Semiconductor processing apparatus

Abstract

A semiconductor processing apparatus includes a semiconductor manufacturing device, a stocker device, and a carrier transfer assembly. A semiconductor manufacturing device includes a plurality of loading ports. The carrier transfer assembly is located between the stocker apparatus and the semiconductor manufacturing apparatus. The carrier conveying assembly comprises a conveying robot and a moving mechanism. The transfer robot is located between the semiconductor manufacturing apparatus and the stocker apparatus. The moving mechanism comprises an objective table for supporting the conveying robot and a driving device arranged beside the objective table.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a semiconductor processing apparatus, and more particularly to a semiconductor processing apparatus having a transfer robot. BACKGROUND

[0002] Generally, the semiconductor manufacturing industry involves highly complex technologies for using semiconductor materials to fabricate integrated circuits that are layered and patterned onto substrates such as silicon. Integrated circuits are produced from photomasks. Initially, a circuit designer provides circuit pattern data describing a particular integrated circuit (IC) design to a photomask production system, which converts the pattern data into a photomask. As the degree of circuit integration has increased and the size of semiconductor devices has continued to shrink, photomasks and the resulting devices have become increasingly sensitive to defects. SUMMARY

[0003] In some embodiments, a semiconductor processing apparatus includes a semiconductor manufacturing equipment, a stocker equipment, and a carrier transfer assembly. The semiconductor manufacturing equipment includes a plurality of load ports. The carrier transfer assembly is located between the stocker equipment and the semiconductor manufacturing equipment. The carrier transfer assembly includes a transfer robot and a movement mechanism. The transfer robot is located between the semiconductor manufacturing equipment and the stocker equipment. The movement mechanism includes a carrier stage supporting the transfer robot, and a drive device disposed adjacent to the carrier stage.

[0004] In some embodiments, a semiconductor processing apparatus includes a semiconductor manufacturing equipment, a stocker equipment, and a carrier transfer assembly. The semiconductor manufacturing equipment includes a plurality of load ports. The carrier transfer assembly is located between the stocker equipment and the semiconductor manufacturing equipment. The carrier transfer assembly includes a transfer robot and a movement mechanism. The transfer robot is located between the semiconductor manufacturing equipment and the stocker equipment. The movement mechanism includes a carrier stage supporting the transfer robot, and a drive device disposed adjacent to the carrier stage.

[0005] In some embodiments, a semiconductor processing apparatus includes a semiconductor manufacturing equipment, a stocker equipment, and a carrier transfer assembly. The semiconductor manufacturing equipment includes a plurality of load ports. The carrier transfer assembly is located between the stocker equipment and the semiconductor manufacturing equipment. The carrier transfer assembly includes a transfer robot and a movement mechanism. The transfer robot is located between the semiconductor manufacturing equipment and the stocker equipment. The movement mechanism includes a carrier stage supporting the transfer robot, and a drive device disposed adjacent to the carrier stage. BRIEF DESCRIPTION OF DRAWINGS

[0006] Various aspects of the present disclosure can be best understood with reference to the following detailed description when considered in connection with the accompanying drawings. It should be noted that various features are not drawn to scale. In fact, the dimensions of the various features can be arbitrarily increased or decreased for the sake of discussion. Embodiments of the present disclosure will employ embodiments of the various features outlined above, drawings, and embodiments of the various features disclosed in this detailed description.

[0007] FIG. 1A is a top view of a semiconductor processing system according to some embodiments of the present disclosure;

[0008] FIG. 1B is a top view of a semiconductor processing system according to some embodiments of the present disclosure; FIG. 1A

[0009] FIG. 1C is a side view of a semiconductor manufacturing equipment in a semiconductor processing system according to some embodiments of the present disclosure; FIG. 1A

[0010] FIG. 2A is a flowchart of a method for operating a semiconductor processing system according to some embodiments of the present disclosure; FIG. 2B

[0011] FIG. 3 to FIG. 13 is a top view of a semiconductor processing system at various stages of operation according to some embodiments of the present disclosure;

[0012] FIG. 14 shows the relationship of pulses to time for various processes when operating a semiconductor processing system according to some embodiments of the present disclosure.

[0013]

