Stable adsorption device for SMT (Surface Mount Technology)

Abstract

The utility model relates to the technical field of SMT (Surface Mount Technology), and particularly discloses a stable adsorption device for SMT. Comprising a negative pressure main body for generating negative pressure, a first adsorption assembly integrally formed with the negative pressure main body and communicated with the negative pressure main body, a second adsorption assembly detachably connected with the negative pressure main body, and a first stabilizing assembly and a second stabilizing assembly which are detachably connected to the first adsorption assembly and the second adsorption assembly correspondingly and used for improving the negative pressure stability. The negative pressure action range of the second adsorption assembly is larger than that of the first adsorption assembly. The device solves the problem that a traditional adsorption device used for adsorbing surface-mounted components of the chip mounter cannot achieve stable adsorption.

Description

Technical Field

[0001] This application relates to the field of SMT (Surface Mount Technology) technology, and specifically discloses a stable adsorption device for SMT assembly. Background Technology

[0002] SMT (Surface Mount Technology) is an advanced electronic manufacturing technology with significant advantages and broad application prospects. With continuous technological advancements, SMT technology will continue to improve and refine, providing more efficient, reliable, and flexible solutions for electronic product manufacturing.

[0003] SMT is an abbreviation for Surface Mount Technology, which is one of the most widely used technologies and processes in the electronics assembly industry. It involves mounting surface mount components (SMC / SMD, also known as chip components) without leads or with short leads onto the surface of a printed circuit board (PCB) or other substrates, and then assembling them by methods such as reflow soldering or dip soldering.

[0004] Among them, the pick-and-place machine is the most critical technical equipment. The pick-and-place machine accurately mounts various surface mount components (SMD) onto the PCB pads through functions such as pick-up, displacement, positioning, and placement. Specifically, it first uses a vacuum pen or robotic arm to pick up electronic components, then moves them to the designated position on the PCB, and finally places and fixes the components on the pads.

[0005] Vacuum suction pens are essentially stable adsorption devices that adsorb surface-mount components. The principle of vacuum suction pens is mainly based on the pressure difference generated by negative pressure adsorption to adsorb surface-mount components.

[0006] The current problems with stable adsorption devices used for SMT assembly include:

[0007] Since surface mount components vary in size, and current stable adsorption devices have a fixed negative pressure area, they cannot stably adsorb larger surface mount components. Therefore, this invention provides a stable adsorption device for SMT assembly to solve the above problems. Utility Model Content

[0008] The purpose of this invention is to solve the problem that traditional adsorption devices used for surface mount components in pick-and-place machines cannot achieve stable adsorption.

[0009] To achieve the above objectives, this utility model provides the following basic solution:

[0010] A stable adsorption device for SMT chip mounting includes a negative pressure body that generates negative pressure, a first adsorption component integrally formed with and connected to the negative pressure body, a second adsorption component detachably connected to the negative pressure body, and a first stabilizing component and a second stabilizing component detachably connected to the first adsorption component and the second adsorption component, respectively, for increasing the stability of the negative pressure. The negative pressure range of the second adsorption component is greater than that of the first adsorption component.

[0011] Furthermore, the negative pressure body includes a negative pressure cylinder and a connecting cylinder disposed away from the first adsorption component, and the other end of the connecting cylinder is connected to a vacuum pump.

[0012] Furthermore, the first adsorption component includes a connecting ring block integrally formed with the negative pressure body and a slot on the end face of the connecting ring block, and the first stabilizing component engages with the slot.

[0013] Furthermore, the first stabilizing component is a ring cylinder that engages with the slot. The ring cylinder includes a first ring post, a contact surface fixed to the first ring post, and a rubber surface disposed on the contact surface. The contact surface and the rubber surface are flush.

[0014] Furthermore, the second adsorption component includes an external thread on the outer periphery of the connecting ring block, an internal threaded cylinder threadedly connected to the connecting ring block, and a stabilizing cylinder fixedly connected to the internal threaded cylinder, wherein the size of the stabilizing cylinder is larger than the size of the connecting ring block.

[0015] Furthermore, the second stabilizing component includes a second annular post that engages with the end face of the stabilizing cylinder, a groove on the second annular post, a covering surface fixed to the second annular post, and a stabilizing surface disposed on the covering surface, wherein the covering surface and the stabilizing surface are flush.

[0016] Furthermore, the covering surface and the contact surface are made of the same material, and the rubber surface and the stabilizing surface are made of the same material, both being rubber.

