IDC machine room server heat dissipation integrated device

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to an IDC machine room server heat dissipation integrated device. According to the technical scheme, the heat dissipation device comprises a cabinet and a heat dissipation module installed on the back of the cabinet, the heat dissipation module comprises a flow guide block, the flow guide block is provided with a circulation hole communicated with the interior of the cabinet, and the heat dissipation module further comprises a sealing assembly for sealing the two sides of the flow guide block and a driving assembly for driving the flow guide block to ascend and descend. Air flow generated by the heat dissipation module is discharged into the cabinet through the circulation holes. According to the utility model, airflow can enter the cabinet from each height of the cabinet, so that uniform heat dissipation can be carried out on each height in the cabinet, the problem that the heat dissipation effect of a server close to the upper part in the cabinet is poor is avoided, the output power of the fan does not need to be increased, a proper amount of air enters the cabinet body, and the heat dissipation efficiency is improved. Therefore, the whole cabinet can be cooled, and energy conservation is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to an integrated heat dissipation device for IDC server rooms. Background Technology

[0002] The background technology of integrated server cooling devices for IDC (Internet Data Center) data centers relates to the heat dissipation problem. IDCs provide large-scale, high-quality, secure, and reliable server hosting services to internet content providers, enterprises, media, and various websites. Due to the massive amounts of data processed within IDC data centers, server racks easily generate significant heat. Failure to cool them quickly and effectively will affect the stable operation of components within the racks, potentially leading to substantial losses. Existing IDC server racks are typically arranged side-by-side on the ground, with no ventilation or heat dissipation at the bottom, making heat dissipation difficult and lacking necessary cooling devices.

[0003] Existing cooling systems typically use fans at the bottom to blow air towards the bottom of the cabinet. The air exchanges heat with the servers as it passes over them, and the exhausted air is then discharged through the top. However, if multiple servers are installed sequentially from bottom to top inside the cabinet, the air entering the bottom will first exchange heat with the servers at the bottom, and then gradually rise to exchange heat with the servers above. This causes the temperature of the rising air to gradually increase, resulting in poor cooling for the servers above. To prevent this, the output power of the fans needs to be increased to allow excessive airflow into the cabinet, thus avoiding poor cooling for the servers above. However, this method increases the power consumption of the fans, which is not energy-efficient. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing an integrated heat dissipation device for IDC server rooms.

[0005] The technical solution of this utility model: An integrated heat dissipation device for IDC server rooms, including a server rack, and further comprising:

[0006] The heat dissipation module installed on the back of the server rack includes a flow guide block with a flow hole communicating with the inside of the server rack. The heat dissipation module also includes a sealing component for sealing both sides of the flow guide block and a drive component for driving the flow guide block to move up and down. The heat dissipation module generates airflow that is discharged into the inside of the server rack through the flow hole.

[0007] Optionally, the heat dissipation module further includes a mounting box fixedly installed on the rack, a fan fixedly installed on one side of the mounting box, and the air guide block slidably installed inside the mounting box.

[0008] Optionally, the sealing assembly includes a telescopic plate fixedly mounted on the guide block, with the other end of the telescopic plate fixedly connected to the mounting box.

[0009] Optionally, the drive assembly includes a reciprocating lead screw rotatably mounted in a mounting box, a motor fixedly mounted on the mounting box, and the output shaft of the motor being coaxially and fixedly connected to the reciprocating lead screw.

[0010] Optionally, a side sealing plate is fixedly installed on one side of the mounting box, and the side sealing plate is provided with multiple air holes. The sealing assembly divides the interior of the mounting box into an air inlet chamber and an air outlet chamber.

[0011] Optionally, an air pipe is fixedly installed at the air inlet end of the fan, and the other end of the air pipe is connected to the top of the cabinet.

[0012] Optionally, a water-cooled box is fixedly installed on the air pipe, and an inlet and an outlet are respectively provided on both sides of the water-cooled box. The inlet and outlet are connected to a water pump assembly through water pipes.

[0013] Optionally, the gas pipe is provided with a threaded vortex tube, which is located inside the water-cooled box.

