Wafer edge clamping type spin-drying mechanism
By using a wafer edge clamping spin-drying mechanism, which combines a cam turntable and an elastic element, the problem of vacuum chuck damage and breakage during wafer spin-drying is solved, achieving uniform clamping and efficient drying of the wafer.
Patent Information
- Application Number
- CN202520445842.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-13
AI Technical Summary
Existing wafer spin-drying technology is prone to damage to vacuum chucks and wafer breakage, and cannot achieve one-time drying, thus affecting drying efficiency.
The wafer edge clamping spin-drying mechanism uses a cam turntable and elastic elements in conjunction with a support column to move the support column on the spin-drying tray, clamping and releasing the wafer edge to avoid contact with the end face, and achieving drying through high-speed rotation.
This avoids wafer breakage, achieves uniform wafer clamping, improves drying efficiency, enables one-time drying, and enhances the reliability and efficiency of wafer processing.
Smart Images
Figure CN223925318U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a wafer edge clamping type spin-drying mechanism. BACKGROUND
[0002] Wafer spin-drying technology is one of wafer drying methods, and is widely applied in wafer early processing and single chip cleaning. In wafer spin-drying, the end face of a wafer is usually adsorbed by a vacuum chuck, however, the vacuum of the vacuum chuck is easily destroyed in spin-drying, leading to wafer cracking; in addition, the wafer in contact with the vacuum chuck cannot be dried at one time, affecting wafer drying efficiency. SUMMARY
[0003] The utility model discloses a wafer edge clamping type spin-drying mechanism, avoids wafer cracking, and improves wafer drying efficiency.
[0004] To achieve the purpose, the utility model adopts the following technical scheme:
[0005] A wafer edge clamping type spin-drying mechanism, comprising:
[0006] A base;
[0007] A spin-drying assembly, comprising a spin-drying disc, at least three support columns arranged along the circumference of the spin-drying disc, the support columns being connected to the spin-drying disc through elastic members, the support columns being movable between the circumference side and the center of the spin-drying disc, the elastic members causing the support columns to have a tendency to move towards the center;
[0008] A lifting assembly and a cam turntable, the lifting assembly being arranged on the base, the cam turntable being arranged on the output end of the lifting assembly, the lifting assembly being capable of driving the cam turntable to the first position to cooperate with the support columns, the lifting assembly being capable of driving the cam turntable to the second position to separate from the support columns; the cam turntable comprising at least three push stroke segments corresponding to the at least three support columns one by one;
[0009] A driving member arranged on the base, the driving member being used to drive the spin-drying disc to rotate, when the cam turntable is in the first position, the driving member drives the support columns to move in the push stroke segments to move relative to the spin-drying disc; when the cam turntable is in the second position, the driving member drives the spin-drying assembly to rotate to perform spin-drying.
[0010] In some possible implementation manners, the outer edge contour surface of the cam turntable forms the push stroke segments.
[0011] In some possible implementation manners, the spin-drying disc is provided with at least three sliding grooves extending towards the center along the circumference side of the spin-drying disc, and the support columns are correspondingly and slidingly connected to the sliding grooves.
[0012] In some possible implementation manners, the spin-dry assembly further comprises at least three guide columns, the spin-dry disc is provided with at least three mounting grooves, the guide columns are arranged along the moving direction of the support column and are correspondingly mounted in the mounting grooves, the elastic member is a spring, the spring is sleeved on the guide column, and one end of the elastic member is connected to the support column.
[0013] In some possible implementation manners, the guide column is provided with a limiting stop, and the other end of the elastic member is connected to the limiting stop.
[0014] In some possible implementation manners, the sliding groove is provided with a limiting groove extending along the moving direction of the support column, the support column is provided with a limiting protrusion, and the support column is always limited in and moves in the limiting groove.
[0015] In some possible implementation manners, the spin-dry assembly further comprises a bearing sleeved on the support column, and the support column is in contact with the cam disc through the bearing.
[0016] In some possible implementation manners, the support column penetrates through the spin-dry disc, one end of the support column is used for clamping the wafer, and the other end of the support column is used for cooperating with the cam disc.
[0017] In some possible implementation manners, the support column is provided with a clamping groove, and the wafer can be limited in the clamping groove.
