Wafer supporting device and thin film deposition equipment

Abstract

The utility model provides a wafer supporting device and thin film deposition equipment, the wafer supporting device comprises a supporting column and a heavy hammer, the bottom of the supporting column is provided with a plurality of clamping grooves which are arranged at intervals along the height direction of the supporting column; a containing cavity and a through hole are formed in the heavy hammer, and the through hole communicates with the exterior of the heavy hammer and the containing cavity; the bottom of the supporting column penetrates through the through hole to be located in the containing cavity, the clamping block is connected with any clamping groove in a clamped mode, and the clamping block is clamped below the through hole. The multiple clamping grooves are formed in the bottom of the supporting column at intervals in the height direction of the supporting column, the clamping block is clamped to any one of the clamping grooves, and then the clamping block is clamped below the through hole, so that clamping and fixing of the supporting column and the heavy hammer are achieved; according to the wafer supporting device, a worker can adjust the supporting height, located outside the heavy hammer, of the supporting column by adjusting clamping connection between the clamping blocks and the clamping grooves in different positions, so that the requirements of machines of different sizes are met, and the adaptability of the wafer supporting device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a wafer support device and a thin film deposition equipment. Background Technology

[0002] Semiconductor coating technology is a key technology for forming thin films with specific functions on the surface of wafers. This process is usually carried out in a vacuum environment, using physical or chemical methods to deposit metals, non-metals, or other compound materials in the gas phase onto the wafer surface to form a dense thin film.

[0003] Currently, thin film deposition on wafers takes place inside a reaction chamber. A robotic arm picks up a wafer from outside the reaction chamber, passes it through a valve into the chamber, and places it on a heating plate to deposit the thin film at a high temperature. After deposition, the robotic arm removes the wafer for transfer to the next process stage. To ensure that the robotic arm and the heating plate do not interfere with each other during wafer placement and removal, a wafer support device is provided on the heating plate to support the wafer after the heating plate descends, facilitating the placement and picking up of the wafer by the robotic arm. However, different machine sizes result in different robotic arm entry and exit heights from the reaction chamber, and different protrusion heights of the wafer support device after the heating plate descends. Therefore, different sizes of wafer support devices are required to ensure proper placement and picking up of the wafer by the robotic arm. Consequently, the current wafer support devices have low adaptability and cannot meet the needs of different machine types. Utility Model Content

[0004] The embodiments of this utility model provide a wafer support device and a thin film deposition equipment to improve the adaptability of the wafer support device and meet the needs of various sizes of machines.

[0005] This utility model provides a wafer support device, which includes:

[0006] A support column, the bottom of which is provided with a plurality of slots spaced apart along its height direction;

[0007] A weight, wherein the weight has an internal cavity and a through hole, the through hole connecting the outside of the weight and the cavity;

[0008] The bottom of the support column passes through the through hole and is located in the receiving cavity. It is engaged with any one of the slots by a locking block, and the locking block is locked below the through hole.

[0009] In the wafer support device provided by this utility model, the card block is provided with a card block groove, which is formed by an inward recess at one end of the card block; wherein, the card block groove passes through the opening of the card block groove to engage and fix with the card block groove.

[0010] In the wafer support device provided by this utility model, the diameter of the receiving cavity is larger than the diameter of the clamping block, and the diameter of the clamping block is larger than the diameter of the through hole.

[0011] In the wafer support device provided by this utility model, the weight includes an upper weight and a lower weight. The upper weight is snapped into the support column, and the lower weight is detachably connected to the upper weight. The lower weight is sleeved on the outside of the bottom of the upper weight and the support column.

[0012] In the wafer support device provided by this utility model, the outer surface of the upper weight is provided with a first locking part, the lower weight is provided with a fixing cavity formed by the downward indentation of its top end, the inner wall of the fixing cavity is provided with a second locking part, and the second locking part is locked and fixed with the first locking part.

[0013] In the wafer support device provided by this utility model, the first locking part includes a protruding block that protrudes outward from the outer surface of the upper counterweight, and the second locking part includes an inner flange that protrudes from the inner wall of the fixing cavity toward the center of the fixing cavity, and the inner flange is provided with a clearance opening for avoiding the protruding block;

[0014] Specifically, the lower counterweight is moved upward to allow the protruding block to pass through the clearance opening, and the lower counterweight is rotated to cause the protruding block to be locked under the inner flange.