[0014] In summary, this application includes at least one of the following beneficial technical effects:

[0015] This invention allows airflow to enter the cabinet from all heights, thus providing uniform heat dissipation throughout the cabinet. It avoids the problem of poor heat dissipation for servers near the top of the cabinet, and eliminates the need to increase the output power of the fan. By allowing an appropriate amount of air to enter the cabinet, it can dissipate heat for the entire cabinet, which is beneficial for energy saving. Attached Figure Description

[0016] Figure 1 The structural schematic diagram of the cabinet of this utility model is given. Figure 1 ;

[0017] Figure 2 The structural schematic diagram of the cabinet of this utility model is given. Figure 2 ;

[0018] Figure 3 This is a schematic diagram of the heat dissipation module.

[0019] Figure 4 This is a structural schematic diagram of the telescopic plate;

[0020] Figure 5 This is a schematic diagram of a vortex tube.

[0021] Figure 6 This is a schematic diagram of the pore structure.

[0022] Reference numerals: 1. Cabinet; 2. Heat dissipation module; 201. Mounting box; 202. Fan; 203. Guide block; 204. Flow hole; 205. Side sealing plate; 206. Telescopic plate; 207. Air inlet chamber; 208. Air outlet chamber; 209. Reciprocating lead screw; 210. Motor; 211. Air vent; 3. Air pipe; 301. Scroll tube; 4. Water cooling box; 401. Input port; 402. Output port. Detailed Implementation

[0023] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] like Figures 1 to 6 As shown, this utility model proposes an integrated server cooling device for IDC data centers, including a server rack 1 for mounting, supporting, and protecting servers. The rack 1 also includes a cooling module 2 installed on the back of the rack 1, which dissipates heat from the interior of the rack 1. The cooling module 2 includes a guide block 203 with a flow hole 204 communicating with the interior of the rack 1. The cooling module 2 also includes a sealing component for sealing both sides of the guide block 203 and a driving component for raising and lowering the guide block 203. Airflow generated by the cooling module 2 is discharged into the rack 1 through the flow hole 204. Because the airflow generated by the cooling module 2 enters the rack 1 through the flow hole 204, and the lifting component allows the flow hole 204 to periodically move at various heights within the rack 1, airflow can enter the rack 1 from various heights, resulting in uniform heat dissipation throughout the rack 1 and preventing poor heat dissipation for servers near the top of the rack.

[0025] Furthermore, the heat dissipation module 2 also includes a mounting box 201 fixedly installed on the cabinet 1. A fan 202 is fixedly installed on one side of the mounting box 201, and a guide block 203 is slidably installed inside the mounting box 201. Airflow is generated by the fan 202. The sealing assembly includes a telescopic plate 206 fixedly installed on the guide block 203, and the other end of the telescopic plate 206 is fixedly connected to the mounting box 201. The telescopic plate 206 can extend or retract as the guide block 203 rises and falls, ensuring the sealing of both sides of the guide block 203. A side sealing plate 205 is fixedly installed on one side of the mounting box 201. The side sealing plate 205 has multiple air holes 211. The sealing assembly divides the interior of the mounting box 201 into an air inlet chamber 207 and an air outlet chamber 208. The airflow generated by the fan 202 first enters the air inlet chamber 207. Under the action of air pressure, the gas inside the air inlet chamber 207 enters the air outlet chamber 208 through the flow hole 204, and then enters the cabinet 1 through the air hole 211 near the flow hole 204.

[0026] The drive assembly includes a reciprocating lead screw 209 rotatably mounted inside a mounting box 201. A motor 210 is fixedly mounted on the mounting box 201, and the output shaft of the motor 210 is coaxially and fixedly connected to the reciprocating lead screw 209. The motor 210 drives the reciprocating lead screw 209 to rotate, and the rotating reciprocating lead screw 209 drives the guide block 203 to perform reciprocating lifting and lowering motion.

