Wafer coating jig convenient to disassemble and assemble

By designing a combination of base, cover plate, clamping structure and drive components, the wafer coating fixture can be quickly clamped and disassembled, solving the problem of inconvenient operation in the prior art and improving the convenience and adaptability of the wafer coating fixture.

CN223928799UActive Publication Date: 2026-02-17REACHHIGH(XIAMEN)TECH CO LTD
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Patent Information

Application Number
CN202520236818.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-14
Publication Date
2026-02-17
Estimated Expiration
2035-02-14

AI Technical Summary

Technical Problem

Existing wafer coating fixtures require a significant amount of time to clamp and remove wafers, making operation inconvenient and hindering assembly and disassembly.

Method used

A wafer coating fixture is designed, comprising a base, a cover plate, a clamping structure, a drive assembly, and a connecting rod. The drive assembly drives the connecting rod to move the movable block and clamping rod in the clamping structure, and the spring force is used to achieve rapid clamping and fixation. The clamping force can be adjusted by the adjustment assembly.

Benefits of technology

It enables rapid wafer clamping and unclamping, avoiding wafer damage caused by excessive clamping force, and improving the convenience and adaptability of operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer coating jig convenient to disassemble and assemble, which belongs to the technical field of wafer coating and comprises a base, and a cover plate is arranged on the base. Through the arranged clamping structure, the driving assembly and the connecting rod, when a wafer is clamped, the driving assembly is pressed down to drive the connecting rod to move, so that a movable block and the clamping rod in the clamping structure are pushed to move and give way, the wafer is conveniently and rapidly placed, after the wafer is placed, the movable block and the clamping rod move under the action of a spring, and the wafer is clamped. The wafer is clamped and fixed by the clamping rods, the wafer is directly taken and disassembled after being coated, the effect of quickly disassembling and assembling the wafer can be achieved, meanwhile, the wafer is fixed in an elastic clamping mode, damage to the wafer caused by too large clamping force is avoided, the adjusting assembly is adopted, the movable base can be driven by the adjusting screw rod to move, and therefore the wafer can be quickly disassembled and assembled. Therefore, the relative position of the movable seat is changed, the acting force applied by the spring when the wafer is finally clamped can be changed, and the use adaptability is high.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wafer coating technical field, especially relate to a convenient to dismount wafer coating fixture. BACKGROUND

[0002] Wafer refers to the circular silicon piece with specific crystal structure and electrical characteristics manufactured through specific process, and it is the basic material used for making silicon semiconductor integrated circuit, and through processing various circuit element structures on the wafer, the wafer is finally cut into chip with specific electrical function.In wafer coating processing, in order to improve the uniformity and accuracy of coating, the stability of wafer needs to be ensured, and the wafer is usually clamped and fixed by using fixture, and then coating operation is carried out.

[0003] When the existing fixture clamps the wafer, the wafer is placed on the base in the fixture, and the wafer is clamped and fixed by using the clamping plate, when the wafer is disassembled, the clamping plate is operated to loosen, and then the wafer is taken away.However, in the existing fixture, the clamping and disassembly of the wafer need to drive and operate the clamping plate, which needs to spend a lot of time in the process, and it is not convenient to quickly disassemble the wafer, which leads to the disassembly of the wafer being extremely inconvenient and poor in operation convenience. UTILITY MODEL CONTENT

[0004] The main purpose of the utility model is to provide a wafer coating fixture which is convenient to disassemble and assemble, and can effectively solve the problems in the background art.

[0005] In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

[0006] A wafer coating fixture which is convenient to disassemble and assemble, comprising a base, a cover plate is arranged on the base, a placing seat is fixed on the cover plate, a clamping structure is arranged in the base, a hexagonal column is fixed at the bottom of the base, a driving assembly is connected to the hexagonal column, a connecting rod is connected to the driving assembly, and the end of the connecting rod is rotatably connected to the clamping structure.