[0015] In the wafer support device provided by this utility model, the lower counterweight is further provided with a threaded hole that passes through its bottom end and the fixed cavity, and the threaded hole is connected to the receiving cavity. The wafer support device also includes a set screw.

[0016] The bottom end of the support column passes through the receiving cavity into the threaded hole, and the set screw is locked to the threaded hole and abuts against the bottom end of the support column.

[0017] In the wafer support device provided by this utility model, the support column includes a support head and a support rod. The support head is connected to the top end of the support rod, and the diameter of the support head is larger than the diameter of the support rod. The support head is locked in the insertion hole of the heating plate, and the support rod passes through the insertion hole and is connected to the counterweight.

[0018] In the wafer support device provided by this utility model, the diameter of the support head gradually narrows from top to bottom.

[0019] This invention also provides a thin film deposition apparatus, which includes the wafer support device described in any of the above claims.

[0020] This application achieves a secure connection between the support column and the counterweight by providing multiple slots spaced at intervals along the height direction at the bottom of the support column, and then engaging any one of the slots with a locking block. The locking block is then positioned below the through hole, ensuring that the portion of the support column below the locking block is within the receiving cavity. Operators can adjust the engagement of the locking block with different slots to regulate the support height of the support column outside the counterweight, thus adjusting the support height of the wafer support device. This adapts to the needs of different sized machines, allowing the wafer support device to provide support under different machine sizes simply by adjusting the engagement position of the locking block with any one of the slots, thereby improving the adaptability of the wafer support device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a cross-sectional view of the wafer support device in an embodiment of the present invention;

[0023] Figure 2 This is an exploded view of the wafer support device in an embodiment of the present invention;

[0024] Figure 3 This is a structural diagram of the wafer support device in an embodiment of the present invention;

[0025] Figure 4 This is a structural diagram of the support column in an embodiment of the present invention;

[0026] Figures 5a-5b These are structural diagrams of the upper counterweight at various angles in embodiments of this utility model;

[0027] Figures 6a-6b These are structural diagrams of the lower counterweight at various angles in an embodiment of this utility model;

[0028] Figure 7 This is a structural diagram of the card block in an embodiment of the present utility model;

[0029] Figure 8 This is an assembly diagram of the wafer support device and heating plate in an embodiment of this utility model;

[0030] Figure 9 This is a cross-sectional view of the wafer support device and heating plate in an embodiment of the present invention;

[0031] Figure 10 This is a structural diagram of the thin film deposition equipment in an embodiment of the present invention;

[0032] Figures 11a-11c This is a diagram illustrating the movement process of the heating plate and the wafer support device in an embodiment of this utility model.

[0033] Figure 12 for Figure 11c Enlarged view of point A in the middle;

[0034] Figure 13 This is a structural diagram showing the card block located in another card slot in an embodiment of this utility model;

[0035] Figure 14 for Figure 13 Enlarged view of point B in the middle.

[0036] The labels for the attached figures are as follows:

[0037] 1. Wafer support device; 11. Support column; 111. Slot; 112. Support head; 113. Support rod; 12. Counterweight; 121. Receiving cavity; 122. Through hole; 123. Upper counterweight; 1230. First locking part; 1231. Protruding block; 124. Lower counterweight; 1240. Fixing cavity; 1241. Second locking part; 12411. Inner flange; 12412. Clearance opening; 1242. Threaded hole; 13. Locking block; 131. Locking block slot; 14. Set screw; 2. Heating plate; 21. Insertion hole; 3. Wafer; 4. Base plate. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0039] Reference Figures 1 to 14 The diagram illustrates an embodiment of the wafer support device 1 and thin film deposition equipment of this invention. The wafer support device 1 includes a support column 11 and a counterweight 12. The bottom of the support column 11 is provided with a plurality of slots 111 spaced apart along its height direction. The counterweight 12 has a receiving cavity 121 and a through hole 122 inside, the through hole 122 connecting the outside of the counterweight 12 and the receiving cavity 121. The bottom of the support column 11 passes through the through hole 122 and is located in the receiving cavity 121. A locking block 13 engages with any one of the slots 111 and is also secured below the through hole 122.

