0263] The silicon rod cutting and grinding all-in-one machine also includes a silicon rod loading and unloading device for loading the silicon rod with a circular cross section onto the first silicon rod transfer device, unloading the silicon rod after the first cutting from the first silicon rod transfer device and loading it onto the second silicon rod transfer device, and unloading the square silicon rod after the second cutting operation from the second silicon rod transfer device and loading it onto the silicon rod grinding equipment.

[0264] In some embodiments, the silicon rod loading and unloading device includes a silicon rod mounting frame, a silicon rod clamp, and a clamp displacement mechanism, wherein the silicon rod mounting frame is arranged across the cutting machine seat along the displacement direction, the silicon rod clamp is used to clamp the two end surfaces of the silicon rod, and the clamp displacement mechanism is used to drive the silicon rod clamp to move along the displacement direction to move the silicon rod clamp on the silicon rod mounting frame.

[0265] In some embodiments, the silicon rod loading and unloading device includes a silicon rod mounting frame, a silicon rod clamp, and a clamp displacement mechanism, wherein the silicon rod mounting frame is arranged across the cutting machine seat along the displacement direction, the silicon rod clamp is used to clamp the two end surfaces of the silicon rod, and the clamp displacement mechanism is used to drive the silicon rod clamp to move along the displacement direction to move the silicon rod clamp on the silicon rod mounting frame.Figure 1 and Figure 2 In the embodiment shown, the silicon rod squaring equipment includes a silicon rod loading and unloading device 17, which includes a silicon rod mounting frame 171, a silicon rod clamp 172, and a clamp repositioning mechanism.

[0266] The silicon rod mounting bracket is mounted across the cutting machine base along the transposition direction. The transposition direction is consistent with the second direction. The length of the silicon rod mounting bracket must be sufficient to cover the entire cutting platform of the cutting machine base. When the cutting platform has one or more cutting station groups, each cutting station group includes multiple cutting stations along the second direction, the length of the silicon rod mounting bracket must be long enough to cover the multiple cutting stations.

[0267] The silicon rod clamp is used to hold the two end faces of a silicon rod. In some embodiments, the silicon rod clamp includes a clamp mounting bracket and a silicon rod holding element. Please refer to [link to relevant documentation]. Figure 2 The image shows a schematic diagram of a silicon rod clamp in one embodiment. Figure 1 and Figure 2 In the embodiment shown, the silicon rod clamp 172 includes a clamp mounting frame 173 and a silicon rod holder 174.

[0268] The fixture mounting frame is mounted on the silicon rod mounting frame for setting silicon rod clamping components. Here, the specific structure of the fixture mounting frame can be set in different forms based on the arrangement requirements of the silicon rod clamping components, such as beams, frames, plate frames, etc.

[0269] The silicon rod clamping member is disposed on the fixture mounting frame. In some embodiments, the silicon rod clamping member moves up and down relative to the fixture mounting frame via a fixture lifting mechanism. The silicon rod clamping member is used to clamp silicon rods. In some embodiments, the silicon rod clamping member includes: a clamping arm mounting base, at least one pair of clamping arms, and a clamping arm driving mechanism.

[0270] The clamping arm mounting base is disposed on the clamp mounting frame. As mentioned above, the silicon rod clamping member moves up and down relative to the clamp mounting frame via a clamp lifting mechanism.

[0271] In some embodiments, the clamp lifting mechanism comprises a lifting guide rail and a lifting driving unit. The lifting guide rail is arranged along a lifting direction for setting the silicon rod clamping member. Specifically, the lifting guide rail is associated with the clamp arm mounting seat. The lifting driving unit is configured to drive the silicon rod clamping member to move up and down along the lifting guide rail. In some implementations, the lifting driving unit comprises a driving motor and a screw rod assembly arranged along the lifting direction and driven by the driving motor. The driving motor can be arranged at one end of the screw rod assembly and disposed on the clamp mounting frame. The screw rod assembly is controlled by the driving motor and screwed with the clamp arm mounting seat of the silicon rod clamping member. In this way, when the clamp lifting mechanism is used, the screw rod assembly is driven by the driving motor to rotate forward, thereby driving the silicon rod clamping member connected with the screw rod assembly to move upward along the lifting guide rail, or the screw rod assembly is driven by the driving motor to rotate reversely, thereby driving the silicon rod clamping member connected with the screw rod assembly to move downward along the lifting guide rail.

[0272] The at least one pair of clamp arms is arranged opposite to each other on the clamp arm mounting seat along the transfer direction for clamping the two end faces of the silicon rod. Any one of the at least one pair of clamp arms is provided with a clamping portion for directly contacting and clamping the silicon rod. In some embodiments, the clamp arm extends downward from the clamp arm mounting seat, i.e., the bottom of the clamp arm is arranged on the clamp arm seat, and the top of the clamp arm is provided with a clamping portion for contacting and clamping the end face of the silicon rod. In this application, for the silicon rod to be cut, the silicon rod to be cut is a cylindrical structure with a certain length, and the length direction thereof is placed along the transfer direction (i.e., the first direction), and the end face is the face at both ends of the length direction. For the cut silicon rod, the silicon rod is a rectangular cuboid structure (the cross section thereof is rectangular or similar to rectangular) with a certain length, and the length direction thereof is placed along the transfer direction (i.e., the first direction), and the end face is the face at both ends of the length direction.

[0273] The silicon rod clamp further comprises a clamp arm driving mechanism, which can drive at least one of the at least one pair of clamp arms to move along the transfer direction to adjust the clamping spacing between the pair of oppositely arranged clamp arms. In this way, the clamping portions of the at least one pair of clamp arms can approach or move away from each other under the action of the clamp arm driving mechanism to perform the clamping or releasing action on the silicon rod.

[0274] In some embodiments, the clamp arm driving mechanism comprises a moving guide rail and a clamp arm driving unit. The moving guide rail is arranged along the transfer direction (i.e., the first direction) for setting the at least one pair of clamp arms. In some implementations, the bottom of at least one of the at least one pair of clamp arms is provided with a guide groove structure matched with the moving guide rail. The clamp arm driving unit is associated with at least one of the at least one pair of clamp arms for driving the associated clamp arm to move along the moving guide rail.

[0275] In some embodiments, the arm driving unit comprises a moving rack arranged on the arm mounting base in a moving direction, a driving gear arranged on the associated arm and engaged with the moving rack, and a gear driving source for driving the driving gear to rotate so as to move the associated arm in the moving direction. The moving rack can be in the form of a rack, and the gear driving source can be, for example, a servo motor. In the above embodiments, the moving rack, the driving gear, and the gear driving source in the arm driving unit can be implemented in different ways.

[0276] In some embodiments, when driving one arm is to be implemented, an arm driving unit can be provided, which comprises a moving rack, a driving gear, and a gear driving source. In actual application, the driving gear is driven by the gear driving source to rotate so as to move the associated arm along the moving rack, for example, to move close to the other arm (to reduce the clamping distance between the two arms) or to move away from the other arm (to increase the clamping distance between the two arms).

[0277] In some embodiments, when driving a pair of arms is to be implemented, two arm driving units can be provided, each comprising a moving rack, a driving gear, and a gear driving source. In actual application, for each arm, the driving gear is driven by the gear driving source to rotate so as to move the associated arm along the moving rack, so that by driving the respective arms to move by the two arm driving units respectively, the two arms can be driven to move towards each other (the two arms move close to each other to reduce the clamping distance between the two arms) or move away from each other (the two arms move away from each other to increase the clamping distance between the two arms).

[0278] In some embodiments, the arm driving unit comprises a moving rack arranged on the associated arm in a moving direction, a driving gear arranged on the arm mounting base and engaged with the moving rack, and a gear driving source for driving the driving gear to rotate so as to move the associated arm in the moving direction. The moving rack can be in the form of a rack, and the gear driving source can be, for example, a servo motor. In the above embodiments, the moving rack, the driving gear, and the gear driving source in the arm driving unit can be implemented in different ways.

[0279] In some embodiments, when driving one arm is to be implemented, an arm driving unit can be provided, which comprises a moving rack, a driving gear, and a gear driving source. In actual application, the driving gear is driven by the gear driving source to rotate so as to move the associated arm along the moving rack, for example, to move close to the other arm (to reduce the clamping distance between the two arms) or to move away from the other arm (to increase the clamping distance between the two arms).

[0280] In some implementations, when a pair of clamping arms is to be actuated, two clamping arm actuating units can be provided, each including a moving rack, a driving gear, and a gear driving source. In actual applications, for each clamping arm, the driving gear is driven to rotate by the gear driving source to move the associated clamping arm along the moving rack. Thus, by driving each corresponding clamping arm to move by the two clamping arm actuating units respectively, the two clamping arms can be driven to move towards each other (to reduce the clamping distance between the two clamping arms) or move away from each other (to increase the clamping distance between the two clamping arms).

[0281] In some implementations, when a pair of clamping arms is to be actuated, one clamping arm actuating unit can be provided, which includes two moving racks, a driving gear, and a gear driving source. Each moving rack is associated with a corresponding clamping arm. The driving gear is disposed between the two moving racks on the clamping arm mounting seat and engages with both moving racks. In actual applications, the driving gear is driven to rotate by the gear driving source to move the associated opposite clamping arm mounting seat and its clamping arms along the moving racks towards each other (to reduce the clamping distance between the two clamping arms) or move away from each other (to increase the clamping distance between the two clamping arms).

[0282] In some implementations, the clamping arm actuating unit includes a moving lead screw disposed in a transfer direction and associated with a corresponding clamping arm, and a lead screw driving source for driving the moving lead screw to rotate to move the associated clamping arm in the transfer direction. The lead screw driving source can be, for example, a servo motor. In the above implementations, the moving lead screw and the lead screw driving source in the clamping arm actuating unit can be implemented in different ways.

[0283] In some implementations, when a clamping arm is to be actuated, a clamping arm actuating unit can be provided, which includes a moving lead screw and a lead screw driving source. The moving lead screw is disposed in a transfer direction and associated with a corresponding clamping arm. In actual applications, the moving lead screw is driven to rotate by the lead screw driving source to move the associated clamping arm in the transfer direction, for example, to move closer to another clamping arm (to reduce the clamping distance between the two clamping arms) or to move away from another clamping arm (to increase the clamping distance between the two clamping arms).

[0284] In some implementations, when a pair of clamping arms is to be actuated, two clamping arm actuating units can be provided, each including a moving screw rod and a screw rod driving source, wherein each moving screw rod is associated with a respective one of the clamping arms. In actual use, for each clamping arm, the moving screw rod is driven to rotate by the screw rod driving source to move the associated clamping arm in the shifting direction, so that by using the two clamping arm actuating units to respectively drive the corresponding clamping arms to move, the two clamping arms can be driven to move towards each other (to reduce the clamping distance between the two clamping arms) or move away from each other (to increase the clamping distance between the two clamping arms) along the moving toothed rail.

