LED device

Abstract

The utility model discloses an LED device, which relates to the technical field of supports and comprises a support with a cup body structure and two top bonding pads arranged at the bottom of the cup body structure, an isolation section is formed between the two top bonding pads, and the top surface of the isolation section is higher than the top surfaces of the top bonding pads. The isolation section is parallel to the long edges of the bottom of the cup body structure, the bottom of the cup body structure is provided with two long edge step structure sets symmetrically distributed on the long edges of the two sides, each long edge step structure set comprises a long edge step structure, and a solder containing space is formed between each long edge step structure and the isolation section; and the long-edge step structure at the bottom of the cup body structure forms a placing platform for placing an LED chip. The LED chip is placed on the long-side step structure, the stability of the chip placed in the support is improved, the riverway between the top bonding pads is lifted to form the isolation section, the long-side step structure is matched to reserve a solder melting area, the risk of position deviation or short circuit of the LED chip after remelting soldering is reduced, and the packaging stability and reliability of an LED device are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED packaging technical field, concretely relates to a LED device. BACKGROUND

[0002] Figure 1 It is the structure schematic diagram of prior high luminous efficiency LED device product, the existing LED device structure design, the structure of top pad 5 on support 1 top presents left and right sides distribution, forms the riverway structure perpendicular to support 1 cup body structure bottom long side, and it is easy to exist the situation of mismatching of support 1 and LED chip 3, leads to the chip deviation phenomenon caused after over reflow furnace, and the solder of top pad 5 is easy to penetrate to the riverway position in reflow soldering process, leads to the short circuit risk of LED device. SUMMARY

[0003] The utility model discloses a kind of LED devices, long side step structure is arranged at cup body structure bottom to support LED chip, improve the stability of LED chip placement;And the riverway between top pad is lifted to form isolation section, cooperate long side step structure reserved solder melting area, reduce the risk of position deviation or short after reflow soldering of LED chip, improve the packaging stability and reliability of LED device.

[0004] The utility model provides a kind of LED device, the LED device includes: the support of cup body structure, two top pads are set in the cup body structure bottom, isolation section is formed between two top pads, the top surface of the isolation section is higher than the top surface of the top pad;

[0005] The isolation section is parallel to the long side of the cup body structure bottom, the cup body structure bottom is provided with two long side step structure groups symmetrically distributed in two sides long side, the long side step structure group includes long side step structure, solder containment space is formed between the long side step structure and the isolation section;

[0006] Long side step structure located in one side long side of the cup body structure bottom and long side step structure located in the other side long side of the cup body structure bottom form placement platform for placing LED chip.

[0007] Further, two the top pad is along the geometric center of the cup body structure bottom symmetry distribution, and S-shaped insulating riverway is formed between two the top pad;

[0008] The S-shaped insulating riverway and the middle section parallel to the long side of the cup body structure bottom form the isolation section.

[0009] Further, a height difference between the top surface of the isolation section and the top surface of the top pad is △h, and the value of the △h is in a range of 10 μm≤△h<30 μm.

[0010] Further, a height difference between the top surface of the long-side step structure and the top surface of the top pad is H3, and the value of the H3 is in a range of 30 μm≤H3≤70 μm.

[0011] Further, a step surface width of the long-side step structure is L3, and the value of the L3 is in a range of 30 μm≤L3≤60 μm.

[0012] Further, the long-side step structure is perpendicular to the top pad, or an inclined angle is formed between the long-side step structure and the top pad.

[0013] Further, the short side of the bottom of the cup structure is provided with two short-side step structure groups symmetrically distributed on both sides of the short side, and the short-side step structure groups on both sides of the bottom of the cup structure form a limiting area for accommodating the LED chip.

[0014] Further, the short-side step structure group includes a first short-side step structure and a second short-side step structure, and the first short-side step structure and the second short-side step structure are arranged as a double-step structure of continuous steps.

[0015] The step height of the first short-side step structure is H1, and the value of the H1 is in a range of 30 μm≤H1≤70 μm.

[0016] The step height of the second short-side step structure is H2, and the value of the H2 is in a range of 30 μm≤H2≤70 μm.

[0017] Further, a step surface width of the first short-side step structure is L1, and the value of the L1 is in a range of 100 μm≤L1≤200 μm.

[0018] The step surface width of the second short-side step structure is L2, and the value of the L2 is in a range of 100 μm≤L2≤400 μm.

[0019] Further, the bottom surface of the bracket is provided with two bottom pads, and an S-shaped insulation river channel is formed between the two bottom pads.