[0040] Specifically, the wafer support device 1 is used to support the wafer 3 to facilitate the placement and gripping of the wafer 3 by the robotic arm. The wafer support device 1 is movably connected to the heating plate 2 and is mounted on the heating plate 2, so that when the heating plate 2 moves up and down, the wafer support device 1 follows the heating plate 2 in its up and down movement. When the bottom end of the wafer support device 1 abuts against the base plate 4 of the reaction chamber, if the heating plate 2 moves down, the heating plate 2 continues to move down, while the wafer support device 1 no longer follows the heating plate 2 in its descent. At this time, the top end of the wafer support device 1 is higher than the top end of the heating plate 2, so as to facilitate the placement or gripping of the wafer 3 onto the wafer support device 1 by the robotic arm and ensure that the robotic arm does not interfere with the heating plate 2.

[0041] The wafer support device 1 includes a support column 11 and a counterweight 12. The top end of the support column 11 is engaged with the top end of the heating plate 2, and the support column 11 is slidably connected to the heating plate 2. The bottom end of the support column 11 is detachably connected to the counterweight 12. The top end of the support column 11 is used to contact the wafer 3, thereby ensuring that the wafer 3 is placed on the support column 11. The counterweight 12 is used to support the support column 11, and the counterweight 12 has a certain weight to ensure that the support column 11 can descend smoothly when the heating plate 2 descends.

[0042] The bottom of the support column 11 is provided with a plurality of slots 111. The slots 111 are formed by indentation from the outer surface of the support column 11 along the circumference of the support column 11. The plurality of slots 111 are spaced apart at the bottom of the support column 11 along the height direction of the support column 11. The slots 111 are used to engage with the locking block 13 to engage and fix with the counterweight 12. The counterweight 12 is provided with a through hole 122 and a receiving cavity 121. The receiving cavity 121 is located inside the counterweight 12. The through hole 122 extends from one side of the counterweight 12 into the receiving cavity 121. Therefore, the through hole 122 passes through the outside of the counterweight 12 and the receiving cavity 121. The through hole 122 is used to avoid the support column 11 so that the bottom of the support column 11 can pass through the through hole 122 and enter the receiving cavity 121.

[0043] The support column 11 is inserted into the hole of the heating plate 2, and the bottom end of the support column 11 passes through the through hole 122 into the receiving cavity 121. At this time, the multiple slots 111 are located in the receiving cavity 121. Then, the locking block 13 is locked into any one of the slots 111, and the locking block 13 is also locked into the receiving cavity 121. That is, the locking block 13 is first locked into the slot 111, so that the locking block 13 is fixedly connected to the support column 11. Then, the locking block 13 is locked below the through hole 122, that is, the top end of the locking block 13 is locked into the bottom end of the through hole 122, so that the bottom of the support column 11 is fixed in the receiving cavity 121, thereby making the support column 11 fixedly connected to the counterweight 12.

[0044] This application achieves the locking and fixing of the support column 11 and the counterweight 12 by setting multiple slots 111 at intervals along the height direction at the bottom of the support column 11, and then locking the locking block 13 onto any one of the slots 111. The locking block 13 is then locked below the through hole 122, so that the part of the support column 11 below the locking block 13 is all located within the receiving cavity 121. The operator can adjust the locking height of the support column 11 outside the counterweight 12 by adjusting the locking position of the locking block 13 with the slots 111 at different positions, thereby adjusting the support height of the wafer support device 1 to adapt to the needs of different sized machines. Under the condition of different sized machines, the wafer support device 1 can achieve the supporting function by simply adjusting the locking position of the locking block 13 with any one of the slots 111, thus improving the adaptability of the wafer support device 1.