[0285] In some implementations, when a pair of clamping arms is to be actuated, a clamping arm actuating unit can be provided, which includes a moving screw rod and a screw rod driving source, wherein the moving screw rod can be, for example, a bidirectional screw rod having threads at opposite ends with opposite directions, and the opposite ends of the bidirectional screw rod are respectively associated with a pair of opposite clamping arms. In actual use, the bidirectional screw rod is driven to rotate by the screw rod driving source to move the associated pair of opposite clamping arms towards each other (to reduce the clamping distance between the two clamping arms) or move away from each other (to increase the clamping distance between the two clamping arms) along the moving toothed rail.

[0286] Of course, the clamping arm actuating unit can still be varied in other ways. For example, in some implementations, the clamping arm actuating unit can include a telescopic air cylinder, and the opposite ends of the telescopic air cylinder are respectively associated with a pair of opposite clamping arms. Alternatively, in some implementations, the clamping arm actuating unit includes a clamping arm telescopic assembly, which includes a clamping arm telescopic rod associated with a respective one of the clamping arms and a clamping arm telescopic cylinder associated with the clamping arm telescopic rod.

[0287] In some embodiments, the clamping arms are rotatable, and the silicon rod clamping device further comprises a clamping arm rotating mechanism for driving the clamping arms to rotate. In some implementations, the clamping arm rotating mechanism is arranged on at least one of the at least one pair of clamping arms, and any one of the clamping portions of the at least one pair of clamping arms or both clamping portions of the pair of clamping arms are rotatable, and are driven by the clamping arm rotating mechanism to rotate along the axial line of the silicon rod, so that the clamped silicon rod rotates along the axial line of the silicon rod. For example, in some examples, the clamping arm rotating mechanism can be a rotating motor, and both clamping portions of the pair of clamping arms are rotatable, and both clamping portions of the pair of clamping arms or one clamping portion of the pair of clamping arms are connected to the output shaft of the rotating motor. For example, both clamping portions of the pair of clamping arms are connected to a rotating motor, and both clamping portions of the pair of clamping arms are driven by the rotating motor to rotate, or one clamping portion of the pair of clamping arms is connected to a rotating motor, and the one clamping portion of the pair of clamping arms is driven by the rotating motor to rotate, and the other clamping portion of the pair of clamping arms is also driven to rotate by the friction of the clamped silicon rod.

[0288] In some implementations of the present embodiments, the clamping portions of the at least one pair of clamping arms have a contact surface for clamping the silicon rod or the square silicon rod. The contact surface is arranged on a rotatable platform, and the platform can have a self-defined regular geometric shape or irregular geometric shape.

[0289] In some embodiments, the rotatable platform can be a whole body of a hinged device with a locking function, and can rotate along the axial line of the transfer direction. The axial line of the rotating shaft is connected to the clamping arm rotating mechanism.

[0290] In some embodiments, the clamping portion of the clamping arm can be a rotatable circular platform, and the circular surface of the circular platform is in contact with the end surface of the silicon rod and remains relatively stationary after being in close contact with the end surface of the silicon rod. The clamping portion further comprises a locking structure, and the clamping portion is in a locked state when performing a corresponding work on the silicon rod (for example, cutting). In the switching of the silicon rod, for example, the switching of the cutting position, the clamping portion rotates along the center of the circular platform under the driving of the clamping arm rotating mechanism.

[0291] In some embodiments, the clamping part of the clamping arm comprises a rotatable circular platform and a series of convex contact points arranged on the circular platform, each contact point having a contact plane. The circular platform is rotated by the clamping arm rotating mechanism. In one implementation, the protruding length of the contact points, i.e. the position in the transfer direction, is adjustable, so that in the process of clamping the silicon rod, for the silicon rod with lower end surface flatness, the protruding length of the contact points can be adjusted according to the end surface of the silicon rod, so that each contact plane is in close contact with the end surface of the silicon rod. The protruding length is the length in the transfer direction between the circular plane of the circular platform and the contact plane of the contact point.

[0292] In some embodiments, the clamping part of the silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact points based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of clamping arms of the silicon rod clamp are driven by the clamping arm driving mechanism to move towards each other in the transfer direction until the contact planes of the clamping parts are in contact with the end surfaces of the silicon rod to be clamped. When the clamping part is provided with multiple contact points and it is detected that the pressure value of the contact between some contact points and the end surface of the contacted silicon rod is less than a set value or a set range, the clamping degree can be changed by adjusting the protruding length of the contact points (generally in the direction close to the end surface of the silicon rod); alternatively, each clamping part of a pair of clamping arms of the silicon rod clamp is provided with a contact plane, and in the process of clamping the silicon rod, the clamping arm driving mechanism drives a pair of clamping arms to move towards each other in the direction of the end surfaces of the silicon rod to achieve that after the clamping parts are in contact with the end surfaces of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the clamping arm driving mechanism controls the movement of the pair of clamping arms to stop.

[0293] The clamping arm rotating mechanism can be arranged on one clamping arm of a pair of clamping arms (the other clamping arm only has rotating function) to drive the clamping parts of the pair of clamping arms to rotate with the clamped silicon rod or square silicon rod; or the clamping arm rotating mechanism is arranged on each clamping arm of a pair of clamping arms and cooperatively controls the two clamping parts of the pair of clamping arms to rotate by the same angle and direction. In some implementations, the clamping arm rotating mechanism can comprise a driving motor.

[0294] In the process of cutting the silicon rod by the silicon rod cutting device, the clamping part can be driven to rotate by the clamping arm rotating mechanism. Generally, in the process of cutting the single crystal silicon rod, the clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, for example 90°, to achieve cutting one side or opposite two sides of the silicon rod by the silicon rod cutting device.

[0295] In the silicon rod cutting and grinding all-in-one machine of the present application, the silicon rod loading and unloading device further comprises a centering and adjusting mechanism for adjusting the position of the silicon rod so that the center axis of the silicon rod corresponds to the predetermined center line. For example, in the process of loading the silicon rod, the centering and adjusting mechanism is used to adjust the position of the silicon rod so that the center axis of the silicon rod corresponds to the predetermined center line. Figure 2In the shown embodiment, the centering adjustment mechanism 175 comprises at least two clamping assemblies arranged along the transfer direction, each of the clamping assemblies comprising two clamping pieces arranged oppositely on the clamping arm mounting base along a clamping direction and a telescopic drive unit associated with the two clamping pieces, the telescopic drive unit being used for telescopic movement of the two clamping pieces relative to the clamping arm mounting base along the clamping direction, wherein the clamping direction is perpendicular to the transfer direction and constitutes a horizontal plane, i.e. the clamping direction is the second direction. The clamping pieces can be, for example, clamping plates or clamping strips, and the telescopic drive unit can be, for example, a telescopic cylinder or a servo motor with a screw rod. In actual application, when the silicon rod needs to be centered before being placed horizontally on the first silicon rod transfer device for first cutting operation or before being placed horizontally on the second silicon rod transfer device for second cutting operation, at least two clamping assemblies in the centering adjustment mechanism can be operated, i.e. the telescopic drive unit in the clamping assembly drives the two clamping pieces to move telescopically relative to the clamping arm mounting base along the clamping direction, and the silicon rod between the two clamping pieces is clamped to complete the centering operation, which is simple and fast.

[0296] The clamp displacement mechanism is used for driving the silicon rod clamp to move along a displacement direction.

[0297] In some embodiments, the clamp displacement mechanism comprises a clamp displacement guide rail and a clamp displacement drive unit, wherein the clamp displacement guide rail is arranged on the silicon rod mounting rack along a displacement direction, and the clamp displacement drive unit is associated with the silicon rod clamp and is used for driving the associated silicon rod clamp to move along the clamp displacement guide rail. Wherein the displacement direction is perpendicular to the transfer direction and constitutes a horizontal plane, i.e. the second direction Y-axis in Figure 1

[0298] In some embodiments, the clamp displacement drive unit comprises a displacement toothed rail, a drive gear and a gear drive source, the displacement toothed rail is arranged along the displacement direction, the drive gear is arranged on the silicon rod clamp and engages with the displacement toothed rail, and the gear drive source is used for driving the drive gear to rotate to drive the associated silicon rod clamp to move along the displacement direction.

[0299] In some embodiments, the clamp displacement drive unit comprises a displacement toothed rail, a drive gear and a gear drive source, the displacement toothed rail is arranged along the displacement direction, the drive gear is arranged on the silicon rod clamp and engages with the displacement toothed rail, and the gear drive source is used for driving the drive gear to rotate to drive the associated silicon rod clamp to move along the displacement direction. Figure 1 and Figure 2 ​In the illustrated embodiment, the clamp transposition driving unit comprises a transposition rack, a driving gear, and a gear driving source. The transposition rack is arranged along a transposition direction, and the length of the transposition rack in the transposition direction covers at least the positions of the respective cutting stations and the silicon rod cutting device in the silicon rod squaring apparatus, so as to ensure that the silicon rod clamp can be transferred to cover each cutting station. The transposition rack can have the structure of a rack. The driving gear is arranged on the clamp mounting frame of the silicon rod clamp and is engaged with the transposition rack. The gear driving source is arranged on the clamp mounting frame of the silicon rod clamp and is associated with the driving gear. In actual application, the gear driving source can be used to drive the driving gear to rotate, so as to drive the silicon rod clamp to move along the transposition direction through the transposition rack. For example, the driving gear is driven by the gear driving source to rotate forward, and through the cooperation of the driving gear and the transposition rack, the associated silicon rod clamp is driven to move forward along the transposition direction; the driving gear is driven by the gear driving source to rotate reversely, and through the cooperation of the driving gear and the transposition rack, the associated silicon rod clamp is driven to move reversely along the transposition direction.

[0300] Of course, the structure of the clamp transposition driving unit can still be changed in other ways. For example, in some embodiments, the clamp transposition driving unit can comprise a transposition screw rod arranged along a transposition direction and associated with the clamp mounting frame of the silicon rod clamp, and a screw rod driving source for driving the transposition screw rod to rotate so as to drive the associated silicon rod clamp to move along the transposition direction. In some embodiments, the chain conveying mechanism comprises a ring chain associated with the clamp mounting frame of the silicon rod clamp, and a chain driving source. The ring chain can be, for example, a closed ring chain arranged around a plurality of movable gears to form a predetermined shape, and the chain driving source can be, for example, a servo motor.

[0301] In this application, the silicon rod squaring apparatus comprises a skin unloading device for unloading the cut skin.

