High-thermal-conductivity low-dielectric high-frequency cover film synthesizer

Abstract

The utility model relates to the technical field of cover film synthesis devices, and discloses a high-thermal-conductivity, low-dielectric and high-frequency cover film synthesis device, which solves the problems that after a high-thermal-conductivity, low-dielectric and high-frequency cover film is laminated on a substrate by the existing synthesis device, the laminated substrate is difficult to take out due to a small gap in a laminating template, and the laminating efficiency of the high-thermal-conductivity, low-dielectric and high-frequency cover film is influenced. The device comprises a working table, a lower die is arranged in the middle of the top of the working table, a mounting frame is fixedly mounted on one side of the top of the working table, a hydraulic cylinder is fixedly mounted on the top of the mounting frame, the output end of the hydraulic cylinder extends into the mounting frame and is fixedly provided with an upper die, and a supporting plate is arranged on the lower portion in the lower die; a supporting plate is fixedly installed on one side of the bottom in the workbench, and a motor is fixedly installed on one side of the supporting plate. According to the synthesis device, after the high-thermal-conductivity low-dielectric high-frequency covering film is laminated on the substrate, the laminated substrate can be taken out quickly and conveniently, and the synthesis device is very convenient to use.

Description

Technical Field

[0001] This utility model belongs to the technical field of cover film synthesis device, specifically a high thermal conductivity, low dielectric, high frequency cover film synthesis device. Background Technology

[0002] High thermal conductivity, low dielectric constant, high frequency cover film is a cover film material specifically designed for high-frequency, high-speed signal transmission. It combines high thermal conductivity, low dielectric constant, and low dielectric loss, meeting the high-performance material requirements of modern electronic devices. The high thermal conductivity, low dielectric constant, high frequency cover film synthesis device is a device specifically used for laminating high thermal conductivity, low dielectric constant, high frequency cover film. Its design and configuration are usually based on meeting the performance requirements of high frequency, high thermal conductivity, and low dielectric constant. It typically consists of two lamination templates that can press against each other to generate sufficient pressure to tightly bond the cover film to the substrate.

[0003] However, in existing synthesis devices, after pressing a high thermal conductivity, low dielectric, high frequency cover film onto a substrate, the small gap inside the pressing template makes it difficult to remove the pressed substrate, which is very inconvenient to use. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a high thermal conductivity, low dielectric high frequency cover film synthesis device, which effectively solves the problem that after the high thermal conductivity, low dielectric high frequency cover film is pressed onto the substrate, the small gap inside the pressing template makes it difficult to remove the pressed substrate, which is very inconvenient to use.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high thermal conductivity, low dielectric, high frequency coating film synthesis device, comprising a worktable, a lower mold provided in the middle of the top of the worktable, a mounting frame fixedly installed on one side of the top of the worktable, a hydraulic cylinder fixedly installed on the top of the mounting frame, the output end of the hydraulic cylinder extending into the interior of the mounting frame and fixedly installed with an upper mold, a support plate provided in the lower part of the interior of the lower mold, a support plate fixedly installed on one side of the bottom of the worktable, a motor fixedly installed on one side of the support plate, a transmission component provided at the output end of the motor, the transmission component being connected to the support plate in a transmission manner, when the motor is running, power is output to the support plate through the transmission component, causing the support plate to move upward and push the substrate to the outside of the lower mold.

[0006] Preferably, the transmission assembly includes a worm gear, which is fixedly installed at the output end of the motor. A positioning plate is rotatably installed at one end of the worm gear, and the bottom of the positioning plate is fixedly connected to the bottom of the worktable. A worm wheel is meshed with the upper part of the worm gear surface, and a first shaft is fixedly installed in the middle of the worm wheel. Two first bushings are rotatably installed on the surface of the first shaft, and the lower parts of the two first bushings are fixedly connected to the bottom of the worktable through mounting rods. First bevel gears are fixedly installed at both ends of the first shaft.