[0018] In some possible implementation manners, the spin-dry assembly, the cam disc, the base and the lifting assembly are sequentially arranged along the vertical direction, the output end of the lifting assembly penetrates through the base to be connected with the cam disc.
[0019] The utility model discloses the beneficial effect of the following:
[0020] The utility model provides a kind of wafer edge clamping type spin-drying mechanism, when cam turntable is located first position and cooperates with support column, when spin-drying disc rotates, bearing rotates along the push section of cam turntable.When moving from low to high of push section, cam turntable pushes support column to move in the direction of far from the center of spin-drying disc, and it is in open state.When moving from high to low, elastic member drives support column to move in the direction of the center of spin-drying disc, and it is in clamping state.Cam turntable is separated from support column when it is located second position, the position of support column relative to spin-drying disc is not limited by cam turntable, can keep the state of stable clamping wafer, driving piece drives spin-drying assembly to rotate to carry out spin-drying.The scheme is simple in structure, due to the effect of elastic member during spin-drying process, support column always keeps uniform clamping force to wafer, avoids wafer breakage, only clamps the edge of wafer, avoids contact with the end surface of wafer, can realize disposable drying, avoids secondary drying to wafer contact place, to improve wafer drying efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0021] Fig. 1 It is the schematic diagram of wafer edge clamping type spin-drying mechanism provided by the specific embodiment of the utility model;
[0022] Fig. 2 It is the sectional view of spin-drying assembly provided by the specific embodiment of the utility model;
[0023] Fig. 3 It is the bottom view of cam turntable cooperation when spin-drying assembly rotates to original point position provided by the specific embodiment of the utility model.
[0024] In the drawing:
[0025] 1, base;11, support plate;12, support seat;
[0026] 2, spin-drying assembly;21, spin-drying disc;211, sliding slot;212, mounting groove;213, limiting groove;22, support column;221, clamping groove;222, limiting protrusion;24, elastic member;25, guide column;251, limiting stop;26, bearing;27, adapter sleeve;
[0027] 3, cam turntable;31, push section;
[0028] 4, driving piece;
[0029] 5, lifting assembly;51, air cylinder;52, connecting rod. DETAILED DESCRIPTION
[0030] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model embodiments will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of protection of the utility model.
[0031] In the description of the utility model, unless explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For the person skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0032] In the utility model, unless explicitly defined and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or it can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0033] As Figs. 1-3As shown, the embodiment provides a wafer edge clamping type spin-drying mechanism, which comprises a base 1, a spin-drying assembly 2, a cam turntable 3, a lifting assembly 5 and a driving member 4. The spin-drying assembly 2 comprises a spin-drying disc 21, at least three support columns 22 arranged along the circumference of the spin-drying disc 21, the support columns 22 being connected to the spin-drying disc 21 through elastic members 24, the support columns 22 being movable between the circumference and the center of the spin-drying disc 21, and the elastic members 24 enabling the support columns 22 to have a tendency to move towards the center. The lifting assembly 5 is arranged on the base 1, the cam turntable 3 is arranged on the output end of the lifting assembly 5, the lifting assembly 5 is capable of driving the cam turntable 3 to a first position and a second position, when the cam turntable 3 is in the first position, the cam turntable 3 cooperates with the support columns 22, and when the cam turntable 3 is in the second position, the cam turntable 3 is separated from the support columns 22. The cam turntable 3 comprises at least three push stroke segments 31 corresponding to the at least three support columns 22. The driving member 4 is arranged on the base 1, since the support columns 22, bearings 26 and elastic members 24 are arranged on the spin-drying disc 21, the driving member 4 is used to drive the spin-drying disc 21 to rotate. When the cam turntable 3 is in the first position, since the cam turntable 3 cooperates with the support columns 22, the driving member 4 drives the spin-drying assembly 2 to rotate relative to the cam turntable 3, the push stroke segments 31 push the support columns 22, so that the support columns 22 move in the push stroke segments 31 to move relative to the spin-drying disc 21; when the cam turntable 3 is in the second position, since the cam turntable 3 is separated from the support columns 22, during the rotation of the spin-drying assembly 2, the position of the support columns 22 relative to the spin-drying disc 21 is not limited by the cam turntable 3, and the support columns 22 can keep the state of stably clamping the wafer, and the driving member 4 drives the spin-drying assembly 2 to spin-dry.