[0302] In some embodiments, the skin unloading device comprises a skin mounting frame, a skin suction accessory, and a suction accessory transposition mechanism, wherein the skin mounting frame is arranged across the cutting seat along a transposition direction, the skin suction accessory is used for suction of the skin, and the suction accessory transposition mechanism is used for driving the suction accessory to move on the skin mounting frame along the transposition direction.

[0303] In the illustrated embodiment, Figure 1 and Figure 3 In the illustrated embodiment, the silicon rod squaring apparatus 1 comprises a skin unloading device 18, which can be arranged at a loading and unloading area of the cutting processing platform, and is used for unloading the cut skin from the cutting station (the first cutting station or the second cutting station) of the cutting processing platform. The loading and unloading area is located at the side of the cutting processing platform.

[0304] The edge skin unloading device 18 comprises an edge skin mounting frame 181, an edge skin suction accessory 182, and a suction accessory transposition mechanism.

[0305] The edge skin mounting frame is arranged across the cutting machine base along the transposition direction. In some embodiments, the edge skin mounting frame is arranged across the cutting machine base along the transposition direction, which is consistent with the second direction, and the length of the edge skin mounting frame is able to cover the entire cutting processing platform of the cutting machine base. When the cutting processing platform is provided with a first cutting station and a second cutting station along the second direction, the length of the edge skin mounting frame is long enough to cover the cutting stations.

[0306] The edge skin suction accessory is used for suction of the edge skin. In some embodiments, the edge skin unloading device comprises a suction accessory mounting structure, and a plurality of edge skin suction accessories are arranged on the suction accessory mounting structure along the transference direction (i.e. the length direction of the edge skin). In some embodiments, the edge skin suction accessory comprises a suction disc.

[0307] The edge skin suction accessory is arranged on the edge skin mounting frame by the suction accessory lifting mechanism.

[0308] In some embodiments, the suction accessory lifting mechanism comprises a lifting guide rod and a lifting driving unit. The lifting guide rod is arranged along the lifting direction and is used for arranging the edge skin suction accessory. Specifically, the lifting guide rod is associated with the suction accessory mounting structure of the edge skin suction accessory. The lifting driving unit is used for driving the edge skin suction accessory to move up and down along the lifting guide rod. In some embodiments, the lifting driving unit comprises a driving motor and a screw rod assembly arranged along the lifting direction and driven by the driving motor. The driving motor and the screw rod assembly can be arranged on the suction accessory mounting structure, wherein the driving motor can be arranged at one end of the screw rod assembly, and the screw rod assembly is controlled by the driving motor and is associated with the suction accessory mounting frame of the edge skin suction accessory. In this way, when the edge skin lifting mechanism is used, the screw rod assembly is driven by the driving motor to rotate forward, thereby driving the suction accessory mounting frame and the edge skin suction accessory thereon to move upward along the lifting guide rod, or the screw rod assembly is driven by the driving motor to rotate reversely, thereby driving the suction accessory mounting frame and the edge skin suction accessory thereon to move downward along the lifting guide rod.

[0309] The suction accessory transposition mechanism is used for driving the edge skin suction accessory to move along the transposition direction to switch between the cutting stations.

[0310] In some embodiments, the suction accessory transposition mechanism comprises a suction accessory transposition guide rail and a suction accessory transposition drive unit, wherein the suction accessory transposition guide rail is arranged on the edge skin mounting frame along a transposition direction, and the suction accessory transposition drive unit is associated with the edge skin suction accessory and is configured to drive the associated edge skin suction accessory to move along the suction accessory transposition guide rail. The transposition direction is perpendicular to the transfer direction and forms a horizontal plane, i.e., the second direction Y-axis in Figure 1 .

[0311] In some embodiments, the suction accessory transposition drive unit comprises a transposition rack, a drive gear, and a gear drive source. The transposition rack is arranged along the transposition direction and is arranged on the edge skin suction accessory and is engaged with the transposition rack. The gear drive source is configured to drive the drive gear to rotate so as to drive the associated edge skin suction accessory to move along the transposition direction.

[0312] In some embodiments, as shown in Figure 1 and Figure 2 , the suction accessory transposition drive unit comprises a transposition rack, a drive gear, and a gear drive source. The transposition rack is arranged along the transposition direction, and the length of the transposition guide rail in the transposition direction covers the positions of the respective cutting stations and the silicon rod cutting device in the silicon rod cutting and grinding integrated machine, so as to ensure that the suction accessory can be transferred to cover each cutting station. The moving rack can have a rack structure. The drive gear is arranged on the suction accessory mounting frame of the edge skin suction accessory and is engaged with the transposition rack. The gear drive source is arranged on the suction accessory mounting frame of the edge skin suction accessory and is associated with the drive gear. In actual application, the gear drive source can be used to drive the drive gear to rotate so as to drive the edge skin suction accessory to move along the transposition direction through the transposition rack. For example, the gear drive source drives the drive gear to rotate in the forward direction, and through the cooperation of the drive gear and the transposition rack, the associated silicon rod clamp is driven to move forward along the transposition direction. The gear drive source drives the drive gear to rotate in the reverse direction, and through the cooperation of the drive gear and the transposition rack, the associated silicon rod clamp is driven to move backward along the transposition direction.

[0313] Of course, the structure of the suction accessory transposition drive unit can still be changed. For example, in some embodiments, the suction accessory transposition drive unit can comprise a transposition screw rod arranged along the transposition direction and associated with the suction accessory mounting frame of the edge skin suction accessory, and a screw rod drive source configured to drive the transposition screw rod to rotate so as to drive the associated edge skin suction accessory to move along the transposition direction. In some embodiments, the chain conveying mechanism comprises a ring chain associated with the suction accessory mounting frame of the edge skin suction accessory, and a chain drive source. The ring chain can be a closed loop chain, for example, which is arranged around a plurality of movable gears to form a predetermined shape. The chain drive source can be a servo motor, for example.

[0314] In some embodiments, the silicon rod squaring apparatus of the present application can further comprise a side skin recovery bin or a side skin recovery vehicle, and the side skin unloading device 18 is configured to unload the side skin into the side skin recovery bin or the side skin recovery vehicle.

[0315] In some embodiments, the silicon rod squaring apparatus of the present application can further comprise a discharging conveying device configured to convey the squared silicon rod after the grinding process. In some embodiments, the discharging conveying device can be a conveying belt device comprising a conveying belt configured to be wound around two conveying rollers arranged opposite to each other, and at least one of the two conveying rollers is connected to a discharging driving source, which can be a servo motor. Figure 1 and Figure 2 In some embodiments, the silicon rod squaring apparatus of the present application can further comprise a discharging conveying device 179.

[0316] In some embodiments, the silicon rod squaring apparatus of the present application can further comprise a crystal line detection device.

[0317] In some embodiments, the crystal line detection device comprises at least two support structures arranged along the transfer direction, each of the support structures comprises a support roller set configured to support the silicon rod to be cut, a roller driving source configured to drive each of the support rollers of the support roller set to rotate, and a crystal line detection probe arranged between the at least two support structures.

[0318] In some embodiments, the at least two support structures are arranged along the transfer direction, and each of the support structures comprises a support roller set, wherein each of the support roller sets comprises two or more rollers arranged along the transfer direction, and each of the rollers belonging to the same support roller set is connected by a shaft arranged along the transfer direction, and when the support roller set is used to support the silicon rod to be cut, the surface of each of the rollers of the support roller set is in contact with the silicon rod to be cut. In some embodiments, the at least two support structures arranged along the transfer direction are movable, i.e., at least one of the at least two support structures is movable along the transfer direction to adjust the support distance of the at least two support structures to adapt to the size of the silicon rod to be cut.

[0319] In some embodiments, the roller driving source is configured to drive each of the support rollers of the support roller set to rotate, and the roller driving source can be a servo motor, which can be connected to at least one of the support roller sets by a chain or a gear set.

[0320] In actual application, when the to-be-cut silicon rod with circular cross section is placed in a horizontal state on the supporting structure of the crystal line detection device, the axial line of the to-be-cut silicon rod is consistent with the transfer direction, and then the supporting rollers in the supporting roller set are driven to rotate by the roller driving source to drive the to-be-cut silicon rod to rotate by the friction between the supporting rollers and the to-be-cut silicon rod, and the crystal line detection operation is completed.

[0321] When the Figure 1 When the silicon rod squaring device in the silicon rod cutting and grinding all-in-one machine of the embodiment performs squaring cutting operation, the specific process can be approximately as follows:

[0322] Firstly, the to-be-cut silicon rod with circular cross section is placed in a horizontal state on the crystal line detection device, and the to-be-cut silicon rod is driven to rotate by the crystal line detection device to complete the crystal line detection operation.

[0323] Then, the to-be-cut silicon rod is clamped from the crystal line detection device by the silicon rod loading and unloading device and transferred to the first silicon rod transfer device corresponding to the first loading and unloading area of the first cutting station, and the to-be-cut silicon rod is placed in a horizontal state and the axial line of the silicon rod is consistent with the transfer direction.

[0324] Then, the skin clamp is driven by the skin clamp advancing and retreating mechanism to advance to the silicon rod along the advancing and retreating direction, the skin clamp of the skin anti-collapse edge device corresponding to the first silicon rod transfer device clamps the to-be-cut silicon rod, the first silicon rod transfer device carries the silicon rod and advances from the first loading and unloading area to the first cutting area along the transfer direction, the first silicon rod cutting device and the first silicon rod transfer device relatively move along the transfer direction, and the to-be-cut silicon rod carried by the first silicon rod transfer device is subjected to first cutting operation by the two first cutting wire saws (the first cutting wire saws are arranged along the vertical direction or at an angle with the vertical direction) arranged oppositely in the first silicon rod cutting device, so that the to-be-cut silicon rod forms two parallel first side cutting surfaces and two skins.

[0325] Then, the skin clamp is driven by the skin clamp advancing and retreating mechanism to advance to the silicon rod along the advancing and retreating direction, the skin clamp of the skin anti-collapse edge device corresponding to the first silicon rod transfer device clamps the to-be-cut silicon rod, the first silicon rod transfer device carries the silicon rod and advances from the first loading and unloading area to the first cutting area along the transfer direction, the first silicon rod cutting device and the first silicon rod transfer device relatively move along the transfer direction, and the to-be-cut silicon rod carried by the first silicon rod transfer device is subjected to first cutting operation by the two first cutting wire saws (the first cutting wire saws are arranged along the vertical direction or at an angle with the vertical direction) arranged oppositely in the first silicon rod cutting device, so that the to-be-cut silicon rod forms two parallel first side cutting surfaces and two skins.

