Plate carrying device and chip mass transfer equipment

Abstract

The utility model discloses a plate carrying device and chip mass transfer equipment, and relates to the technical field of semiconductor manufacturing, and the plate carrying device comprises a first moving mechanism, a positioning mechanism and a lifting mechanism. The positioning mechanism is arranged on the first movable mechanism, an adjustable plate positioning space is formed in the positioning mechanism, high flexibility and adaptability are achieved, it is ensured that each base plate can be accurately guided and roughly positioned in the process of being fed into the plate positioning space, the positioning mechanism is provided with a pressing plate assembly, and the pressing plate assembly is convenient to use. And the problem of possible warping of the plate is eliminated, so that the problem that the chip pricking precision is reduced due to unevenness of the plate is avoided. The lifting mechanism is arranged on the first movable mechanism, dynamic compensation can be carried out in the preset direction through the first movable mechanism, and therefore the control logic of the mechanical system is effectively simplified, and the object placing table is arranged on the lifting mechanism and can be driven by the lifting mechanism to do lifting motion in the direction close to or away from the plate positioning space.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing especially relates to a plate carrying device and chip mass transfer equipment. BACKGROUND

[0002] As a key means to realize high-precision connection between chips and substrates, the process efficiency and precision of mass transfer technology have a crucial impact on the performance and yield of the final product. Among them, the crystal piercing process, as a method of mass transfer technology, the common implementation is to arrange the tiny chips (i.e. crystal grains) attached to the blue film on the bottom of the substrate according to a certain arrangement order by moving the mechanism loading the piercing needle, so as to realize fast and efficient crystal grain transfer.

[0003] However, in practical application, the crystal piercing process faces a series of technical challenges. First, the size and thickness difference between substrates will bring difficulties to automation processing. In the existing process, the conveying device needs to be adjusted accordingly for substrates of different sizes, especially the manual adjustment of the clamp height to adapt to the change of substrate thickness. This process not only consumes time and effort, but also the error caused by manual adjustment may affect the subsequent alignment accuracy. Second, the warping problem of large-size substrates also makes their overall flatness low, which leads to fluctuations in process height during the crystal piercing process, thereby affecting the die bonding accuracy and reducing the product yield. In addition, the micro-compensation complexity in the high-frequency punching process is also an important factor restricting the improvement of the precision of the crystal piercing process. In order to overcome the small slope between the crystal grain arrangement on the blue film and the surface of the substrate, dynamic micro-compensation of the axis of the crystal piercing head is usually required. However, in high-speed, high-frequency punching operation, there is a complex coupling effect between the axes of the mechanical system, and the system rigidity limit makes it extremely difficult to control accurately. This not only requires a highly complex control algorithm, but also may cause inaccurate compensation due to mechanical response lag, thereby affecting the accuracy of the die bonding position. SUMMARY

[0004] The purpose of the embodiment of the utility model is to provide a plate carrying device and chip mass transfer equipment which can solve the above-mentioned problems existing in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] In the first aspect, a plate carrying device is provided, comprising:

[0007] A first movable mechanism;

[0008] A positioning mechanism is arranged on the first movable mechanism and is configured to allow the reciprocating movement of the first movable mechanism along a preset direction on a horizontal plane. The positioning mechanism is formed with an adjustable plate positioning space, and a pressing plate assembly is arranged on the positioning mechanism and at least partially located in the plate positioning space.

[0009] A lifting mechanism is arranged on the first movable mechanism and is configured to move synchronously with the positioning mechanism along a preset direction.

[0010] A storage platform is arranged on the lifting mechanism and is capable of moving up and down under the driving of the lifting mechanism to approach or move away from the plate positioning space.

[0011] As an optional embodiment, the positioning mechanism comprises:

[0012] A support member is movably mounted on the first movable mechanism.

[0013] A fixed support is fixedly mounted on the support member.

[0014] A movable support is movably arranged on the support member, and the plate positioning space is formed between the movable support and the fixed support. The movable support is capable of reciprocating to approach or move away from the fixed support to adjust the plate positioning space.

[0015] A first conveying assembly is arranged between the fixed support and the movable support and is configured to allow the driving plate to move between the fixed support and the movable support.

[0016] As an optional embodiment, the positioning mechanism is provided with a first guide component and a second guide component on opposite sides of the plate positioning space. The first guide component is provided with a blocking assembly and a pushing assembly, and both the blocking assembly and the pushing assembly are capable of moving in the direction of extending into or moving away from the plate positioning space.

[0017] When the blocking assembly is in the state of extending into the plate positioning space, the blocking assembly is configured to block the plate from staying at a preset position in the plate positioning space.

[0018] The pushing assembly is configured to push the plate in the plate positioning space to the second guide component.

[0019] As an optional embodiment, the first guide component is provided with a plurality of expansion grooves extending through opposite sides of the first guide component along the length direction of the first guide component.

[0020] The pushing assembly comprises at least two first telescopic mechanisms, each of which is adjustable along the length direction of the first guide component, one end of each of the first telescopic mechanisms is movably installed on the positioning mechanism, and the other end of each of the first telescopic mechanisms is configured to extend into or away from the plate positioning space through the telescopic slot.

[0021] The pushing assembly comprises at least two second telescopic mechanisms, each of which is adjustable along the length direction of the first guide component, and each of the second telescopic mechanisms is located between any two of the first telescopic mechanisms, one end of each of the second telescopic mechanisms is movably installed on the positioning mechanism, and the other end of each of the second telescopic mechanisms is configured to extend into or away from the plate positioning space through the telescopic slot.

[0022] As an optional embodiment, the pressing plate assembly comprises:

[0023] A limiting component is fixedly installed on the upper side of the positioning mechanism and extends in the height direction;

[0024] A tablet pressing support is movably arranged on the limiting component, at least part of the tablet pressing support is located in the plate positioning space, and the tablet pressing support is configured to have a freedom of movement in the height direction to approach and move away from the plate positioning space on the limiting component;

[0025] An elastic component is further arranged between the tablet pressing support and the limiting component, and the elastic component is configured to continuously apply an elastic force to the tablet pressing support to approach the plate positioning space.

[0026] As an optional embodiment, the lifting mechanism is configured as a wedge-shaped lifting platform.

[0027] As an optional embodiment, the object placing platform is detachably arranged on the lifting mechanism.

[0028] Furthermore, the surface of the object placing platform is concavely provided with a plurality of adsorption grooves that are interconnected, and the groove bottoms of at least part of the adsorption grooves are provided with adsorption holes.

[0029] As an optional embodiment, two connection mechanisms are further included, the connection mechanisms are formed with a conveying channel for conveying plates, and the two connection mechanisms are respectively arranged on opposite sides of the first movable mechanism.

[0030] The positioning mechanism reciprocates along the preset direction between a feeding position and a processing position; in a state where the positioning mechanism is located at the feeding position, the opposite ends of the plate positioning space are respectively communicated with the two conveying channels; in a state where the positioning mechanism is located at the processing position, the two connecting mechanisms are configured to move to the two conveying channels in communication with each other in the direction of approaching each other.