[0007] Preferably, a second bevel gear is meshed with one side of the surface of the first bevel gear, a second shaft is fixedly installed on one side of each of the two second bevel gears, a second bushing is rotatably installed on the surface of each second shaft, the bottom of each second bushing is fixedly connected to the inner bottom of the worktable through a fixed rod, a transmission bar is fixedly installed at one end of each of the two second shafts, a transmission pin is rotatably installed on the upper end of one side of each transmission bar, and a movable frame is movably sleeved on the surface of each of the two transmission pins.

[0008] Preferably, a first slider is fixedly installed at the bottom of each of the movable frames, a first groove is provided in the middle of the bottom of the workbench, two first sliders are slidably installed inside the first groove, a transmission rod is rotatably installed at the top of each of the two movable frames, a transmission block is rotatably installed between the tops of the two transmission rods, a top rod is fixedly installed at the top of the transmission block, the top of the top rod extends into the interior of the lower mold and is fixedly connected to the bottom of the pallet, a second slider is fixedly installed at both ends of the transmission block through a connecting rod, a second groove is provided on the inner walls of both sides of the workbench, and two second sliders are slidably installed inside the two second grooves.

[0009] Compared with the prior art, the beneficial effects of this utility model are as follows: In use, the operator places the substrate and the high thermal conductivity, low dielectric, high frequency cover film in the lower mold, and then the operator starts the hydraulic cylinder on the mounting frame to drive the upper mold to move down. When the upper mold moves down, it will press the substrate and the high thermal conductivity, low dielectric, high frequency cover film together. After the pressing is completed, the operator starts the motor to drive the worm gear to rotate along the positioning plate. When the worm gear rotates, it drives the first shaft to rotate along the inside of the two first shaft sleeves through the worm wheel. At the same time, the rotation of the first shaft drives the two second bevel gears to rotate through the two first bevel gears.

[0010] When the two second bevel gears rotate, they drive the second shaft to rotate along the inside of the two second bushings. When the two second shafts rotate, they drive the transmission pin to move inside the two moving frames through the transmission bar. As the two moving frames move towards each other, the first slider slides along the inside of the first slide groove, increasing the stability of the two moving frames. When the two moving frames move towards each other, the transmission block is pushed upward through the two transmission rods. When the transmission block moves upward, the operator drives the two second sliders to slide along the inside of the two second slide grooves through the two connecting rods, increasing the stability of the transmission block. When the transmission block moves upward, the push rod drives the pallet to move upward, thereby pushing the substrate out of the lower mold. This allows the high thermal conductivity, low dielectric, high frequency cover film to be pressed onto the substrate quickly and easily, making it very convenient to use. Attached Figure Description

[0011] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0012] In the attached diagram:

[0013] Figure 1 This is a schematic diagram of the structure of the high thermal conductivity, low dielectric, high frequency coating film synthesis device of this utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of the main body of the device of this utility model. Figure 1 ;

[0015] Figure 3 This is a schematic diagram of the internal structure of the main body of the device of this utility model. Figure 2 ;

[0016] In the diagram: 1. Workbench; 2. Lower mold; 3. Mounting frame; 4. Hydraulic cylinder; 5. Upper mold; 6. Support plate; 7. Support plate; 8. Motor; 9. Worm gear; 10. Positioning plate; 11. Worm wheel; 12. First shaft; 13. First bushing; 14. First bevel gear; 15. Second bevel gear; 16. Second shaft; 17. Second bushing; 18. Fixed rod; 19. Transmission bar; 20. Transmission pin; 21. Moving frame; 22. First slider; 23. First slide groove; 24. Transmission rod; 25. Transmission block; 26. Push rod; 27. Connecting rod; 28. Second slider; 29. ​​Second slide groove. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0018] Depend on Figures 1 to 3 The present invention includes a workbench 1, a lower mold 2 at the center of the top of the workbench 1, a mounting frame 3 fixedly installed on one side of the top of the workbench 1, a hydraulic cylinder 4 fixedly installed on the top of the mounting frame 3, the output end of the hydraulic cylinder 4 extending into the interior of the mounting frame 3 and fixedly installed with an upper mold 5, a support plate 6 at the lower part of the interior of the lower mold 2, a support plate 7 fixedly installed on one side of the bottom of the workbench 1, a motor 8 fixedly installed on one side of the support plate 7, a transmission assembly at the output end of the motor 8, the transmission assembly being connected to the support plate 6, and when the motor 8 is running, power is output to the support plate 6 through the transmission assembly, causing the support plate 6 to move upward and push the base plate to the outside of the lower mold 2.

