Vacuum adsorption device for special-shaped sample in semiconductor production

Abstract

The utility model discloses a vacuum adsorption device for special-shaped samples in semiconductor production, which comprises a vacuum chuck and an air pipe communicated with a vacuum pipeline, the vacuum chuck comprises a central through hole communicated with the air pipe and an annular groove unit communicated with the central through hole, a special carrier is arranged on the vacuum chuck, and the annular groove unit is provided with an annular groove. The special carrier comprises a placing groove for placing a wafer sample, the shape of the placing groove on the special carrier is set according to the shape of the wafer sample, the special carrier is divided into multiple types according to the shape of the placing groove, the multiple types of special carriers are detachably connected to the vacuum chuck, the placing groove is communicated with the central through hole, and the placing groove is matched with the annular groove unit. The special carrier has the beneficial effects that the problem of vacuum leakage caused by the fact that a special-shaped wafer sample cannot cover the vacuum chuck can be solved through the special carrier matched with the vacuum chuck for use, the purpose of adsorbing the wafer sample can be achieved by transferring vacuum air pressure to the wafer sample, and the processing steps of corresponding semiconductors can be smoothly completed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and more specifically, it relates to a vacuum adsorption device for irregularly shaped samples in semiconductor manufacturing. Background Technology

[0002] Vacuum adsorption is a common wafer fixation technique in semiconductor manufacturing. Vacuum chucks used on common semiconductor equipment are generally only suitable for adsorbing entire wafers. A small hole at the center of the chuck connects to a vacuum tube, and an annular groove communicates with the hole. Vacuum pressure is transmitted through this groove for adsorbing the entire wafer. However, when the wafer diameter is smaller than a certain value, or when the wafer sample to be processed is irregularly shaped such as square or triangular, making it impossible to cover the entire groove, vacuum leakage will occur, preventing the wafer sample from being adsorbed.

[0003] To address the aforementioned technical issues, a vacuum adsorption device for irregularly shaped samples in semiconductor manufacturing needs to be designed. By designing a dedicated carrier that works in conjunction with a vacuum chuck, the problem of vacuum leakage caused by irregularly shaped wafer samples not being able to cover the entire vacuum chuck can be prevented. At the same time, the vacuum pressure can be transferred to the wafer sample to achieve the purpose of adsorbing the wafer sample and smoothly completing the corresponding semiconductor processing steps. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a vacuum adsorption device for irregularly shaped samples in semiconductor production.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A vacuum adsorption device for irregularly shaped samples in semiconductor manufacturing includes a vacuum suction cup and a gas pipe connected to a vacuum pipeline. The vacuum suction cup includes a central through hole connected to the gas pipe and an annular groove unit connected to the central through hole. The vacuum suction cup is provided with a special carrier for adsorbing wafer samples. The special carrier includes a placement slot for placing wafer samples. The shape of the placement slot on the special carrier is set according to the shape of the wafer sample. The special carrier is divided into various types according to the shape of the placement slot. Various special carriers are detachably connected to the vacuum suction cup. The placement slot is connected to the central through hole and cooperates with the annular groove unit.

[0007] Further configured, the annular groove unit includes a first annular groove, a second annular groove, and a third annular groove with successively increasing radii. The bottom inner wall of the placement groove has a first suction hole corresponding to the central through hole, a plurality of second suction holes communicating with the first annular groove, and a plurality of third suction holes communicating with the second annular groove. The plurality of second suction holes are arranged circumferentially along the first annular groove, and the plurality of third suction holes are arranged circumferentially along the second annular groove. The first suction hole, the second suction hole, and the third suction hole correspond to the wafer sample in the placement groove.

[0008] Further configured, the diameter of the special carrier is larger than the diameter of the third annular groove.

[0009] A further configuration is provided, wherein the vacuum suction cup has a guide groove that communicates with the central through hole, and the guide groove communicates with the first annular groove, the second annular groove and the third annular groove.

[0010] By adopting the above technical solution, the beneficial effects of this utility model are as follows: by designing a special carrier that works in conjunction with a vacuum chuck, it is possible to prevent vacuum leakage caused by irregularly shaped wafer samples not being able to cover the annular groove unit of the vacuum chuck, and to transfer vacuum pressure to the wafer sample to achieve the purpose of adsorbing the wafer sample, thus successfully completing the corresponding semiconductor processing steps. Attached Figure Description

[0011] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0012] Figure 2 This is a schematic diagram of the structure of the annular groove unit and the central through hole.

[0013] Figure 3 This is a schematic diagram of the structure of a special carrier and a vacuum suction cup.

[0014] In the figure: vacuum suction cup 1, vacuum pipeline 2, central through hole 3, annular groove unit 100, special carrier 4, placement groove 5, first annular groove 6, second annular groove 7, third annular groove 8, first suction hole 9, second suction hole 10, third suction hole 11, guide groove 12. Detailed Implementation

[0015] Reference Figures 1 to 3 The embodiments of this utility model will be further described below.

[0016] A vacuum adsorption device for irregularly shaped samples in semiconductor manufacturing includes a vacuum suction cup 1 and an air pipe 2 connected to a vacuum pipeline. The vacuum suction cup 1 includes a central through hole 3 connected to the air pipe 2 and an annular groove unit 100 connected to the central through hole 3. The annular groove unit 100 includes a first annular groove 6, a second annular groove 7, and a third annular groove 8 with successively increasing radii. The bottom inner wall of the placement groove 5 has a first suction hole 9 corresponding to the central through hole 3, a plurality of second suction holes 10 connected to the first annular groove, and a plurality of third suction holes 11 connected to the second annular groove. The plurality of second suction holes 10 are arranged circumferentially along the first annular groove, and the plurality of third suction holes 11 are arranged circumferentially along the second annular groove. The first suction hole 9, the second suction hole 10, and the third suction hole 11 correspond to the wafer samples in the placement groove 5.

