Electroplating structure for thin film processing

Abstract

The utility model discloses an electroplating structure for thin film processing, which comprises a long cross frame, the long cross frame is respectively provided with a deposition tank, an electroplating tank, a cleaning box and a drying box, the two sides of the long cross frame are respectively provided with a first transfer roller and a wind-up roller, the first transfer roller is rotatably connected with a thin film body, and the wind-up roller is rotatably connected with the thin film body. The conductive covering mechanism is arranged on the inner wall of the deposition tank; the cooling mechanism comprises a partition plate arranged on the inner wall of the deposition tank, the conductive covering mechanism is located on one side of the partition plate, a partition bin is arranged between the deposition tank and the electroplating tank, the partition bin is communicated with the deposition tank and the electroplating tank, and a cooling roller body is arranged on the inner wall of the partition bin. The electroplating structure for thin film processing provided by the utility model has the technical effect of improving the stability of the electroplating process.

Description

TECHNICAL FIELD

[0001] The utility model relates to a film processing technical field especially relates to a kind of electroplating structures for film processing. BACKGROUND

[0002] Film processing is a widely used process, in real use process, to meet the demand, need to be electroplated to film, and film is non-metallic material, when electroplating, need to deposit a layer of conductive material on film surface.

[0003] The patent document with application No.202121278103.6 discloses a water electroplating equipment for flexible film substrate surface electroplating processing, including plating solution pool for electroplating film plating, insulating main roller is arranged in plating solution pool, film plating is passed out by plating solution pool after winding around main roller, conductive belt is arranged on the outer side of main roller, conductive belt is tightly attached to the outer side of part of film plating, arc-shaped anode plate is arranged on the periphery of main roller.

[0004] But the traditional electroplating structure for film processing when using, structure setting is simple, after the settlement of conductive layer, the temperature of film cannot be timely dropped, when entering electroplating bath electroplating, high-temperature film body will affect the stability of electroplating process.

[0005] For example: before the electroplating of non-metallic material film body, need to go through conductive layer deposition process, and deposition process needs to heat reducing gas (for example: hydrogen) to a certain temperature, so after deposition, film body will have higher temperature. UTILITY MODEL CONTENT

[0006] The utility model discloses an electroplating structure for film processing, to solve the technical problem that the traditional electroplating structure for film processing when using, structure setting is simple, after the settlement of conductive layer, the temperature of film cannot be timely dropped, when entering electroplating bath electroplating, high-temperature film body will affect the stability of electroplating process.

[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0008] The utility model provides a kind of electroplating structure for film processing, including long crosspiece, respectively with deposition groove, electroplating groove, cleaning tank and drying tank are equipped on the long crosspiece, the two sides of the long crosspiece are respectively equipped with first adapter roller and winding roller, the first adapter roller is connected with film body on adapter, further include: electrically conductive covering mechanism: the electrically conductive covering mechanism is arranged on the inner wall of the deposition groove;Cooling mechanism: the cooling mechanism includes the partition plate being arranged on the inner wall of the deposition groove, the electrically conductive covering mechanism is located in the one side of the partition plate, the deposition groove and the electroplating groove are equipped with separate warehouse between, the separate warehouse is respectively linked with the deposition groove and the electroplating groove, the inner wall of the separate warehouse is equipped with cooling roller body, one end of the cooling roller body is connected with inlet pipe and outlet pipe, and the inlet pipe and the outlet pipe are used in cooperation.

[0009] In the scheme, the electrically conductive covering mechanism can deposit the non-metal material film body with a conductive layer on one side of the deposition groove. The process requires the use of reducing gas at high temperature. After the film is treated at high temperature and passes through the partition plate, it will naturally cool down on one side of the partition plate in the deposition groove. The film body that has undergone natural cooling is transferred to the inside of the interval warehouse. The cooling roller body in the interval warehouse is used to cool the film body with a deposited conductive layer for the second time, ensuring that the film body enters the electroplating tank more stably during the electroplating process. This avoids the direct entry of high-temperature film body into the electroplating tank, which causes the temperature of the electroplating solution to rise, affecting the stability of the electroplating solution and the electroplating effect.