[0031] As an optional implementation, the connecting mechanism comprises a fixed support plate and a movable support plate capable of approaching and moving away from the fixed support plate, and the fixed support plate is spaced apart from the movable support plate and defines the conveying channel;

[0032] A second conveying assembly is further arranged between the fixed support plate and the movable support plate, and the second conveying assembly is configured to allow the driving plate to reciprocate along the conveying channel;

[0033] The fixed support plate and the movable support plate are movably arranged on the pneumatic slide table through the support bottom plate.

[0034] In a second aspect, a chip mass transfer device is provided, comprising:

[0035] The plate carrying device as claimed in the first aspect.

[0036] The plate carrying device has the following beneficial effects: the first movable mechanism is arranged, so that the plate (substrate) can be dynamically compensated along the preset direction under the positioning of the positioning mechanism, the complex compensation of the wafer picking head in the traditional chip mass transfer device is abandoned, the control logic of the mechanical system is effectively simplified, the decoupling between the axes where the wafer picking head is located is promoted, the structural rigidity of the axes is significantly enhanced, the control difficulty is reduced, and the precision and stability of the wafer picking operation are improved.

[0037] The adjustable plate positioning space of the positioning mechanism can be adjusted according to plate pieces of different sizes, has high flexibility and adaptability, ensures that each substrate can be accurately guided and roughly positioned during feeding into the plate positioning space, improves the automation level of plate processing, and lays a solid foundation for subsequent accurate wafer picking operation. Moreover, the pressing plate assembly is arranged on the positioning mechanism, and under the cooperation of the lifting mechanism and the placement table, the surfaces of plate pieces of different thicknesses can be kept in a substantially horizontal state, the consistency of the plate pieces is ensured, and the wafer picking precision is improved.

[0038] The first moving mechanism is designed to reciprocate in a preset direction, enabling the board to be transported quickly and smoothly between the chip-piercing station and the upstream and downstream stations. This not only shortens the production cycle but also effectively improves the overall efficiency of chip transfer. Attached Figure Description

[0039] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0040] Figure 1 This is one of the structural schematic diagrams of the plate transport device described in the embodiments of this utility model;

[0041] Figure 2 This is a schematic diagram showing the cooperation state of the positioning mechanism and the lifting mechanism described in an embodiment of this utility model;

[0042] Figure 3 This is a schematic diagram of the positioning mechanism structure described in an embodiment of the present utility model;

[0043] Figure 4 This is a schematic diagram of the lifting mechanism structure described in an embodiment of the present utility model;

[0044] Figure 5 This is a front view of the lifting mechanism described in an embodiment of the present utility model;

[0045] Figure 6 This is a schematic diagram of the shelf structure described in an embodiment of the present utility model;

[0046] Figure 7 This is a schematic diagram of the pressure plate assembly structure according to an embodiment of the present utility model;

[0047] Figure 8 This is a front view of the pressure plate assembly described in an embodiment of the present utility model;

[0048] Figure 9 for Figure 8 A sectional view along the AA direction;

[0049] Figure 10 This is the second schematic diagram of the plate transport device described in this embodiment of the utility model;

[0050] Figure 11 This is the third schematic diagram of the plate transport device described in this embodiment of the utility model;

[0051] Figure 12 This is a schematic diagram of the connection mechanism described in an embodiment of the present utility model.

[0052] In the figure: 10, first movable mechanism; 20, positioning mechanism; 21, support member; 22, fixed support; 221, second guide component; 23, movable support; 231, first guide component; 2311, telescopic groove; 232, first telescopic mechanism; 233, second telescopic mechanism; 24, first conveying assembly; 25, pressing plate assembly; 251, limiting component; 252, tablet support; 253, elastic component; 30, lifting mechanism; 31, base; 32, wedge-shaped block; 33, lifting platform; 34, guide device; 35, driving mechanism; 36, placing table; 361, adsorption groove; 362, adsorption hole; 40, connecting mechanism; 41, fixed support plate; 42, movable support plate; 43, support bottom plate; 44, pneumatic sliding table; 45, second conveying assembly; 46, first connecting assembly; 47, second connecting assembly; 50, support base body. DETAILED DESCRIPTION

[0053] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the embodiment of the utility model is further described in detail below. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all the other embodiments obtained by the person skilled in the art without making the creative labor belong to the scope of protection of the utility model.

[0054] In the description of the utility model, unless there is explicit definition and limitation, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication inside two elements or the interaction relationship of two elements. For the person skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0055] In the utility model, unless there is explicit definition and limitation, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0056] As the background technology shows, the crystal spike process faces a series of technical challenges in its practical application in chip mass transfer equipment. First, the diversity of substrate size and thickness poses difficulties for automated processing. In existing processes, the conveyor devices connecting upstream and downstream stations, as well as the fixtures in the chip mass transfer equipment, all need to be adjusted accordingly for substrates of different sizes. Especially when manual adjustment is required, this process is not only time-consuming and labor-intensive, but the errors caused by manual adjustment may also affect the subsequent alignment accuracy.

[0057] Secondly, the warping of large-size substrates themselves also leads to a lower overall flatness, which is a key factor affecting the precision of the die bonding process. As electronic products move towards miniaturization and integration, the use of large-size substrates is increasing. However, large-size substrates are prone to warping due to factors such as material internal stress and processing errors, resulting in poor surface flatness. This unevenness can cause fluctuations in the process height during die bonding, thereby affecting the die bonding precision and reducing product yield.

[0058] Furthermore, controlling the substrate loading angle is also a critical challenge in current crystal spike manufacturing processes. On automated production lines, the substrate loading angle is often difficult to control precisely, primarily due to mechanical errors in the loading mechanism and minute deformations of the material itself. This uncontrollable angle leads to angular deviations during crystal placement. Even with subsequent correction via camera recognition, this increases production time and costs, and the subjectivity of manual adjustments may introduce new sources of error.

[0059] Finally, the complexity of micro-compensation during high-frequency die bonding is also a significant factor limiting the improvement of die bonding accuracy. To overcome the slight slope between the grain arrangement on the blue film and the substrate surface, dynamic micro-compensation is usually required for the axis of the die bonding head. However, in high-speed, high-frequency die bonding operations, there are complex coupling effects between the axes of the mechanical system, coupled with system rigidity limitations, making precise control extremely difficult. This not only requires highly complex control algorithms but may also lead to inaccurate compensation due to mechanical response lag, thus affecting the accuracy of the die bonding position.

[0060] In summary, the existing crystal spike process has significant shortcomings in handling diverse substrates, controlling the flatness of large-size boards, ensuring the stability of the feeding angle, and providing micro-compensation under high-frequency operation, which limits the further improvement of production efficiency and product quality.

[0061] In view of this, this embodiment provides a board transport device, which is suitable for board (substrate) transfer operations in chip mass transfer equipment. Based on the horizontal and vertical movable mechanisms, it further includes a positioning mechanism and a pressure plate assembly, allowing the board to be stably constrained in a preset position and to move horizontally and vertically. This improves the adaptability of the chip mass transfer equipment to boards of different sizes and thicknesses, simplifies the control logic of the mechanical system in the chip mass transfer equipment, and solves the related technical problems mentioned in the background art.

