Photoelectric coupler

Abstract

The photoelectric coupler comprises a first conductive support which is provided with a die bonding area; the receiving chip is fixedly arranged in the die bonding area; the isolation protection layer is stacked on the receiving chip; the emission chip is stacked on the isolation protection layer; the second conductive bracket is arranged opposite to the first conductive bracket; the emission chip is electrically connected with the second conductive support through a crystal wire. The insulating part is fixedly arranged at the opposite end parts of the first conductive bracket and the second conductive bracket; and a packaging adhesive. The transmitting chip, the isolation protection layer and the receiving chip are sequentially attached in the vertical direction, so that the size of the photoelectric coupler in the vertical direction is reduced; the first conductive support and the second conductive support are abutted against each other, so that the size of the photoelectric coupler in the horizontal direction is reduced, and the overall size of the photoelectric coupler is minimized.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, specifically to an optocoupler. Background Technology

[0002] An optocoupler, also known as an optical coupler or opto-isolator, is a device that uses light as a medium to transmit electrical signals. Its structure mainly consists of two parts: a transmitter and a receiver. First, an electronic signal drives a light-emitting element at the transmitter to emit light of a specific wavelength. This light is received by a photodetector at the receiver, generating a photocurrent. This photocurrent can be amplified or shaped to output an electrical signal. There are two main types of existing optocoupler packaging structures: reflective and through-beam. Reflective optocouplers transmit the light signal from the transmitter to the receiver via reflection within the optocoupler. This method results in a smaller optocoupler but lower photoelectric conversion efficiency. Through-beam optocouplers transmit the light signal directly from the transmitter to the receiver within the optocoupler, with the transmitter and receiver chips located on different planes. This method results in higher photoelectric conversion efficiency, but requires multiple layers of support on different planes, leading to a larger product size. Therefore, reducing product size while maintaining photoelectric conversion efficiency is a pressing issue that needs to be addressed. Utility Model Content

[0003] The main technical problem this invention addresses is how to reduce the size of the optocoupler while ensuring its photoelectric conversion efficiency.

[0004] This application provides an optocoupler, including:

[0005] A first conductive support has a support surface disposed on its top, and a die-bonding region is disposed on the support surface.

[0006] A receiving chip is fixedly disposed in the die-bonding area, and the photosensitive surface of the receiving chip is disposed away from the supporting surface of the first conductive bracket. The receiving chip is electrically connected to the first conductive bracket.

[0007] An isolation protective layer is stacked on the photosensitive surface of the receiving chip;

[0008] The emitting chip is stacked on the end of the isolation protective layer away from the receiving chip, and the light-emitting surface of the emitting chip is facing the isolation protective layer. The light emitted by the emitting chip is transmitted to the receiving chip through the isolation protective layer.

[0009] The second conductive support is disposed opposite to the first conductive support along the support surface of the first conductive support; the transmitting chip is electrically connected to the second conductive support through a crystal wire.

[0010] An insulating component is fixedly disposed at the ends of the first conductive support and the second conductive support that are opposite to each other;

[0011] The encapsulating adhesive encapsulates the receiving chip, the isolation protective layer, the transmitting chip, a portion of the first conductive support, and a portion of the second conductive support.

[0012] In one embodiment, the cross-sectional area of ​​the receiving chip along the direction perpendicular to the height is greater than the cross-sectional area of ​​the transmitting chip along the direction perpendicular to the height.

[0013] In one embodiment, the thickness and transmittance of the isolation protective layer correspond to the required photoelectric conversion efficiency.

[0014] In one embodiment, the insulating element is fixedly disposed on the first conductive bracket; the second conductive bracket includes a body portion, a bent portion and a first extension portion, the body portion is disposed opposite to the first conductive bracket, the first extension portion is located above the support surface of the first conductive bracket, and the bent portion is connected between the body portion and the first extension portion.

[0015] In one embodiment, the bent portion abuts against the insulating element.

[0016] In one embodiment, the first extension overlaps the top of the insulating member, and the orthographic projection of the first extension onto the support surface of the first conductive bracket is located within the support range of the insulating member.

[0017] In one embodiment, the second conductive support further includes a second extension, which extends along the height direction from the end of the first extension near the first conductive support, and the extension height does not exceed the height of the transmitting chip.

[0018] In one embodiment, the main body, the bent portion, the first extension portion, and the second extension portion are integrally bent into a structure.