[0045] In one embodiment, reference is made to Figure 1 and Figure 7As shown, the locking block 13 has a locking slot 131, which is formed by an inward recess from one end of the locking block 13. The locking groove 111 passes through the opening of the locking slot 131 to engage and fix it. Specifically, the locking block 13 and the locking groove 111 are engaged to fix the locking block 13 to the support column 11. In this embodiment, the locking groove 111 is formed by an inward recess from the outer surface of the support column 11 along its circumference. The support column 11 is a cylindrical structure, therefore the locking block 13 is designed as a ring structure. The locking block 13 has a locking slot 131, which is used to accommodate the locking groove 111. When the locking block 13 and the support column 11 are engaged, the locking groove 131 engages with the locking block 13. On the groove 111, the fixed connection between the locking block 13 and the support column 11 is achieved; the locking block groove 131 is formed by one end of the locking block 13 being recessed inward, so the opening of the locking block groove 131 connects the locking block groove 131 and the outside, and the locking block groove 131 penetrates the upper and lower ends of the locking block 13, that is, the opening of the locking block groove 131 makes one end of the locking block 13 form a notch, the notch is used to avoid the support column 11. In this embodiment, the locking block 13 has a "C" shaped structure and the locking block groove 131 has a "U" shaped structure.

[0046] Therefore, when assembling the locking block 13 and the support column 11, one of the locking slots 111 on the support column 11 can pass through the opening of the locking block slot 131 and enter the locking block slot 131. Through the locking of the locking slot 111 and the locking block slot 131, the locking block 13 and the support column 11 are locked together. Among them, a suitable locking slot 111 can be selected to lock with the locking block 13 according to the actual machine requirements, thereby adjusting the support height of the support column 11.

[0047] In this embodiment, the connection between the locking block 13 and the support column 11 is achieved by locking the locking block slot 131 into the slot 111. This method is simple to operate, and when adjusting the locking position of the locking block 13 and the slot 111, the locking block 13 can be directly removed from one of the slots 111 and then locked into the other slot 111. This improves the assembly and disassembly efficiency of the locking block 13 and the support column 11 and enhances the user experience.

[0048] In a specific embodiment, refer to Figure 1As shown, the diameter of the receiving cavity 121 is larger than the diameter of the locking block 13, and the diameter of the locking block 13 is larger than the diameter of the through hole 122. Specifically, when assembling the support column 11 and the counterweight 12, the bottom end of the support column 11 is first passed through the through hole 122 into the receiving cavity 121. Then, the counterweight 12 is moved up the height direction of the support column 11 until the locking groove 111 to be locked is exposed. Then, the locking block 13 is locked onto the locking groove 111. Then, the counterweight 12 is moved downward so that the bottom of the locking block 13 and the support column 11 are both accommodated in the receiving cavity 121. Finally, by locking the locking block 13 below the through hole 122, the support column 11 and the counterweight 12 are locked and fixed, preventing the bottom end of the support column 11 from detaching from the counterweight 12 and moving upward. Therefore, the diameter of the receiving cavity 121 is set to be larger than the diameter of the locking block 13 to ensure that the locking block 13 is placed inside the receiving cavity 121, thereby preventing the locking block 13 from being bumped, improving the service life of the locking block 13, and ensuring the stability of the locking block 13 in use, thereby improving the structural stability of the wafer support device 1; at the same time, the locking method of the locking block 13 and the through hole 122 is to set the diameter of the locking block 13 to be larger than the diameter of the through hole 122, so that the locking block 13 is locked below the through hole 122, that is, the locking block 13 is locked in the receiving cavity 121, preventing the locking block 13 and the support column 11 from detaching from the counterweight 12 through the through hole 122.

[0049] In this embodiment, by setting the diameter of the locking block 13 to be larger than the diameter of the through hole 122 and smaller than the diameter of the receiving cavity 121, it is ensured that the bottoms of the locking block 13 and the support column 11 are both located within the receiving cavity 121, and the locking block 13 and the support column 11 are prevented from detaching from the counterweight 12.