[0010] In a preferred scheme, the electrically conductive covering mechanism includes a first mounting bracket arranged on the outer wall of one side of the deposition groove. One side of the first mounting bracket is connected with a port. The side of the first mounting bracket facing the inside of the deposition groove is provided with a first spray head. The first mounting bracket is internally provided with a heating resistance wire. One side of the inner wall of the bottom of the deposition tank is also provided with a second mounting bracket. The second mounting bracket is connected with a conduit. One end of the conduit penetrates through the outer wall on one side of the deposition tank. The top outer wall of the second mounting bracket is provided with second spray heads distributed at equal distances. The spray direction of the first spray head is inclined upward. The spray direction of the second spray head is vertically upward.

[0011] In the specific conductive layer deposition process, the reducing gas needs to be heated and then introduced into the deposition tank. After the deposition tank is filled with high-temperature reducing gas, the metal gaseous compounds sprayed by the second spray head will react with each other, and finally a metal layer will be deposited on the surface of the film body. By controlling the temperature and other reaction conditions, the thickness of the deposited layer can be adjusted. In the present scheme, the first spray head acts on the inclined surface of the film body entering the deposition groove section, and the second spray head acts on the bottom plane of the film body from the bottom. They do not interfere with each other under the action of spraying, and the process of depositing the conductive layer is more stable.

[0012] As described above, an electroplating structure for thin film processing includes a long horizontal frame, on which a deposition tank, an electroplating tank, a cleaning chamber, and a drying chamber are respectively arranged. A first transfer roller and a take-up roller are respectively arranged on both sides of the long horizontal frame. A thin film body is transferred onto the first transfer roller. The structure also includes: a conductive covering mechanism disposed on the inner wall of the deposition tank; a cooling mechanism including a partition disposed on the inner wall of the deposition tank, with the conductive covering mechanism located on one side of the partition; a partition chamber between the deposition tank and the electroplating tank, the partition chamber being connected to both the deposition tank and the electroplating tank; a cooling roller body disposed on the inner wall of the partition chamber, one end of the cooling roller body being connected to an inlet pipe and an outlet pipe, and the inlet pipe and the outlet pipe working together. The electroplating structure for thin film processing provided by this utility model has the technical effect of improving the stability of the electroplating process. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of an electroplating structure for thin film processing proposed in this utility model.

[0014] Figure 2 This is a side view of an electroplating structure for thin film processing proposed in this utility model.

[0015] Figure 3 This is a schematic diagram of the first mounting bracket of an electroplating structure for thin film processing proposed in this utility model.

[0016] Figure 4 For the present utility model in Figure 3 A magnified structural diagram of point A in the middle.

[0017] Figure 5 This is a schematic diagram of the first spray head structure of an electroplating structure for thin film processing proposed in this utility model.

[0018] Figure 6 This is a schematic cross-sectional view of the spacer compartment structure for electroplating in thin film processing proposed in this utility model.

[0019] In the attached diagram: 1. Long cross frame; 2. Deposition tank; 3. Electroplating tank; 4. Cleaning box; 5. Drying box; 6. Film body; 7. First transfer roller; 8. Rewind roller; 9. First mounting frame; 10. Second mounting frame; 11. Partition plate; 12. Second transfer roller; 13. Third transfer roller; 14. Spacer compartment; 15. Conduit; 16. Second spray head; 17. First spray head; 18. Interface; 19. Cooling roller body; 20. Liquid inlet pipe; 21. Liquid outlet pipe. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] The electroplating structure for thin film processing disclosed in this utility model is mainly applied to traditional electroplating structures for thin film processing. When in use, the structure is simple, and after the conductive layer settles, the temperature of the thin film cannot drop in time. When entering the electroplating bath, the high temperature of the thin film body will affect the stability of the electroplating process.