[0062] Please refer to the instruction manual attached. Figures 1-2 The board transport device includes a first movable mechanism 10. In the actual application scenario of chip mass transfer equipment, the first movable mechanism 10 can be directly installed on the base of the equipment, or installed on the base of the chip mass transfer equipment through the support base 50.

[0063] For example, the first movable mechanism 10 generally has a fixed end and a driving end. The fixed end is used to be mounted on the base, while the driving end is movably engaged with the fixed end in a preset direction. The first movable mechanism 10 is the core component in the board transport device that realizes the horizontal movement of the board. It can drive the board to move stably and accurately in the horizontal direction through, but is not limited to, linear guide rail and slider structure, ball screw structure, synchronous belt or chain transmission structure, cylinder or hydraulic cylinder direct drive structure, linear motor direct drive structure, etc., to ensure that the board can be smoothly transferred from the conveying device to the die-splitting station of the chip mass transfer equipment, or moved between other stations that need to be transferred.

[0064] Based on the aforementioned structure, the board transport device further includes a positioning mechanism 20. The positioning mechanism 20 is disposed at the drive end of the first movable mechanism 10 and configured to allow reciprocating motion in a preset direction on a horizontal plane via the first movable mechanism 10. In practical applications of chip mass transfer equipment, the positioning mechanism 20 can accurately fix the board in a preset position, ensuring that it will not shift or shake during transport.

[0065] It should be explained here that the preset direction mentioned above refers to the direction of movement of the sheet metal on the horizontal plane. This direction is typically determined based on factors such as production line layout, equipment arrangement, and process flow. In the sheet metal transport device provided in this embodiment, the first movable mechanism 10 moves along this preset direction positioning mechanism 20, thereby achieving horizontal transfer of the sheet metal.

[0066] The positioning mechanism 20 specifically forms an adjustable plate positioning space that can accommodate plates. The adjustable plate positioning space is designed to adapt to plates of different sizes, ensuring that the plates can be accurately positioned in the preset position within the plate positioning space when they are transported to the positioning mechanism 20.

[0067] For example, the plate positioning space on the positioning mechanism 20 is set to be defined by at least two limiting structures. By adjusting the distance between the two limiting structures, the plate positioning space can be adjusted. As for the specific adjustment method of the plate positioning space, this embodiment will not describe it in detail here. It can be achieved by using a lead screw pair, direct drive of a motor, cylinder or hydraulic cylinder, etc.

[0068] It should be noted that in this embodiment, the positioning mechanism 20 does not specifically constrain the positioning of the plate by clamping the plate, but adopts a non-contact positioning method, such as a stop block, guide block, or other structure, to limit the specific positioning position of the plate. These structures can serve as positioning references during the positioning process of the plate, accurately limiting the moving direction and specific stopping position of the plate, and ensuring its stability and accuracy during the transfer process.

[0069] In addition, by precisely adjusting the positioning space of the board, the stability and accuracy of the board during transportation can be maintained, which helps to reduce errors and failures during transportation, improves the overall transportation efficiency, and avoids potential damage to the board.

[0070] It should be understood that the plate positioning space in the positioning mechanism 20 has an adjustable width. At least one end of the plate positioning space in the length direction can be connected to the external environment, so that the plate can enter and exit the plate positioning space from at least one end of the positioning mechanism 20 along the length direction. By adjusting the width of the plate positioning space, the positioning mechanism 20 can adapt to plates of different widths, so that the same set of transport devices can handle plates of various sizes, thereby improving the versatility and flexibility of the equipment.

[0071] Based on the positioning mechanism 20 provided above, the positioning mechanism 20 is equipped with a pressure plate assembly 25, which is at least partially located within the board positioning space. Specifically, a portion of the structure of the pressure plate assembly 25 is projected onto the board positioning space in the height direction of the positioning mechanism 20. Thus, when the board is in the board positioning space, its upper surface can be resisted by the pressure plate assembly 25. In the actual application scenario of chip mass transfer equipment, the pressure plate assembly 25 is specifically responsible for pressing the upper surface of the board during the board transfer process, thereby pressing the board firmly onto the stage 36 to ensure its stability and accuracy before the chip insertion operation.

[0072] Understandably, the pressure plate assembly 25 is generally positioned at the edge of the board positioning space. This allows the pressure plate assembly 25 to apply pressure to the edge of the board when it is within the positioning space, ensuring it is fixed to the stage 36 while also addressing positioning and edge warping issues. The pressure plate assembly 25 is mounted on the positioning mechanism 20, allowing it to adjust simultaneously with the positioning mechanism 20's adjustment of the board positioning space. This enables the board positioning space to accommodate boards of different sizes, while the pressure plate assembly 25 can also support the edges of boards of corresponding sizes. This adjustability can be achieved by adjusting the position, angle, or pressure of the pressure plate to ensure it fits tightly against the edge of the PCB board, preventing wobbling or shifting during transport.

[0073] Please continue to refer to the instruction manual appendix. Figures 1-2 The plate transport device also includes a lifting mechanism 30. Based on the above embodiment, the lifting mechanism 30 is disposed at the drive end of the first movable mechanism 10, specifically between the first movable mechanism 10 and the positioning mechanism 20. Under the premise that the positioning mechanism 20 is also installed on the first movable mechanism 10, the lifting mechanism 30 moves along the preset direction through the first movable mechanism 10, and the positioning mechanism 20 also moves synchronously with the lifting mechanism 30 along the preset direction.

[0074] In practical applications, the lifting mechanism 30 moves along the height direction (perpendicular to the horizontal plane) to enable the plate constrained on the positioning mechanism 20 to be transferred in the vertical direction. When the lifting mechanism 30 is provided with a platform 36, the lifting mechanism 30 can press the lower surface of the plate in the plate positioning space against the pressure plate assembly 25 of the positioning mechanism 20 through the platform 36, so as to adapt to plates of different thicknesses and different positioning positions preset by the positioning mechanism 20.

[0075] Similarly, the lifting mechanism 30 also has a fixed end and a driving end. Its driving end is mounted on the fixed end in a lifting manner. The fixed end of the lifting mechanism 30 is mounted on the driving end of the first movable mechanism 10, and the positioning mechanism 20 is also mounted on the driving end of the first movable mechanism 10. The two can be integrated and set on a support structure at the same time, so as to realize the synchronous movement of the lifting mechanism 30 and the positioning mechanism 20 on the first movable mechanism 10.

[0076] For example, this embodiment does not have strict limitations or requirements on the specific structural form of the lifting mechanism 30. It may be, but is not limited to, a scissor lift mechanism 30, a chain or wire rope traction lift mechanism 30, a pneumatic or hydraulic lift mechanism 30, a screw lift mechanism 30, a mast lift mechanism 30, etc.

[0077] Based on the above implementation method, the lifting mechanism 30 is also provided with a platform 36, which can move up and down towards or away from the board positioning space under the drive of the lifting mechanism 30. Specifically, the projection of the platform 36 in the vertical direction of the board carrying device is located within the projection of the board positioning space, avoiding interference between the platform 36 and the positioning mechanism 20. In the specific application scenario of the chip mass transfer device, the platform 36 can enter and exit the board positioning space in the vertical direction under the drive of the lifting mechanism 30, allowing it to cooperate with the positioning mechanism 20 to constrain and release the board in the vertical direction.