[0034] Specifically, when the support columns 22 move from the high position to the low position of the push stroke segments 31, the support columns 22 move inward relative to the spin-drying disc 21 to clamp the edge of the wafer; when the support columns 22 move from the low position to the high position of the push stroke segments 31, the support columns 22 move outward relative to the spin-drying disc 21 to release the wafer.
[0035] In an embodiment, the spin-drying disc 21 is a disc, the spin-drying assembly 2 comprises three support columns 22, the three support columns 22 are arranged uniformly along the circumference of the spin-drying disc 21, and the support columns 22 are movable along the radial direction of the spin-drying disc 21. The cam turntable 3 comprises three push stroke segments 31 arranged continuously, the three push stroke segments 31 correspond to the three support columns 22, since the cam turntable 3 is provided only with the push stroke segments 31, the structure is simple and compact. The spin-drying assembly 2 further comprises bearings 26 sleeved on the support columns 22, the support columns 22 are in contact with the cam turntable 3 through the bearings 26, the bearings 26 rotate along the cam turntable 3 in the corresponding push stroke segments 31 with the rotation of the support columns 22. The support columns 22 are in rolling connection with the cam turntable 3 through the bearings 26, which reduces the friction and abrasion, and the movement is smoother. The side of the support columns 22 away from the cam turntable 3 is provided with a clamping groove 221, the wafer can be limited in the clamping groove 221, which ensures the installation stability of the wafer during the rotation after being clamped by the support columns 22.
[0036] In the initial state, the elastic member 24 is in the initial position, the support column 22 is in the clamping state under the action of the elastic member 24, and the cam disc 3 is separated from the bearing 26 or in the approximate contact state. As shown in the figure, when the elastic member 24 is in the initial position, the position of the spin-drying assembly 2 relative to the cam disc 3 is the original position. Fig. 3
[0037] When the wafer edge clamping type spin-drying mechanism is used, the following steps are included:
[0038] Step one, the driving member 4 drives the spin-drying disc 21 to rotate to the original position.
[0039] Step two, the lifting assembly 5 drives the cam disc 3 to rise to a position consistent with the height of the bearing 26, that is, the cam disc 3 is in the first position.
[0040] Step three, the driving member 4 drives the spin-drying disc 21 to rotate clockwise, and the support column 22 moves from low to high along the push stroke 31, moving away from the center of the spin-drying disc 21, and the support column 22 is in the open state.
[0041] Step four, the robot sends the wafer to a position consistent with the height of the clamping slot 221 on the support column 22, and the driving member 4 drives the spin-drying disc 21 to move in the counterclockwise direction. Under the action of the restoring force, that is, the pulling force, of the elastic member 24, the support column 22 moves from high to low along the push stroke 31, that is, the support column 22 moves towards the center of the spin-drying disc 21, so that the support column 22 gradually approaches the wafer from the four directions of the wafer, until the spin-drying assembly 2 is in the original position, the elastic member 24 is in the initial state, and the support column 22 is clamped on the edge of the wafer, so that the wafer is in the clamping state.
[0042] Step five, the lifting assembly 5 drives the cam disc 3 to descend to a position below the bearing 26, that is, the cam disc 3 is in the second position.
[0043] Step six, the driving member 4 drives the spin-drying disc 21 to move, and the support column 22 remains unchanged in the state of clamping the wafer under the action of the pulling force of the elastic member 24. The driving member 4 drives the spin-drying disc 21 to rotate at high speed. Under the action of the high-speed movement of the spin-drying disc 21, the water on the wafer gradually separates from the wafer, so that the wafer reaches a dry state.
[0044] Step seven, the robot grabs the wafer, the driving member 4 drives the spin-drying disc 21 to rotate to the original position, and the lifting assembly 5 drives the cam disc 3 to rise to contact with the support column 22, so that the support column 22 moves away from the center of the spin-drying disc 21, thereby releasing the wafer.
[0045] After that, the above steps are repeated to realize the spin-drying and drying of the next wafer.