[0019] In one embodiment, the insulating component includes a connecting sleeve with openings at both ends, which are respectively fitted onto the ends of the first conductive support and the second conductive support; the connecting sleeve has a connecting through hole penetrating the top wall of the connecting sleeve, and an electrode is embedded in the connecting through hole, the electrode forming an electrical connection with the second conductive support; an insulating layer is also provided inside the connecting sleeve to separate the openings at both ends.

[0020] In one embodiment, the encapsulating adhesive includes an inner encapsulating adhesive and an outer encapsulating adhesive. The inner encapsulating adhesive integrally encapsulates the receiving chip, the isolation protective layer, the transmitting chip, a portion of the first conductive support, and a portion of the second conductive support. The outer encapsulating adhesive completely encapsulates the inner encapsulating adhesive.

[0021] According to the above embodiment of the optocoupler, since the transmitting chip, the isolation protective layer and the receiving chip are attached in sequence in the vertical direction, the size of the optocoupler in the vertical direction can be reduced; and since the first conductive support and the second conductive support are abutted against each other, the size of the optocoupler in the horizontal direction can also be reduced, thereby realizing a smaller overall size of the optocoupler.

[0022] Furthermore, since the first conductive support and the second conductive support are in contact with each other, the length of the crystal wire connecting the transmitter chip on the first conductive support to the second conductive support is shorter; since the main component of the crystal wire is metallic gold, the cost is relatively high, and reducing the length of the crystal wire can save a lot of costs. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of an optocoupler structure in an embodiment of this application.

[0024] Figure 2 This is a top view schematic diagram of an optocoupler in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of a second conductive support structure in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of another optocoupler structure in an embodiment of this application.

[0027] Figure 5 This is a schematic diagram of another second conductive support structure in an embodiment of this application.

[0028] Figure 6 This is a schematic diagram of another second conductive support structure in the embodiments of this application.

[0029] Figure 7 This is a schematic diagram of another optocoupler structure in the embodiments of this application.

[0030] Figure 8 This is a schematic diagram of a connecting sleeve structure in an embodiment of this application.

[0031] Figure 9 This is a side view of a connecting sleeve structure in an embodiment of this application.

[0032] Figure 10This is a flowchart illustrating a method for fabricating an optocoupler according to an embodiment of this application.

[0033] Figure 11 This is a schematic diagram of a light-emitting wafer structure in an embodiment of this application.

[0034] Figure 12 This is a side view schematic diagram of a light-emitting chip in an embodiment of this application.

[0035] Figure 13 This is a schematic diagram of a light-emitting chip with an isolation protective layer in an embodiment of this application.

[0036] Figure 14 This is a schematic diagram of the transmitting component structure in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1-First conductive support; 11-Die bonding region;

[0039] 2-Second conductive support; 21-Main body; 22-Bending part; 23-First extension; 24-Second extension;

[0040] 3-Receiver chip;

[0041] 4-Emitting chip;

[0042] 5-Isolation and protective layer;

[0043] 6-Insulating component; 61-Connecting sleeve; 62-Insulating layer; 63-Electrode; 64-Insulating partition;

[0044] 7-Encapsulating adhesive; 71-Inner encapsulating adhesive; 72-Outer encapsulating adhesive;

[0045] 8-Crystal wire;

[0046] 9-Light-emitting chip. Detailed Implementation

[0047] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0048] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0049] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0050] An optocoupler, also known as an optical coupler or opto-isolator, is a device that uses light as a medium to transmit electrical signals. Its structure mainly consists of two parts: a transmitter and a receiver. First, an electronic signal drives a light-emitting element at the transmitter to emit light of a specific wavelength. This light is received by a photodetector at the receiver, generating a photocurrent. This photocurrent can be amplified or shaped to output an electrical signal. Because the signal in the optocoupler travels from the transmitter to the receiver in the form of light, it provides excellent isolation from signal noise, preventing interference between the transmitting and receiving electrical signals. Due to its superior signal isolation, optocouplers are widely used in various circuits, making them one of the most diverse and widely applied optoelectronic components. There are two main types of packaging structures for optocouplers: one is the reflective type, where the optical signal travels from the transmitter to the receiver via reflection within the optocoupler. The transmitter and receiver chips are mounted on the same plane, as are the conductive supports that hold the chips. This requires only one set of supports and eliminates the need for stacking, resulting in a smaller product size. However, because the optical signal is transmitted through internal reflection, its photoelectric conversion efficiency is relatively low. The other type is the through-beam type, where the optical signal travels directly from the transmitter to the receiver within the optocoupler. The transmitter and receiver chips are located on different planes and positioned opposite each other. This results in higher photoelectric conversion efficiency. However, because the supports that hold the chips are not on the same plane, two sets of supports are often required, along with bending operations, to achieve the pairwise alignment of the transmitter and receiver chips. This increases the cost of supports and manufacturing, and because the transmitter and receiver are not on the same plane, the overall product size is relatively larger.