[0020] The utility model provides a kind of LED device, long side step structure is arranged to support LED chip by being set in cup body structure bottom, improve the stability of LED chip placement;And the riverway between top pad is lifted to form isolated section, cooperate long side step structure reserved solder melt area, reduce the risk that LED chip appears position deviation or short after re-melting, improve the encapsulation stability and reliability of LED device. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the structure plan view of LED device in prior art;

[0022] Figure 2 It is the structure section view of LED device of the utility model embodiment one;

[0023] Figure 3 It is the structure section view of another angle of LED device of the utility model embodiment one;

[0024] Figure 4 It is the support structure plan view of LED device of the utility model embodiment one;

[0025] Figure 5 It is the support structure section view of LED device of the utility model embodiment one;

[0026] Figure 6 It is the bottom structure schematic view of LED device of the utility model embodiment;

[0027] Figure 7 It is the support structure plan view of LED device of the utility model embodiment two;

[0028] Figure 8 It is the support structure plan view of LED device of the utility model embodiment three;

[0029] Figure 9 It is the support structure section view of LED device of the utility model embodiment three. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and apparently, the described embodiments only are part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without making creative labor belong to the range of protection of the utility model.

[0031] Embodiment one:

[0032] Please refer to Figures 2 to 6The utility model embodiment provides a kind of LED device, the LED device includes: bracket 1 with cup body structure 2, two top pads 5 being arranged in the bottom of cup body structure 2, the isolation section 8 is formed between the two top pads 5, the top surface of the isolation section 8 is higher than the top surface of the top pad 5, so that the isolation section 8 separates the top pad 5 of the bottom of cup body structure 2, to realize the physical barrier between the solder 4 on two top pads 5, reduce the risk of shorting between each top pad 5.

[0033] Further, the LED device further includes LED chip 3 arranged in the cup body structure 2, the LED chip 3 is die-bonded on two top pads 5, the inside of the cup body structure 2 is filled with plastic sealing layer 7, the LED chip 3 is packaged based on the plastic sealing layer 7, constructs the LED device, the plastic sealing layer 7 is used to protect the plastic sealing of LED chip 3, and the light of the LED chip 3 is adjusted, to meet the light output requirement of the LED device.

[0034] The isolation section 8 is parallel to the long side of the bottom of the cup body structure 2, the bottom of the cup body structure 2 is provided with two long side step structure groups symmetrically distributed on both sides of the long side, the long side step structure group includes long side step structure 22, solder 4 containing space is formed between the long side step structure 22 and the isolation section 8, in the reflow soldering process, the solder 4 containing space reserves containing space for tin paste melting, thereby reducing the risk of tin paste melting penetration above the isolation section 8, improve the reliability of LED chip 3 die-bonding.

[0035] Further, the long side step structure 22 located at one side of the bottom of the cup body structure 2 long side and the long side step structure 22 located at the other side of the bottom of the cup body structure 2 long side form a placement platform for placing LED chip 3, that is, the two long side step structures 22 oppositely arranged at the bottom of the cup body structure 2 can support LED chip 3, so that the contact area of LED chip 3 and the bracket 1 is increased, the placement stability of LED chip 3 is improved, so that the stress uniformity of LED chip 3 during reflow soldering can be improved, the risk of LED chip 3 offset or damage is reduced.

[0036] Further, the two top pads 5 include first top pad 51 and second top pad 52, the first top pad 51 and the second top pad 52 are symmetrically distributed along the geometric center of the bottom of the cup body structure 2, and S-shaped insulation river is formed between the first top pad 51 and the second top pad 52, based on the geometric center symmetry distribution, so that the first top pad 51 and the second top pad 52 can increase the contact area with the bracket 1, and form a misaligned distribution state, thereby effectively improving the bonding force between the top pad 5 and the bracket 1.

[0037] The S-shaped insulating channel and the middle section parallel to the long side of the bottom of the cup structure 2 form the isolation section 8, so that the isolation section 8 can satisfy the separation and physical limitation of the top pad 5.

[0038] Specifically, the height difference between the top surface of the isolation segment 8 and the top surface of the top pad 5 is Δh. The value of Δh is in the range of 10μm≤Δh<30μm. The value of Δh can be one of 10μm, 15μm, 20μm, and 25μm. That is, the isolation segment 8 is raised relative to the top pad 5 by 10μm to 30μm, which can satisfy the blocking effect on the solder 4 in the top area of ​​the top pad 5.

