Wafer thickness detection machine

Abstract

The utility model discloses a wafer thickness detection machine, which belongs to the technical field of wafer thickness detection and comprises a machine body provided with a support. Through the arrangement of the placement structure, the arrangement of the linkage assembly in the placement seat and the arrangement of the arc-shaped hole in the placement plate, the wafer can be clamped by cooperating with the linkage assembly and the clamping rod, so that the wafer is ensured to have good stability in the rotation detection process, the falling condition is avoided, and the detection efficiency is improved. The linkage assembly is internally provided with a rotating shaft, a transmission gear, a torsion spring, a connecting shaft and rotating gears, in the wafer dismounting and mounting process, after one clamping rod is subjected to rotating receding, the corresponding rotating gear rotates on the connecting shaft, meanwhile, the transmission gear drives the remaining rotating gears to rotate, the effect of synchronous movement of all the clamping rods is achieved, and the wafer dismounting and mounting efficiency is improved. And under the action of the torsion spring, the transmission gear rotates along with the rotating shaft to drive all the rotating gears and the clamping rods to rotate and reset, so that rapid clamping of the wafer is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer thickness detection technical field, especially in kind wafer thickness detection platform. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, because its shape is circular, so it is called wafer. After wafer is produced, its thickness uniformity needs to be detected, so thickness detection platform is used. When the thickness uniformity of wafer is detected by using the thickness detection platform, the wafer is placed on the support seat, the laser detector is started to detect the thickness of wafer, the laser is emitted to the surface of wafer, and the thickness of wafer is calculated according to the time difference or phase change of reflected light.

[0003] In the existing thickness detection platform, the thickness uniformity of wafer needs to be detected, so multiple parts on the wafer are measured, in order to improve detection convenience, the wafer is usually arranged on the rotating turntable, and the rotating turntable is used to rotate and replace the detection point with the wafer. However, in the thickness detection platform, the rotating turntable is not provided with the structure of fixed clamping, the wafer is easy to fall off under the influence of centrifugal force in the rotating process, and then the normal detection work is affected. In the detection platform with the clamping function of the rotating turntable, the wafer cannot be clamped quickly, the operation convenience is poor, and the operation is time-consuming and laborious. UTILITY MODEL CONTENT

[0004] The utility model mainly aims at providing a wafer thickness detection platform, which can effectively solve the problems in the background art.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the technical scheme that

[0006] A wafer thickness detection platform, including platform main part, be equipped with support on the platform main part, and be installed with movable frame on the support, be fixed with laser detector on the movable frame, be equipped with placing structure on the platform main part, and the placing structure includes placing seat, placing plate, arc hole, linkage assembly and clamping rod, the placing seat is connected with the placing plate, the arc hole is opened on the placing plate, the linkage assembly is arranged in the inside of placing seat, and the linkage assembly is connected with the clamping rod.

[0007] Preferably, the platform main body is provided with a display screen, and the platform main body is provided with a function key, and the lower surface of the platform main body is fixed with a supporting leg.

[0008] Preferably, the support is provided with an end plate, and a lead screw connected with the end plate is arranged on the support, a servo motor is fixed on the support, and the servo motor is connected with the lead screw, and the movable frame is threadedly connected with the lead screw.

[0009] Preferably, the placing seat is fixedly connected with the placing plate, the arc-shaped holes are arranged in a ring array on the placing plate, the clamping rods are fixedly connected with the linkage assembly, and the clamping rods penetrate through the arc-shaped holes on the placing plate.

[0010] Preferably, the linkage assembly comprises a rotating shaft, a transmission gear, a torsion spring, a fixed column, a connecting shaft and a rotating gear, the rotating shaft is fixedly connected with the transmission gear, and the rotating shaft is rotatably arranged in the placing seat, the fixed column is fixedly arranged in the placing seat, the torsion spring is connected to the rotating shaft, and the end of the torsion spring is sleeved on the fixed column, the connecting shaft is fixedly arranged in the placing seat, and the rotating gear is rotatably connected to the connecting shaft and is in meshing connection with the transmission gear.