[0326] Then, the first silicon rod transfer device is driven to carry the silicon rod after the first cutting operation to retreat to the first loading and unloading position in the direction away from the first cutting position, the silicon rod is clamped from the first silicon rod transfer device by the silicon rod loading and unloading device and moved to the second cutting position in the conversion direction, the silicon rod is rotated by 90° and placed on the second silicon rod transfer device at the second loading and unloading position, and the silicon rod is placed horizontally and the axis of the silicon rod is consistent with the transfer direction.

[0327] Then, the position of the silicon rod is adjusted by the centering adjustment mechanism in the silicon rod loading and unloading device so that the axis of the silicon rod corresponds to the predetermined center line.

[0328] Then, the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to advance to the silicon rod in the advancing and retreating direction, the edge skin clamp of the edge skin collapse prevention device of the corresponding second silicon rod transfer device clamps the silicon rod, the second silicon rod transfer device is driven to carry the silicon rod to advance to the second cutting position in the transfer direction from the second loading and unloading position, the second silicon rod cutting device and the second silicon rod transfer device are relatively moved in the transfer direction, the silicon rod carried by the second silicon rod transfer device is cut by the two second cutting wiresaws (the second cutting wiresaws are arranged vertically or at an angle with the vertical direction) in the second silicon rod cutting device to form two parallel second side cutting surfaces, and the silicon rod is cut to form a square silicon rod with a rectangular cross section.

[0329] Then, the edge skin clamp is driven by the edge skin clamp advancing and retreating mechanism to advance to the silicon rod in the advancing and retreating direction, the edge skin clamp of the edge skin collapse prevention device of the corresponding second silicon rod transfer device clamps the silicon rod, the second silicon rod transfer device is driven to carry the silicon rod to advance to the second cutting position in the transfer direction from the second loading and unloading position, the second silicon rod cutting device and the second silicon rod transfer device are relatively moved in the transfer direction, the silicon rod carried by the second silicon rod transfer device is cut by the two second cutting wiresaws (the second cutting wiresaws are arranged vertically or at an angle with the vertical direction) in the second silicon rod cutting device to form two parallel second side cutting surfaces, and the silicon rod is cut to form a square silicon rod with a rectangular cross section.

[0330] Then, the second silicon rod transfer device is driven to carry the square silicon rod after the second cutting operation to retreat to the first loading and unloading position in the direction away from the first cutting position, the square silicon rod is clamped from the second silicon rod transfer device by the silicon rod loading and unloading device and moved in the conversion direction, and the square silicon rod is loaded into the silicon rod grinding equipment.

[0331] Please refer to Figure 1 and Figure 12 wherein, Figure 12 is shown as Figure 1 the structural schematic diagram of the silicon rod grinding equipment. As Figure 1 and Figure 12As shown, the silicon rod grinding device 2 provided in the present application comprises a grinding base 21, a first type of grinding surface device 23, 23', a second type of grinding surface device 25, and a chamfering device 27.

[0332] The silicon rod grinding device provided in the present application will be described in detail below.

[0333] The grinding base 21 serves as the main component of the silicon rod grinding device, and is used to provide a grinding processing platform. In actual applications, the grinding base has a large volume and weight to provide a large mounting surface and firm stability of the whole machine. It should be understood that the grinding base can serve as the seat body of different structures or components in the silicon rod grinding device that perform grinding operations, and the specific structure of the grinding base can be changed based on different functional requirements or structural requirements. In some examples, the grinding base includes fixing structures or limiting structures such as a base, a column, a rack, etc. for receiving different components in the silicon rod grinding device, which are all the grinding bases described in the present application.

[0334] Meanwhile, in some examples, the grinding base can be an integrated base, and in some examples, the grinding base can include a plurality of independent bases.

[0335] The grinding base has a grinding processing platform, which can be divided into a plurality of functional areas according to the specific operation content of the square silicon rod operation. For example, in some embodiments, the grinding processing platform includes a grinding surface area and a chamfering area. In some embodiments, the grinding processing platform includes a loading area, a grinding surface area, a chamfering area, and an unloading area. In some embodiments, the grinding processing platform includes a loading and unloading area, a grinding surface area, and a chamfering area. It should be noted that in each example provided in the present application, the functional area is defined according to the stroke path and range of the processing device at the functional area. For example, the grinding surface device of the silicon rod grinding device is arranged at the grinding surface area, and the range of the grinding surface area is the range occupied by the grinding surface device during the completion of the grinding surface operation. Similarly, the chamfering device of the silicon rod grinding device is arranged at the chamfering area, and the range of the chamfering area is the range occupied by the chamfering device during the completion of the chamfering operation. The shape of the grinding processing platform can be determined according to the grinding base, or can be determined according to the grinding base and the processing needs of the grinding surface device and the chamfering device.

[0336] In some embodiments, each functional zone is arranged along the first direction or along the second direction, wherein in the following description, the first direction refers to the depth extension direction of the silicon rod grinding device (i.e. the front-rear direction or the transfer direction), and the second direction is perpendicular to the first direction, referring to the width extension direction of the silicon rod grinding device (i.e. the left-right direction or the transposition direction). For example, when the silicon rod grinding device includes a grinding surface zone and a chamfering zone, the grinding surface zone and the chamfering zone can be sequentially arranged along the first direction or arranged in parallel along the second direction. Taking the parallel arrangement along the second direction as an example, when the silicon rod grinding device includes a loading zone, a grinding surface zone, and a chamfering zone, the loading zone, the grinding surface zone, and the chamfering zone can be arranged in parallel along the second direction (e.g. in the order of loading zone, grinding surface zone, and chamfering zone, or in the order of grinding surface zone, loading zone, and chamfering zone, etc.). When the silicon rod grinding device includes a loading zone, a grinding surface zone, a chamfering zone, and an unloading zone, the loading zone, the grinding surface zone, the chamfering zone, and the unloading zone are arranged in parallel along the second direction (e.g. in the order of loading zone, grinding surface zone, chamfering zone, and unloading zone, or in the order of grinding surface zone, loading zone, unloading zone, and chamfering zone, etc.).

[0337] In Figure 1 and Figure 12 the embodiments shown, the grinding machine base 21 has a grinding processing platform provided with a loading zone, a first type of grinding surface zone, a second type of grinding surface zone, a chamfering zone, and the like. The first type of grinding surface zone is provided with a first type of grinding surface device for performing grinding surface work on a first side surface of a square silicon rod located in the first type of grinding surface zone. The second type of grinding surface zone is provided with a second type of grinding surface device for performing grinding surface work on a second side surface of a square silicon rod located in the second type of grinding surface zone. The chamfering zone is provided with a chamfering device for performing chamfering work on a corner portion of a square silicon rod located in the chamfering zone. In Figure 1 and Figure 12 the embodiments shown, each functional zone is arranged in parallel along the second direction.

[0338] The first type of grinding surface device and the second type of grinding surface device are both used for performing grinding surface work on a square silicon rod having four side surfaces to be ground. The first type of grinding surface device is arranged in the first type of grinding surface zone of the grinding processing platform and is used for performing grinding surface work on a pair of first side surfaces of a square silicon rod located in the first type of grinding surface zone. The second type of grinding surface device is arranged in the second type of grinding surface zone of the grinding processing platform and is used for performing grinding surface work on a pair of second side surfaces of a square silicon rod located in the second type of grinding surface zone.

[0339] In the embodiments provided in the present application, the square silicon rod is formed after the silicon rod cutting and squaring device cuts and squares the silicon rod with a circular cross section. The square silicon rod is generally a cuboid, and its length is generally greater than its width, and its width is greater than its thickness, and the whole is a flat long strip. The square silicon rod has two end faces (end faces composed of width and thickness), four side faces (a pair of side faces composed of length and width, and a pair of side faces composed of length and thickness) between the two end faces, and four edge portions, which can be, for example, edges or edge connecting surfaces. The silicon rod grinding device in the silicon rod cutting and grinding integrated machine disclosed in the present application is used for grinding the four side faces of the square silicon rod and chamfering the four edge portions.

[0340] In contrast, the side face composed of length and width is larger than the side face composed of length and thickness, so the grinding time of the side face composed of length and width is longer than the grinding time of the side face composed of length and thickness, and the greater the size difference between the width and the thickness (i.e., the greater the area difference between the side face composed of length and width and the side face composed of length and thickness), the greater the grinding time difference between the two.

[0341] In the embodiments shown in Figure 1 and Figure 12 , the grinding processing platform is provided with two first type grinding areas and a second type grinding area, wherein the first type grinding area is used for grinding the first side face (the side face composed of length and width) with a larger area in the square silicon rod, and the second type grinding area is used for grinding the second side face (the side face composed of length and thickness) with a smaller area in the square silicon rod.

[0342] In the present application, the square silicon rod is placed in a horizontal manner at the first type grinding area and the second type grinding area of the grinding processing platform. In order to enable the square silicon rod to be stably placed at the first type grinding area and the second type grinding area, the silicon rod grinding device of the present application includes a first square silicon rod clamping device and a second square silicon rod clamping device.

[0343] The first square silicon rod clamping device is arranged at the first type grinding area and is used for clamping the end portion of the square silicon rod in the length direction. In Figure 12 and Figure 12In the shown embodiment, the grinding processing platform is provided with two first-type grinding surface positions, and each first-type grinding surface position is correspondingly provided with a first square silicon rod clamping device and a first-type grinding surface device, i.e., the silicon rod grinding equipment comprises: a first-type grinding surface device 23 and a first square silicon rod clamping device 24 located at a first-type grinding surface position, a first-type grinding surface device 23' and a first square silicon rod clamping device 24' located at a first-type grinding surface position, and a second-type grinding surface device 25 and a second square silicon rod clamping device 26 located at a second-type grinding surface position.

[0344] In some embodiments, the first-type grinding surface device 23 and the first square silicon rod clamping device 24 located at the first-type grinding surface position can be identical or similar in structure and working principle to the first-type grinding surface device 23' and the first square silicon rod clamping device 24' located at the first-type grinding surface position, and therefore, in the following description, only the first-type grinding surface device 23 and the first square silicon rod clamping device 24 located at the first-type grinding surface position are taken as representatives for illustration.

[0345] The first square silicon rod clamping device is intended to clamp a square silicon rod. In some embodiments, the first square silicon rod clamping device comprises a first bearing mounting seat and a first square silicon rod bearing clamp provided on the first bearing mounting seat. Figure 13 As shown, the first square silicon rod clamping device 24 comprises a first bearing mounting seat and a first square silicon rod bearing clamp.

[0346] The first bearing mounting seat is provided on the grinding machine base. In some embodiments, the first bearing mounting seat is provided on the grinding machine base 21 along a first direction. Figure 12 In the shown embodiment, the first bearing mounting seat is provided on the grinding machine base 21 along a first direction for arranging the first square silicon rod bearing clamp.