Symbolic Representation

[0014] 100: carrier transfer assembly

[0015] 110: transfer robot

[0016] 112: robotic arm

[0017] 114: base

[0018] 120: movement mechanism

[0019] 121: carrier

[0020] 122: carrier table

[0021] 124: rail assembly

[0022] 124a, 124b: rail

[0023] 126: drive

[0024] 126a: servo motor

[0025] 126b: coupler ​​​

[0026] 126c: drive screw

[0027] 126e: encoder

[0028] 128a, 128b: light sensor

[0029] 129: cable track

[0030] 200: stocker apparatus

[0031] 200D, D1, X, Y, Z: direction

[0032] 200S1, 200S2: side

[0033] 210: first station

[0034] 220: second station

[0035] 222: unboxing device

[0036] 300: semiconductor manufacturing apparatus

[0037] 310: second area

[0038] 320: interface module

[0039] 322: transfer means

[0040] 330: semiconductor processing tool

[0041] 330A: exposure tool

[0042] 330B: deposition tool

[0043] 330C: etching tool

[0044] 330D: baking tool

[0045] 332: radiation source

[0046] 334: mask stage

[0047] 336: optical module

[0048] 338: substrate stage

[0049] 400: control system

[0050] 410: input device

[0051] 412: button

[0052] 420: output device

[0053] BP: bottom plate

[0054] CI, CO: dashed line

[0055] CP: cover

[0056] HA: hollow area / channel

[0057] LB: load boat

[0058] LBB: body

[0059] LBC: cover

[0060] M1, M2: method

[0061] MA: mask

[0062] MM: maintenance tool

[0063] P1: first region

[0064] P2: second region

[0065] S1-S17: step

[0066] W: wafer

[0067] WA: working area

[0068] WC: wafer carrier

[0069] SP: space / area DETAILED DESCRIPTION

[0070] The following disclosure provides many different embodiments, or examples, for implementing different characteristics of the provided subject matter. Specific examples of elements and configurations are described below to provide a thorough description of embodiments. Of course, these are simply examples, and are not intended to be limiting. For example, in the following description, forming a first feature over or on a second feature can include embodiments where the first and second features are formed in direct contact, and can also include embodiments where additional features can be formed between the first and second features such that the first and second features can not be in direct contact. Furthermore, the disclosure can repeat reference numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configurations discussed.

[0071] Further, for ease of description, spatial relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein to describe one component's or feature's relationship to another component or feature as illustrated in the figures. The spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial relative descriptors used herein interpreted accordingly. As used herein, "around", "about", "approximately", or "substantially" shall generally mean within 20 percent, or within 10 percent, or within 5 percent of a given value or range. Numerical values given herein are approximate, meaning that the term "around", "about", "approximately", or "substantially" can be inferred if not explicitly stated.

[0072] FIG. 1A is a top view of a semiconductor processing system according to some embodiments of the present disclosure. The semiconductor processing system includes a carrier transfer assembly 100, a stocker apparatus 200, a semiconductor manufacturing apparatus 300, and a control system 400. The carrier transfer assembly 100 is an automated transportation system that transfers wafer carriers WC between the stocker apparatus 200 and the semiconductor manufacturing apparatus 300. The wafer carriers WC can include wafer boxes, front-opening unified pods (FOUPs), cassettes, containers, or similar types of devices used to hold and / or store a plurality of wafers W.

[0073] The carrier transfer assembly 100 can include a transfer robot 110 and an automated movement mechanism 120 supporting the transfer robot 110. The transfer robot 110 has a range of motion sufficient to transfer the wafer carrier WC between the semiconductor manufacturing equipment 300 and the stocker equipment 200. For example, the transfer robot 110 is used to move the wafer carrier WC from the stocker equipment 200 to the semiconductor manufacturing equipment 300 and to move the wafer carrier WC from the semiconductor manufacturing equipment 300 to the stocker equipment 200. The movement mechanism 120 includes a stage 122 supporting the transfer robot 110 and a rail assembly 124. The rail assembly 124 can be a linear guide extending along a direction Dl, and the stage 122 can move along the direction Dl on the rail assembly 124. In some embodiments of the present disclosure, the stage 122 is located at a first region PI during a carrier transfer process and at a second region P2 during a maintenance process. The first region PI is closer to the load port 310 of the semiconductor manufacturing equipment 300 than the second region P2. For example, a minimum distance (or shortest distance) from the first region PI to the load port 310 is less than a minimum distance (or shortest distance) from the second region P2 to the load port 310.

[0074] In some embodiments of the present embodiments, the first region PI is aligned with a blank space / region in front of the load port 310 of the semiconductor manufacturing equipment 300 along the direction X. Also, the second region P2 can be aligned with the load port 310 of the semiconductor manufacturing equipment 300 along the direction X. In this context, the first region PI can be referred to as a working region, and the second region P2 can be referred to as a non-working region.

[0075] The stocker equipment 200 is an automated system for handling the wafer boxes LB. The wafer boxes LB are used to receive the wafer carriers WC and can be moved manually or automatically. For example, the wafer boxes LB have a main body LBB receiving the wafer carriers WC and a cover LBC covering an opening of the main body. In some embodiments, the stocker equipment 200 has a first station 210 for receiving the wafer boxes LB and a second station 220 for opening / closing the wafer boxes LB. The first station 210 can be referred to as a storage station. The second station 220 can be referred to as an opening / closing station. For example, an unboxing device 222 at the second station 220 can rotate the cover LBC, moving the cover LBC away from the main body LBB to expose an interior of the main body LBB or moving the cover LBC back to the main body LBB to cover the main body LBB.

[0076] In some embodiments, the stocker apparatus 200 has an elongated shape extending along a direction 200D, and the stocker apparatus 200 has two opposite sides 200S1 and 200S2 extending along the direction 200D. In some embodiments, the two sides 200S1 and 200S2 of the stocker apparatus 200 are respectively used for manual transportation and automatic transportation. For example, an operator at the side 200S1 can manually move a wafer cassette LB to the first station 210. In some embodiments, a transfer robot 110 or a transfer element of the stocker apparatus 200 can move the wafer cassette LB from the first station 210 to the second station 220. An unloading device 222 at the second station can open the wafer cassette LB to release a wafer carrier WC in the wafer cassette LB. Subsequently, a transfer robot 110 of the carrier transfer assembly 100 at the side 200S2 can automatically move the wafer carrier WC from the second station 220 to the semiconductor manufacturing apparatus 300.