[0019] In use, the operator places the substrate and the high thermal conductivity, low dielectric, high frequency cover film in the lower mold 2. Then, the operator activates the hydraulic cylinder 4 on the mounting frame 3 to move the upper mold 5 downward. When the upper mold 5 moves downward, it presses the substrate and the high thermal conductivity, low dielectric, high frequency cover film together. After the pressing is completed, the operator starts the motor 8 to drive the transmission component. When the transmission component moves, it moves the support plate 6 upward, thereby pushing the substrate out of the lower mold 2. This allows the synthesis device to quickly and easily remove the pressed substrate after pressing the high thermal conductivity, low dielectric, high frequency cover film onto the substrate, making it very convenient to use.

[0020] The transmission assembly includes a worm gear 9, which is fixedly installed at the output end of a motor 8. A positioning plate 10 is rotatably mounted on one end of the worm gear 9, and the bottom of the positioning plate 10 is fixedly connected to the inner bottom of the worktable 1. A worm wheel 11 is meshed with the upper part of the surface of the worm gear 9, and a first shaft 12 is fixedly mounted in the middle of the worm wheel 11. Two first bushings 13 are rotatably mounted on the surface of the first shaft 12, and the lower parts of the two first bushings 13 are fixedly connected to the inner bottom of the worktable 1 via mounting rods. First bevel gears 14 are fixedly mounted on both ends of the first shaft 12. Second bevel gears 15 are meshed with one side of the surface of each of the first bevel gears 14, and second shafts 16 are fixedly mounted on one side of each of the two second bevel gears 15. Second bushings 17 are rotatably mounted on the surface of each of the second shafts 16, and the bottoms of the second bushings 17 are fixedly connected to the inner bottom of the worktable 1 via fixing rods 18. One end of each of the two worktables is fixedly mounted with a transmission bar 19. The upper end of one side of each transmission bar 19 is rotatably mounted with a transmission pin 20. The surfaces of the two transmission pins 20 are movably sleeved with a movable frame 21. The bottom of each movable frame 21 is fixedly mounted with a first slider 22. The middle of the bottom of the worktable 1 is provided with a first groove 23. The two first sliders 22 are slidably mounted inside the first groove 23. The top of each of the two movable frames 21 is rotatably mounted with a transmission rod 24. The top of the two transmission rods 24 is rotatably mounted with a transmission block 25. The top of the transmission block 25 is fixedly mounted with a top rod 26. The top of the top rod 26 extends into the interior of the lower mold 2 and is fixedly connected to the bottom of the support plate 6. The two ends of the transmission block 25 are fixedly mounted with second sliders 28 through connecting rods 27. The inner walls of both sides of the worktable 1 are provided with second grooves 29. The two second sliders 28 are slidably mounted inside the two second grooves 29.