[0347] The first square silicon rod bearing clamp is provided on the first bearing mounting seat for bearing and clamping a square silicon rod. In some embodiments, the first square silicon rod bearing clamp comprises at least one pair of first bearing clamping pieces and a first bearing clamping piece driving mechanism for driving at least one first bearing clamping piece of the at least one pair of first bearing clamping pieces to move.

[0348] The pair of first bearing clamping pieces are oppositely arranged along a first direction. The first bearing clamping piece has a square silicon rod bearing surface for bearing a square silicon rod, which can be horizontally arranged, i.e., the square silicon rod bearing surface (a first side surface composed of the length and width of the square silicon rod) is located in a horizontal plane composed of the first direction and a second direction. The first bearing clamping piece is provided with a square silicon rod clamping portion connected with the square silicon rod bearing surface and protruding from the square silicon rod bearing surface, and the square silicon rod clamping portion can define one end of the bearing square silicon rod.

[0349] At least one of the pair of first bearing clamping members is configured with a first bearing clamping member driving mechanism, which is used to drive the associated first bearing clamping member to move to clamp the placed square silicon rod. In some embodiments, both of the pair of first bearing clamping members are configured with a first bearing clamping member driving mechanism, and a square silicon rod clamping space is formed between the two first bearing clamping members. After the square silicon rod is placed horizontally on the square silicon rod bearing surface of the two first bearing clamping members, the two first bearing clamping members are respectively driven by the respective first bearing clamping member driving mechanisms to move towards each other to clamp the placed square silicon rod. In some embodiments, one of the pair of first bearing clamping members is configured with a first bearing clamping member driving mechanism, which can be designed as a movable type. A square silicon rod clamping space is formed between the two first bearing clamping members. After the square silicon rod is placed horizontally on the square silicon rod bearing surface of the two first bearing clamping members, the corresponding one of the first bearing clamping members is driven by the first bearing clamping member driving mechanism to move towards the other first bearing clamping member to clamp the placed square silicon rod.

[0350] In some embodiments, the first bearing clamping member driving mechanism includes a bearing clamping member travel guide and a bearing clamping member travel driving unit. The bearing clamping member travel guide is arranged on the first bearing mounting seat in a first direction. The bearing clamping member travel driving unit is used to drive the first bearing clamping member to move along the bearing clamping member travel guide.

[0351] In some embodiments, the bearing clamping member travel driving unit includes a horizontal telescopic rod and a telescopic cylinder. One end of the horizontal telescopic rod is associated with the first bearing clamping member, and the other end of the horizontal telescopic rod is associated with the telescopic cylinder, which is arranged on the first bearing mounting seat. In actual application, the telescopic cylinder can drive the horizontal telescopic rod to telescope. For example, the telescopic cylinder drives the horizontal telescopic rod to telescope inward, thereby driving the first bearing clamping member to move in the first direction. The telescopic cylinder can also be a telescopic oil cylinder.

[0352] In some embodiments, the bearing clamping member travel driving unit includes a bearing clamping member travel rack, a driving gear, and a driving source. The bearing clamping member travel rack is arranged on the first bearing mounting seat in the first direction, parallel to the bearing clamping member travel guide. The driving gear is arranged on the first bearing clamping member and engages with the bearing clamping member travel guide. The driving gear is rotated by the driving source, and the teeth of the driving gear engage with the bearing clamping member travel guide to move along the bearing clamping member travel guide. The first bearing clamping member connected to the driving gear moves along the bearing clamping member travel guide. The driving source is, for example, a driving motor.

[0353] In some embodiments, the carrier clamp traveling drive unit comprises a carrier clamp traveling screw and a driving source, wherein the carrier clamp traveling screw is arranged along the first direction and is associated with the first carrier clamp, and the driving source is configured to drive the carrier clamp traveling screw to rotate so as to move the associated first carrier clamp along the carrier clamp traveling guide. The driving source is, for example, a driving motor.

[0354] In actual application, the silicon rod to be ground is horizontally placed on the first carrier clamp, wherein a first side surface composed of length and width of the silicon rod is placed on the first carrier clamp as a contact surface; the silicon rod is clamped by cooperation of the two first carrier clamps, and another first side surface (top surface) opposite to the contact surface of the silicon rod is exposed as a grinding surface.

[0355] In some embodiments, the first silicon rod clamping device comprises a first carrier mounting base, a first carrier table, and a first movable clamp. Please refer to Figure 13 , which shows a structural schematic diagram of the first silicon rod clamping device in an embodiment. In combination with Figure 12 and Figure 13 , the first silicon rod clamping device 24 comprises a first carrier mounting base 241, a first carrier table 243, and a first movable clamp 245.

[0356] The first carrier mounting base is arranged on the machine base. In the embodiments shown in Figure 12 and Figure 13 , the first carrier mounting base 241 is arranged on the grinding machine base 21 along the transfer direction (i.e. the first direction X-axis) for arranging the first carrier table 243 and the first movable clamp 245.

[0357] The first carrier table is arranged on the first carrier mounting base for carrying the silicon rod. In some embodiments, the first carrier table has a silicon rod carrying surface for carrying the silicon rod, which can be horizontally arranged, i.e. the silicon rod carrying surface (a first side surface composed of length and width of the silicon rod) is located in a horizontal plane composed of the first direction and the second direction. The size of the silicon rod carrying surface can be adapted to the silicon rod, specifically, the width of the silicon rod carrying surface is comparable to the width of the silicon rod, and the length of the silicon rod carrying surface is comparable to the length of the silicon rod.

[0358] In some embodiments, one end side of the first carrier table is provided with a first limiting member, and the first limiting member is used to limit one end of the carried silicon rod. In the embodiments shown in Figure 12 and Figure 13 , the first limiting member 2431 is arranged at one end side of the first carrier table 243, and the first limiting member 2431 is to be protruded from the silicon rod carrying surface in the first carrier table 243.

[0359] The first movable clamping member is driven to move relative to the first carrier table to cooperate with the first limiting member to clamp the square silicon rod placed on the first carrier table. Figure 12 and Figure 13 In the embodiment shown, the first movable clamping member 245 is movably arranged on the other end side of the first carrier table 243 relative to the first limiting member 2431. The first movable clamping member 245 protrudes from the square silicon rod bearing surface in the first carrier table 243. A square silicon rod clamping space is formed between the first movable clamping member 245 and the first limiting member 2431. The first movable clamping member 245 is capable of moving relative to the first carrier table 243 to adjust the square silicon rod clamping space. The first movable clamping member moves relative to the first carrier table along the second direction through a clamping member travel mechanism.

[0360] In some embodiments, the clamping member travel mechanism includes a clamping member travel guide and a clamping member travel drive unit. The clamping member travel guide is arranged on the first carrier mounting seat along the second direction. The clamping member travel drive unit is used to drive the first movable clamping member to move along the clamping member travel guide.

[0361] In some embodiments, the clamping member travel drive unit includes a horizontal telescopic rod and a telescopic cylinder. One end of the horizontal telescopic rod is associated with the first movable clamping member. The other end of the horizontal telescopic rod is associated with the telescopic cylinder. The telescopic cylinder is arranged on the first carrier table. In actual application, the telescopic cylinder can drive the horizontal telescopic rod to contract inwardly, thereby driving the first movable clamping member to move along the second direction towards the first carrier table, reducing the clamping distance between the two, so as to clamp the square silicon rod on the first carrier table. Correspondingly, the telescopic cylinder can drive the horizontal telescopic rod to extend outwardly, thereby driving the first movable clamping member to move along the second direction away from the first carrier table, increasing the clamping distance between the two, so as to release the clamped square silicon rod. The telescopic cylinder can also be a telescopic oil cylinder.

[0362] In the embodiment shown, Figure 1 and Figure 12 The clamping member travel mechanism includes a clamping member travel guide 242 and a clamping member travel drive unit. The clamping member travel guide 242 is arranged on the first carrier mounting seat 241 along the second direction. The clamping member travel drive unit includes a horizontal telescopic rod and a telescopic cylinder 244. One end of the horizontal telescopic rod is associated with the first movable clamping member 245. The other end of the horizontal telescopic rod is associated with the telescopic cylinder 244. The telescopic cylinder 244 is arranged on the first carrier table 243.

[0363] In some embodiments, the clamping member traveling driving unit comprises a clamping member traveling rack, a driving gear and a driving source. The clamping member traveling rack is arranged on the first bearing seat in the second direction and parallel to the clamping member traveling guide. The driving gear is arranged on the first mobile clamping member and engages with the clamping member traveling guide. The driving gear is driven to rotate by the driving source. The teeth of the driving gear engage with the clamping member traveling guide to move along the clamping member traveling guide. The first mobile clamping member connected with the driving gear moves along the clamping member traveling guide. The driving source is, for example, a driving motor.

[0364] In some embodiments, the clamping member traveling driving unit comprises a clamping member traveling rack, a driving gear and a driving source. The clamping member traveling rack is arranged on the first bearing seat in the second direction and parallel to the clamping member traveling guide. The driving gear is arranged on the first mobile clamping member and engages with the clamping member traveling guide. The driving gear is driven to rotate by the driving source. The teeth of the driving gear engage with the clamping member traveling guide to move along the clamping member traveling guide. The first mobile clamping member connected with the driving gear moves along the clamping member traveling guide. The driving source is, for example, a driving motor.

[0365] In some embodiments, the first limiting member and the first mobile clamping member are a multi-point contact clamping head. Understandably, the contact mode between the multi-point contact clamping head and the end face of the square silicon rod is not limited to point contact. For example, the first limiting member and the first mobile clamping member have a plurality of protrusions to contact the end face of the square silicon rod, wherein each protrusion can be in surface contact with the end face of the square silicon rod.

[0366] In actual application, the square silicon rod to be ground is placed horizontally on the first bearing table, wherein a first side surface composed of length and width of the square silicon rod is placed as a contact surface on the first bearing table; the first mobile clamping member is driven to move towards the first bearing table, and the square silicon rod is clamped by the cooperation of the first mobile clamping member and the first limiting member. Another first side surface (top surface) opposite to the contact surface of the square silicon rod is exposed as a grinding surface.

[0367] The first type of grinding surface device comprises a first grinding surface frame and at least one first grinding surface unit movably arranged on the first grinding surface frame, and each first grinding surface unit has at least one first grinding surface tool.

[0368] In Figure 1 and Figure 12 In the embodiments shown in the drawings, the first square silicon rod clamping device clamps the horizontally placed square silicon rod and exposes a first side surface as a grinding surface. The first side surface is horizontally upward, and therefore the grinding surface of the first grinding surface tool is horizontally downward.