[0050] In one embodiment, reference is made to Figure 1 and Figure 3As shown, the counterweight 12 includes an upper counterweight 123 and a lower counterweight 124. The upper counterweight 123 is engaged with the support column 11, and the lower counterweight 124 is detachably connected to the upper counterweight 123. The lower counterweight 124 is sleeved on the outer side of the bottom of the upper counterweight 123 and the support column 11. Specifically, the counterweight 12 is composed of an upper counterweight 123 and a lower counterweight 124. The upper counterweight 123 is used to engage and fix with the support column 11, thereby fixing the support height of the support column 11. The receiving cavity 121 and the through hole 122 are both provided in the upper counterweight 123. The receiving cavity 121 is located inside the upper counterweight 123, and the through hole 122 is located at the top of the upper counterweight 123 and extends into the receiving cavity 121. Therefore, the bottom of the support column 11 can pass through the through hole 122 and enter the receiving cavity 121.

[0051] If the height of the bottom of the support column 11 from the position of the locking block 13 to the bottom of the support column 11 is greater than the height of the upper counterweight 123, the bottom of the support column 11 will protrude outward from the upper counterweight 123 and be located below the bottom of the upper counterweight 123. In this case, the bottom of the support column 11 will directly abut against the base 4 of the reaction chamber. The contact area between the support column 11 and the base 4 is small, which will make the stability of the support column 11 poor when lifting the wafer 3. Therefore, in this embodiment, a lower counterweight 124 is also provided. The lower counterweight 124 is used to contact the base 4 to increase the contact area between the wafer support device 1 and the base 4, thereby improving the stability of the wafer support device 1 when supporting the wafer 3. The lower counterweight 124 is detachably connected to the upper counterweight 123 to facilitate the installation and removal of the upper counterweight 123 and the lower counterweight 124, and thus facilitate the adjustment of the locking position of the locking block 13 and the locking slot 111. This arrangement improves assembly efficiency. Simultaneously, the lower counterweight 124 is fitted over the outer side of the bottom of the upper counterweight 123 and the support column 11. Therefore, the cross-sectional area of ​​the bottom of the lower counterweight 124 is larger than that of the bottom of the support column 11. This means the lower counterweight 124 covers the bottom of both the upper counterweight 123 and the support column 11, ensuring that the bottom of the lower counterweight 124 is below the bottom of the support column 11. Consequently, when the wafer support device 1 descends with the heating plate 2 to contact the base 4, the bottom of the lower counterweight 124 directly contacts the base 4, supporting the support column 11 on the base 4. Since the contact area between the lower counterweight 124 and the base 4 is larger than the contact area between the support column 11 and the base 4, the stability of the support column 11 provided by the lower counterweight 124 and the upper counterweight 123 is higher, thus improving the stability of the support column 11 during the lifting of the wafer 3.

[0052] In a specific embodiment, refer to Figures 5a to 6b As shown, the outer surface of the upper hammer 123 is provided with a first locking part 1230, and the lower hammer 124 is provided with a fixing cavity 1240 formed by the downward indentation of its top end. The inner wall of the fixing cavity 1240 is provided with a second locking part 1241, and the second locking part 1241 is locked and fixed with the first locking part 1230. Specifically, the connection methods of the upper hammer 123 and the lower hammer 124 are varied, and the upper hammer 123 and the lower hammer 124 are detachably connected. In this embodiment, the connection method of the upper hammer 123 and the lower hammer 124 is a snap-fit ​​method. More specifically, the outer surface of the upper hammer 123 is provided with a first snap-fit ​​part 1230, and the interior of the lower hammer 124 is provided with a fixing cavity 1240. The diameter of the fixing cavity 1240 is larger than the diameter of the upper hammer 123. The fixing cavity 1240 is used to accommodate the bottom of the upper hammer 123 and the support column 11. The fixing cavity 1240 is formed by the downward indentation of the top end of the lower hammer 124, and the inner wall of the fixing cavity 1240 is provided with a second snap-fit ​​part 1241.

[0053] Therefore, when assembling the heating plate 2 and the wafer support device 1, the support column 11 is first inserted into the hole of the heating plate 2, and then the bottom end of the support column 11 is passed through the through hole 122 of the upper counterweight 123 and enters the receiving cavity 121. The upper counterweight 123 is moved upward to engage the locking block 13 into the locking slot 111. Then, the top end of the lower counterweight 124 is moved from below the upper counterweight 123 to above the upper counterweight 123 until the upper counterweight 123 is embedded in the fixing cavity 1240. At the same time, the first locking part 1230 and the second locking part 1241 are engaged to complete the connection between the lower counterweight 124 and the upper counterweight 123. When it is necessary to disassemble the lower counterweight 124 and the upper counterweight 123, the engagement of the first locking part 1230 and the second locking part 1241 can be directly released.