[0022] Reference Figure 1 , Figure 2 , Figure 3 and Figure 6 An electroplating structure for thin film processing includes a long cross frame 1, on which a deposition tank 2, an electroplating tank 3, a cleaning box 4, and a drying box 5 are respectively provided. A first transfer roller 7 and a take-up roller 8 are respectively provided on both sides of the long cross frame 1. A thin film body 6 is transferred on the first transfer roller 7. The structure also includes: a conductive covering mechanism: the conductive covering mechanism is disposed on the inner wall of the deposition tank 2; a cooling mechanism: the cooling mechanism includes a partition 11 disposed on the inner wall of the deposition tank 2, the conductive covering mechanism is located on one side of the partition 11, a partition chamber is provided between the deposition tank 2 and the electroplating tank 3, the partition chamber is connected to the deposition tank 2 and the electroplating tank 3 respectively, a cooling roller body 19 is disposed on the inner wall of the partition chamber, one end of the cooling roller body 19 is connected to an inlet pipe 20 and an outlet pipe 21, and the inlet pipe 20 and the outlet pipe 21 are used in conjunction.

[0023] In this scheme, a conductive layer can be deposited on one side of the deposition tank 2 by a conductive covering mechanism. This process requires the use of a reducing gas at a high temperature. After the film is treated at high temperature, it will be naturally cooled on one side of the partition 11 in the deposition tank 2. The film body 6 after natural cooling will then be transferred to the spacer chamber 14. The cooling roller body 19 inside the spacer chamber 14 will cool the film body 6 again after the conductive layer is deposited. This ensures that the electroplating process is more stable after the film body 6 enters the electroplating bath, and avoids the high temperature of the electroplating solution from directly entering the electroplating bath, which would affect the stability of the electroplating solution and the electroplating effect.

[0024] Among them, the partition 11 is made of heat insulation material. The partition 11 made of heat insulation material can prevent the heat generated by the operation of the conductive covering mechanism from entering the other side of the partition 11, so that one side of the partition 11 in the deposition tank 2 can become a pre-cooling space, which plays a role in the cooling transition and avoids the high temperature film body 6 from deforming after direct contact with the cooling roller body 19.

[0025] One end of the film body 6 passes through the deposition tank 2, the electroplating tank 3, the cleaning box 4, and the drying box 5 and is connected to the outer wall of the take-up roller 8.

[0026] Reference Figure 1 , Figure 3 , Figure 4 and Figure 5 In a preferred embodiment, the conductive covering mechanism includes a first mounting frame 9 disposed on one side of the outer wall of the deposition tank 2. An interface 18 is connected to one side of the first mounting frame 9. A first spray head 17 is provided on the side of the first mounting frame 9 facing the interior of the deposition tank 2. A heating resistance wire is provided inside the first mounting frame 9. A second mounting frame 10 is also provided on one side of the bottom inner wall of the deposition tank 2. A conduit 15 is connected to the second mounting frame 10. One end of the conduit 15 passes through one side of the outer wall of the deposition tank. Second spray heads 16 are evenly distributed on the top outer wall of the second mounting frame 10.

[0027] In the specific conductive layer deposition process, the reducing gas needs to be heated and then introduced into the deposition tank 2. After the deposition tank 2 is filled with high-temperature reducing gas, the metal gaseous compound sprayed through the second nozzle 16 will react with it, and finally form a metal layer deposited on the surface of the thin film body 6. The thickness of the deposited layer can be adjusted by controlling the reaction conditions such as temperature.

[0028] The first nozzle 17 sprays upward at an angle, while the second nozzle 16 sprays vertically upward. The first nozzle 17 acts on the inclined surface of the thin film body 6 as it enters the deposition tank 2 section, while the second nozzle 16 acts on the bottom plane of the thin film body 6 from the bottom. Under the spraying action, they do not interfere with each other, making the deposition of the conductive layer more stable.