[0077] The semiconductor manufacturing apparatus 300 includes one or more load ports 310 and semiconductor processing tools 330. The load ports 310 can be used to receive and support a wafer carrier WC from the transfer robot 110 of the carrier transfer assembly 100. The semiconductor processing tools 330 can include one or more tools 330A-330D to perform one or more semiconductor processes on one or more semiconductor substrates and / or devices. For example, the semiconductor processing tools 330 can include an exposure tool 330A (e.g., an extreme ultraviolet (EUV) tool, an electron beam (e-beam) tool), a deposition tool 330B (e.g., a tool to deposit one or more layers onto a semiconductor substrate), an etching tool 330C (e.g., a wet etching tool, a dry etching tool), a baking tool 330D, or another type of semiconductor processing tool.

[0078] The control system 400 can control various operations of the carrier transfer assembly 100, the stocker apparatus 200, and the semiconductor manufacturing apparatus 300 to perform carrier transfer processes and maintenance processes. For example, the control system 400 can control the carrier transfer assembly 100 to move the carrier table 122 to the first region PI for a carrier transfer process, and control the carrier transfer assembly 100 to move the carrier table 122 to the second region P2 for a carrier transfer process.

[0079] The control system 400 can include a computer-readable storage medium and a processor coupled to the computer-readable storage medium. The processor is to execute program instructions stored in the computer-readable storage medium. In some embodiments, the computer-readable storage medium stores program instructions to perform the operations discussed below. FIG. 2A and FIG. 2BThe program instructions of the various steps of the method in the flowchart of FIG. 10 can be stored in the memory media 402. The control system 400 controls the operation of the carrier transport assembly 100, the stocker apparatus 200, and the semiconductor manufacturing apparatus 300 by using a processor that reads and executes the program stored in the memory media. The program can be a program that has been stored in a computer-readable memory media, or can be a program that has been installed in the memory media of the control system 400. In some embodiments, the control system 400 can include a processor, a central processing unit (CPU), a multi-processor, a distributed processing system, a special application integrated circuit (ASIC), etc.

[0080] In some embodiments, the control system 400 can include an input device 410 and an output device 420, or a combined input / output device for enabling user interaction. The output device 420 is used to provide information to an operator. For example, the output device 420 can include a display, a printer, a speech synthesizer, etc. The input device 410 includes, for example, a keyboard, a keypad, a mouse, a trackball, a touchpad, and / or cursor direction keys for communicating information and commands to the processor of the control system 400. In the present embodiment, the input device 410 can include a button 412. The output device 420 includes, for example, a display, a printer, a speech synthesizer, etc. for communicating information to the user.

[0081] In FIG. 1A In some embodiments, the load port 310 can be configured along a direction X. In some embodiments, the direction D1 of the rail assembly 124 is inclined with respect to the direction X. For example, the angle between the direction D1 of the rail assembly 124 and the direction X along which the load port 310 is configured can be in the range of about 30 degrees to about 60 degrees. Also, in some embodiments, the direction 200D of the stocker apparatus 200 intersects the direction X. For example, the direction 200D of the stocker apparatus 200 can be substantially parallel to a direction Y that is orthogonal to the direction X. The direction D1 lies on the plane of the directions X and Y.

[0082] FIG. 1B is FIG. 1A A schematic view of a moving mechanism 120 of the carrier transport assembly 100 in the semiconductor processing system of FIG. 1. Reference is made to FIG. 1A and FIG. 1B The moving mechanism 120 includes a carrier 121, a stage 122, a rail assembly 124, and a drive device 126. The stage 122 is used to support the transport robot 110.

[0083] The guide rail assembly 124 can include a pair of guide rails 124a and 124b spaced apart from each other. The guide rails 124a and 124b are linear guides extending along the direction Dl, and the carrier 121 can move (e.g., slide) along the direction Dl on the guide rails 124a and 124b. The stage 122 is supported by the carrier 121 and thus can move along the Y direction. In the context, the carrier 121 can be referred to as a slide, a slider, a sliding member. The guide rails 124a and 124b and the carrier 121 can be made of a suitable rigid material, such as ceramic (e.g., aluminum oxide).

[0084] The drive device 126 includes a servo motor 126a, a coupler 126b, and a drive screw 126c. The servo motor 126a can convert electrical energy into rotational motion based on input signals from the control system 400. For example, the control system 400 can send a signal carrying a command to the servo motor 126a (and its encoder) for moving the stage 122 to the first region PI or the second region P2. The servo motor 126a uses feedback from its encoder 126e to ensure that it moves to the desired position or velocity accurately. The encoder 126e can include a sensor that converts the angular position of the motor shaft into an electrical signal. Thus, the encoder 126e can provide feedback about the position, velocity, and direction of the servo motor 126a. This feedback allows precise control of the movement between the first region PI and the second region P2, enabling applications that require accuracy and reliability.