[0054] In this embodiment, the upper counterweight 123 and the lower counterweight 124 are detachably connected by a snap-fit ​​mechanism, which is simple in structure and quick to operate.

[0055] In one embodiment, reference is made to Figures 5a to 6bAs shown, the first locking part 1230 includes a protruding block 1231 protruding outward from the outer surface of the upper counterweight 123, and the second locking part 1241 includes an inner flange 12411 protruding from the inner wall of the fixing cavity 1240 toward the center of the fixing cavity 1240. The inner flange 12411 is provided with a clearance opening 12412 for avoiding the protruding block 1231. The lower counterweight 124 is moved upward so that the protruding block 1231 passes through the clearance opening 12412, and the lower counterweight 124 is rotated so that the protruding block 1231 is locked under the inner flange 12411. Specifically, the first engaging portion 1230 is disposed on the outer surface of the upper counterweight 123, and the first engaging portion 1230 includes a protruding block 1231 protruding outward from the outer surface of the upper counterweight 123, the protruding block 1231 being located on opposite sides of the upper counterweight 123; the second engaging portion 1241 includes an inner flange 12411 disposed within the fixing cavity 1240, the inner flange 12411 extending horizontally from the cavity wall of the fixing cavity 1240 toward the center of the fixing cavity 1240, the inner flange 12411 dividing the fixing cavity 1240 into upper and lower chambers, and the two chambers being interconnected. The inner flange 12411 is also provided with a clearance opening 12412 corresponding to the protruding block 1231. The clearance opening 12412 is used to avoid the protruding block 1231 so that the protruding block 1231 passes through the clearance opening 12412 from one side of the inner flange 12411 to the other side of the inner flange 12411. The clearance opening 12412 is formed by the edge of the inner flange 12411 near the center of the fixing cavity 1240 and is recessed towards the cavity wall of the fixing cavity 1240. The size and shape of the clearance opening 12412 are consistent with the size and shape of the protruding block 1231.

[0056] When assembling the lower counterweight 124 and the upper counterweight 123, move the lower counterweight 124 upwards toward the upper counterweight 123, and align the clearance opening 12412 with the position of the protruding block 1231. Move the lower counterweight 124 upwards until the protruding block 1231 passes through the clearance opening 12412 from the upper side of the inner flange 12411 and is located on the lower side of the inner flange 12411. Then rotate the lower counterweight 124 to offset the clearance opening 12412 and the protruding block 1231 so that the top of the protruding block 1231... The protruding block 1231 abuts against the lower end of the inner flange 12411, thereby locking the lower counterweight 124 and the upper counterweight 123 under the inner flange 12411, thus achieving the assembly of the lower counterweight 124 and the upper counterweight 123. When disassembling the lower counterweight 124 and the upper counterweight 123, first rotate the lower counterweight 124 so that the clearance opening 12412 is aligned with the position of the protruding block 1231, then move the lower counterweight 124 down so that the protruding block 1231 passes through the clearance opening 12412 until the lower counterweight 124 and the upper counterweight 123 are completely separated.

[0057] In this embodiment, by limiting and fixing the protruding block 1231 and the inner flange 12411, the connection between the lower hammer 124 and the upper hammer 123 can be achieved simply by moving and rotating the lower hammer 124. This operation is simple and facilitates the installation and disassembly of the lower hammer 124 and the upper hammer 123, thereby improving work efficiency.