[0369] In Figure 1 and Figure 12In the embodiment shown, the first type of grinding device 23 comprises a first grinding frame and at least one first grinding unit vertically arranged on the first grinding frame, the first grinding unit comprising a first grinding support movably arranged on the first grinding frame in the vertical direction and at least one first grinding tool arranged on the first grinding support, the at least one first grinding tool 13 being used to grind a first side surface of the square silicon rod 102 held by the first square silicon rod holding device 24.

[0370] In addition, in some embodiments, the first type of grinding device on one side of the first type of grinding area is an independent device from the first type of grinding device on the other side of the first type of grinding area. In some embodiments, the first type of grinding device on one side of the first type of grinding area is associated with the first type of grinding device on the other side of the first type of grinding area, for example, in Figure 1 and Figure 12 In the embodiment shown, the first grinding frame in the first type of grinding device 23 at the first type of grinding area can be shared with the first grinding frame in the first type of grinding device 23' at the first type of grinding area.

[0371] When the first type of grinding device is used to grind the first side surface of the square silicon rod at the first type of grinding area, the first square silicon rod holding device and the square silicon rod held thereby are driven by the first clamping and advancing mechanism to move in the first direction to achieve relative movement with the first grinding unit in the first type of grinding device, so that the first grinding tool in the first grinding unit grinds one of the first side surfaces of the first square silicon rod holding device and the square silicon rod held thereby.

[0372] Similarly, the first type of grinding device 23' and the first square silicon rod holding device 24' on one side of the first type of grinding area and the first type of grinding device 23 and the first square silicon rod holding device 24 on the other side of the first type of grinding area have the same or similar structure and working principle, and will not be described here. The other first side surface of the first square silicon rod holding device 24' and the square silicon rod held thereby can be ground by the first type of grinding device 23' at the first type of grinding area.

[0373] The second square silicon rod holding device is arranged at the second type of grinding area and is used to hold the end portion of the square silicon rod in the length direction. In Figure 3 and Figure 1 In the embodiment shown, the grinding processing platform is provided with a second type of grinding area, and the second type of grinding area is correspondingly provided with a second square silicon rod holding device and a second type of grinding device, i.e., the silicon rod grinding equipment comprises a second type of grinding device 25 and a second square silicon rod holding device 26 at the second type of grinding area.

[0374] The second square silicon rod clamping device is intended to clamp a square silicon rod. In some embodiments, the second square silicon rod clamping device comprises a second bearing mounting seat and a second square silicon rod bearing clamp arranged on the second bearing mounting seat. Please refer to Figure 12 , which shows a structural schematic diagram of the second square silicon rod clamping device in an embodiment. In combination with Figure 1 and Figure 12 , the second square silicon rod clamping device 26 comprises a second bearing mounting seat and a second square silicon rod bearing clamp.

[0375] The second bearing mounting seat is arranged on the grinding machine base. In the embodiment shown in Figure 13 and Figure 1 , the second bearing mounting seat is arranged on the grinding machine base 21 in a first direction for arranging the second square silicon rod bearing clamp.

[0376] The second square silicon rod bearing clamp is arranged on the second bearing mounting seat for bearing and clamping a square silicon rod. In some embodiments, the second square silicon rod bearing clamp comprises at least one pair of second bearing clamping members and a second bearing clamping member driving mechanism for driving at least one second bearing clamping member of the at least one pair of second bearing clamping members to move.

[0377] The second square silicon rod clamping device comprises a second bearing mounting seat, a second bearing table, and a second moving clamping member. The structure of the second bearing mounting seat, the second bearing table, and the second moving clamping member in the second square silicon rod clamping device and their working principles can be referred to the description of the first square silicon rod clamping device in the foregoing Figure 12 , which will not be described here again. In actual application, a square silicon rod to be ground is placed horizontally on the second bearing table, wherein a second side surface composed of length and width in the square silicon rod is placed on the second bearing table as a contact surface; the second moving clamping member is driven to move towards the second bearing table, and the square silicon rod is clamped by the cooperation of the second moving clamping member and the second limiting member, and another second side surface (top surface) opposite to the contact surface in the square silicon rod is exposed as a grinding surface.

[0378] The second type of surface grinding device is used for second side surface grinding of a square silicon rod located at the second type of surface grinding area. In some embodiments, a second type of surface grinding device is arranged at the second type of surface grinding area, which comprises a second surface grinding frame and at least one pair of second surface grinding units arranged oppositely on the second surface grinding frame, each of which has at least one second surface grinding tool. In some embodiments, a pair of second type of surface grinding devices are arranged oppositely at the second type of surface grinding area, which comprises a second surface grinding frame and at least one second surface grinding unit arranged movably on the second surface grinding frame, each of which has at least one second surface grinding tool.

[0379] InFigure 1 and Figure 3 In the embodiment shown in FIG. 1, the second square silicon rod clamping device clamps the horizontally placed square silicon rod, and the exposed pair of second side surfaces, which are vertically oriented left and right, serve as the grinding surface. Therefore, the second type of grinding device includes at least one pair of second grinding units arranged opposite each other, and the second grinding units are oriented vertically right or left, respectively.

[0380] In some embodiments, the second grinding surface of the second grinding unit is oriented vertically left (or vertically right), and the second grinding unit includes a second grinding support movably arranged on the second grinding frame in the horizontal direction and at least one second grinding unit arranged on the second grinding support, which is used to grind the second side surface of the square silicon rod clamped by the second square silicon rod clamping device.

[0381] In this application, when grinding the second side surface of the square silicon rod, the second type of grinding device grinds the second side surface of the square silicon rod clamped by the second square silicon rod clamping device by driving the relative movement of the second type of grinding device and the second square silicon rod clamping device in the first direction. Therefore, in some embodiments, the second type of grinding device is a mobile grinding device and the second square silicon rod clamping device is a fixed square silicon rod clamping device. In some embodiments, the second type of grinding device is a fixed grinding device and the second square silicon rod clamping device is a mobile square silicon rod clamping device. In some embodiments, the second type of grinding device is a mobile grinding device and the second square silicon rod clamping device is a mobile square silicon rod clamping device.

[0382] Taking the mobile second type of grinding device as an example, the second type of grinding device includes a second grinding frame traveling mechanism, which is used to drive the second grinding frame and the second grinding units arranged thereon to move in the first direction.

[0383] In some embodiments, the second grinding frame traveling mechanism includes a second grinding traveling guide rail arranged on the grinding machine base in the first direction and a second grinding traveling driving unit, which is used to drive the second grinding frame and the second grinding units arranged thereon to move along the second grinding traveling guide rail.

[0384] In some embodiments, the second abrasive surface traveling driving unit comprises a second abrasive surface traveling rack, a driving gear and a driving source. The second abrasive surface traveling rack is arranged in parallel with the second abrasive surface traveling guide rail on the grinding base in the first direction. The driving gear is arranged on the second abrasive surface frame (e.g. the bottom of the second abrasive surface frame) and is engaged with the second abrasive surface traveling rack. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second abrasive surface traveling rack to move along the second abrasive surface traveling rack. The second abrasive surface frame and the second abrasive surface unit arranged thereon move along the second abrasive surface traveling guide rail. The driving source is, for example, a driving motor.

[0385] In some embodiments, the second abrasive surface traveling driving unit comprises a second abrasive surface traveling rack, a driving gear and a driving source. The second abrasive surface traveling rack is arranged in parallel with the second abrasive surface traveling guide rail on the grinding base in the first direction. The driving gear is arranged on the second abrasive surface frame (e.g. the bottom of the second abrasive surface frame) and is engaged with the second abrasive surface traveling rack. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second abrasive surface traveling rack to move along the second abrasive surface traveling rack. The second abrasive surface frame and the second abrasive surface unit arranged thereon move along the second abrasive surface traveling guide rail. The driving source is, for example, a driving motor.

[0386] In some embodiments, the second abrasive surface traveling driving unit comprises a second abrasive surface traveling rack, a driving gear and a driving source. The second abrasive surface traveling rack is arranged in parallel with the second abrasive surface traveling guide rail on the grinding base in the first direction. The driving gear is arranged on the second abrasive surface frame (e.g. the bottom of the second abrasive surface frame) and is engaged with the second abrasive surface traveling rack. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second abrasive surface traveling rack to move along the second abrasive surface traveling rack. The second abrasive surface frame and the second abrasive surface unit arranged thereon move along the second abrasive surface traveling guide rail. The driving source is, for example, a driving motor.

[0387] In some embodiments, the second abrasive surface traveling driving unit comprises a second abrasive surface traveling rack, a driving gear and a driving source. The second abrasive surface traveling rack is arranged in parallel with the second abrasive surface traveling guide rail on the grinding base in the first direction. The driving gear is arranged on the second abrasive surface frame (e.g. the bottom of the second abrasive surface frame) and is engaged with the second abrasive surface traveling rack. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second abrasive surface traveling rack to move along the second abrasive surface traveling rack. The second abrasive surface frame and the second abrasive surface unit arranged thereon move along the second abrasive surface traveling guide rail. The driving source is, for example, a driving motor.

[0388] In some embodiments, the second abrasive surface traveling driving unit comprises a second abrasive surface traveling rack, a driving gear and a driving source. The second abrasive surface traveling rack is arranged in parallel with the second abrasive surface traveling guide rail on the grinding base in the first direction. The driving gear is arranged on the second abrasive surface frame (e.g. the bottom of the second abrasive surface frame) and is engaged with the second abrasive surface traveling rack. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second abrasive surface traveling rack to move along the second abrasive surface traveling rack. The second abrasive surface frame and the second abrasive surface unit arranged thereon move along the second abrasive surface traveling guide rail. The driving source is, for example, a driving motor.

[0389] In some embodiments, the second clamping travel driving unit comprises a second clamping travel rack, a driving gear and a driving source. The second clamping travel rack is arranged on the second bearing mount in the first direction and is parallel to the second clamping travel rail. The driving gear is arranged on the second square silicon rod bearing clamp and is engaged with the second clamping travel rail. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second clamping travel rail to move along the second clamping travel rail. The second square silicon rod bearing clamp and the square silicon rod clamped thereby move along the second clamping travel rail. The driving source is, for example, a driving motor.

[0390] In some embodiments, the second clamping travel driving unit comprises a second clamping travel rack, a driving gear and a driving source. The second clamping travel rack is arranged on the second bearing mount in the first direction and is parallel to the second clamping travel rail. The driving gear is arranged on the second square silicon rod bearing clamp and is engaged with the second clamping travel rail. The driving gear is driven to rotate by the driving source. The teeth of the driving gear are engaged with the second clamping travel rail to move along the second clamping travel rail. The second square silicon rod bearing clamp and the square silicon rod clamped thereby move along the second clamping travel rail. The driving source is, for example, a driving motor.