[0017] The principle and effect of this solution are as follows:

[0018] 1. Compared with the prior art, the present invention is provided with a first adsorption component and a second adsorption component, which are detachably connected. The first adsorption component and the second adsorption component are different in size. Based on the different sizes of the first adsorption component and the second adsorption component, different surface mount components can be adsorbed. The adsorption of surface mount components is more stable by the negative pressure range.

[0019] 2. Compared with the prior art, this utility model integrates the first adsorption component with the negative pressure body, thereby using the first adsorption component to adsorb most of the surface mount components. After the first adsorption component and the second adsorption component are detachably connected, the second adsorption component is used to adsorb large-sized surface mount components, thus achieving full adsorption of most surface mount components.

[0020] 3. Compared with the prior art, this device improves the stability of adsorption by setting a first stabilizing component and a second stabilizing component on the first adsorption component and the second adsorption component. The first stabilizing component and the second stabilizing component have similar structures and use the same principle. They both use snap-fit ​​with their respective first adsorption components and second adsorption components. After snap-fit, the surface mount components contact their respective first stabilizing components and second stabilizing components. The contact position is improved by setting a contact element, which can improve the contact strength between the surface mount components and their respective first stabilizing components and second stabilizing components, thereby improving the contact adsorption stability. This ultimately solves the problem that traditional adsorption devices used for adsorbing surface mount components in pick-and-place machines cannot achieve stable adsorption. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of a stable adsorption device for SMT chip mounting according to an embodiment of this application is shown.

[0023] Figure 2 This paper shows a schematic diagram of the position of the slot in a stable adsorption device for SMT chip mounting according to an embodiment of this application;

[0024] Figure 3 This paper shows a schematic diagram of the structure of the first stabilizing component in a stabilizing adsorption device for SMT chip mounting according to an embodiment of this application.

[0025] Figure 4 A schematic diagram of the second stabilizing component in a stabilizing adsorption device for SMT chip mounting according to an embodiment of this application is shown. Detailed Implementation

[0026] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0027] The reference numerals in the accompanying drawings include: negative pressure cylinder 1, connecting cylinder 2, connecting ring block 3, external thread 4, groove 5, internal thread cylinder 6, stabilizing cylinder 7, first stabilizing component 8, first ring post 801, contact surface 802, contact surface 803, second stabilizing component 9, second ring post 901, groove 902, covering surface 903, and stabilizing surface 904.

[0028] Implementation, for example Figures 1-4 As shown:

[0029] A stable adsorption device for SMT chip mounting includes a negative pressure body that generates negative pressure, a first adsorption component integrally formed with and connected to the negative pressure body, a second adsorption component detachably connected to the negative pressure body, and a first stabilizing component 8 and a second stabilizing component 9 detachably connected to the first adsorption component and the second adsorption component, respectively, for increasing the stability of the negative pressure. The negative pressure range of the second adsorption component is greater than that of the first adsorption component.

[0030] Regarding the negative pressure body, this device still uses the negative pressure principle to achieve adsorption. Therefore, the negative pressure body includes a negative pressure cylinder 1 and a connecting cylinder 2 located away from the first adsorption component in the negative pressure cylinder 1. The other end of the connecting cylinder 2 is connected to a vacuum pump. The vacuum pump generates a negative pressure difference, thereby achieving the adsorption of surface-mount components through the negative pressure body.

[0031] To further improve the stability of adsorption:

[0032] This device is equipped with a first adsorption component and a first stabilizing component 8:

[0033] Regarding the first adsorption component: The first adsorption component includes a connecting ring block 3 integrally formed with the negative pressure body and a slot 5 opened on the end face of the connecting ring block 3, and the first stabilizing component 8 is engaged with the slot 5.

[0034] When the first stabilizing component 8 is not used, a negative pressure difference is generated from the end face of the connecting ring block 3, and surface mount components are adsorbed onto the end face of the connecting ring block 3. When the first stabilizing component 8 is used, it indicates that a better stabilizing adsorption effect is required. Regarding the first stabilizing component 8:

[0035] The first stabilizing component 8 is a ring cylinder that engages with the slot 5. The ring cylinder includes a first ring post 801, a contact surface 802 fixedly connected to the first ring post 801, and a rubber surface disposed on the contact surface 802. The contact surface 802 and the rubber surface are flush.