[0017] The vacuum chuck 1 is equipped with a special carrier 4 for adsorbing wafer samples. The diameter of the special carrier 4 is larger than the diameter of the third annular groove 8. The special carrier 4 includes a placement groove 5 for placing wafer samples. The shape of the placement groove 5 on the special carrier 4 is set according to the shape of the wafer sample. The special carrier 4 is divided into various types according to the shape of the placement groove 5. Various special carriers 4 are detachably connected to the vacuum chuck 1. The placement groove 5 is connected to the central through hole 3 and cooperates with the annular groove unit 100.

[0018] In use: Vacuum pressure enters the air pipe 2 through the vacuum line and is transmitted to the central through hole 3, then through the guide groove 12 to the first annular groove 6, the second annular groove 7, and the third annular groove 8. Since the diameter of the special carrier 4 is larger than the diameter of the third annular groove 8, the vacuum pressure transmitted to the third annular groove 8 adsorbs the special carrier 4, thus fixing it on the vacuum suction cup 1. The vacuum pressure entering the central through hole 3 then adsorbs the wafer sample in the placement groove 5 through the first suction hole 9. The vacuum pressure transmitted to the first annular groove 6 and the second annular groove 7 further adsorbs the wafer sample in the placement groove 5 through the second suction hole 10 and the third suction hole 11, achieving adsorption of the wafer sample on the special carrier 4. Because the special carrier 4 is fixed by adsorption through the vacuum pressure transmitted to the third annular groove 8, it is convenient for various special carriers 4 to be used. The detachable connection on the vacuum chuck 1 allows for easy replacement of the dedicated carrier 4 with corresponding shaped placement slots 5 according to the shape of the wafer sample. This ensures that irregularly shaped wafer samples, such as square or triangular ones, can cover the first suction hole 9, the second suction hole 10, and the third suction hole 11 to prevent vacuum pressure leakage, thereby achieving the adsorption of irregularly shaped wafer samples. The arrangement of several second suction holes 10 and several third suction holes 11 increases the adsorption force on the wafer sample, which helps to adsorb the wafer sample more firmly. Ultimately, by designing a dedicated carrier 4 that works in conjunction with the vacuum chuck 1, the problem of vacuum leakage caused by irregularly shaped wafer samples not being able to cover the annular slot unit of the vacuum chuck 1 is prevented, and the vacuum pressure is transferred to the wafer sample to achieve the purpose of adsorbing the wafer sample, thus successfully completing the corresponding semiconductor processing steps.

[0019] The vacuum chuck 1 has a guide groove 12 that communicates with the central through hole 3. The guide groove 12 is also connected to the first annular groove 6, the second annular groove 7, and the third annular groove 8. The guide groove 12 enables the annular groove unit 100 to communicate with the central through hole 3, facilitating the entry of vacuum air pressure into the central through hole 3 and its transmission through the guide groove 12 to the first annular groove 6, the second annular groove 7, and the third annular groove 8 to adsorb the wafer sample and the special carrier 4.

[0020] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A vacuum chucking device for irregularly shaped samples in semiconductor production, comprising a vacuum chuck (1) and an air tube (2) in communication with a vacuum line, characterized in that, The vacuum chuck (1) comprises a central through hole (3) communicated with the air pipe (2) and an annular groove unit (100) communicated with the central through hole (3), and a special carrier (4) for adsorbing a wafer sample is arranged on the vacuum chuck (1), the special carrier (4) comprises a placing groove (5) for placing the wafer sample, the shape of the placing groove (5) on the special carrier (4) is arranged according to the shape of the wafer sample, the special carrier (4) is divided into multiple types according to the shape of the placing groove (5), the multiple special carriers (4) are detachably connected on the vacuum chuck (1), the placing groove (5) is communicated with the central through hole (3), and the placing groove (5) is matched with the annular groove unit (100).

2. The vacuum chucking device for a profiled sample in semiconductor production according to claim 1, characterized in that, The annular groove unit (100) comprises a first annular groove (6), a second annular groove (7) and a third annular groove (8) with increasing radii, a first suction hole (9) corresponding to the central through hole (3), a plurality of second suction holes (10) communicated with the first annular groove and a plurality of third suction holes (11) communicated with the second annular groove are arranged on the inner wall of the bottom of the placing groove (5), the plurality of second suction holes (10) are arranged along the circumference of the first annular groove, the plurality of third suction holes (11) are arranged along the circumference of the second annular groove, and the first suction hole (9), the second suction hole (10) and the third suction hole (11) correspond to the wafer sample in the placing groove (5).

3. The vacuum chucking device for a profiled sample in semiconductor production according to claim 2, characterized in that, The diameter of the special carrier (4) is greater than the diameter of the third annular groove (8).

4. The vacuum chucking device for a profiled sample in semiconductor production according to claim 3, characterized in that, The vacuum chuck (1) is provided with a guide groove (12) communicated with the central through hole (3), and the guide groove (12) is communicated with the first annular groove (6), the second annular groove (7) and the third annular groove (8).

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