[0051] This application provides an optocoupler in its embodiments; please refer to [reference needed]. Figures 1-2 As shown, the optocoupler includes:

[0052] The first conductive support 1 has a support surface disposed on its top, and a die-bonding region 11 is disposed on the support surface;

[0053] The receiving chip 3 is fixedly disposed in the die bonding area 11, and the photosensitive surface of the receiving chip 3 is disposed away from the support surface of the first conductive bracket 1. The receiving chip 3 and the first conductive bracket 1 are electrically connected.

[0054] An isolation protective layer 5 is stacked on the photosensitive surface of the receiving chip 3;

[0055] The emitting chip 4 is stacked on the end of the isolation protective layer 5 away from the receiving chip 3, and the light-emitting surface of the emitting chip 4 faces the isolation protective layer 5. The light emitted by the emitting chip 4 is transmitted to the receiving chip 3 through the isolation protective layer 5.

[0056] The second conductive support 2 is disposed opposite to the first conductive support 1 along the support surface of the first conductive support 1; the transmitting chip 4 and the second conductive support 2 are electrically connected through the crystal wire 8;

[0057] Insulating component 6 is fixedly disposed at the opposite ends of the first conductive bracket 1 and the second conductive bracket 2;

[0058] The encapsulating adhesive 7 encapsulates the receiving chip 3, the isolation protective layer 5, the transmitting chip 4, part of the first conductive support 1, and part of the second conductive support 2 within it.

[0059] In the optocoupler design structure of this application embodiment, in order to reduce the size of the optocoupler, the support used includes a first conductive support 1 and a second conductive support 2, which are basically located on the same plane, that is, the first conductive support 1 and the second conductive support 2 are arranged opposite each other along the support surface. In this arrangement, related technologies usually set a gap between the first conductive support 1 and the second conductive support 2 to achieve insulation. However, this structure has poor reliability and usually requires a large gap to ensure the insulation effect. In this application embodiment, a solid insulating member 6 is set between the first conductive support 1 and the second conductive support 2. The insulating member 6 is set at the opposite ends of the first conductive support 1 and the second conductive support 2, and the insulating member 6 is fixed to the first conductive support 1 and / or the second conductive support 2. By setting the insulating member 6, the gap between the first conductive support 1 and the second conductive support 2 can be reduced while ensuring mutual insulation, thereby reducing the size of the entire optocoupler.

[0060] To ensure photoelectric conversion efficiency, the optocoupler in this embodiment adopts a through-beam structure, wherein an isolation protective layer 5 is disposed between the receiving chip 3 and the transmitting chip 4. The emitting surface of the transmitting chip 4 faces the isolation protective layer 5, and the photosensitive surface of the receiving chip 3 also faces the isolation protective layer 5. The light emitted by the transmitting chip 4 is transmitted to the receiving chip 3 after passing through the isolation protective layer 5. Since the isolation protective layer 5 is disposed between the transmitting chip 4 and the receiving chip 3, the photoelectric conversion efficiency of the entire optocoupler can be adjusted by adjusting the parameters of the isolation protective layer 5, including but not limited to transmittance and thickness. For example, the higher the thickness of the isolation protective layer 5, the lower the corresponding photoelectric conversion efficiency; the higher the transmittance of the isolation protective layer 5, the higher the corresponding photoelectric conversion efficiency. In other words, the thickness and transmittance of the isolation protective layer 5 correspond to the required photoelectric conversion efficiency. In addition, parameters such as the hardness of the isolation protective layer 5 can be adjusted to meet the safety standards required for the product.

[0061] The receiving chip 3 is directly fixed to the die-bonding region 11 of the first conductive support 1, and the isolation protective layer 5 and the emitting chip 4 are stacked sequentially on top of the receiving chip 3. In order to support the isolation protective layer 5 and the emitting chip 4, and to improve the light receiving efficiency, the cross-sectional area of ​​the receiving chip 3 along the direction perpendicular to its height can be configured to be larger than the cross-sectional area of ​​the emitting chip 4 along the direction perpendicular to its height. This can reduce the proportion of light leakage emitted by the emitting chip 4 and ensure photoelectric conversion efficiency.