[0085] The coupler 126b links the servo motor 126a with the drive screw 126c. This allows the rotational motion to be transmitted from the servo motor 126a to the drive screw 126c. The coupler 126b can also help to absorb shocks and reduce vibrations, ensuring smooth operation.

[0086] The drive screw 126c is a mechanical element for converting rotational motion into linear motion. The drive screw 126c is installed in a fixed position, while a nut (not shown) moves along the drive screw 126c as the drive screw 126c rotates. The stage 122 can be attached to the nut. In other words, rotation of the drive screw 126c causes the nut (and the attached stage 122) to move linearly in the direction (e.g., direction Dl) of the drive screw 126c.

[0087] The movement mechanism 120 can further include light sensors 128a and 128b to detect the position of the stage 122. For example, the light sensor 128a in the first region PI is used to check whether the stage 122 is in the first region PI, and the light sensor 128b in the second region P2 is used to check whether the stage 122 is in the second region P2.

[0088] In some embodiments, the light sensors 128a and 128b can include light detectors that can sense and measure the intensity of light or the presence of light. For example, when the stage 122 is at the first region PI and the second region P2 is not in the stage 122, the light sensor 128a will be shielded by the stage 122 and can not detect ambient light, while the light sensor 128b will be exposed by the stage 122 and can detect ambient light. On the other hand, when the stage 122 is at the second region P2 and the first region PI is not in the stage 122, the light sensor 128b will be shielded by the stage 122 and can not detect ambient light, while the light sensor 128a will be exposed by the stage 122 and can detect ambient light.

[0089] In some embodiments, the light sensors 128a and 128b can include light emitters to emit light (e.g., along the direction Z) and light receivers to detect light reflected by an object (e.g., the stage 122). The direction Z is orthogonal to the plane of the directions X and Y in FIG. 1A Therefore, when the stage 122 is at the first region PI and the second region P2 is not in the stage 122, the light emitted by the light receiver of the light sensor 128a will be detected by the light receiver of the light sensor 128a via reflection at the backside of the stage 122, and the light emitted by the light receiver of the light sensor 128b will not be detected by the light receiver of the light sensor 128b. And, when the stage 122 is at the second region P2 and the first region PI is not in the stage 122, the light emitted by the light receiver of the light sensor 128b will be detected by the light receiver of the light sensor 128b via reflection at the backside of the stage 122, and the light emitted by the light receiver of the light sensor 128a will not be detected by the light receiver of the light sensor 128a.

[0090] The moving mechanism 120 can include a main body / substrate BP to support various elements (e.g., the rails 124a and 124b, the light sensors 128a and 128b, the coupler 126b, the drive screw 126c, and the like) and a cover CP to shield the elements (e.g., the rails 124a and 124b, the light sensors 128a and 128b, the coupler 126b, the drive screw 126c, and the like) from environmental factors such as dust, moisture, and physical damage, which can extend the life of the cable.

[0091] The mobile mechanism 120 can further include a cable track 129 that includes protecting various cables and hoses connected to the robot system. The cables can transmit power and signals to the transfer robot 110. For example, the control system 400 can send signals carrying commands to the transfer robot 110 via cables in the cable track 129 for transferring a wafer carrier WC between the load port 310 of the semiconductor manufacturing equipment 300 and the stocker apparatus 200. The cable track 129 can shield the cables from environmental factors such as dust, moisture, and physical damage, which can prolong the life of the cables.

[0092] An operator can control the position of the stage 122 via the input device 410 of the control system 400 and the cables. For example, the operator can press the button 412 of the control system 400 to send a command to the drive device 126 via the cables to move the stage 122 to the second region P2. Also, the operator can release the button 412 of the control system 400 to send a command to the drive device 126 via the cables to move the stage 122 to the first region PI.

[0093] FIG. 1C is FIG. 1A a side view of the semiconductor manufacturing equipment 300. Reference is made to FIG. 1A and FIG. 1C . The semiconductor manufacturing equipment 300 further includes an interface module 320 to transfer a wafer W between a wafer carrier WC on the load port 310 and a semiconductor processing tool 330. For example, the interface module 320 can be an equipment front end module (EFEM). The interface module 320 can include a transfer tool 322 to transfer a semiconductor substrate between the wafer carrier WC and the semiconductor processing tool 330. For example, the transfer tool 322 can be a robot arm. In some embodiments, the transfer tool 322 transfers the wafer W between the wafer carrier WC and a staging area of the semiconductor processing tool 330.

[0094] In FIG. 1CIn some embodiments, the semiconductor processing system 300 is an exposure tool 330A. For example, the exposure tool 330A can perform a lithography exposure process to expose a photoresist layer on a wafer W using a respective radiation source 332. In the present embodiment, the wafer W is a semiconductor wafer, such as a silicon wafer or other type of wafer to be patterned. In the present embodiment, the wafer W is coated with a photoresist layer that is sensitive to light from the radiation source 332. In some embodiments, the radiation source 332 generates extreme ultraviolet (EUV) light, and the photoresist layer is a material that is sensitive to EUV light. In some embodiments, the exposure tool 330A can include various optical elements (e.g., mirrors) to direct light from the radiation source 332 to a mask stage 334, particularly to a mask MA that is secured on the mask stage 334.