[0058] In a specific embodiment, refer to Figure 1 , Figure 12 and Figure 14As shown, the lower counterweight 124 is also provided with a threaded hole 1242 that passes through its bottom end and the fixed cavity 1240, and the threaded hole 1242 communicates with the receiving cavity 121. The wafer support device 1 also includes a set screw 14. The bottom end of the support column 11 passes through the receiving cavity 121 into the threaded hole 1242, and the set screw 14 is locked to the threaded hole 1242 and abuts against the bottom end of the support column 11. Specifically, the receiving cavity 121 extends from the interior of the upper counterweight 123 to the bottom end of the upper counterweight 123. Therefore, the top and bottom ends of the upper counterweight 123 are connected by the through hole 122 and the receiving cavity 121, allowing the bottom end of the support column 11 to pass through the through hole 122 sequentially from above the upper counterweight 123. The receiving cavity 121 is located below the upper counterweight 123. The lower counterweight 124 is also provided with a threaded hole 1242, which extends through the fixing cavity 1240 and the bottom end of the lower counterweight 124, i.e., the top and bottom ends of the lower counterweight 124 are connected, and the threaded hole 1242 is connected to the receiving cavity 121. The wafer support device 1 also includes a set screw 14, which is used to cooperate with the locking block 13 to fix the support column 11. The outer surface of the set screw 14 is provided with threads to lock and fix it with the threaded hole 1242.

[0059] When the upper counterweight 123, the lower counterweight 124, and the support column 11 are assembled, the upper counterweight 123 is embedded in the fixed cavity 1240, and the bottom end of the receiving cavity 121 is correspondingly connected and communicates with the threaded hole 1242. At this time, the bottom end of the support column 11 passes through the through hole 122 and the receiving cavity 121 to the threaded hole 1242. Then, the set screw 14 is screwed into the threaded hole 1242 of the lower counterweight 124 with a wrench so that the set screw 14 is locked to the threaded hole 1242, thereby making the set screw 14 abut against the bottom end of the support column 11. At the same time, the locking block 13 engages the locking groove 111 and the through hole 122. The support column 11 is fixed in the upper counterweight 123 and the lower counterweight 124 by the set screw 14 and the locking block 13, realizing the connection of the support column 11, the upper counterweight 123, and the lower counterweight 124.

[0060] In this embodiment, the support height of the support column 11 is adjusted by adjusting the screwing depth of the set screw 14 and the position of the locking block 13 in the locking slot 111, thereby improving the stability of the support column 11, the upper counterweight 123 and the lower counterweight 124, and the stability of the support column 11 when lifting the wafer 3.

[0061] More specifically, the bottom end of the set screw 14 is provided with an internal hexagon head to facilitate operation with the hole of a hex wrench.

[0062] In one embodiment, reference is made to Figure 4 , Figures 8 to 13 As shown, the support column 11 includes a support head 112 and a support rod 113. The support head 112 is connected to the top end of the support rod 113, and the diameter of the support head 112 is larger than the diameter of the support rod 113. The support head 112 is engaged in the insertion hole 21 of the heating plate 2, and the support rod 113 passes through the insertion hole 21 and is connected to the counterweight 12. Specifically, the support column 11 includes a support head 112 and a support rod 113. The support head 112 is fixedly connected to the top end of the support rod 113, and the diameter of the support head 112 is larger than the diameter of the support rod 113, that is, the support column 11 is generally T-shaped. The support head 112 is used to lift the wafer 3, and the support rod 113 is used to connect to the counterweight 12 and support the support head 112. When the wafer support device 1 is assembled with the heating plate 2, the support head 112 is engaged above the insertion hole 21 of the heating plate 2. The bottom end of the support rod 113 passes through the insertion hole 21 until it is located below the heating plate 2, and the bottom end of the support rod 113 is connected to the counterweight 12, and the support rod 113 is movably connected to the insertion hole 21; therefore, the support column 11 moves with the heating plate 2 until the counterweight 12 abuts against the base plate 4, and the support rod 113 can move relative to the heating plate 2 so that the support head 112 has a certain distance from the top of the heating plate 2, and the support head 112 can directly support the wafer 3, which is convenient for the robot to place or grasp the wafer 3.