[0029] Reference Figure 2 In a preferred embodiment, a second transfer roller 12 and a third transfer roller 13 are respectively provided in the deposition tank 2 and the electroplating tank 3. Under the action of the second transfer roller 12, the thin film body 6 after the conductive layer is deposited can smoothly move from one side of the partition 11 to the other side, while the third transfer roller 13 can guide the thin film body 6 to be fully electroplated in the electroplating tank.

[0030] Working principle: In use, the cleaned and dried film body 6 is introduced onto the long cross frame 1 through the first transfer roller 7, and then the film body 6 is introduced into the deposition tank 2 through the second transfer roller 12. The reducing gas is heated and then introduced into the deposition tank 2. After the deposition tank 2 is filled with high temperature reducing gas, the metal gaseous compound sprayed through the second nozzle 16 reacts with it, and finally a metal layer is deposited on the surface of the film body 6. A conductive layer is deposited on the non-metallic film body 6. After the conductive layer is deposited, the film body 6 is cooled by the cooling mechanism and then enters the electroplating tank 3 to complete the electroplating. After electroplating, the film body 6 is cleaned by the cleaning box 4 and dried by the drying box 5, and then collected by the take-up roller 8.

[0031] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. An electroplating structure for thin film processing, comprising a long crossbeam (1), wherein a deposition tank (2), an electroplating tank (3), a cleaning box (4), and a drying box (5) are respectively provided on the long crossbeam (1), characterized in that, The long crossbeam (1) is provided with a first transfer roller (7) and a take-up roller (8) on both sides respectively. The first transfer roller (7) is connected to a film body (6), and also includes: Conductive covering mechanism: The conductive covering mechanism is disposed on the inner wall of the deposition tank (2); Cooling mechanism: The cooling mechanism includes a partition (11) disposed on the inner wall of the deposition tank (2), the conductive covering mechanism is located on one side of the partition (11), a partition chamber is provided between the deposition tank (2) and the electroplating tank (3), the partition chamber is connected to the deposition tank (2) and the electroplating tank (3) respectively, a cooling roller body (19) is provided on the inner wall of the partition chamber, one end of the cooling roller body (19) is connected to an inlet pipe (20) and an outlet pipe (21), and the inlet pipe (20) and the outlet pipe (21) are used in conjunction.

2. The electroplating structure for thin film processing according to claim 1, characterized in that, The partition (11) is made of heat-insulating material.

3. The electroplating structure for thin film processing according to claim 2, characterized in that, One end of the film body (6) passes through the deposition tank (2), the electroplating tank (3), the cleaning tank (4), and the drying tank (5) and is connected to the outer wall of the take-up roller (8).

4. The electroplating structure for thin film processing according to claim 1, characterized in that, The conductive covering mechanism includes a first mounting bracket (9) disposed on the outer wall of one side of the deposition tank (2), an interface (18) is connected to one side of the first mounting bracket (9), a first spray head (17) is provided on the side of the first mounting bracket (9) facing the inside of the deposition tank (2), and a heating resistance wire is provided inside the first mounting bracket (9).

5. An electroplating structure for thin film processing according to claim 4, characterized in that, A second mounting bracket (10) is provided on one side of the bottom inner wall of the sedimentation tank (2). A conduit (15) is connected to the second mounting bracket (10). One end of the conduit (15) passes through the outer wall of one side of the sedimentation tank (2). Second spray heads (16) are provided on the top outer wall of the second mounting bracket (10) at equal intervals.

6. The electroplating structure for thin film processing according to claim 5, characterized in that, The first nozzle (17) sprays upward at an angle, and the second nozzle (16) sprays vertically upward.

7. The electroplating structure for thin film processing according to claim 1, characterized in that, The deposition tank (2) and the electroplating tank (3) are respectively equipped with a second transfer roller (12) and a third transfer roller (13).

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