[0095] The exposure tool 330A can further include a mask stage 334 to secure the mask MA. In some embodiments, the mask stage 334 includes an electrostatic chuck (e-chuck) to secure the mask MA. In the present context, mask and reticle are used interchangeably. In the present embodiment, the exposure tool 330A uses a transmission lithography technique, and the mask MA is a transmission mask that includes a transparent substrate that allows light from the radiation source 332 to be transmitted. In some other embodiments, the exposure tool 330A is an EUV lithography system, and the mask MA is a reflective mask that includes a reflective multilayer deposited on a substrate.

[0096] The exposure tool 330A can further include an optical module 336 to image a pattern of the mask MA onto a wafer W that is secured on a substrate stage (or wafer stage) 338 of the exposure tool 330A. In the present embodiment, the optical module 336 can include reflective optics. In some alternative embodiments, the optical module 336 can include refractive optics, reflective optics, or a combination thereof. The various elements including the above-mentioned elements are integrated together within the exposure tool 330A, and are operable to perform a lithography exposure process.

[0097] FIG. 2A and FIG. 2B is a flowchart of a method for operating a semiconductor processing system according to some embodiments of the present disclosure. FIG. 3 to FIG. 13 is a top view of a semiconductor processing system at various stages of operation according to some embodiments of the present disclosure. The method M1 includes steps S1-S7 for processing a wafer in a wafer carrier. The method M1 can be repeated for processing multiple wafer carriers. The method M2 includes steps S9-S17. The method M2 involves a maintenance process performed after an alarm signal is issued (as shown in step S8). It should be understood that the method M2 can be performed in place of the method M1, or in addition to the method M1. FIG. 2A and FIG. 2BAdditional steps are provided before, during and after the illustrated steps S1-S17, and some of the steps described below can be replaced or eliminated for additional embodiments of the method. The order of operations / processes can be interchangeable.

[0098] Referring to FIG. 2A and FIG. 3 Method M1 starts from step S1, in which a wafer cassette LB is placed on the stocker apparatus 200. As described above, the stocker apparatus 200 has two opposite sides 200S1 and 200S2 for manual transportation and automatic transportation, respectively. For example, a blank area / passageway HA indicated by a dashed line at the side 200S1 of the stocker apparatus 200 is connected to the main walk path without being blocked by any equipment / machine. Thus, an operator can walk in the blank area / passageway HA and approach the stocker apparatus 200 for moving the wafer cassette LB to the first station 210 in the stocker apparatus 200.

[0099] Referring to FIG. 2A and FIG. 4 Method M1 continues to step S2, in which the wafer cassette LB is opened on the stocker apparatus 200. As described above, after the wafer cassette LB is placed on the first station 210, the transfer robot 110 or the transfer element of the stocker apparatus 200 can move the wafer cassette LB from the first station 210 to the second station 220. And then, the wafer cassette LB can be opened by the wafer cassette opening device 222 at the second station 220 to expose the wafer carriers WC in the wafer cassette LB.

[0100] Referring to FIG. 2A and FIG. 5 Method M1 continues to step S3, in which the wafer carriers WC in the wafer cassette LB are transferred onto one of the load ports 310 of the semiconductor manufacturing apparatus 300 by using the transfer robot 110 at the first area P1. At this stage, the transfer robot 110 is supported by the stage 122 at the first area P1. In some embodiments, the transfer robot 110 has a mechanical arm 112 and a base 114 connected to the bottom of the mechanical arm 112 and supporting the bottom of the mechanical arm 112. The mechanical arm 112 is capable of extending / moving the wafer carriers WC between the second station 220 and the target port of the load ports 310. The base 114 can be mounted on the stage 122. For example, the base 114 of the transfer robot 110 remains stationary on the stage 122 during the movement of the mechanical arm 112 of the transfer robot 110.

[0101] Referring to FIG. 2A and FIG. 6Method Ml proceeds to step S4, where wafer W is moved from wafer carrier WC to processing tool 330. Subsequently, method Ml proceeds to step S5, where one or more semiconductor processes are performed on wafer W in processing tool 330. In some examples, when wafer W is moved to exposure tool 330A, an exposure process is performed to expose photoresist on wafer W. In some other examples, when wafer W is moved to deposition tool 330B, a film is deposited on wafer W. In some other examples, when wafer W is moved to etching tool 330C, material on wafer W is etched. In some other examples, when wafer W is moved to baking tool 330D, wafer W is baked. After the one or more semiconductor processes, method Ml proceeds to step S6, where wafer W is moved from processing tool 330 back to wafer carrier WC, as FIG. 7 described.

[0102] Referring FIG. 2B and FIG. 8 Method Ml proceeds to step S7, where wafer carrier WC on load port 310 of semiconductor manufacturing equipment 300 is transferred to wafer cassette LB on stocker equipment 200 by using transfer robot 110 at first region PI. At this stage, transfer robot 110 is supported by stage 122 at first region PI. The base 114 of transfer robot 110 remains stationary on stage 122 during movement of the mechanical arm 112 of transfer robot 110.