[0007] Preferably, the base and the cover plate are fixedly connected, and a U-shaped hole is formed in the cover plate, and the connecting rod is rotatably connected to the driving assembly.

[0008] Preferably, the driving assembly comprises a lifting plate, a connecting plate, a lifting rod and a limiting plate, the lifting plate is sleeved on the hexagonal column, the connecting plate is fixedly connected to the lifting rod, the connecting plate is fixed on the lifting plate, the lifting rod penetrates through the cover plate, and the limiting plate is fixed on the upper end of the lifting rod.

[0009] Preferably, the clamping structure comprises a fixed frame, a movable block, a clamping rod, a guide rod, a spring and an adjusting assembly, the fixed frame is fixed at the inner bottom end of the base, the movable block and the clamping rod are fixedly connected and the movable block is arranged at the inner side of the fixed frame, and the clamping rod penetrates through the U-shaped hole on the cover plate.

[0010] Preferably, the guide rod is fixed on the fixed frame and penetrates through the movable block, the adjusting assembly is connected with the fixed frame and the guide rod, the spring is sleeved on the guide rod and located between the movable block and the adjusting assembly.

[0011] Preferably, the adjusting assembly comprises a fixed block, an adjusting screw rod, an adjusting block and a movable seat, the fixed block is fixed on the fixed frame through screws, one end of the adjusting screw rod is rotatably connected to the fixed block and the other end penetrates through the side wall of the base, the adjusting block is fixed at the end of the adjusting screw rod, the movable seat is sleeved on the guide rod and threadedly connected with the adjusting screw rod.

[0012] Compared with the prior art, the wafer coating jig which is convenient to disassemble has the following beneficial effects: when the wafer is clamped, the driving assembly and the connecting rod are driven to move downward, so that the movable block and the clamping rod in the clamping structure are moved to make room, the wafer is placed quickly, after the wafer is placed, the movable block and the clamping rod are moved under the action of the spring, the clamping rod clamps and fixes the wafer, after the wafer is coated, the wafer can be directly taken and disassembled, the wafer can be quickly disassembled, the wafer is fixed in an elastic clamping mode, the wafer is not damaged due to excessive clamping force, the adjusting assembly is used, the movable seat is driven to move by the adjusting screw rod, the relative position of the movable seat is changed, the force applied by the spring when the wafer is finally clamped can be changed, and the adaptability is high. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a whole structure schematic view of the utility model;

[0014] Figure 2 It is an internal structure schematic view of the base of the utility model;

[0015] Figure 3 It is a structure schematic view of the clamping structure of the utility model;

[0016] Figure 4 It is a structure schematic view of the adjusting assembly of the utility model.

[0017] In the diagram: 1. Base; 2. Cover plate; 3. Placement seat; 4. Clamping structure; 401. Fixing frame; 402. Movable block; 403. Clamping rod; 404. Guide rod; 405. Spring; 406. Adjustment component; 4061. Fixing block; 4062. Adjusting screw; 4063. Adjusting block; 4064. Movable seat; 5. Hexagonal column; 6. Drive component; 601. Lifting plate; 602. Connecting plate; 603. Lifting rod; 604. Limiting plate; 7. Connecting rod; 8. U-shaped hole. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0019] like Figures 1-4 As shown, a wafer coating fixture that is easy to assemble and disassemble includes a base 1, a cover plate 2 on the base 1, and a placement seat 3 fixed on the cover plate 2. A clamping structure 4 is provided inside the base 1, and a hexagonal post 5 is fixed to the bottom of the base 1. A driving assembly 6 is connected to the hexagonal post 5, and a connecting rod 7 is connected to the driving assembly 6. The end of the connecting rod 7 is rotatably connected to the clamping structure 4. The base 1 and the cover plate 2 are fixedly connected, and a U-shaped hole 8 is provided on the cover plate 2. The connecting rod 7 is rotatably connected to the driving assembly 6.