[0078] Specifically, the platform 36 is positioned above the lifting mechanism 30 to achieve vertical lifting movement under the drive of the lifting mechanism 30. Its main function is to provide a stable and flat support surface for placing and transferring the substrate, ensuring that it can stably and reliably support the substrate.

[0079] Based on the above-described embodiments, the operating steps of the plate transport device in practical applications are provided as follows:

[0080] The plate is conveyed from one end of the positioning mechanism 20 to the plate positioning space. The positioning mechanism 20 supports at least two opposite edges of the plate and drives the plate to adjust its position in the plate positioning space so that the plate is positioned in the horizontal direction to a preset position.

[0081] The lifting mechanism 30 drives the platform 36 to rise to the target position, so that the platform 36 supports the lower surface of the board and the upper edge of the board abuts against the pressure plate assembly 25. The platform 36 and the pressure plate assembly 25 work together to press the board and position the board in the vertical direction.

[0082] The first moving mechanism 10 drives the lifting mechanism 30 and the positioning mechanism 20 to move along the preset direction to the crystal-piercing station of the chip mass transfer equipment and implement the crystal-piercing process. During the crystal-piercing process, the first moving mechanism 10 performs dynamic micro-compensation by reciprocating along the preset direction according to the specific position of each micro-chip to ensure that the micro-chips meet the process requirements on the board.

[0083] After the crystal-piercing process is completed, the first active mechanism 10 drives the lifting mechanism 30 and the positioning mechanism 20 to move along the preset direction and disengage from the crystal-piercing station of the chip mass transfer equipment. The lifting mechanism 30 drives the platform 36 to descend and disengage from the lower surface of the board, so that the edge of the upper surface of the board is also released by the pressure plate assembly 25. The board is then supported by the positioning mechanism 20 again, allowing the board to be sent out from the board positioning space.

[0084] In response to the numerous challenges in the chip mass transfer technology, particularly the flatness of large-size boards, uncontrollable angles, and the complexity of micro-compensation during high-frequency component assembly, the board transport device of this application provides an innovative solution that significantly improves production efficiency and product yield.

[0085] Firstly, by incorporating a first movable mechanism 10, the plate carrier enables the plate (i.e., the substrate) to dynamically compensate along a preset direction under the precise positioning of the positioning mechanism 20. This design abandons the traditional approach of complex compensation for the crystal-piercing head, instead using the plate's own dynamic adjustment to match the position of the crystal-piercing head. This effectively simplifies the control logic of the mechanical system, promotes decoupling between the axes where the crystal-piercing head is located, and significantly enhances the structural rigidity of the axes. This transformation not only reduces the control difficulty but also improves the accuracy and stability of the crystal-piercing operation.

[0086] Secondly, the adjustable plate positioning space of the positioning mechanism 20 can be adjusted according to the different sizes of plates to ensure that each plate is accurately guided and coarsely positioned during the process of being fed into the positioning space. This not only improves the automation level of plate processing, but also lays a solid foundation for subsequent precise crystal-piercing operations.

[0087] It is worth mentioning that the pressure plate assembly 25 further provided on the positioning mechanism 20, under the coordinated action of the lifting mechanism 30 and the placement table 36, can ensure that the surfaces of plates of different thicknesses and sizes are basically horizontal and at similar heights after being pressed against the pressure plate assembly 25. This not only ensures the consistency of the incoming plates, but also effectively eliminates the warping problem that may exist in the plates through physical pressure. Furthermore, no manual intervention is required during the entire pressing process, thereby avoiding the decrease in crystal piercing accuracy caused by unevenness of the plates, and greatly improving the automation level and operating efficiency of the production line.

[0088] In addition, the first moving mechanism 10 is designed to reciprocate in a preset direction, enabling the board to be transported quickly and smoothly between the chip-piercing station and the upstream and downstream stations. This smooth operation not only shortens the production cycle, but also effectively improves the overall efficiency of chip transfer.

[0089] Please refer to the instruction manual attached. Figures 2-3 The following provides a specific structural form of a positioning mechanism 20 that can achieve the above-mentioned functional requirements. The positioning mechanism 20 includes a support member 21, a fixed support 22, and a movable support 23. The support member 21 serves as the supporting foundation of the positioning mechanism 20 and is movably installed on the drive end of the first movable mechanism 10 to bear and support the fixed support 22 and the movable support 23.

[0090] Understandably, the support member 21 needs to have sufficient rigidity and stability to ensure that it does not deform or wobble during the positioning process.

[0091] Furthermore, the fixed support 22 is fixedly installed on the support member 21, while the movable support 23 is movably disposed on the support member 21. The fixed support 22 and the movable support 23 form the aforementioned plate positioning space. The movable support 23 can reciprocate in the direction of approaching or moving away from the fixed support 22 to adjust the plate positioning space. It is understood that, due to the good connection strength and stability between the fixed support 22 and the support member 21, when adjusting the size of the plate positioning space using the movable support 23 and the fixed support 22, and during the positioning process of the positioning mechanism 20, the fixed support 22 can serve as the positioning reference for the plate, allowing the plate to be in a state of abutting against the fixed support 22 on one side during the positioning process, thereby giving the plate high stability and positioning accuracy within the plate positioning space.

[0092] As mentioned above, the positioning mechanism 20 can adjust the size of the plate positioning space by means of, but is not limited to, a lead screw, guide rail, cylinder, etc. In the embodiment where the positioning mechanism 20 includes a fixed support 22 and a movable support 23, the relevant driving device can be set between the fixed support 22 and the movable support 23, using the fixed support 22 as the fulcrum of the driving device so that it can smoothly drive the movable support 23 to move in the direction of approaching and moving away from the fixed support 22.

[0093] In one embodiment, in order to ensure that the movable support 23 moves more smoothly relative to the fixed support 22, the fixed support and the movable support are provided with the aforementioned driving device at both ends of the positioning mechanism 20 along its length. Furthermore, by further providing guide structures such as guide rails between the movable support 23 and the support member 21, the movement of the movable support 23 is made more stable, and the friction generated during the movement is reduced.

[0094] As mentioned above, the fixed support 22 and the movable support 23 respectively form two opposing limiting structures for constraining the position of the plate. Under the joint constraint of the fixed support and the movable support, the plate positioning space is connected to the external environment at both ends and the upper and lower sides in the length direction. In this way, the plate can enter and exit the plate positioning space at at least one end between the fixed support 22 and the movable support 23. The lifting mechanism 30 can support the plate in the plate positioning space from below, while the plate positioning space above provides corresponding operating space for the processing of the plate.

[0095] Based on the above embodiments, a first conveying component 24 is further provided between the fixed support 22 and the movable support 23. The first conveying component 24 is configured to allow the drive plate to move between the fixed support 22 and the movable support 23, so that the plate can be supported by the first conveying component 24 between the fixed support 22 and the movable support 23 (within the plate positioning space), and can also be conveyed by the first conveying component 24 along the length direction of the positioning mechanism 20 to a preset position in the plate positioning space, or sent away from the plate positioning space.