[0103] Method Ml can be repeated for processing multiple wafer carriers. After multiple repetitions of method Ml, the semiconductor manufacturing equipment can require maintenance processes, and the like, or a combination thereof. The semiconductor manufacturing equipment can issue an alarm signal, and an operator or control system 400 can receive the alarm signal. The operator or control system 400 can decide to perform method M2 directed to maintenance processes based on the alarm signal. For example, the maintenance processes can include alignment, calibration, intensity check, gas leakage check, cleaning, replacement of various elements, check of consumption status of various elements.

[0104] Referring FIG. 2B and FIG. 9 Method M2 proceeds to step S9, where stocker equipment 200 is moved away from work area WA. Work area WA can be aligned with a blank space / region in front of load port 310 of semiconductor manufacturing equipment 300 along direction X. In some embodiments, the movement of stocker equipment 200 can be done manually by an operator. In some alternative embodiments, stocker equipment 200 can be equipped with a movement mechanism and can be moved automatically under control of control system 400. After the movement of stocker equipment 200, work area WA is not in stocker equipment 200, which leaves a temporary blank space at work area WA.

[0105] Referring to FIG. 2B and FIG. 10 . The method M2 proceeds to step S10, the stage 122 supporting the transfer robot 110 is moved along the guide assembly 124 from the first area PI to the second area P2. For example, the control system 400 can control the drive device 126 (refer to FIG. 1B ) to move the stage 122 from the first area PI to the second area P2.

[0106] After the movement, the first area PI is not in the stage 122 and the transfer robot 110, which leaves a temporary empty space at the first area PI. Therefore, the empty space / area SP in front of the load port 310 of the semiconductor manufacturing apparatus 300, the temporary empty space at the first area PI, and the temporary empty space at the work area WA can form a temporary empty space / channel HB indicated by a dashed line along the direction X. The temporary empty space / channel HB is connected to the empty space / channel HA without being blocked by any apparatus / machine therebetween.

[0107] The method M2 proceeds to step Sll, in which the position of the stage 122 is checked and determined whether it is acceptable. The determination can include comparing the position of the stage 122 detected by the encoder 126e and the light sensors 128a, 128b in FIG. 1B with the theoretical position. If the distance / offset between the position of the stage 122 and the theoretical position is greater than a threshold value, the position of the stage 122 is determined to be unacceptable, and the method M2 proceeds to step S12. In step S12, the position of the stage 122 is adjusted. For example, the control system 400 can control the drive device 126 (refer to FIG. 1B ) to slightly move the stage 122 according to the comparison result. For example, for the adjustment of the position of the stage 122, the method M2 returns to step Sll. The adjustment of the position of the stage 122 in step S12 is repeated until the position of the stage 122 and the theoretical position are equal to or less than the threshold value.

[0108] If the distance / offset between the position of the stage 122 and the theoretical position is equal to or less than the threshold value, the position of the stage 122 is determined to be acceptable, and the method M2 proceeds to step S13. Referring to FIG. 2B and FIG. 11At step S13, a maintenance process is performed on the semiconductor manufacturing equipment 300 by allowing an operator to walk in the temporary blank area / passageway HB and approach the semiconductor manufacturing equipment 300, and / or moving a maintenance tool MM (e.g., a calibration tool, a cleaning tool, an inspection tool, and the like or a combination thereof) to the temporary blank area / passageway HB to approach the semiconductor manufacturing equipment 300. The maintenance process can include alignment, calibration, intensity inspection, gas leakage inspection, cleaning, replacement of various elements, inspection of a consumption state of various elements, and the like, or a combination thereof.

[0109] Referring to FIG. 2B and FIG. 12 , the method M2 proceeds to step S14, after the maintenance process, the stage 122 supporting the transfer robot 110 is moved along the rail assembly 124 from the second position P2 to the first position P1. For example, the control system 400 can control the drive device 126 (refer to FIG. 1B ) to move the stage 122 from the second area P2 to the first area P1. After the movement of the stage 122, FIG. 10 , the temporary blank area / passageway HB is blocked, and an operator is not allowed to approach the semiconductor manufacturing equipment 300.

[0110] The method M2 proceeds to step S15, in which the position of the stage 122 is checked and determined whether it is acceptable. The determination can include comparing the position of the stage 122 detected by the encoder 126e and the light sensors 128a, 128b in FIG. 1B with a theoretical position. If the distance / offset between the position of the stage 122 and the theoretical position is greater than a threshold, the position of the stage 122 is determined to be unacceptable, and the method M2 proceeds to step S16. At step S16, the position of the stage 122 is adjusted. For example, the control system 400 can control the drive device 126 (refer to FIG. 1B ) to slightly move the stage 122 according to the comparison result. For example, for the adjustment of the position of the stage 122, the method M2 returns to step S15. The adjustment of the position of the stage 122 in step S16 is repeated until the position of the stage 122 and the theoretical position are equal to or less than the threshold.