[0062] In some optional embodiments, the encapsulating adhesive 7 may specifically include an inner encapsulating adhesive 71 and an outer encapsulating adhesive 72. The inner encapsulating adhesive 71 integrally encapsulates the receiving chip 3, the isolation protective layer 5, the transmitting chip 4, a portion of the first conductive support 1, and a portion of the second conductive support 2. The outer encapsulating adhesive 72 completely encapsulates the inner encapsulating adhesive 71. Therefore, during the manufacturing process, the receiving chip 3, the isolation protective layer 5, the transmitting chip 4, a portion of the first conductive support 1, and a portion of the second conductive support 2 can be encapsulated with the inner encapsulating adhesive 71 to fix these components. Then, the outer encapsulating adhesive 72 is placed outside the inner encapsulating adhesive 71 to completely encapsulate the inner encapsulating adhesive 71.

[0063] In some alternative embodiments, please refer to Figure 3To facilitate the electrical connection between the transmitting chip 4 and the second conductive support 2, reduce the length of the crystal wire 8, and improve the overall integrity of the product, the insulating component 6 is fixedly disposed on the first conductive support 1. The second conductive support 2 includes a body portion 21, a bent portion 22, and a first extension portion 23. The body portion 21 is disposed opposite to the first conductive support 1, and the first extension portion 23 is located above the support surface of the first conductive support 1. The bent portion 22 connects the body portion 21 and the first extension portion 23. The structure of the second conductive support 2 sequentially includes the connected body portion, the bent portion 22, and the first extension portion 23, and the first extension portion 23 is directly disposed above the support surface of the first conductive support 1, which is equivalent to raising the position of the first extension portion 23. Since the transmitting chip 4 is connected to the first conductive support 1 through the crystal wire 8, in this structure, the crystal wire 8 can be connected to the transmitting chip 4 and the first extension portion 23, thereby reducing the required length of the crystal wire 8. The crystal wire 8 is mostly composed of gold, so reducing the length of the crystal wire 8 can reduce the amount of crystal wire 8 used, thereby reducing costs.

[0064] In some alternative embodiments, please continue to refer to Figure 1 To improve product consistency and enhance product strength, the bent portion 22 can abut against the insulating component 6. Since the insulating component 6 is located between the first conductive support 1 and the second conductive support 2, even if the bent portion 22 directly abuts against the insulating component 6, it will not affect the insulation performance between the first conductive support 1 and the second conductive support 2. The shape of the bent portion 22 can be curved or zigzag.

[0065] In some alternative embodiments, please continue to refer to Figure 1 To further improve product consistency and enhance product strength, the first extension 23 overlaps the top of the insulating member 6, and the orthographic projection of the first extension 23 onto the support surface of the first conductive bracket 1 is within the support range of the insulating member 6. In other words, the first extension 23 can be directly placed on top of the insulating member 6, which is equivalent to supporting the first extension 23 through the insulating member 6; and since the orthographic projection of the first extension 23 on the support surface of the first conductive bracket 1 is within the support range of the insulating member 6, overlapping the first extension 23 onto the insulating member 6 will not affect the insulation effect.

[0066] In some alternative embodiments, please refer to Figures 4-6 To further reduce the length of the crystal wire 8, the second conductive support 2 also includes a second extension 24. The second extension 24 extends along the height direction from the end of the first extension 23 near the first conductive support 1, and the extension height does not exceed the height of the transmitter chip 4. Because the second extension 24 extends along the height direction, its extended end can be closer to the transmitter chip 4, and the closest point can be flush with the transmitter chip 4. In this state, the length of the crystal wire 8 can be minimized.

[0067] In some alternative embodiments, in order to ensure connection strength and achieve electrical connection, the main body 21, the bent portion 22, the first extension portion 23 and the second extension portion 24 can be directly formed as an integrally bent structure.

[0068] This application also provides an optocoupler in its embodiments; please refer to [reference needed]. Figures 7-9 The corresponding insulating component 6 may specifically include a connecting sleeve 61, wherein the connecting sleeve 61 has openings at both ends and is respectively fitted onto the ends of the first conductive support 1 and the second conductive support 2; the connecting sleeve 61 also has an insulating layer 62 that separates the openings at both ends. The connecting sleeve 61 can be sleeved onto the ends of the first conductive support 1 and the second conductive support 2, which is equivalent to realizing a fixed connection between the first conductive support 1 and the second conductive support 2; and the insulating layer 62 that separates the openings inside the connecting sleeve 61 can thus achieve insulation between the first conductive support 1 and the second conductive support 2.