[0096] In the above embodiment, before the plate is conveyed to the positioning mechanism 20, the control system controls the drive device to drive the movable support 23 to reciprocate in the direction of approaching or moving away from the fixed support 22, according to the size of the plate, so as to adjust the size of the plate positioning space. When the size of the plate positioning space matches the size of the plate, the plate can be sent into the plate positioning space by the first conveying component 24 and continuously supported by the first conveying component 24 in the plate positioning space.

[0097] In the above scheme, the first conveying component 24 not only needs to stably support the plate, but also needs to convey the plate into and out of the plate positioning space. To meet these requirements, the first conveying component 24 can be, but is not limited to, a conveyor belt structure, a chain conveyor structure, a roller conveyor structure, a pneumatic or hydraulic pushing structure, etc. It should be noted that in order to ensure the smooth support and conveying of the plate and to avoid interference with the lifting mechanism 30 and the platform 36, the first conveying component 24 should be set close to the fixed support 22 and the movable support 23 respectively, so that it can provide good support and conveying of both sides of the plate while still leaving enough space between the fixed support 22 and the movable support 23 for the platform 36 to move up and down.

[0098] Through the above implementation method, it is possible to ensure that the plate can be stably supported and transported. The positioning mechanism 20 can adjust the positioning space size of the plate by simply adjusting the movable support 23. The first conveying component 24 not only supports the plate but also transports it, thus making the structure of the positioning mechanism 20 more stable and compact.

[0099] Please refer to the instruction manual attached. Figures 2-3In order to ensure that the board can be smoothly transported into the board positioning space and achieve higher positioning accuracy within the board positioning space, the positioning mechanism 20 is provided with a first guide component 231 and a second guide component 221 on opposite sides of the board positioning space. The first guide component 231 and the second guide component 221 extend along the length direction of the positioning mechanism 20 to limit the width of the board positioning space at intervals. During the process of the board entering or leaving the board positioning space, the side edge of the board can be blocked by the first guide component 231 and the second guide component 221 to ensure that the board will not deviate from the predetermined path during the transport process, and at the same time provide a stable support surface for the board.

[0100] It is understood that in the above-mentioned positioning mechanism 20 including a fixed support 22 and a movable support 23, the first guide component 231 and the second guide component 221 are respectively disposed on opposite sides of the fixed support 22 and the movable support 23. Furthermore, the horizontal height of the first guide component 231 and the second guide component 221 is greater than the horizontal height of the first conveying assembly 24, so as to ensure that the side edge of the plate can be restricted by the first guide component 231 and the second guide component 221 when the first conveying assembly 24 conveys and supports the plate.

[0101] In one embodiment, the first guide component 231 and the second guide component 221 can be configured as guide strips located on opposite sides of the plate positioning space, with the opposite sides of the two guide strips being parallel to each other, and the surfaces need to ensure that when they are in contact with the side edge of the plate, the plate can still continue to move in a predetermined direction without causing jamming or wear due to excessive friction.

[0102] Based on this, the first guide component 231 is provided with a blocking component and a pushing component, both of which can move in and out of the plate positioning space. It should be noted that in the embodiment where the positioning mechanism 20 includes a fixed support 22 and a movable support 23, the fixed support 22 is fixedly connected to the support member 21 and used as a positioning reference for the plate. Therefore, in this embodiment, the first guide component 231 should be located on the movable support 23. Thus, when the blocking component and the pushing component position the plate, the fixed support 22 on the opposite side can be used as its positioning reference, allowing the plate to have higher positioning accuracy within the plate positioning space.

[0103] To gain a more comprehensive understanding of this embodiment, we can see from the above description that both the first guide component 231 and the second guide component 221 are positioned above the first conveying component 24, ensuring that the first guide component 231 and the second guide component 221 are positioned relative to their respective side edges during the conveying and supporting of the plate. Specifically, when the blocking component is in the state of extending into the plate positioning space, the blocking component is configured to prevent the plate from stopping at a preset position in the plate positioning space, preventing it from continuing to move and exceeding the positioning range. The pushing component is configured to push the plate in the plate positioning space toward the second guide component 221. The pushing component and the blocking component are arranged adjacent to each other. During the positioning process of the plate, the plate is first conveyed from outside the positioning mechanism 20 into the plate positioning space by the first conveying component 24. At this time, the blocking component extends into the plate positioning space to prevent the plate from continuing to move in the length direction of the positioning mechanism 20. The main function of the pushing component is to push the plate in this state toward the second guide component 221 (fixed support 22), so that one side of the plate abuts against the second guide component 221. In this way, the plate can use the second guide component 221 as a positioning reference to achieve precise positioning in the length direction through the blocking component, and precise positioning in the width direction through the second guide component 221 and the pushing component.

[0104] It is understandable that in the embodiment combining the lifting mechanism 30 and the platform 36, after the plate is blocked by the blocking component and pushed by the pushing component, and finally located in the preset position of the plate positioning space, both the blocking component and the pushing component need to be reset to a state of retraction away from the plate positioning space, so as to avoid the problem of the plate side edge interfering with the blocking component and the pushing component during the subsequent process of the platform 36 supporting the plate, which would cause the positioning position to shift.

[0105] Please continue to refer to the instruction manual appendix. Figures 2-3 In order to achieve a higher degree of compactness between the first guide component 231 and the blocking component and the pushing component, the first guide component 231 is provided with a plurality of telescopic grooves 2311 extending through its opposite sides along its length direction. That is to say, the telescopic grooves 2311 extend through the opposite sides of the guide component in the width direction in addition to extending along the length direction.

[0106] Based on the above, the blocking component includes at least two first telescopic mechanisms 232. Each first telescopic mechanism 232 can be adjusted to move along the length direction of the first guide component 231. The spacing between the first telescopic mechanisms 232 can be controlled according to the length of the plate, so that the first telescopic mechanisms 232 can define the specific position where the plate should stop in the length direction of the positioning mechanism 20. After the plate enters the appropriate position in the plate positioning space, each first telescopic mechanism 232 can extend into the plate positioning space to block and limit the front and rear ends of the plate. The first telescopic mechanism 232 includes a first mounting part and a first telescopic part. The first telescopic part is telescopically mounted on the first mounting part and movably mounted on the positioning mechanism 20. In the embodiment where the positioning mechanism 20 includes a movable support 23, the first mounting part is movably mounted on the movable support 23 by means of a sliding structure (such as a structure in which a slide rail and a slider cooperate). The first telescopic part is configured to allow it to extend into or retract from the plate positioning space through the telescopic groove 2311, so that the first telescopic part can block the plate by extending into the plate positioning space through the telescopic groove 2311.

[0107] Similarly, the pushing component includes at least two second telescopic mechanisms 233, each telescopic mechanism can be adjusted along the length direction of the first guide component 231, and each second telescopic mechanism 233 is located between at least any two first telescopic mechanisms 232. Thus, under the premise that any two first telescopic components define the beginning and end positions of the plate, each second telescopic mechanism 233 can push against the side edge of the plate.