[0391] In Figure 1 and Figure 12 In the embodiments shown in FIGS. 27 and 28, the second clamping travel mechanism comprises a second clamping travel rail and a second clamping travel driving unit. The second clamping travel rail is arranged on the second bearing mount in the first direction. The second clamping travel driving unit comprises a second clamping travel screw and a driving source. The second clamping travel screw is arranged in the first direction and is associated with the second square silicon rod bearing clamp. The driving source is used to drive the second clamping travel screw to rotate so as to move the second square silicon rod bearing clamp and the square silicon rod clamped thereby along the second clamping travel rail. The clamping member travel rail and the second clamping travel rail can be shared.

[0392] When the second side surface of the square silicon rod at the second type of grinding surface location is subjected to grinding surface processing by the second type of grinding surface device, the second square silicon rod clamping device and the square silicon rod clamped thereby are driven by the second clamping travel mechanism to move in the first direction so as to move relatively with the pair of second grinding surface units in the second type of grinding surface device, so that the pair of second side surfaces of the second square silicon rod clamping device and the square silicon rod clamped thereby are subjected to grinding surface processing by the pair of second grinding surface abrasive tools in the pair of second grinding surface units.

[0393] The chamfering device is arranged at the chamfering location of the grinding processing platform and is used to perform chamfering processing on the edge portions in the square silicon rod at the chamfering location. The square silicon rod has four edge portions, and therefore the chamfering device is used to perform chamfering processing on the four edge portions of the square silicon rod. In the embodiments shown in FIGS. 27 and 28, Figure 1 and Figure 12 In the embodiments shown in FIGS. 27 and 28, the chamfering device 27 is arranged at the chamfering location of the silicon rod grinding equipment.

[0394] In the present application, the square silicon rod is placed horizontally at the chamfering area of the grinding processing platform. In some embodiments, the silicon rod grinding apparatus of the present application comprises a square silicon rod supporting device. In the embodiment as shown in Figure 14 and Figure 12 In the embodiment as shown, the silicon rod grinding apparatus is provided with a square silicon rod supporting device 28 at the chamfering area.

[0395] In some embodiments, the square silicon rod supporting device supports the square silicon rod such that the square silicon rod is placed horizontally and its length direction is consistent with the first direction. In some embodiments, the square silicon rod supporting device supports the square silicon rod such that the square silicon rod is placed horizontally and its length direction is consistent with the second direction.

[0396] In the following description, the square silicon rod is placed horizontally at the chamfering area and its length direction is consistent with the first direction as an example.

[0397] The square silicon rod supporting device can comprise a square silicon rod supporting structure which is provided on the grinding machine base along the first direction and at the chamfering area for supporting at least one square silicon rod placed horizontally. If one square silicon rod is placed horizontally at the square silicon rod supporting structure, the length of the square silicon rod supporting structure is related to the length of the square silicon rod. In some embodiments, the bottom of the square silicon rod supporting device is provided with a slot for exposing at least one edge of the square silicon rod. In this way, when the square silicon rod to be chamfered is placed horizontally at the square silicon rod supporting device, at least one edge of the square silicon rod can be exposed through the slot.

[0398] Please refer to Figure 14 , which shows the structure of the edge skin bearing device and the chamfering device at the chamfering area in Figure 14 . As shown in Figure 14As shown, the silicon ingot supporting device 28 comprises a first supporting slope 281 and a second supporting slope 283, the first supporting slope 281 and the second supporting slope 283 are arranged at an angle, and a groove is left at the joint (lower part) of the first supporting slope 281 and the second supporting slope 283. In some embodiments, the angle between the first supporting slope 281 and the second supporting slope 283 can be, for example, 90°, but is not limited thereto, and the angle can vary within a certain range, for example, any angle between 85° and 95°. The first supporting slope 281 and the second supporting slope 283 can be used to support two adjacent sides of the silicon ingot, respectively, when the silicon ingot is placed horizontally on the silicon ingot supporting device, the two adjacent sides of the silicon ingot abut against the first supporting slope 281 and the second supporting slope 283, respectively, and the edge (i.e., the lowermost edge) at the joint of the two sides is exposed through the groove. Subsequently, the chamfering device 27 can be used to chamfer the exposed edge.

[0399] In some embodiments, the silicon ingot supporting device can further comprise a silicon ingot positioning mechanism for positioning the silicon ingot supported by the first supporting slope and the second supporting slope. In this way, when the surface grinding device is used to grind the surface of the silicon ingot supported by the silicon ingot supporting device, the silicon ingot positioning mechanism can be used to position the silicon ingot supported by the silicon ingot supporting device to avoid relative displacement between the silicon ingot and the silicon ingot supporting device during the grinding process, thereby affecting the grinding quality. In some embodiments, the silicon ingot positioning mechanism can be, for example, a side skin clamping mechanism arranged at the front and back ends of the first supporting slope and the second supporting slope in the length direction for clamping the two end portions of the silicon ingot.

[0400] Since the aforementioned silicon ingot supporting device can support the silicon ingot and expose an edge through the groove formed at the bottom by the first supporting slope and the second supporting slope, the chamfering device comprises at least one chamfering unit, and the chamfering unit has at least one chamfering tool, and the chamfering surface of the chamfering tool is arranged upward.

[0401] Regarding the chamfering device, the chamfering device comprises a chamfering frame and at least one chamfering unit movably arranged on the chamfering frame, and the chamfering unit has at least one chamfering tool.

[0402] In Figure 1 In the embodiment shown, the silicon ingot placed on the silicon ingot supporting device 28 only exposes a lower edge, and the chamfering device 27 can comprise a chamfering frame 271 and a chamfering unit movably arranged on the chamfering frame 271, and the chamfering unit corresponds to the exposed edge.

[0403] The chamfering unit comprises a chamfering support movably arranged on the chamfering frame and at least one chamfering tool arranged on the chamfering support.

[0404] In Figure 12 In the embodiment shown, the silicon ingot placed on the silicon ingot support device 28 only exposes one of the lower edges, and the chamfering surface of the chamfering tool is horizontally upward, so the chamfering unit includes a chamfering support 273 movably arranged on the chamfering frame 271 in the vertical direction, and at least one chamfering tool 275 arranged on the chamfering support 273, which is used to chamfer the exposed lower edge of the silicon ingot 102 supported by the silicon ingot support device 28.

[0405] After the chamfering of one edge of the silicon ingot is completed, the position of the silicon ingot is adjusted, for example, the silicon ingot is turned over by 90°, that is, one side is turned over, so that another edge is exposed through the slot for chamfering. In this embodiment, since the position of the slot formed by the first support inclined surface 281 and the second support inclined surface 283 in the silicon ingot support device 28 does not change, the silicon ingot 102 exposes one edge through the slot, and thus the position of the exposed edge does not change. Therefore, it is not necessary to adjust the position of the chamfering tool in the chamfering device, and it is not necessary to consider the size of the silicon ingot to be machined, that is, the change in the length, width, and height of the silicon ingot does not affect the position of the exposed edge and the position of the chamfering tool in the chamfering device.

[0406] In the silicon ingot grinding device of the present application, a cleaning device can also be included. The cleaning device can be arranged on the grinding machine base and used to clean the silicon ingot.

[0407] In the silicon ingot grinding device of the present application, a feeding conveying device can also be included and arranged at the loading position and used to convey the silicon ingot to be ground. In some embodiments, the feeding conveying device can be, for example, a conveying belt device including a conveying belt arranged around two conveying rollers arranged opposite to each other, at least one of the two conveying rollers is connected to a feeding driving source, which can be, for example, a servo motor. In Figure 1 and Figure 12 In the embodiment shown, the silicon ingot grinding device further includes a feeding conveying device 221.

[0408] In the silicon ingot grinding device of the present application, a discharging conveying device can also be included and arranged at the unloading position and used to convey the silicon ingot after grinding. In some embodiments, the discharging conveying device can be, for example, a conveying belt device including a conveying belt arranged around two conveying rollers arranged opposite to each other, at least one of the two conveying rollers is connected to a discharging driving source, which can be, for example, a servo motor. In Figure 1 and Figure 12 In the embodiment shown, the silicon ingot grinding device further includes a discharging conveying device 223.

[0409] In some embodiments, the upper feeding conveyor and the lower feeding conveyor are of a common structure.

[0410] In the silicon rod grinding device, a square silicon rod transfer device can be further included to transfer the square silicon rod between different functional areas. Figure 1 and Figure 2 In the embodiment shown, the silicon rod grinding device further includes a square silicon rod transfer device 29.

[0411] The square silicon rod transfer device includes a square silicon rod centering mechanism arranged on the clamping seat to make the center line of the horizontally placed square silicon rod consistent with the center line of the square silicon rod clamp in the width direction. The square silicon rod centering mechanism can include at least one pair of clamping members and a clamping member driving mechanism. The at least one pair of clamping members are oppositely arranged in the second direction and are movably designed. When the clamping member driving mechanism drives the at least one pair of clamping members to move towards each other, the square silicon rod therebetween can be clamped and the center line of the square silicon rod can be ensured to be located in the middle of the square silicon rod clamp, thereby achieving the centering of the square silicon rod.

[0412] The following describes the execution process of the silicon rod grinding device in the foregoing embodiments in combination with Figure 12 , ​ , and ​ .

[0413] First, the first square silicon rod 102 to be ground is transferred and placed on the first square silicon rod clamping device 24 in the first first-type surface grinding area by the feeding conveyor 221 and the square silicon rod transfer device 29. The first square silicon rod is horizontally placed in the corresponding first square silicon rod clamping device 24 along the first direction, and the first first side surface is exposed.

[0414] The first first side surface of the first square silicon rod 102 clamped by the first square silicon rod clamping device 24 is ground by the first-type surface grinding device 23 in the first first-type surface grinding area. Specifically, the first first side surface exposed in the first square silicon rod clamped by the first square silicon rod clamping device is ground by at least one first surface grinding tool in the first-type surface grinding device through the relative movement of the first-type surface grinding device and the first square silicon rod clamping device in the first first-type surface grinding area.

[0415] After the first first side of the first silicon ingot is ground, the first silicon ingot is clamped by the silicon ingot transfer device 29, turned over (rotated 180° from the first first side to the second first side opposite to the first first side), transferred and placed on the first silicon ingot clamping device 24' in the second first grinding area, and the first silicon ingot is laid horizontally in the first direction to expose the second first side. At the same time, the second silicon ingot 102 to be ground is transferred and placed on the first silicon ingot clamping device 24 in the first first grinding area by the feeding conveyor 221 and the silicon ingot transfer device 29, and the second silicon ingot is laid horizontally in the first direction to expose the first first side.