[0046] The cam disc 3 cooperates with the support column 22, i.e. the bearing 26 on the support column 22, so that when the spin-drying disc 21 rotates, the bearing 26 rotates along the pushing section 31 of the cam disc 3. When moving from the low position to the high position of the pushing section 31, the cam disc 3 pushes the support column 22 to move away from the center of the spin-drying disc 21, and is in the open state. When moving from the high position to the low position, the elastic member 24 drives the support column 22 to move towards the center of the spin-drying disc 21, and is in the clamping state. The structure is simple, and the support column 22 always maintains uniform clamping force on the wafer during the spin-drying process due to the action of the elastic member 24, avoiding wafer breakage. Only the edge of the wafer is clamped to avoid contact with the end face of the wafer, and one-time drying can be achieved, avoiding secondary drying of the wafer contact part, thereby improving the wafer drying efficiency.
[0047] In other embodiments, the spin-drying assembly 2 can optionally include three support columns 22, four support columns 22, etc., without limitation. When three support columns 22 are provided and the spin-drying disc 21 is a disc, the three support columns 22 are arranged at both ends of the diameter of the spin-drying disc 21 to ensure the reliability of clamping the wafer.
[0048] In other embodiments, the spin-drying disc 21 can be a rectangular disc. When four support columns 22 are provided, the four support columns 22 are located on the four edges of the rectangular disc and move towards the center of the rectangle in a straight line.
[0049] Optionally, the outer edge profile surface of the cam disc 3 forms the pushing section 31, or the cam disc 3 is provided with a groove, and the groove forms the pushing section 31.
[0050] Optionally, when the spin-drying assembly 2 is located at the origin position, the support column 22 and the bearing 26 are located at the approximate middle position of the pushing section 31. In other embodiments, the cam disc 3 further includes a rest section and a return section.
[0051] The spin-drying disc 21 is provided with at least three sliding grooves 211 extending towards the center from the circumferential side of the spin-drying disc 21. In this embodiment, three sliding grooves 211 are provided, and the support column 22 is correspondingly slidingly connected to the sliding groove 211, so that the support column 22 moves along a straight line towards or away from the center of the spin-drying disc 21 under the guidance of the guide column 25, ensuring the position accuracy of the support column 22, moving more smoothly, and improving the reliability of clamping or releasing the wafer.
[0052] The spin-drying assembly 2 further comprises at least three guide columns 25, in the embodiment, the spin-drying disc 21 is provided with at least three mounting grooves 212, the guide columns 25 are arranged along the moving direction of the support columns 22 and are correspondingly mounted in the mounting grooves 212, the elastic member 24 is a spring, the spring is sleeved on the guide column 25, one end of the elastic member 24 is connected to the support column 22, the guide column 25 is provided with a limiting stop 251, the other end of the elastic member 24 is connected to the limiting stop 251, for example, the elastic member 24 is a spring, the two ends of the spring are welded to the support column 22 and the limiting stop 251 respectively, so that the spring is stably mounted and deformed along the guide column 25.
[0053] The sliding groove 211 is provided with a limiting groove 213 extending along the moving direction of the support column 22, the support column 22 is provided with a limiting protrusion 222, the support column 22 is always limited in the limiting groove 213 and moves in the limiting groove 213, so that the support column 22 is limited in the vertical direction.
[0054] The support column 22 penetrates the cam disc 3, the two ends of the support column 22 extend out of the cam disc 3, the cam disc 3 is arranged on the lower side of the spin-drying assembly 2, so that the wafer can be placed between the support columns 22 by the mechanical hand without interfering with the cam disc 3. The clamping groove 221 is located at the upper part of the support column 22 and on the side of the spin-drying disc 21 away from the cam disc 3, and the bearing 26 is located at the lower part of the support column 22 and on the side of the spin-drying disc 21 close to the cam disc 3.
[0055] Specifically, the spin-drying assembly 2, the cam disc 3 and the base 1 are arranged in sequence in the vertical direction, the bottom of the base 1 is provided with three support plates 11, and specifically three lifting assemblies 5, the lifting assembly 5 comprises a cylinder 51 and a connecting rod 52, the cylinder 51 of the three lifting assemblies 5 is correspondingly mounted on the three support plates 11, one end of the connecting rod 52 is connected to the piston rod of the cylinder 51, the middle part penetrates the base 1, and the other end is connected to the cam disc 3, the piston rod of the cylinder 51 drives the lifting of the cam disc 3 through extension and contraction, and the three lifting assemblies 5 are arranged to ensure stable installation of the cam disc 3 and avoid deflection of the cam disc 3.