[0020] During wafer coating, a fixture is used to clamp and fix the wafer. First, the drive assembly 6 is pressed down, and the structure in the drive assembly 6 descends along the hexagonal prism 5 inside the base 1. This, in turn, pushes the components in the clamping structure 4 along the U-shaped hole 8 on the cover plate 2 via the connecting rod 7 to make room. Then, the wafer is placed on the placement seat 3, and the clamping structure 4 is used for quick wafer clamping. Finally, the wafer coating process can be performed. After the wafer coating is completed, the wafer is quickly removed, achieving rapid wafer disassembly. This process is repeated, making wafer assembly and disassembly convenient, quick, and flexible.

[0021] According to the above implementation scheme, the drive component 6 includes a lifting plate 601, a connecting plate 602, a lifting rod 603, and a limiting plate 604. The lifting plate 601 is sleeved on the hexagonal post 5. The connecting plate 602 is fixedly connected to the lifting rod 603 and fixed on the lifting plate 601. The lifting rod 603 passes through the cover plate 2. The limiting plate 604 is fixed to the upper end of the lifting rod 603.

[0022] The clamping structure 4 comprises a fixed frame 401, a movable block 402, a clamping rod 403, a guide rod 404, a spring 405 and an adjusting assembly 406. The fixed frame 401 is fixed to the inner bottom end of the base 1. The movable block 402 and the clamping rod 403 are fixedly connected, and the movable block 402 is arranged on the inner side of the fixed frame 401. The clamping rod 403 penetrates the U-shaped hole 8 on the cover plate 2. The guide rod 404 is fixed to the fixed frame 401 and penetrates the movable block 402. The adjusting assembly 406 is connected with the fixed frame 401 and the guide rod 404. The spring 405 is sleeved on the guide rod 404 and located between the movable block 402 and the adjusting assembly 406.

[0023] The adjusting assembly 406 comprises a fixed block 4061, an adjusting screw 4062, an adjusting block 4063 and a movable seat 4064. The fixed block 4061 is fixed to the fixed frame 401 by a screw. One end of the adjusting screw 4062 is rotatably connected to the fixed block 4061, and the other end penetrates the side wall of the base 1. The adjusting block 4063 is fixed to the end of the adjusting screw 4062. The movable seat 4064 is sleeved on the guide rod 404 and threadedly connected with the adjusting screw 4062.

[0024] During the process of clamping the wafer, the limiting plate 604 is pressed to press the lifting rod 603. The lifting rod 603 drives the lifting plate 601 to descend along the hexagonal column 5 through the connecting plate 602. During this process, the connecting rod 7 rotates relative to the lifting plate 601 and applies a force to the movable block 402 in the clamping structure 4. Under the action of the connecting rod 7, the movable block 402 moves on the guide rod 404 with the clamping rod 403 and compresses the spring 405. The clamping rod 403 moves in the U-shaped hole 8 to make room. After the wafer is placed on the placing seat 3, the movable block 402 moves back with the clamping rod 403 under the elastic force of the spring 405. The connecting rod 7 and the driving assembly 6 are reset synchronously until the clamping rod 403 completes the clamping and fixing of the wafer, and then the wafer coating work can be carried out. When needed, the relative position of the spring 405 can be changed by using the adjusting assembly 406 to adjust the clamping force of the wafer. During adjustment, the adjusting screw 4062 between the base 1 and the fixed block 4061 is rotated by the adjusting block 4063. The adjusting screw 4062 applies a force to the movable seat 4064, so that the movable seat 4064 moves along the guide rod 404 on the inner side of the fixed frame 401, thereby changing the relative position of the movable seat 4064 and changing the clamping force of the clamping rod 403 on the same specification wafer. The structure is simple and has high use adaptability.