[0039] Furthermore, the height difference between the top surface of the long-side step structure 22 and the top surface of the top pad 5 is H3, and the value of H3 is in the range of 30μm≤H3≤70μm. The value of H3 can be one of 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, or 70μm. Combined with the height difference Δh between the top surface of the isolation segment 8 and the top surface of the top pad 5, it can be concluded that the top surface of the long-side step structure 22 is higher than the top surface of the isolation segment 8. This allows a gap to be formed between the LED chip 3 and the isolation segment 8 when the LED chip 3 is placed on the top surface of the long-side step structure 22, thereby preventing the isolation segment 8 from causing the LED chip 3 to be lifted or shifted.

[0040] Furthermore, the step surface width of the long side step structure 22 is L3, and the value range of L3 is: 30μm≤L3≤60μm. The step surface width L3 of the long side step structure 22 can be one of 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, and 60μm, so that the step surface of the long side step structure 22 has sufficient space to meet the placement requirements of the LED chip 3 and realize the limiting of the LED chip 3.

[0041] Furthermore, the long-side step structure 22 can be perpendicular to the top pad 5, or the long-side step structure 22 and the top pad 5 can form an inclined angle. By arranging the long-side step structure 22 at an incline, the surface tension constraint of the bottom plane of the cup structure 2 can be broken, and the inclined surface of the long-side step structure 22 can guide the solder paste to flow and spread along the slope during reflow soldering, reducing solder paste accumulation or gaps and improving the consistency of solder paste thickness.

[0042] Furthermore, the inclined design of the long-side stepped structure 22 can increase the contact anchor points between the solder paste and the cup structure 2, reducing the problem of uneven solder paste distribution caused by mounting misalignment. Moreover, the inclined surface of the long-side stepped structure 22 can increase the contact area between the LED chip 3 and the solder paste, thereby improving the bonding force between the LED chip 3 and the bracket 1, and effectively increasing the heat conduction area of ​​the LED chip 3, thus improving the heat transfer efficiency of the LED chip 3 and effectively improving the heat dissipation performance of the LED device.

[0043] Furthermore, the bottom surface of the bracket 1 is provided with two bottom pads 6, and an S-shaped insulating channel is formed between the two bottom pads 6. The two bottom pads 6 include a first bottom pad 61 and a fourth bottom pad 62. The structural arrangement of the two bottom pads 6 is the same as that of the two top pads 5. By forming an S-shaped insulating channel between the first bottom pad 61 and the fourth bottom pad 62, the contact area between the bottom pads 6 and the bracket 1 is increased, thereby improving the bonding force between the bottom pads 6 and the bracket 1.

[0044] Specifically, the cup body of the bracket 1 is filled with a fluorescent adhesive layer, and the LED chip 3 is completely contained within the fluorescent adhesive layer, so that the light emitted by the LED chip 3 can pass through the fluorescent adhesive layer and be emitted to the outside to meet the light color requirements of different application devices.

[0045] This utility model embodiment provides an LED device. By setting a long-side step structure 22 at the bottom of the cup structure 2 to support the LED chip 3, the stability of the LED chip 3 is improved. The channel between the top pads 5 is raised to form an isolation section 8. With the long-side step structure 22 reserving an area for the solder 4 to melt, the risk of the LED chip 3 shifting or short-circuiting after reflow soldering is reduced, thereby improving the packaging stability and reliability of the LED device.

[0046] Example 2:

[0047] Please refer to Figure 7 Specifically, in this embodiment, the bottom short side of the cup structure 2 is provided with two symmetrically distributed short-side step structure groups on both sides of the short side. The short-side step structure groups on both sides of the bottom of the cup structure 2 form a limiting area for accommodating the LED chip 3. The short-side step structure group includes a short-side step structure 21. The two short-side step structures 21 symmetrically distributed on both sides of the bottom of the cup structure 2 are used to achieve lateral limiting of the LED chip 3, thereby ensuring that the LED chip 3 can maintain an accurate installation position during reflow soldering.

[0048] Example 3:

[0049] Please refer to Figure 8 and Figure 9 In this embodiment, the bottom of the cup structure 2 is provided with two short-side step structure groups symmetrically distributed on both short sides. The short-side step structure group includes a first short-side step structure 211 and a second short-side step structure 212. The first short-side step structure 211 and the second short-side step structure 212 are configured as a double-step structure with continuous steps.