[0056] Optionally, the bottom of the base 1 is provided with a support seat 12, the support seat 12 is located between the three support plates 11, the driving member 4 comprises a motor and a speed reducer, etc., the output end of the driving member 4 penetrates the base 1 and is connected to the spin-drying disc 21 through the adapter sleeve 27. The motor adjusts the rotating speed according to actual needs to realize low-speed or high-speed operation, for example, low-speed operation during clamping of the wafer by the support column 22 to prevent the wafer from being damaged by large impact force, and high-speed operation during spinning of the wafer to improve the spinning effect.
[0057] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and also impossible to exhaust all the implementation modes. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application claims.
Claims
1. A wafer edge chucking spin-dry mechanism characterized by, The application relates to a spin-drying device. The spin-drying device comprises: a base (1); a spin-drying assembly (2) comprising a spin-drying disc (21), at least three support columns (22) arranged circumferentially along the spin-drying disc (21), the support columns (22) being connected to the spin-drying disc (21) through elastic members (24), the support columns (22) being movable between the circumferential side and the center of the spin-drying disc (21), the elastic members (24) enabling the support columns (22) to move towards the center; a lifting assembly (5) arranged on the base (1) and a cam turntable (3) arranged on the output end of the lifting assembly (5), the lifting assembly (5) being capable of driving the cam turntable (3) to a first position to cooperate with the support columns (22) and driving the cam turntable (3) to a second position to separate from the support columns (22), the cam turntable (3) comprising at least three push segments (31) corresponding to the at least three support columns (22); 2. The wafer edge chucking spin mechanism of claim 1, wherein, a driving member (4) arranged on the base (1), the driving member (4) being used for driving the spin-drying disc (21) to rotate, when the cam turntable (3) is in the first position, the driving member (4) drives the support columns (22) to move in the push segments (31) to move relative to the spin-drying disc (21), when the cam turntable (3) is in the second position, the driving member (4) drives the spin-drying assembly (2) to rotate to perform spin-drying.
3. The wafer edge chuck spin mechanism of claim 1, wherein, The outer edge profile surface of the cam turntable (3) forms the push segments (31).
4. The wafer edge chuck spin mechanism of claim 3, wherein, The spin-drying disc (21) is provided with at least three sliding grooves (211) extending towards the center along the circumferential side of the spin-drying disc (21), and the support columns (22) are correspondingly and slidingly connected to the sliding grooves (211).
5. The wafer edge chuck spin mechanism of claim 4, wherein, The spin-drying assembly (2) further comprises at least three guide columns (25), the spin-drying disc (21) is provided with at least three mounting grooves (212), the guide columns (25) are arranged along the moving direction of the support columns (22) and are correspondingly mounted in the mounting grooves (212), the elastic members (24) are springs, the springs are sleeved on the guide columns (25), and one end of the elastic members (24) is connected to the support columns (22).
6. The wafer edge chuck spin mechanism of claim 3, wherein, The guide columns (25) are provided with limiting stop tables (251), and the other end of the elastic members (24) is connected to the limiting stop tables (251).
7. The wafer edge chuck spin mechanism of claim 1, wherein, The sliding grooves (211) are provided with limiting grooves (213) extending along the moving direction of the support columns (22), the support columns (22) are provided with limiting protrusions (222), and the support columns (22) are always limited in and move in the limiting grooves (213). The spin-drying assembly (2) further comprises bearings (26) sleeved on the support columns (22), and the support columns (22) are in contact with the cam turntable (3) through the bearings (26).
8. The wafer edge chuck spin mechanism of claim 1, wherein, The support column (22) penetrates the spin-dry disc (21), one end of which is used for clamping the wafer, and the other end of which is used for cooperating with the cam turntable (3).
9. The wafer edge chuck spin mechanism of claim 1, wherein, The support column (22) is provided with a clamping groove (221), and the wafer can be limited in the clamping groove (221).
10. The wafer edge chucking spin mechanism of claim 1, wherein, The spin-dry assembly (2), the cam turntable (3), the base (1) and the lifting assembly (5) are sequentially arranged in the vertical direction, and the output end of the lifting assembly (5) penetrates the base (1) to be connected with the cam turntable (3).