[0027] In this embodiment, an air pipe 3 is fixedly installed at the air inlet end of the fan 202, and the other end of the air pipe 3 is connected to the top of the cabinet 1. The air pipe 3 allows the gas to circulate internally inside the cabinet 1, preventing external dust from entering the cabinet 1. A water-cooled box 4 is fixedly installed on the air pipe 3. The water-cooled box 4 has an inlet 401 and an outlet 402 on both sides, and the inlet 401 and outlet 402 are connected to a water pump assembly via water pipes. The water pump assembly continuously supplies cool water to the water-cooled box 4 and extracts the hot water after heat exchange with the hot air, thus continuously dissipating heat from the gas after heat exchange, preventing the gas from overheating and ensuring that the temperature inside the cabinet 1 does not become too high (the water pump assembly is prior art and will not be described in detail here).

[0028] The gas pipe 3 is equipped with a threaded vortex tube 301, which is located inside the water-cooled box 4. By setting the vortex tube 301, the contact area between the gas pipe 3 and the water inside the water-cooled box 4 can be increased, thereby accelerating the heat exchange efficiency between the cold water and the hot air inside the gas pipe 3.

[0029] In this embodiment, the airflow generated by the fan 202 first enters the intake chamber 207. Under the action of air pressure, the gas inside the intake chamber 207 enters the exhaust chamber 208 through the flow hole 204, and then enters the cabinet 1 through the air hole 211 near the flow hole 204. The motor 210 drives the reciprocating screw 209 to rotate, and the rotating reciprocating screw 209 drives the guide block 203 to reciprocate and move up and down. This allows the flow hole 204 to move periodically at various heights inside the cabinet 1, thereby allowing airflow to enter the cabinet 1 from various heights. This ensures uniform heat dissipation at various heights within the cabinet 1, preventing the problem of poor heat dissipation for servers near the top of the cabinet.

[0030] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. An IDC machine room server heat dissipation integrated device, comprising a cabinet (1), characterized in that, Also include: The heat dissipation module (2) installed on the back of the cabinet (1), the heat dissipation module (2) includes flow block (203), the flow block (203) is provided with flow hole (204) communicated with the inside of the cabinet (1), the heat dissipation module (2) further includes sealing assembly sealed to both sides of flow block (203) and drive assembly for driving flow block (203) to lift, the heat dissipation module (2) generates airflow through flow hole (204) and discharges to the inside of the cabinet (1).

2. The IDC machine room server heat dissipation integrated device according to claim 1, characterized in that, The heat dissipation module (2) further includes mounting box (201) fixedly installed on the cabinet (1), one side of the mounting box (201) is fixedly installed with fan (202), and the flow block (203) is slidably installed in the mounting box (201).

3. The IDC machine room server heat dissipation integrated device according to claim 2, characterized in that, The sealing assembly includes an expansion plate (206) fixedly installed on the flow block (203), and the other end of the expansion plate (206) is fixedly connected with the mounting box (201).

4. The IDC machine room server heat dissipation integrated device according to claim 3, characterized in that, The drive assembly includes a reciprocating screw rod (209) rotatably installed in the mounting box (201), and a motor (210) is fixedly installed on the mounting box (201), and the output shaft of the motor (210) is coaxially fixedly connected with the reciprocating screw rod (209).

5. The IDC machine room server heat dissipation integrated device according to claim 4, characterized in that, One side of the mounting box (201) is fixedly installed with side sealing plate (205), and a plurality of air holes (211) are formed in the side sealing plate (205), and the sealing assembly divides the mounting box (201) into air inlet cavity (207) and air outlet cavity (208).

6. The IDC machine room server heat dissipation integrated device according to claim 5, characterized in that, The air inlet end of the fan (202) is fixedly installed with air pipe (3), and the other end of the air pipe (3) is communicated with the top of the cabinet (1).

7. The IDC machine room server heat dissipation integrated device according to claim 6, characterized in that, The air pipe (3) is fixedly installed with a water cooling box (4) on the top, and the water cooling box (4) is provided with an input port (401) and an output port (402) on both sides, respectively, and the input port (401) and the output port (402) are connected with a water pump assembly through a water pipe.

8. The IDC machine room server heat dissipation integrated device according to claim 7, characterized in that, The air pipe (3) is provided with a threaded spiral pipe (301), and the spiral pipe (301) is located in the water cooling box (4).

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