[0063] In a specific embodiment, refer to Figure 4 As shown, the diameter of the support head 112 gradually narrows from top to bottom. Specifically, the support head 112 has an inverted conical structure, meaning its diameter gradually narrows from top to bottom. The diameter of the top end of the support head 112 is larger than the diameter of the bottom end. The bottom end of the support head 112 is connected to the top end of the support rod 113. The top end of the support head 112 has a large contact area with the wafer 3 to improve the stability of the support column 11 in lifting the wafer 3. At the same time, the outer surface of the support head 112 that contacts the heating plate 2 has an arc-shaped structure to prevent damage to the heating plate 2 when the support column 11 moves relative to the heating plate 2, thereby improving the service life of the support head 112 and the heating plate 2. Meanwhile, the shape and size of the top of the insertion hole 21 are consistent with the shape and size of the support head 112, so that the support head 112 can be completely embedded in the insertion hole 21. The top of the support head 112 is flush with the top of the heating plate 2, ensuring the stability of the wafer 3 when it is on the top of the heating plate 2.

[0064] Reference Figures 10 to 14As shown, this embodiment also provides a thin film deposition apparatus, which includes a wafer support device 1. The wafer support device 1 can be any type of wafer support device 1 provided by this utility model. Since the specific structure and working principle of the wafer support device 1 have been described in detail in the previous specification, they will not be repeated here for the sake of brevity.

[0065] The thin film deposition equipment in this embodiment adopts the wafer support device 1 provided by this utility model. The wafer support device 1 has high adaptability and can effectively adapt to machine tools of different sizes. There is no need to replace wafer support devices 1 of different sizes. By adjusting the snap-fit ​​position of the snap-fit ​​block 13 and the snap-fit ​​slot 111, it can adapt to machine tools of different sizes. This makes the working efficiency of the thin film deposition equipment high and eliminates the need to use multiple wafer support devices 1 to adapt to machine tools of different sizes, thereby reducing production costs.

[0066] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A wafer support device, characterized in that, include: A support column, the bottom of which is provided with a plurality of slots spaced apart along its height direction; A weight, wherein the weight has an internal cavity and a through hole, the through hole connecting the outside of the weight and the cavity; The bottom of the support column passes through the through hole and is located in the receiving cavity. It is engaged with any one of the slots by a locking block, and the locking block is locked below the through hole.

2. The wafer support device according to claim 1, characterized in that, The card block is provided with a card block groove, which is formed by an inward recess at one end of the card block; wherein, the card block groove passes through the opening of the card block groove to engage and fix with the card block groove.

3. The wafer support device according to claim 1, characterized in that, The diameter of the receiving cavity is larger than the diameter of the card block, and the diameter of the card block is larger than the diameter of the through hole.

4. The wafer support device according to claim 1, characterized in that, The weight includes an upper weight and a lower weight. The upper weight is snapped into the support column, and the lower weight is detachably connected to the upper weight. The lower weight is sleeved on the outside of the bottom of the upper weight and the support column.

5. The wafer support device according to claim 4, characterized in that, The outer surface of the upper counterweight is provided with a first locking part, and the lower counterweight is provided with a fixing cavity formed by the downward indentation of its top end. The inner wall of the fixing cavity is provided with a second locking part, and the second locking part is locked and fixed with the first locking part.

6. The wafer support device according to claim 5, characterized in that, The first locking part includes a protruding block that protrudes outward from the outer surface of the upper counterweight, and the second locking part includes an inner flange that protrudes from the inner wall of the fixing cavity toward the center of the fixing cavity, and the inner flange is provided with a clearance opening for avoiding the protruding block; Specifically, the lower counterweight is moved upward to allow the protruding block to pass through the clearance opening, and the lower counterweight is rotated to cause the protruding block to be locked under the inner flange.

7. The wafer support device according to claim 5, characterized in that, The lower counterweight is also provided with a threaded hole that passes through its bottom end and the fixed cavity, and the threaded hole communicates with the receiving cavity. The wafer support device also includes a set screw. The bottom end of the support column passes through the receiving cavity into the threaded hole, and the set screw is locked to the threaded hole and abuts against the bottom end of the support column.

8. The wafer support device according to claim 1, characterized in that, The support column includes a support head and a support rod. The support head is connected to the top end of the support rod, and the diameter of the support head is larger than the diameter of the support rod. The support head is inserted into the socket of the heating plate, and the support rod passes through the socket and is connected to the counterweight.

9. The wafer support device according to claim 8, characterized in that, The diameter of the support head gradually narrows from top to bottom.

10. A thin film deposition apparatus, characterized in that, Includes the wafer support device as described in any one of claims 1-9.

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