[0021] After the pressing process is completed, the operator starts the motor 8, which drives the worm gear 9 to rotate along the positioning plate 10. When the worm gear 9 rotates, it drives the first shaft 12 to rotate along the inside of the two first bushings 13 via the worm wheel 11. At the same time, the rotation of the first shaft 12 drives the two second bevel gears 15 to rotate via the two first bevel gears 14. When the two second bevel gears 15 rotate, they both drive the second shaft 16 to rotate along the inside of the two second bushings 17. When the two second shafts 16 rotate, they both drive the transmission pins 20 to move inside the two moving frames 21 via the transmission bar 19, thereby driving the two moving frames. When the two moving frames 21 move towards each other, the first slider 22 slides along the inside of the first slide groove 23, which increases the stability of the two moving frames 21 when they move. When the two moving frames 21 move towards each other, the transmission block 25 is pushed up by the two transmission rods 24. When the transmission block 25 moves up, the operator drives the two second sliders 28 to slide along the inside of the two second slide grooves 29 by the two connecting rods 27, which increases the stability of the transmission block 25 when it moves. When the transmission block 25 moves up, the support plate 6 is driven up by the top rod 26, so that the substrate can be pushed out of the lower mold 2.

Claims

1. A high thermal conductivity, low dielectric, high frequency capping film synthesis apparatus, comprising a worktable (1), characterized in that: The workbench (1) has a lower mold (2) in the middle of the top. A mounting frame (3) is fixedly installed on one side of the top of the workbench (1). A hydraulic cylinder (4) is fixedly installed on the top of the mounting frame (3). The output end of the hydraulic cylinder (4) extends into the interior of the mounting frame (3) and is fixedly installed with an upper mold (5). A support plate (6) is provided in the lower part of the interior of the lower mold (2). A support plate (7) is fixedly installed on one side of the bottom of the workbench (1). A motor (8) is fixedly installed on one side of the support plate (7). A transmission component is provided at the output end of the motor (8). The transmission component is connected to the support plate (6). When the motor (8) is running, it outputs power to the support plate (6) through the transmission component, causing the support plate (6) to move upward and push the base plate to the outside of the lower mold (2).

2. The apparatus for synthesizing a high thermal conductivity, low dielectric, high frequency capping film according to claim 1, characterized in that: The transmission assembly includes a worm (9), which is fixedly installed at the output end of the motor (8). A positioning plate (10) is rotatably installed at one end of the worm (9). The bottom of the positioning plate (10) is fixedly connected to the bottom of the workbench (1). A worm wheel (11) is meshed with the upper part of the surface of the worm (9). A first shaft (12) is fixedly installed in the middle of the worm wheel (11). Two first bushings (13) are rotatably installed on the surface of the first shaft (12). The lower parts of the two first bushings (13) are fixedly connected to the bottom of the workbench (1) through mounting rods. A first bevel gear (14) is fixedly installed at both ends of the first shaft (12).

3. The apparatus for synthesizing a high thermal conductivity, low dielectric, high frequency capping film according to claim 2, characterized in that: One side of the surface of the first bevel gear (14) is meshed with a second bevel gear (15). One side of each of the two second bevel gears (15) is fixedly mounted with a second shaft (16). The surface of each second shaft (16) is rotatably mounted with a second bushing (17). The bottom of each second bushing (17) is fixedly connected to the inner bottom of the workbench (1) through a fixing rod (18). One end of each of the two second shafts (16) is fixedly mounted with a transmission bar (19). The upper end of one side of each transmission bar (19) is rotatably mounted with a transmission pin (20). The surface of each of the two transmission pins (20) is movably sleeved with a movable frame (21).

4. The apparatus for synthesizing a high thermal conductivity, low dielectric, high frequency capping film according to claim 3, characterized in that: The bottom of each movable frame (21) is fixedly equipped with a first slider (22). The middle of the bottom of the workbench (1) is provided with a first groove (23). The two first sliders (22) are slidably installed inside the first groove (23). The top of each of the two movable frames (21) is rotatably equipped with a transmission rod (24). The top of the two transmission rods (24) is rotatably installed between the tops of the two transmission rods (24). The top of the transmission block (25) is fixedly equipped with a top rod (26). The top of the top rod (26) extends into the interior of the lower mold (2) and is fixedly connected to the bottom of the tray (6). The two ends of the transmission block (25) are fixedly equipped with second sliders (28) through connecting rods (27). The inner walls of both sides of the workbench (1) are provided with second grooves (29). The two second sliders (28) are slidably installed inside the two second grooves (29).

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