[0111] If the distance / offset between the position of the stage 122 and the theoretical position is equal to or less than the threshold, the position of the stage 122 is determined to be acceptable, and the method M2 proceeds to step S17. Referring to FIG. 2B and FIG. 13In step S17, the stocker apparatus 200 moves back to the work area WA. As described above, the work area WA can be aligned with a blank space / area in front of the load port 310 of the semiconductor manufacturing apparatus 300 along the direction X. The movement of the stocker apparatus 200 can be done manually by an operator. In some alternative embodiments, the stocker apparatus 200 can be equipped with a moving mechanism and can be moved automatically under the control of the control system 400. After the movement of the stocker apparatus 200, the work area WA is occupied by the stocker apparatus 200.

[0112] FIG. 14 The relationship between pulses and time for various processes when operating a semiconductor manufacturing apparatus according to some embodiments of the present disclosure is shown. In FIG. 14 , the dashed lines CI and CO are used to indicate the timing of wafer carrier transfers. The dashed line CI indicates the timing of the movement of the wafer carrier WC from the stocker apparatus 200 onto the load port 310 (e.g., steps S3 and FIG. 4 to FIG. 5 ). Also, the dashed line CO indicates the timing of the movement of the wafer carrier WC from the load port 310 to the stocker apparatus 200 (e.g., steps S7 and FIG. 7 to FIG. 8 ). As shown in FIG. 3 to FIG. 13 , when the robot arm 112 is in the first position PI, the wafer carrier WC is transferred onto and away from the load port 310 to perform semiconductor processes on the plurality of wafers W (e.g., steps S5 and FIG. 6 ). Also, when the robot arm 112 is in the second position P2, a maintenance process is performed (e.g., steps S13 and FIG. 11 ).

[0113] Based on the above discussion, it can be seen that the present disclosure provides advantages. However, it should be understood that other embodiments can provide additional advantages, and not all advantages need be disclosed in this document, and particular advantages need not be present in all embodiments. One advantage is that the carrier transfer robot is mounted on an automatic moving mechanism so that the carrier transfer robot can move to create a passage to the semiconductor process apparatus, allowing a maintenance process on the semiconductor process apparatus. Another advantage is that the carrier transfer robot can move automatically at a fast speed. Another advantage is that the carrier transfer robot can move precisely to a desired position by an encoder and a light sensor. Another advantage is that the semiconductor manufacturing apparatus, the carrier transfer robot, and the stocker apparatus are properly configured to save space in a manufacturing environment.

[0114] According to some embodiments of this disclosure, a method for operating a semiconductor processing system is provided. The method includes the following steps: performing a semiconductor process by a semiconductor manufacturing apparatus, wherein the semiconductor manufacturing apparatus includes a plurality of load ports configured substantially along a first direction in a top view; moving a load table between a first region and a second region substantially along a second direction intersecting the first direction in the top view, wherein the load table supports a transfer robot, and a minimum distance from the first region to the plurality of load ports is less than a minimum distance from the second region to the plurality of load ports; transferring a wafer carrier between a stocker apparatus and the semiconductor manufacturing apparatus using the transfer robot when the load table is located at the first region; and performing a maintenance process on the semiconductor manufacturing apparatus when the load table is located at the second region.

[0115] According to some embodiments of this disclosure, a method for operating a semiconductor processing system is provided. The method includes the following steps: transferring a wafer carrier from a stocker apparatus to one of a plurality of load ports of a semiconductor manufacturing apparatus by using a transfer robot at a work region; performing a semiconductor process by the semiconductor manufacturing apparatus; after the semiconductor process, transferring the wafer carrier from the one of the plurality of load ports of the semiconductor manufacturing apparatus to the stocker apparatus by using the transfer robot at the work region; and moving the transfer robot away from the work region after transferring the wafer carrier from the one of the plurality of load ports of the semiconductor manufacturing apparatus to the stocker apparatus using a moving mechanism.

[0116] According to some embodiments of this disclosure, a semiconductor processing system includes a semiconductor manufacturing apparatus, a stocker apparatus, and a carrier transfer assembly between the stocker apparatus and the semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a plurality of load ports. The carrier transfer assembly includes a transfer robot and a moving mechanism. The transfer robot has a motion range sufficient to transfer a wafer carrier between the semiconductor manufacturing apparatus and the stocker apparatus; and the moving mechanism is located between the stocker apparatus and the semiconductor manufacturing apparatus. The moving mechanism includes a load table and a driving device. The load table supports the transfer robot. The driving device is operable to move the load table between a first region and a second region, wherein a shortest distance from the first region to the plurality of load ports is shorter than a shortest distance from the second region to the plurality of load ports.