[0025] Need to explain, through the clamping structure 4, drive assembly 6 and connecting rod 7 set, the clamping of wafer, drive assembly 6 with connecting rod 7 movement, so as to push the movable block 402 in clamping structure 4 and clamping rod 403 moves and lets the position, it is convenient to place wafer quickly, wafer is placed, under the action of spring 405, movable block 402 and clamping rod 403 movement, clamping rod 403 is clamped and fixed to wafer, wafer is coated, directly take and disassemble, can reach the effect of quick disassembly and assembly wafer, at the same time, the elastic clamping mode is realized wafer's fixation, will not cause wafer's damage because of clamping force is too big, adopts adjusting assembly 406, can utilize adjusting screw 4062 driveing movable seat 4064 moves, further changes the relative position of movable seat 4064, can change the force that spring 405 applies when clamping wafer finally, the use adaptability is high.

[0026] The above describes the use principle, features and beneficial effects of the present application. Those skilled in the art can understand the above content, and the above content does not limit the present application. The above examples and description of the specification describe the basic principles and features of the present application. Under the premise of meeting the concept of the present application, the present application can be variously changed and improved. These improvements should fall within the scope of the present application.

Claims

1. A wafer coating fixture that is easy to assemble and disassemble, comprising a base (1), wherein a cover plate (2) is provided on the base (1), and a placement seat (3) is fixed on the cover plate (2), characterized in that: The inside of the base (1) is provided with a clamping structure (4), and the bottom of the base (1) is fixedly provided with a hexagonal column (5), the hexagonal column (5) is connected with a driving assembly (6), and the driving assembly (6) is connected with a connecting rod (7), and the end of the connecting rod (7) is rotatably connected to the clamping structure (4).

2. The wafer coating jig according to claim 1, wherein: The base (1) is fixedly connected with the cover plate (2), and the cover plate (2) is provided with a U-shaped hole (8), and the connecting rod (7) is rotatably connected with the driving assembly (6).

3. The wafer coating jig according to claim 2, wherein: The driving assembly (6) comprises a lifting plate (601), a connecting plate (602), a lifting rod (603) and a limiting plate (604), the lifting plate (601) is sleeved on the hexagonal column (5), the connecting plate (602) is fixedly connected with the lifting rod (603), and the connecting plate (602) is fixedly connected with the lifting plate (601), the lifting rod (603) penetrates the cover plate (2), and the limiting plate (604) is fixedly connected to the upper end of the lifting rod (603).

4. The wafer coating jig according to claim 3, wherein: The clamping structure (4) comprises a fixed frame (401), a movable block (402), a clamping rod (403), a guide rod (404), a spring (405) and an adjusting assembly (406), the fixed frame (401) is fixedly arranged at the inner bottom end of the base (1), the movable block (402) and the clamping rod (403) are fixedly connected, and the movable block (402) is arranged on the inner side of the fixed frame (401), and the clamping rod (403) penetrates the U-shaped hole (8) on the cover plate (2).

5. The wafer coating jig according to claim 4, wherein: The guide rod (404) is fixedly arranged on the fixed frame (401), and the guide rod (404) penetrates the movable block (402), the adjusting assembly (406) is connected with the fixed frame (401) and the guide rod (404), the spring (405) is sleeved on the guide rod (404), and the spring (405) is located between the movable block (402) and the adjusting assembly (406).

6. The wafer coating jig according to claim 5, wherein: The adjusting assembly (406) comprises a fixed block (4061), an adjusting screw (4062), an adjusting block (4063) and a movable seat (4064), the fixed block (4061) is fixedly arranged on the fixed frame (401) by screws, one end of the adjusting screw (4062) is rotatably connected to the fixed block (4061), the other end penetrates the side wall of the base (1), the adjusting block (4063) is fixedly arranged at the end of the adjusting screw (4062), the movable seat (4064) is sleeved on the guide rod (404), and the movable seat (4064) is threadedly connected with the adjusting screw (4062).