[0036] Specifically:

[0037] The ring cylinder is engaged with the slot 5, and then the negative pressure difference is transferred from the end face of the connecting ring block 3 to the contact surface 802. At this time, the contact surface 802 is in contact with the surface mount components. In order to improve the contact effect between the two, a rubber surface is provided on the contact surface 802. The rubber surface can improve the sealing effect between the two, thereby further improving the adsorption stability.

[0038] Because surface mount components vary in size, a larger second adsorption assembly was incorporated. Details of the second adsorption assembly are as follows:

[0039] The second adsorption assembly includes an external thread 4 on the outer periphery of the connecting ring block 3, an internal threaded cylinder 6 threadedly connected to the connecting ring block 3, and a stabilizing cylinder 7 fixedly connected to the internal threaded cylinder 6. The size of the stabilizing cylinder 7 is larger than the size of the connecting ring block 3.

[0040] Specifically: After the internal threaded cylinder 6 is threadedly connected to the connecting ring block 3, the negative pressure difference is transferred from the end face of the connecting ring block 3 to the internal threaded cylinder 6. Since the internal threaded cylinder 6 is fixedly connected to the stabilizing cylinder 7, the negative pressure is transferred to the stabilizing cylinder 7 at this time.

[0041] To enhance the adsorption stability of the stabilizing cylinder 7, this device is also equipped with a second stabilizing component 9;

[0042] Regarding the second stabilizing component 9: it includes a second ring post 901 that is snapped into the end face of the stabilizing cylinder 7, a groove 902 opened on the second ring post 901, a covering surface 903 fixedly connected to the second ring post 901, and a stabilizing surface 904 disposed on the covering surface 903, wherein the covering surface 903 and the stabilizing surface 904 are flush.

[0043] The second ring post 901 is snapped onto the end face of the stabilizing cylinder 7 through the groove 902, and then the covering surface 903 and the stabilizing surface 904 provided on the covering surface 903 come into contact with the surface mount components. The stabilizing surface 904 improves the sealing effect when in contact with the surface mount components.

[0044] For ease of control and manufacturing, the covering surface 903 is made of the same material as the contact surface 802, and the rubber surface is made of the same material as the stabilizing surface 904, both being rubber.

[0045] This device solves the problem that traditional adsorption devices used in pick-and-place machines cannot achieve stable adsorption.

[0046] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A stable adsorption device for SMT chip mounting, characterized in that, It includes a negative pressure body that generates negative pressure, a first adsorption component integrally formed with and connected to the negative pressure body, a second adsorption component that is detachably connected to it, and a first stabilizing component and a second stabilizing component that are detachably connected to the first adsorption component and the second adsorption component, respectively, for increasing the stability of negative pressure. The negative pressure range of the second adsorption component is greater than that of the first adsorption component.

2. The stable adsorption device for SMT chip mounting according to claim 1, characterized in that, The negative pressure body includes a negative pressure cylinder and a connecting cylinder disposed away from the first adsorption component. The other end of the connecting cylinder is connected to a vacuum pump.

3. The stable adsorption device for SMT chip mounting according to claim 1, characterized in that, The first adsorption component includes a connecting ring block integrally formed with the negative pressure body and a slot on the end face of the connecting ring block, and the first stabilizing component engages with the slot.

4. The stable adsorption device for SMT chip mounting according to claim 3, characterized in that, The first stabilizing component is a ring cylinder that engages with the slot. The ring cylinder includes a first ring post, a contact surface fixed to the first ring post, and a rubber surface disposed on the contact surface. The contact surface and the rubber surface are flush.

5. A stable adsorption device for SMT chip mounting according to claim 4, characterized in that, The second adsorption component includes an external thread on the outer periphery of the connecting ring block, an internal threaded cylinder threaded to the connecting ring block, and a stabilizing cylinder fixed to the internal threaded cylinder. The size of the stabilizing cylinder is larger than the size of the connecting ring block.

6. A stable adsorption device for SMT chip mounting according to claim 5, characterized in that, The second stabilizing component includes a second annular post that engages with the end face of the stabilizing cylinder, a groove on the second annular post, a covering surface fixed to the second annular post, and a stabilizing surface disposed on the covering surface, wherein the covering surface and the stabilizing surface are flush.

7. A stable adsorption device for SMT chip mounting according to claim 6, characterized in that, The covering surface and the contact surface are made of the same material, and the rubber surface and the stabilizing surface are made of the same material, which is rubber.

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