[0069] In some optional embodiments, to facilitate the electrical connection between the transmitting chip 4 and the second conductive support 2, the connecting sleeve 61 is also provided with a connecting through hole penetrating the top wall of the connecting sleeve 61. An electrode 63 is embedded in the connecting through hole, and the electrode 63 is electrically connected to the second conductive support 2. The electrode 63 embedded in the connecting through hole can be electrically connected to the transmitting chip 4, and the height of the electrode 63 can even be adjusted to bring it closer to the transmitting chip 4. In addition, when there are multiple second conductive supports 2, the connecting sleeve 61 can be integrally sleeved on each second conductive support 2, and an insulating partition 64 can be provided in the sleeve based on each conductive support.

[0070] According to the optocoupler provided in the embodiments of this application, since the transmitting chip 4, the isolation protective layer 5 and the receiving chip 3 are attached in sequence in the vertical direction, the size of the optocoupler in the vertical direction is reduced; and since the first conductive support 1 and the second conductive support 2 are abutted against each other, the size of the optocoupler in the horizontal direction is also reduced, thereby realizing a smaller overall size of the optocoupler.

[0071] Furthermore, since the first conductive support 1 and the second conductive support 2 are in contact with each other, the length of the crystal wire 8 connecting the transmitting chip 4 on the first conductive support 1 to the second conductive support 2 is shorter; since the main component of the crystal wire is metallic gold, the cost is relatively high, and reducing the length of the crystal wire can save a lot of costs.

[0072] Furthermore, this application also provides a method for fabricating an optocoupler; please refer to [link / reference]. Figures 10-14 ,include:

[0073] S101, A light-emitting chip 9 is provided, wherein the light-emitting surface of the light-emitting chip 9 and the electrode surface 63 are arranged opposite to each other; the light-emitting chip 9 is generally in the form of a sheet, and can be cut to form multiple individual emitting chips 4, such as... Figure 11 and Figure 12 As shown.

[0074] S102. An isolation protective layer 5 is provided on the light-emitting surface of the light-emitting chip 9, such as... Figure 13 As shown, the isolation protective layer 5 serves as the medium for transmitting light emitted by the emitting chip 4 to the receiving chip 3. It is fixed to the emitting chip 9 before it is cut. In the subsequent cutting process, the emitting chip 9 and the isolation protective layer 5 are cut together as a whole to obtain the desired combination structure of the emitting chip 4 and the isolation protective layer 5.

[0075] S103. The light-emitting chip 9 with the isolation protective layer 5 is cut to form an emitting component. The emitting component includes an emitting chip 4 and the isolation protective layer 5, such as... Figure 14 As shown.

[0076] S104. The end of the transmitting component with the isolation protective layer 5 is fixed to the photosensitive surface of the receiving chip 3; wherein the receiving chip 3 is fixed to the die-bonding area 11 of the first conductive bracket 1; the die-bonding area 11 is provided on the support surface at the top of the first conductive bracket 1; wherein the step of fixing the receiving chip 3 to the first conductive bracket 1 can be done before any step before obtaining the transmitting chip 4, or it can be done after fixing the receiving chip 3 and the transmitting chip 4 to each other, and then fixing the receiving chip 3, the isolation protective layer 5 and the transmitting chip 4 to the die-bonding area 11 of the first conductive bracket 1 as a whole.

[0077] S105. The transmitting chip 4 and the receiving chip 3 are electrically connected to the second conductive bracket 2 and the first conductive bracket 1, respectively. The first conductive bracket 1 and the second conductive bracket 2 are arranged opposite to each other along the support surface, and an insulating member 6 is provided between the opposite ends of the first conductive bracket 1 and the second conductive bracket 2. When making electrical connections, the receiving chip 3 can form an electrical connection with the first conductive bracket 1 by means of a patch or a crystal wire 8, while the transmitting chip 4 generally only forms a cable with the second conductive bracket 2 by means of a crystal wire 8.