[0011] Compared with the prior art, the wafer thickness detection machine has the following beneficial effects: the placing structure is arranged in the placing seat, the arc-shaped holes are arranged on the placing plate, the linkage assembly and the clamping rods are used in cooperation, the wafer can be clamped, the wafer has good stability in the process of rotary detection, and the wafer is prevented from falling off, the rotating shaft, the transmission gear, the torsion spring, the connecting shaft and the rotating gear are arranged in the linkage assembly, one of the clamping rods is rotated and positioned, the corresponding rotating gear rotates on the connecting shaft, the remaining rotating gears rotate through the transmission gear, the synchronous movement effect of all the clamping rods is realized, under the action of the torsion spring, the transmission gear rotates with the rotating shaft, drives all the rotating gears and the clamping rods to rotate and reset, the wafer is quickly clamped, the structure is simple, and the operation is convenient. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a whole structure schematic view of the utility model;

[0013] Figure 2 It is a structure schematic view of the support of the utility model;

[0014] Figure 3 It is a structure schematic view of the placing structure of the utility model;

[0015] Figure 4 It is a structure schematic view of the linkage assembly of the utility model.

[0016] In the drawing: 1, machine main body; 2, support; 3, movable frame; 4, laser detector; 5, placing structure; 501, placing seat; 502, placing plate; 503, arc-shaped hole; 504, linkage assembly; 5041, rotating shaft; 5042, transmission gear; 5043, torsion spring; 5044, fixed column; 5045, connecting shaft; 5046, rotating gear; 505, clamping rod; 6, end plate; 7, screw rod; 8, servo motor; 9, display screen; 10, function key; 11, supporting leg. Detailed Implementation

[0017] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] like Figures 1-4 As shown, a wafer thickness inspection machine includes a main body 1, a support 2 on the main body 1, a movable frame 3 mounted on the support 2, a laser detector 4 fixed on the movable frame 3, and a placement structure 5 on the main body 1. The main body 1 has a display screen 9 and function keys 10, and a support leg 11 fixed to its lower surface. The support 2 has an end plate 6, a lead screw 7 connected to the end plate 6, a servo motor 8 fixed on the support 2, and the servo motor 8 connected to the lead screw 7. The movable frame 3 is threadedly connected to the lead screw 7.

[0019] When using a thickness inspection machine to inspect the uniformity of wafer thickness, the main body 1 of the machine is stably placed by the support legs 11, and the wafer is placed on the placement structure 5. The placement structure 5 clamps and fixes the wafer. The inspection machine is started by function key 10, the display screen 9 lights up, and the relevant parameters are set before inspection. During inspection, the placement structure 5 rotates with the wafer, and the laser detector 4 emits a laser beam that acts on the wafer. The wafer thickness is calculated based on the reflected laser beam. Simultaneously, the servo motor 8 on the support 2 can be started. The servo motor 8 rotates the lead screw 7 between the end plate 6 and the support 2. In the drive box of the lead screw 7, the movable frame 3 moves with the laser detector 4, which can realize the inspection of a larger area of ​​the wafer and improve the inspection accuracy. After the inspection is completed, the inspection machine is turned off and the wafer is removed.

[0020] According to the above implementation scheme, the placement structure 5 includes a placement base 501, a placement plate 502, an arc-shaped hole 503, a linkage component 504, and a clamping rod 505. The placement base 501 is connected to the placement plate 502. The arc-shaped hole 503 is formed on the placement plate 502. The linkage component 504 is disposed inside the placement base 501 and is connected to the clamping rod 505. The placement base 501 is fixedly connected to the placement plate 502. The arc-shaped holes 503 are distributed in a circular array on the placement plate 502. The clamping rod 505 is fixedly connected to the linkage component 504 and passes through the arc-shaped hole 503 on the placement plate 502.

[0021] The linkage assembly 504 comprises a rotating shaft 5041, a transmission gear 5042, a torsion spring 5043, a fixing column 5044, a connecting shaft 5045 and a rotating gear 5046, the rotating shaft 5041 is fixedly connected with the transmission gear 5042, and the rotating shaft 5041 is rotatably installed in the placing seat 501, the fixing column 5044 is fixed in the placing seat 501, the torsion spring 5043 is connected on the rotating shaft 5041, and the end of the torsion spring 5043 is sleeved on the fixing column 5044, the connecting shaft 5045 is fixed in the placing seat 501, and the rotating gear 5046 is rotatably connected on the connecting shaft 5045, and the rotating gear 5046 is meshingly connected with the transmission gear 5042.