[0117] In some embodiments, a semiconductor processing apparatus includes a semiconductor manufacturing equipment, a stocker equipment, and a carrier transfer assembly. The semiconductor manufacturing equipment includes a plurality of load ports. The carrier transfer assembly is located between the stocker equipment and the semiconductor manufacturing equipment. The carrier transfer assembly includes a transfer robot and a movement mechanism. The transfer robot is located between the semiconductor manufacturing equipment and the stocker equipment. The movement mechanism includes a stage supporting the transfer robot and a drive device disposed beside the stage. The movement mechanism further includes a guide rail and a carrier. The carrier supports the stage and is movably disposed on the guide rail. The plurality of load ports of the semiconductor manufacturing equipment are substantially arranged along a first direction in a top view. The plurality of load ports of the semiconductor manufacturing equipment are substantially arranged along a first direction in a top view, and the movement mechanism includes a guide rail extending along a second direction, and the second direction intersects the first direction in the top view. The movement mechanism further includes a light sensor, a detection range of the light sensor covering a position of the stage. The stocker equipment includes an unboxing device.

[0118] In some embodiments, a semiconductor processing apparatus includes a semiconductor manufacturing equipment, a stocker equipment, and a carrier transfer assembly. The semiconductor manufacturing equipment includes a plurality of load ports. The carrier transfer assembly is located between the stocker equipment and the semiconductor manufacturing equipment. The carrier transfer assembly includes a transfer robot and a movement mechanism. The transfer robot is located between the semiconductor manufacturing equipment and the stocker equipment. The movement mechanism includes a movable stage and a drive device. The movable stage supports the transfer robot. The drive device is connected to the movable stage. The drive device includes a servo motor. The drive device further includes a coupler between the servo motor and the stage.

[0119] In some embodiments, a semiconductor processing apparatus includes a semiconductor manufacturing equipment, a stocker equipment, and a carrier transfer assembly. The semiconductor manufacturing equipment includes a plurality of load ports. The carrier transfer assembly is located between the stocker equipment and the semiconductor manufacturing equipment. The carrier transfer assembly includes a transfer robot and a movement mechanism. The transfer robot is located between the semiconductor manufacturing equipment and the stocker equipment. The movement mechanism includes a stage, a track assembly, and a cable track. The stage supports the transfer robot. The track assembly includes a pair of tracks below the stage. The cable track is electrically connected to the transfer robot. At least a portion of the cable track extends along parallel to the pair of tracks of the track assembly.

[0120] The foregoing summary of features of the various embodiments serves to provide a better understanding of the nature and spirit of the disclosure. Those skilled in the art will readily appreciate that the disclosure can be readily used as the basis for the designing or modifying other processes and structures as the same serve the same purposes and / or achieve the same ends as those introduced here. Those skilled in the art will further appreciate that such equivalent constructions do not depart from the spirit and scope of the disclosure, and that changes can be made in form and detail without departing from the spirit and the scope of the disclosure.

Claims

1. A semiconductor processing apparatus characterized by comprising: A semiconductor manufacturing apparatus comprising a plurality of load ports; A stocker apparatus; and A carrier transfer assembly located between the stocker apparatus and the semiconductor manufacturing apparatus, wherein the carrier transfer assembly comprises: A transfer robot located between the semiconductor manufacturing apparatus and the stocker apparatus; and A movement mechanism comprising: A stage supporting the transfer robot; and A drive device disposed adjacent to the stage. Wherein the movement mechanism further comprises:

2. The semiconductor processing apparatus of claim 1, wherein A guide rail; and A carrier supporting the stage and movably disposed on the guide rail. Wherein the plurality of load ports of the semiconductor manufacturing apparatus are arranged substantially along a first direction in a top view.

3. The semiconductor processing apparatus of claim 1, wherein Wherein the plurality of load ports of the semiconductor manufacturing apparatus are arranged substantially along a first direction in a top view, and the movement mechanism comprises a guide rail extending along a second direction, and the second direction intersects the first direction in the top view.

4. The semiconductor processing apparatus of claim 1, wherein Wherein the movement mechanism further comprises a light sensor.

5. The semiconductor processing apparatus of claim 1, wherein Wherein the stocker apparatus comprises an unboxing device.

6. The semiconductor processing apparatus of claim 1, wherein A semiconductor manufacturing apparatus comprising a plurality of load ports; 7. A semiconductor processing apparatus, characterized by comprising: A stocker apparatus; and A carrier transfer assembly located between the stocker apparatus and the semiconductor manufacturing apparatus, wherein the carrier transfer assembly comprises: A transfer robot located between the semiconductor manufacturing apparatus and the stocker apparatus; and A movement mechanism comprising: A movable stage supporting the transfer robot; and A drive device connected to the movable stage, the drive device comprising a servo motor. Wherein the drive device further comprises a coupler located between the servo motor and the movable stage. A semiconductor manufacturing apparatus comprising a plurality of load ports; 8. The semiconductor processing apparatus of claim 7, wherein A stocker apparatus; and 9. A semiconductor processing apparatus, characterized by comprising: A carrier transfer assembly located between the stocker apparatus and the semiconductor manufacturing apparatus, wherein the carrier transfer assembly comprises: A transfer robot located between the semiconductor manufacturing apparatus and the stocker apparatus; and A movement mechanism comprising: A stage supporting the transfer robot; A track assembly comprising a pair of tracks located below the stage; and A cable track electrically connected to the transfer robot. Wherein at least a portion of the cable track extends along parallel to the pair of tracks of the track assembly. ​ ​ 10. The semiconductor processing apparatus of claim 9, wherein, ​

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