[0108] In one embodiment, two telescopic mechanisms 232 and 233 are provided. A slide rail is provided on the side of the first guide member 231 away from the plate positioning space. Both the first telescopic mechanism 232 and the second telescopic mechanism 233 are slidably mounted on the slide rail (movable support 23) via sliders. The distance between the movable support 23 and the fixed support 22 is set according to the width of the plate, while the distance between the two first telescopic mechanisms 232 is set according to the length of the plate. The two second telescopic mechanisms 233 are respectively located on the adjacent sides of the two first telescopic mechanisms 232, and are both located between the two first telescopic mechanisms 232, so as to maximize the range of the two second telescopic mechanisms 233 acting on the side edge of the plate and ensure that the plate remains stable when pushed. Specifically, the second telescopic mechanism 233 includes a second mounting part and a second telescopic part. The second telescopic part is telescopically mounted on the second mounting part and movably mounted on the positioning mechanism 20. The second telescopic part is configured to allow it to extend into or retract from the plate positioning space through the telescopic groove 2311. As can be seen from the above, the first telescopic mechanism 232 and the second telescopic mechanism 233 have similar structures and functions. Therefore, in some embodiments, the first telescopic mechanism 232 and the second telescopic mechanism 233 can, but are not limited to, be simultaneously or separately configured as cylinders, hydraulic cylinders, electromagnet assemblies, linear motor assemblies, crank-slider and motor assemblies, etc., to achieve the function of telescopic movement in a straight line. For example, when both the first telescopic mechanism 232 and the second telescopic mechanism 233 are configured as cylinders, the first mounting portion and the second mounting portion are both configured as cylinder bodies, and the first telescopic portion and the second telescopic portion are both configured as cylinder piston rods.

[0109] By opening a telescopic groove 2311 on the first guide component 231, it can be ensured that the horizontal height of the first telescopic mechanism 232 and the second telescopic mechanism 233 is consistent with that of the first guide component 231. This eliminates the need for additional height dimensions and installation space, making the structure more compact. It also simplifies the driving method and structure of the first telescopic mechanism 232 and the second telescopic mechanism 233. The first telescopic mechanism 232 and the second telescopic mechanism 233 can achieve the corresponding effect simply by linear telescopic movement, making their movement faster and enabling quick response to the positioning operation of the plate. This improves the positioning accuracy of the plate in the plate positioning space and the transfer efficiency of the plate transport device.

[0110] The following provides a specific structural form of the pressure plate assembly 25.

[0111] It is worth mentioning that in the embodiment where the positioning mechanism 20 includes a fixed support 22 and a movable support 23, the pressure plate assembly 25 is provided on both the fixed support 22 and the movable support 23. In the embodiment where the movable support 23 and the fixed support 22 are respectively provided with a first guide component 231 and a second guide component 221, the first guide component 231 and the second guide component 221 can be provided in multiples. The multiple first guide components 231 and second guide components 221 are arranged at intervals along the length direction of the movable support 23 and the fixed support 22. In this way, when multiple pressure plate assemblies 25 are provided, they can be respectively arranged between any two adjacent first guide components 231 and any two adjacent second guide components 221, thereby reducing the height space occupied by the pressure plate assembly 25 on the plate carrying device and improving the overall structural compactness of the device.

[0112] Please refer to the instruction manual attached. Figures 7-9 In this embodiment, the pressure plate assembly 25 specifically includes a limiting component 251 and a tablet support 252. The limiting component 251 is fixedly installed on the upper side of the positioning mechanism 20 and extends along the height direction, providing a certain amount of vertical space for the tablet support 252. A positioning structure is provided at the end of the limiting component 251 away from the positioning mechanism 20 (the movable support 23 and the fixed support 22). While the body of the limiting component 251 provides vertical guidance for the tablet support 252, the positioning structure restricts the tablet support 252 from continuing to move vertically away from the movable support 23 or the fixed support 22. As described above, the tablet support 252 is movably disposed on the limiting member 251, so that the tablet support 252 has the freedom of movement to move closer to and further away from the plate positioning space in the height direction on the limiting member 251. At least part of the tablet support 252 is located within the plate positioning space. In the height projection direction of the plate carrying device, at least part of the projection of the tablet support 252 is located in the projection of the plate positioning space, so that the plate can be pressed tightly by the tablet support 252 under the support of the table 36.

[0113] It should be noted that in the embodiments where the aforementioned multiple pressure plate assemblies 25 are respectively arranged in any two adjacent first guide components 231 and any two adjacent second guide components 221, the inner side of the pressure plate support 252 is basically on the same plane as the inner side of the first guide component 231 or the second guide component 221. This allows the pressure plate support 252, the first guide component 231, and the second guide component 221 to work together to guide the plate, avoiding the effect of the plate being affected by the spacing of the first guide component 231 and the second guide component 221. The upper side of the pressure plate support 252 is provided with a pressure plate structure extending inward. The pressure plate structure is located within or above the plate positioning space and is used to press the upper surface of the plate.

[0114] Furthermore, an elastic component 253 is provided between the tablet support 252 and the limiting component 251. The elastic component 253 is configured to continuously apply a spring force to the tablet support 252 towards the plate positioning space, so that the tablet support 252 remains against the positioning mechanism 20 (movable support 23 or fixed support 22) without the action of other external forces. When the tablet support 252 is under the action of external forces (by being pushed up from the bottom by the plate), the tablet support 252 can be lifted up to a certain extent, which plays a certain buffering role.

[0115] For example, in one embodiment, the limiting component 251 is a bolt, which includes a threaded rod, a smooth rod, and a threaded head connected in sequence. The bolt is fixedly connected to the movable support 23 or the fixed support 22 by its threaded rod. The pressure plate support 252 is movably sleeved on the smooth rod structure, and the smooth rod provides a guiding function, while the threaded head of the bolt can constrain the pressure plate support 252. The elastic component 253 is composed of multiple disc spring components stacked together. By stacking multiple disc springs, the elastic force and load-bearing capacity of the entire elastic component 253 can be significantly enhanced. Furthermore, the elastic force provided by the disc springs can remain basically constant, allowing the pressure plate assembly 25 to press the plate more stably and effectively, ensuring that the plate will not deform or be damaged due to uneven force during the pressing process.

[0116] In one embodiment, the lifting mechanism 30 is configured as a wedge-shaped lifting platform, which is a mechanism that uses a wedge mechanism to achieve lifting function, such as... Figure 2 , Figures 4-5 As shown, the wedge-shaped lifting platform mainly includes:

[0117] The base 31 serves as the main support for the entire wedge-shaped lifting platform;

[0118] The wedge block 32 is movably mounted on the base 31 in the horizontal direction. The wedge block 32 has an inclined surface. When subjected to a horizontal thrust, the wedge block 32 will generate a vertical component force by utilizing the inclined surface, thereby realizing the lifting function.

[0119] The lifting platform 33 is movably mounted on the base 31 along the height direction and movably engages with the inclined surface of the wedge block 32. As the wedge block 32 moves horizontally, the lifting platform 33 moves vertically along the inclined surface of the wedge block 32. It is understood that the lifting platform 33 is used to provide a load-bearing function and is typically made of high-strength materials to ensure it can withstand the required weight and remain stable during lifting.