[0416] The second...

Claims

1. A silicon ingot squaring apparatus, characterized by, include: A cutting machine base has a cutting processing platform, and the cutting processing platform is provided with one or more cutting station groups, each cutting station group including a first cutting station and a second cutting station. The first cutting station is equipped with a first silicon rod cutting device, which is used to perform a first cutting operation on a silicon rod with a circular cross-section, so that the silicon rod forms two parallel first side cut surfaces. as well as The second cutting station is equipped with a second silicon rod cutting device, which is used to perform a second cutting operation on the silicon rod having two first side cut surfaces, so that the silicon rod becomes a square silicon rod with a rectangular cross-section after forming two parallel second side cut surfaces, and the second side cut surfaces are perpendicular to the first side cut surfaces.

2. The silicon ingot squaring apparatus of claim 1, wherein The first cutting station includes a first loading and unloading area and a first cutting area. A first silicon rod transfer device is configured on the first cutting station. The first silicon rod transfer device is used to carry a silicon rod with a circular cross-section and transfer it between the first loading and unloading area and the first cutting area along the transfer direction. The first silicon rod cutting device is located in the first cutting area. The first silicon rod cutting device is equipped with at least one first cutting wire saw. The at least one first cutting wire saw is located in the vertical plane and is arranged along the vertical or at an angle to the vertical. The first silicon rod cutting device and the first silicon rod transfer device move relative to each other along the transfer direction so that the at least one first cutting wire saw can perform a first cutting operation on the silicon rod with a circular cross-section. The second cutting station includes a second loading / unloading area and a second cutting area. A second silicon rod transfer device is configured on the second cutting station. The second silicon rod transfer device is used to carry a silicon rod with two first side cuts and transfer it between the second loading / unloading area and the second cutting area along the transfer direction. The second silicon rod cutting device is located in the second cutting area and is equipped with at least one second wire saw. The at least one second wire saw is located in the vertical plane and is arranged along the vertical or at an angle to the vertical. The second silicon rod cutting device and the second silicon rod transfer device move relative to each other along the transfer direction so that the at least one second wire saw can perform a second cutting operation on the silicon rod with two first side cuts.

3. The silicon ingot squaring apparatus of claim 2, wherein The first silicon rod transfer device includes: a first transfer channel arranged along the transfer direction, a first support platform for carrying the silicon rod, and a first transfer drive mechanism for driving the first support platform and the silicon rod it carries to move along the transfer direction on the first transfer channel; the second silicon rod transfer device includes: a second transfer channel arranged along the transfer direction, a second support platform for carrying the silicon rod, and a second transfer drive mechanism for driving the second support platform and the silicon rod it carries to move along the transfer direction on the second transfer channel.

4. The silicon ingot squaring apparatus of claim 3, wherein include: A first edge-skin anti-splitting device that works in conjunction with a first silicon rod transfer device and a second edge-skin anti-splitting device that works in conjunction with a second silicon rod transfer device.

5. The silicon ingot squaring apparatus of claim 4, wherein The first edge skin anti-collapse device or the second edge skin anti-collapse device comprises a clamping support and an edge skin clamp arranged on the clamping support, the edge skin clamp comprises a clamp base, at least one pair of end face chucks arranged opposite in the clamping direction, and a chuck driving mechanism for driving at least one end face chuck in the at least one pair of end face chucks to move in the clamping direction.

6. The silicon ingot squaring apparatus of claim 5, wherein The end face chuck comprises a clamping base body and an edge skin pressing element arranged on the clamping base body.

7. The silicon ingot squaring apparatus of claim 6, wherein In the end face chuck, the edge skin pressing element comprises an edge skin pressing screw or an edge skin pressing elastic element arranged on the clamping base body.

8. The silicon ingot squaring apparatus of claim 5, wherein, The end face chuck comprises a clamping base body and a silicon rod pressing element and an edge skin pressing element arranged on the clamping base body, and an edge skin clamping reinforcing element that is controlled to advance and retreat relative to the clamping base body in the clamping direction.

9. The silicon ingot squaring apparatus of claim 8, wherein, In the end face chuck, the silicon rod pressing element comprises a silicon rod pressing screw arranged on the clamping base body, the edge skin pressing element comprises an edge skin pressing screw arranged on the clamping base body, and the edge skin clamping reinforcing element comprises a telescopic pressing rod or a telescopic pressing block that is controlled to advance and retreat relative to the clamping base body; or, the silicon rod pressing element comprises a silicon rod pressing elastic element arranged on the clamping base body, the edge skin pressing element comprises an edge skin pressing elastic element arranged on the clamping base body, and the edge skin clamping reinforcing element comprises a telescopic pressing rod or a telescopic pressing block that is controlled to advance and retreat relative to the clamping base body.

10. A silicon ingot squaring apparatus as claimed in claim 8 or 9, wherein The end face chuck comprises a biasing fine adjustment structure for adjusting the position of the clamping base body.

11. The silicon ingot squaring apparatus of claim 10, wherein The biasing fine adjustment structure comprises a hinged structure or a ball head structure, and the clamping base body is arranged through the hinged structure or the ball head structure.

12. The silicon ingot squaring apparatus of claim 5, wherein, The chuck driving mechanism comprises a chuck moving guide rail arranged in the clamping direction, and a chuck driving unit for driving at least one end face chuck in the at least one pair of end face chucks to move along the chuck moving guide rail.

13. The silicon ingot squaring apparatus of claim 5, wherein, The first edge skin anti-collapse device or the second edge skin anti-collapse device comprises an edge skin clamp advancing and retreating mechanism for driving the edge skin clamp to advance and retreat in the advancing and retreating direction.

14. The silicon ingot squaring apparatus of claim 13, wherein, The edge skin clamp advancing and retreating mechanism comprises an edge skin clamp advancing and retreating guide rail arranged in the advancing and retreating direction, and an edge skin clamp advancing and retreating unit for driving the edge skin clamp to move along the edge skin clamp advancing and retreating guide rail.

15. The silicon ingot squaring apparatus of claim 6, wherein, The first edge skin anti-collapse device or the second edge skin anti-collapse device comprises a clamp lifting mechanism, the clamp lifting mechanism comprises a clamp lifting guide rail arranged in the vertical direction, and a clamp lifting unit for driving the edge skin clamp to move up and down along the clamp lifting guide rail.

16. The silicon ingot squaring apparatus of claim 5, wherein, The first edge skin anti-collapse device or the second edge skin anti-collapse device comprises an edge skin feeding and conveying mechanism, the edge skin feeding and conveying mechanism comprises an edge skin bearing structure and a conveying driving mechanism.

17. The silicon ingot squaring apparatus of claim 16, wherein The edge skin bearing structure is controlled to be turned over by an edge skin turning mechanism.

18. The silicon ingot squaring apparatus of claim 1 or 2, wherein The first silicon rod cutting device comprises two first wire cutting units arranged in parallel, each first wire cutting unit forms a first cutting wire saw, and the second silicon rod cutting device comprises two second wire cutting units arranged in parallel, each second wire cutting unit forms a second cutting wire saw.

19. The silicon ingot squaring apparatus of claim 2, wherein, The silicon rod squaring apparatus comprises a silicon rod loading and unloading device for loading a silicon rod with a circular cross section onto a first silicon rod transfer device, unloading the silicon rod after the first cutting from the first silicon rod transfer device and loading it onto a second silicon rod transfer device, and unloading the silicon rod after the second cutting from the second silicon rod transfer device.

20. The silicon ingot squaring apparatus of claim 19, wherein, The silicon rod loading and unloading device comprises a silicon rod mounting frame across the cutting machine base along a transposition direction, a silicon rod clamp for clamping two end faces of the silicon rod, and a clamp transposition mechanism for driving the silicon rod clamp to move along the transposition direction on the silicon rod mounting frame.

21. The silicon ingot squaring apparatus of claim 20, wherein, The silicon rod clamp comprises a clamp mounting frame and a silicon rod clamping member provided on the clamp mounting frame.

22. The silicon ingot squaring apparatus of claim 21, wherein The silicon rod clamping member comprises a clamp arm mounting seat provided on the clamp mounting frame, at least one pair of clamp arms provided on the clamp arm mounting seat and facing each other along a transfer direction, and a clamp arm driving mechanism for driving at least one clamp arm of the at least one pair of clamp arms to move along the transfer direction to adjust the clamping spacing between the at least one pair of clamp arms.

23. The silicon ingot squaring apparatus of claim 22, wherein, The at least one pair of clamp arms comprises a rotating structure; the silicon rod clamp comprises a clamp arm rotating mechanism provided on at least one clamp arm of the at least one pair of clamp arms for driving the clamping part of the at least one clamp arm to rotate.

24. The silicon ingot squaring apparatus of claim 22, wherein, In the silicon rod clamp, the silicon rod clamping member is moved up and down relative to the clamp mounting frame by a clamp lifting mechanism.

25. The silicon ingot squaring apparatus of claim 20, wherein, The clamp transposition mechanism comprises a clamp transposition guide rail provided on the silicon rod mounting frame along a transposition direction; the transposition direction is perpendicular to the transfer direction and constitutes a horizontal plane; and a clamp transposition driving unit associated with the silicon rod clamp for driving the associated silicon rod clamp to move along the clamp transposition guide rail.

26. The silicon ingot squaring apparatus of claim 19, wherein, The silicon rod loading and unloading device comprises a centering adjustment mechanism for adjusting the position of the silicon rod so that the axial center line of the silicon rod corresponds to a predetermined center line.

27. The silicon ingot squaring apparatus of claim 4 or 16, wherein, The silicon rod squaring apparatus comprises a side skin unloading device comprising a side skin mounting frame across the cutting machine base along a transposition direction, a side skin suction member for suctioning the side skin, and a suction member transposition mechanism for driving the suction member to move along the transposition direction on the side skin mounting frame.

28. The silicon ingot squaring apparatus of claim 27, wherein, The suction member transposition mechanism comprises: a suction member transposition guide rail provided on the side skin mounting frame along a transposition direction; the transposition direction is perpendicular to the transfer direction and constitutes a horizontal plane; and a suction member transposition driving unit associated with the side skin suction member for driving the associated side skin suction member to move along the suction member transposition guide rail.

29. The silicon ingot squaring apparatus of claim 1, wherein The silicon rod squaring apparatus comprises a crystal line detection device, which comprises: at least two support structures arranged at a distance, the support structures having a support roller set arranged along a transfer direction for supporting a silicon rod to be cut; and a roller driving source for driving each support roller in the support roller set to rotate to drive the silicon rod to be cut to rotate.

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