[0078] S106. Set the encapsulating adhesive 7. The encapsulating adhesive 7 may specifically include an inner encapsulating adhesive 71 and an outer encapsulating adhesive 72. First, the inner encapsulating adhesive 71 is used for encapsulation, and then the outer encapsulating adhesive 72 is used to wrap the inner encapsulating adhesive 71, thereby obtaining the required optocoupler.

[0079] After the optocoupler product is formed, corresponding tests can be carried out. The tests include photoelectric conversion efficiency, safety level, etc., to determine whether it meets the requirements of the product.

[0080] According to the above embodiment, the optocoupler is reduced in size in the vertical direction because the transmitting chip 4, the isolation protective layer 5, and the receiving chip 3 are attached in sequence in the vertical direction; and because the first conductive support 1 and the second conductive support 2 are abutted against each other, the size of the optocoupler is also reduced in the horizontal direction, thereby achieving a smaller overall size of the optocoupler.

[0081] Furthermore, since the first conductive support 1 and the second conductive support 2 are in contact with each other, the length of the crystal wire 8 connecting the transmitting chip 4 on the first conductive support 1 to the second conductive support 2 is shorter; since the main component of the crystal wire is metallic gold, the cost is relatively high, and reducing the length of the crystal wire can save a lot of costs.

[0082] Those skilled in the art will understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc., and can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0083] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. An opto-coupler, characterized by, The application relates to a light emitting diode (LED) package, which comprises the following components: a first conductive support provided with a support surface on the top of the first conductive support, a fixedly arranged receiving chip on the support surface, a light receiving surface of the receiving chip facing away from the support surface of the first conductive support, an electric connection between the receiving chip and the first conductive support, an isolation protection layer arranged on the light receiving surface of the receiving chip, a fixedly arranged emitting chip on the end of the isolation protection layer away from the receiving chip, a light emitting surface of the emitting chip facing the isolation protection layer, light emitted by the emitting chip being transmitted to the receiving chip through the isolation protection layer, a second conductive support arranged opposite to the first conductive support along the support surface of the first conductive support, an electric connection between the emitting chip and the second conductive support through a crystal line, an insulating member fixedly arranged on the end of the first conductive support opposite to the second conductive support, and encapsulating glue for integrally encapsulating the receiving chip, the isolation protection layer, the emitting chip, part of the first conductive support and part of the second conductive support. The cross-sectional area of the receiving chip along the vertical height direction is greater than the cross-sectional area of the emitting chip along the vertical height direction. The thickness and light transmittance of the isolation protection layer correspond to the required photoelectric conversion efficiency. The insulating member is fixedly arranged on the first conductive support, the second conductive support comprises a body part, a bending part and a first extending part, the body part is arranged opposite to the first conductive support, the first extending part is above the support surface of the first conductive support, and the bending part is connected between the body part and the first extending part. The bending part abuts against the insulating member. The first extending part is overlapped on the insulating member, and the projection range of the first extending part on the support surface of the first conductive support is within the support range of the insulating member. The second conductive support further comprises a second extending part, the second extending part is on the end of the first extending part close to the first conductive support and extends along the vertical height direction, and the extending height does not exceed the height of the emitting chip. The body part, the bending part, the first extending part and the second extending part are integrally bent and formed.

2. The opto-coupler of claim 1, wherein, The insulating member comprises a connecting sleeve, the connecting sleeve is open at both ends and is sleeved on the end of the first conductive support and the end of the second conductive support, the connecting sleeve is provided with a connecting through hole penetrating through the top wall of the connecting sleeve, an electrode is embedded in the connecting through hole, the electrode is electrically connected with the second conductive support, and an insulating layer is arranged in the connecting sleeve to separate the two ends.

3. The opto-coupler of claim 1, wherein, ​ 4. An opto-coupler as claimed in any one of claims 1 to 3, wherein, ​ 5. The opto-coupler of claim 4, wherein, ​ 6. The opto-coupler of claim 4, wherein, ​ 7. The opto-coupler of claim 4, wherein, ​ 8. The opto-coupler of claim 7, wherein, ​ 9. An opto-coupler as claimed in any one of claims 1 to 3, wherein, ​ 10. An opto-coupler as claimed in any one of claims 1 to 3, wherein, The encapsulation glue comprises inner encapsulation glue and outer encapsulation glue, the inner encapsulation glue integrally encapsulates the receiving chip, the isolation protection layer, the transmitting chip, part of the first conductive support and part of the second conductive support, and the outer encapsulation glue integrally encapsulates the inner encapsulation glue.

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