[0120] A guide device 34 is disposed between the lifting platform 33 and the base 31 along the height direction to ensure the stability and accuracy of the lifting platform 33 during the lifting process. The guide device 34 may be, but is not limited to, components such as guide rails and sliders.

[0121] The drive mechanism 35 is connected to the base 31 and the wedge block 32. It is used to provide horizontal thrust to the wedge block 32, so that the wedge block 32 can move and generate a vertical component force, so that the lifting platform 33 can move up and down. Common drive mechanisms 35 include motors, cylinders, etc.

[0122] This embodiment uses a wedge-shaped lifting platform as the lifting mechanism 30 in the above-described scheme, enabling precise control of the lifting height of the platform 36 and providing high stability. This ensures that the platform 36 does not wobble or shift during the lifting and lowering of the plate, improving the accuracy of plate positioning and facilitating precise parting of the plate in the crystal-bonding process, thus enhancing its process precision. Furthermore, the wedge-shaped lifting platform also possesses strong load-bearing capacity and rigidity, allowing it to easily handle plates of various weights and sizes. This ensures that during the rapid micro-compensation of the lifting mechanism 30 by the first moving mechanism 10 in the preset direction, the plate does not experience significant slippage or vibration, and also ensures that the plate does not deform or get damaged during the lifting process.

[0123] In another embodiment, the shelf 36 is detachably installed between the lifting mechanism 30 and the lifting mechanism 30 (the lifting platform 33). The shelf 36 is detachably installed on the lifting mechanism 30 (the lifting platform 33), so that the plate carrying device can quickly replace the shelf 36 of different sizes, shapes or materials according to different usage needs or scenarios. This flexibility helps to meet the placement needs of different items and improves the versatility of the device.

[0124] In addition, such as Figure 6 As shown, the surface of the shelf 36 is recessed with multiple interconnected adsorption grooves 361. The shape and size of these adsorption grooves 361 can be customized according to the characteristics of the board. In addition, adsorption holes 362 are opened at the bottom of at least some of the adsorption grooves 361 for connecting to an external negative pressure source.

[0125] In practical applications, after the board is placed on the positioning mechanism 20, the platform 36 is driven to rise by the lifting mechanism 30. After the platform 36 supports the lower surface of the board, the external negative pressure source immediately releases negative pressure through the adsorption hole 362. This negative pressure is evenly applied to the lower surface of the board through the adsorption groove 361, tightly adsorbing it onto the platform 36 to ensure stability and prevent shaking. In addition to ensuring the smooth transmission and even distribution of negative pressure, the adsorption groove 361 also effectively avoids the problem of insufficient local adsorption force.

[0126] Based on any of the above embodiments, please refer to the appendix to the instruction manual. Figures 10-12 The plate transport device also includes two connecting mechanisms 40. The two connecting mechanisms 40 have basically the same structure and are mainly used to form a transport channel. The two connecting mechanisms 40 are placed on opposite sides of the first movable mechanism 10 so as to transport the plate from the upstream process to the positioning mechanism 20, or from the positioning mechanism 20 to the downstream process.

[0127] The positioning mechanism 20 reciprocates between the feeding position and the processing position along a preset direction. When the positioning mechanism 20 is in the feeding position, the two opposite ends of the plate positioning space are connected to the two conveying channels respectively. When the positioning mechanism 20 is in the processing position, the two connecting mechanisms 40 are configured to move towards each other until the two conveying channels are connected. Therefore, in addition to the above functions, the two connecting mechanisms 40 are also responsible for adjusting the state of the conveying channels when the positioning mechanism 20 is in different positions to adapt to the conveying requirements of the plate.

[0128] In this embodiment, the connecting mechanism 40 may include, but is not limited to, conveying elements such as conveyor belts, rollers, and guide rails, as well as a drive mechanism 35 and a transmission mechanism for adjusting the state of the conveying channel.

[0129] In one embodiment, such as Figure 12 As shown, the connecting mechanism 40 includes a fixed support plate 41 and a movable support plate 42 that can move relatively close to or away from the fixed support plate 41. The fixed support plate 41 and the movable support plate 42 are spaced apart and define a conveying channel. A second conveying assembly 45 is also provided between the fixed support plate 41 and the movable support plate 42. The second conveying assembly 45 is configured to allow the driven plate to reciprocate along the conveying channel. As can be understood from the above, the second conveying assembly 45 can adopt a structure similar to the first conveying assembly 24 to provide the plate conveying function.

[0130] Both the fixed support plate 41 and the movable support plate 42 are movably mounted on the pneumatic slide table 44 via the support base plate 43, so that the movable support plate 42 can move relative to the fixed support plate 41 via the pneumatic slide table 44.

[0131] This embodiment also provides a chip mass transfer device, which adopts the board transport device as described in any of the above embodiments. In addition, the chip mass transfer device is equipped with a series of related mechanisms and devices such as a crystal-piercing head at the crystal-piercing station, so as to perform the crystal-piercing and board-making function on the board at the crystal-piercing station.

[0132] In the technical solution provided by the above embodiments, the chip mass transfer equipment based on the crystal spike process can adjust the size of the positioning mechanism 20 and the connecting mechanism 40 according to different board sizes, and replace the corresponding size of the table 36. It can adapt to different board thicknesses to adjust the lifting range of the lifting mechanism 30 and the elasticity of the pressure plate assembly 25, which can meet the clamping requirements and the compensation requirements of processing and inspection.

[0133] As can be understood from the above embodiments, during the process of transferring the plate by the plate transport device, the two connecting mechanisms 40 can be connected to the upstream station and the downstream station respectively, so that the plate is transported to the positioning mechanism 20 for positioning and conveying crystal through one of the connecting mechanisms 40, and then the plate is transported to the downstream process through the other connecting mechanism 40.

[0134] Next, taking the example of the same connecting mechanism 40 entering and exiting simultaneously, in this embodiment, the other connecting mechanism 40 mainly serves to reserve plates in advance, thereby improving the overall transfer efficiency of the plate transport device. Figures 10-11 As shown, for ease of understanding of this embodiment, the two connecting mechanisms 40 are defined as the first connecting component 46 and the second connecting component 47, respectively. The plate carrying steps of this embodiment are as follows:

[0135] 1. Based on the dimensions of the sheet metal, pre-adjust the width dimensions of the two connecting mechanisms 40 (conveying channels) and the positioning mechanism 20 (sheet metal positioning space);

[0136] 2. The sheet metal can be automatically or manually fed into the first connecting component 46 by a robotic arm. The first connecting component 46 detects the incoming material and reads the sheet metal code.

[0137] 3. The board is transported to the positioning mechanism 20 by the first connecting component 46. The positioning mechanism 20 detects the incoming material, drives the blocking component to stop the board, and then the first conveying component 24 stops conveying.

[0138] 4. The positioning mechanism 20 drives the pushing assembly to push the plate from the first guide component 231 toward the second guide component 221 until its side edge abuts against the inner side of the second guide component 221. Then, both the blocking assembly and the pushing assembly retract away from the plate positioning space.