[0022] When the wafer is placed and clamped, an acting force is directly applied to one of the clamping rods 505, the clamping rod 505 moves in the arc-shaped hole 503 on the placing plate 502 to give way, at this time, the rotating gear 5046 at the lower end of the clamping rod 505 rotates on the connecting shaft 5045, under the action of the rotating gear 5046, the transmission gear 5042 is forced to rotate through the rotating shaft 5041, so as to wind the torsion spring 5043 at the rotating shaft 5041 and the fixing column 5044, and under the driving of the transmission gear 5042, the remaining rotating gears 5046 rotate synchronously on the connecting shaft 5045, and then the remaining clamping rods 505 rotate synchronously, so as to realize the effect that all the clamping rods 505 are synchronously opened to give way. After the wafer is placed on the placing plate 502, the clamping rod 505 is loosened, under the action of the torsion spring 5043, the rotating shaft 5041 drives the transmission gear 5042 to rotate back to the original position, so as to drive the rotating gear 5046 and the clamping rod 505 to reset, until the clamping rod 505 abuts against the wafer, at this time, the clamping rod 505 clamps and fixes the wafer, and the detection machine is started to detect the thickness of the wafer. When the detection is completed, the clamping rod 505 is opened to give way according to the above process, and then the wafer is taken out.

[0023] It needs to be explained that through the setting of the placing structure 5, the linkage assembly 504 is arranged inside the placing seat 501, the arc-shaped hole 503 is arranged on the placing plate 502, and the linkage assembly 504 and the clamping rod 505 are used in cooperation, so that the wafer can be clamped, the wafer has good stability in the process of rotation detection, and the situation of falling off is avoided. The rotation shaft 5041, the transmission gear 5042, the torsion spring 5043, the connecting shaft 5045 and the rotation gear 5046 are arranged in the linkage assembly 504. In the process of disassembly and assembly of the wafer, one of the clamping rods 505 is rotated and positioned, the corresponding rotation gear 5046 rotates on the connecting shaft 5045, the transmission gear 5042 rotates with the remaining rotation gears 5046, the effect that all the clamping rods 505 move synchronously is realized, under the action of the torsion spring 5043, the transmission gear 5042 rotates with the rotation shaft 5041, drives all the rotation gears 5046 and the clamping rods 505 to rotate and reset, realizes the rapid clamping of the wafer, and the structure is simple and the operation convenience is high.

[0024] The above describes the use principle, characteristics and beneficial effects of the utility model. Related personnel in the art can understand from the above that the above does not limit the utility model, and the above embodiment and description describe the basic principle and characteristics of the utility model. On the premise of meeting the concept of the utility model, the utility model can also be variously changed and improved, and these improvements should fall within the scope of the utility model.

Claims

1. A wafer thickness inspection machine, comprising a machine body (1), a support (2) provided on the machine body (1), and a movable frame (3) mounted on the support (2), wherein a laser detector (4) is fixed on the movable frame (3), characterized in that: The machine body (1) is provided with a placing structure (5), and the placing structure (5) comprises a placing seat (501), a placing plate (502), an arc-shaped hole (503), a linkage assembly (504) and a clamping rod (505), the placing seat (501) is connected with the placing plate (502), the arc-shaped hole (503) is formed in the placing plate (502), the linkage assembly (504) is arranged in the placing seat (501), and the linkage assembly (504) is connected with the clamping rod (505).

2. The wafer thickness detection machine of claim 1, wherein: The machine body (1) is provided with a display screen (9), and the machine body (1) is provided with a function key (10), and the lower surface of the machine body (1) is fixedly provided with a supporting leg (11).

3. The wafer thickness inspection machine of claim 2, wherein: The bracket (2) is provided with an end plate (6), and the bracket (2) is provided with a lead screw (7) connected with the end plate (6), the bracket (2) is fixedly provided with a servo motor (8), and the servo motor (8) is connected with the lead screw (7), and the movable frame (3) is threadedly connected with the lead screw (7).

4. The wafer thickness inspection machine of claim 3, wherein: The placing seat (501) is fixedly connected with the placing plate (502), the arc-shaped holes (503) are arranged in an annular array on the placing plate (502), the clamping rod (505) is fixedly connected with the linkage assembly (504), and the clamping rod (505) penetrates through the arc-shaped holes (503) on the placing plate (502).

5. The wafer thickness inspection machine of claim 4, wherein: The linkage assembly (504) comprises a rotating shaft (5041), a transmission gear (5042), a torsion spring (5043), a fixed column (5044), a connecting shaft (5045) and a rotating gear (5046), the rotating shaft (5041) is fixedly connected with the transmission gear (5042), and the rotating shaft (5041) is rotatably installed in the placing seat (501), the fixed column (5044) is fixedly arranged in the placing seat (501), the torsion spring (5043) is connected with the rotating shaft (5041), and the end portion of the torsion spring (5043) is sleeved on the fixed column (5044), the connecting shaft (5045) is fixedly arranged in the placing seat (501), and the rotating gear (5046) is rotatably connected with the connecting shaft (5045), and the rotating gear (5046) is meshedly connected with the transmission gear (5042).

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