[0050] The step height of the first short-side step structure 211 is H1, and the value of H1 is in the range of 30μm≤H1≤70μm. The step height H1 of the first short-side step structure 211 can be one of 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, and 70μm. The step height of the second short-side step structure 212 is H2, and the value of H2 is in the range of 30μm≤H2≤70μm. The step height H2 of the second short-side step structure 212 can be one of 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, and 70μm. This allows the double-step structure formed by the first short-side step structure 211 and the second short-side step structure 212 to satisfy the lateral positioning of the LED chip 3 and improve the stability of the LED chip 3 die bonding.

[0051] Furthermore, the step surface width of the first short-side step structure 211 is L1, and the value range of L1 is: 100μm≤L1≤200μm; the step surface width of the second short-side step structure 212 is L2, and the value range of L2 is: 100μm≤L2≤400μm. That is, the step surface width L2 of the second short-side step structure 212 is 1 to 2 times the step surface width L1 of the first short-side step structure 211, so that the step surface of the first short-side step structure 211 can meet the limiting requirements of the LED chip 3.

[0052] Furthermore, in this embodiment, the step height refers to the lifting height of a single step structure. That is, the step height of the first short side step structure 211 refers to the height from the top surface of the top pad 5 to the step surface of the first short side step structure 211, and the step height of the second short side step structure 212 refers to the height from the step surface of the first short side step structure 211 to the step surface of the second short side step structure 212.

[0053] This utility model provides an LED device that supports the LED chip 3 by setting a long-side step structure 22 at the bottom of the cup structure 2, thereby improving the stability of the LED chip 3. The channel between the top pads 5 is raised to form an isolation section 8. The long-side step structure 22 is used to reserve an area for the solder 4 to melt, thereby reducing the risk of the LED chip 3 shifting or short-circuiting after reflow soldering, and improving the packaging stability and reliability of the LED device.

[0054] Furthermore, the above provides a detailed description of an LED device provided by the embodiments of this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. An LED device, characterized by, The LED device comprises a bracket with a cup structure, two top pads arranged at the bottom of the cup structure, and an isolation section formed between the two top pads, wherein the top surface of the isolation section is higher than the top surface of the top pads; The isolation section is parallel to the long edges of the bottom of the cup structure, and the bottom of the cup structure is provided with two long edge step structure groups symmetrically arranged on the two long edges, wherein the long edge step structure group comprises a long edge step structure, and a solder containing space is formed between the long edge step structure and the isolation section; The long edge step structure located on one side of the bottom of the cup structure and the long edge step structure located on the other side of the bottom of the cup structure form a placement platform for placing LED chips.

2. The LED device of claim 1, wherein, The two top pads are symmetrically arranged along the geometric center of the bottom of the cup structure, and an S-shaped insulation river is formed between the two top pads. The S-shaped insulation river and the middle section parallel to the long edges of the bottom of the cup structure form the isolation section.

3. The LED device of claim 2, wherein, The height difference between the top surface of the isolation section and the top surface of the top pad is △h, and the value of △h is in the range of 10 μm≤△h<30 μm.

4. The LED device of claim 1, wherein, The height difference between the top surface of the long edge step structure and the top surface of the top pad is H3, and the value of H3 is in the range of 30 μm≤H3≤70 μm.

5. The LED device of claim 1, wherein, The step surface width of the long edge step structure is L3, and the value of L3 is in the range of 30 μm≤L3≤60 μm.

6. The LED device of claim 1, wherein, The long edge step structure is perpendicular to the top pad, or an inclination angle is formed between the long edge step structure and the top pad.

7. The LED device of claim 1, wherein, The short edges of the bottom of the cup structure are provided with two short edge step structure groups symmetrically arranged on the two short edges, and the short edge step structure groups located on the two short edges of the bottom of the cup structure form a limiting area for containing LED chips.

8. The LED device of claim 7, wherein, The short edge step structure group comprises a first short edge step structure and a second short edge step structure, and the first short edge step structure and the second short edge step structure are arranged as a double-step structure with continuous steps. The step height of the first short edge step structure is H1, and the value of H1 is in the range of 30 μm≤H1≤70 μm. The step height of the second short edge step structure is H2, and the value of H2 is in the range of 30 μm≤H2≤70 μm.

9. The LED device of claim 8, wherein, The step surface width of the first short edge step structure is L1, and the value of L1 is in the range of 100 μm≤L1≤200 μm. The step surface width of the second short edge step structure is L2, and the value of L2 is in the range of 100 μm≤L2≤400 μm.

10. The LED device of claim 1, wherein, The bottom surface of the bracket is provided with two bottom pads, and an S-shaped insulation river is formed between the two bottom pads.

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