[0139] 5. The lifting mechanism 30 moves upward, causing the platform 36 to contact the lower surface of the plate;

[0140] 6. When the external vacuum source is activated, the plate is adsorbed onto the platform 36 through the adsorption hole 362 and the adsorption groove 361;

[0141] 7. The lifting mechanism 30 continues to lift to the preset position, so that the lower surface of the board is separated from the first conveying component 24, and the board is supported by the table 36. The upper edge of the board is pressed against the flattening component to eliminate the surface warping of the board.

[0142] 8. The first active mechanism 10 drives the positioning mechanism 20 and the lifting mechanism 30 to move from the feeding position to the processing position (the chip mass transfer equipment's crystal-piercing station) to start the pre-processing and inspection process, such as establishing the processing coordinate system in conjunction with the camera group, dividing the process into sections for boards of different sizes, and performing crystal-piercing operations.

[0143] 9. At the same time, the plate (hereinafter referred to as the preparation plate) that needs to be sent into the positioning mechanism 20 as a subsequent preparation is placed into the first connecting assembly 46, the first connecting assembly 46;

[0144] 10. The first connecting component 46 and the second connecting component 47 move toward each other until their conveying channels are connected, and then the prefabricated plate is conveyed from the first connecting component 46 to the second connecting component 47;

[0145] 11. After the second connecting component 47 detects the incoming material, the first connecting component 46 and the second connecting component 47 move away from each other to reset.

[0146] 12. After the crystal-piercing operation of the plate located at the processing position is completed, the first moving mechanism 10 retracts from the processing position to the feeding position;

[0147] 13. When the external negative pressure source is turned off, the lifting mechanism 30 descends until the plate is once again supported by the first conveying assembly 24;

[0148] 14. The first conveying component 24 moves to convey the plate to the first connecting component 46 for unloading;

[0149] 15. At the same time, the prefabricated plates on the second connecting component 47 are transported to the positioning mechanism 20 to start the next round of process flow.

[0150] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are merely used for distinction in description and have no special meaning.

[0151] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0152] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0153] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A plate-carrying device, characterized in that, include: First activity organization (10); A positioning mechanism (20) is disposed on the first active mechanism (10) and configured to allow reciprocating motion in a preset direction on a horizontal plane via the first active mechanism (10). The positioning mechanism (20) forms an adjustable plate positioning space, and a pressure plate assembly (25) is disposed on the positioning mechanism (20) at least partially located within the plate positioning space. A lifting mechanism (30) is disposed on the first movable mechanism (10), and the lifting mechanism (30) is configured to move synchronously with the positioning mechanism (20) in a preset direction; A platform (36) is provided on the lifting mechanism (30). The platform (36) can move up and down in the direction of approaching or moving away from the plate positioning space under the drive of the lifting mechanism (30).

2. The plate-carrying device according to claim 1, characterized in that, The positioning mechanism (20) includes: The support member (21) is movably mounted on the first movable mechanism (10); A fixed support (22) is fixedly installed on the supporting member (21); and A movable support (23) is movably disposed on the support member (21). The movable support (23) and the fixed support (22) form the plate positioning space. The movable support (23) can reciprocate in the direction of approaching or moving away from the fixed support (22) to adjust the plate positioning space. A first conveying assembly (24) is disposed between the fixed support (22) and the movable support (23) and is configured to allow the drive plate to move between the fixed support (22) and the movable support (23).

3. The plate-carrying device according to claim 1 or 2, characterized in that, The positioning mechanism (20) is provided with a first guide component (231) and a second guide component (221) on opposite sides of the plate positioning space. The first guide component (231) is provided with a blocking component and a pushing component. Both the blocking component and the pushing component can move in the direction of extending into and retracting from the plate positioning space. When the blocking component is in the state of extending into the plate positioning space, the blocking component is configured to prevent the plate from remaining at a preset position in the plate positioning space; The pushing component is configured to push the plate in the plate positioning space toward the second guide member (221).

4. The plate-carrying device according to claim 3, characterized in that, The first guide component (231) has a plurality of telescopic grooves (2311) extending through its opposite sides along its length direction; The blocking assembly includes at least two first telescopic mechanisms (232), each of which can be adjusted to move along the length of the first guide member (231). One end of the first telescopic mechanism (232) is movably mounted on the positioning mechanism (20), and the other end of the first telescopic mechanism (232) is configured to allow it to extend into or retract from the plate positioning space through the telescopic groove (2311). The pushing assembly includes at least two second telescopic mechanisms (233), each of which is movable and adjustable along the length direction of the first guide member (231), and each of the second telescopic mechanisms (233) is located between at least two of the first telescopic mechanisms (232). One end of the second telescopic mechanism (233) is movably mounted on the positioning mechanism (20), and the other end of the second telescopic mechanism (233) is configured to allow it to extend into or retract from the plate positioning space through the telescopic groove (2311).

5. The plate-carrying device according to claim 1, characterized in that, The pressure plate assembly (25) includes: The limiting component (251) is fixedly installed on the upper side of the positioning mechanism (20) and extends along the height direction; A tablet support (252) is movably disposed on the limiting member (251), the tablet support (252) is at least partially located within the plate positioning space, and the tablet support (252) is configured on the limiting member (251) to have a degree of freedom of movement to move closer to and away from the plate positioning space in the height direction; An elastic member (253) is also provided between the tablet support (252) and the limiting member (251), and the elastic member (253) is configured to continuously apply an elastic force to the tablet support (252) towards the plate positioning space.

6. The plate-carrying device according to claim 1, characterized in that, The lifting mechanism (30) is configured as a wedge-shaped lifting platform.

7. The plate-carrying device according to claim 1, characterized in that, The shelf (36) is detachably mounted on the lifting mechanism (30); Furthermore, the surface of the shelf (36) is recessed with multiple interconnected adsorption grooves (361), and at least some of the adsorption grooves (361) have adsorption holes (362) at the bottom.

8. The plate-carrying device according to claim 1, characterized in that, It also includes two connecting mechanisms (40), which form a conveying channel for conveying plates, and the two connecting mechanisms (40) are respectively placed on opposite sides of the first movable mechanism (10); The positioning mechanism (20) reciprocates between the feeding position and the processing position along the preset direction; when the positioning mechanism (20) is in the feeding position, the two opposite ends of the plate positioning space are respectively connected to the two conveying channels; when the positioning mechanism (20) is in the processing position, the two connecting mechanisms (40) are configured to allow movement in a direction that brings them closer to each other until the two conveying channels are connected.

9. The plate-carrying device according to claim 8, characterized in that, The connecting mechanism (40) includes a fixed support plate (41) and a movable support plate (42) that can be relatively close to or away from the fixed support plate (41). The fixed support plate (41) and the movable support plate (42) are spaced apart and define the conveying channel. A second conveying assembly (45) is also provided between the fixed support plate (41) and the movable support plate (42), the second conveying assembly (45) being configured to allow the drive plate to reciprocate along the conveying channel; Both the fixed support plate (41) and the movable support plate (42) are movably mounted on the pneumatic slide table (44) via the supporting base plate (43).

10. A chip mass transfer device, characterized in that, include: The plate transport device as described in any one of claims 1-9.

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