Cooling device for high-temperature detection probe

Abstract

The utility model discloses a high temperature detection probe cooling device which comprises a probe body, the outer wall of the probe body is sleeved with a first U-shaped piece in a sliding mode, the outer wall of the probe body is sleeved with a second U-shaped piece of a hollow structure in a sliding mode, and a semiconductor chilling plate is fixedly embedded in the inner wall of the second U-shaped piece. A U-shaped heat conduction copper sheet is fixedly connected to the outer wall of the refrigeration end of the semiconductor refrigeration sheet, heat conduction silica gel sheets are fixedly connected to the outer wall of the first U-shaped piece and the outer wall of the U-shaped heat conduction copper sheet, and a micro cooling fan is fixedly connected to the interior of the second U-shaped piece. Through the arrangement of the first U-shaped piece, the second U-shaped piece, the semiconductor chilling plate, the U-shaped heat conduction copper sheet, the heat conduction silica gel sheet, the miniature cooling fan and the cooling copper sheet, the shell of the probe body is cooled, and heat transferred into internal electronic elements is reduced, so that long-time welding seam detection is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of weld inspection technology, and in particular to a cooling device for a high-temperature detection probe. Background Technology

[0002] Saturated field gradient electromagnetic array imaging (FGI) is based on the principle of electromagnetic induction. It excites a gradient field of electric and magnetic fields on the surface of a conductor, and measures the three-dimensional dimensions of defects by observing the perturbation of this gradient field by defects. By adding a strong DC magnetic field to the surface gradient field, the penetration depth of the induced surface current is increased, and changes in permeability caused by internal defects are simultaneously sensed, thus enabling the detection of internal defects. In practical applications, the main probe utilizes saturated field gradient electromagnetic array imaging to inspect the fillet weld area of ​​small pipes.

[0003] In existing technologies, FGI detection technology mainly relies on manual scanning by inspectors using probes. However, the weld seam retains residual heat after welding. If the small connecting pipe is allowed to cool completely before detection, it takes a lot of time. Therefore, when the probe is used before the weld seam has fully cooled, the heat from the probe housing is continuously transferred to the interior, which can easily affect the internal electronic components. Therefore, we propose a high-temperature detection probe cooling device to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-temperature detection probe cooling device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-temperature detection probe cooling device includes a probe body. A first U-shaped component is slidably fitted onto the outer wall of the probe body. A second U-shaped component with a hollow structure is slidably fitted onto the outer wall of the probe body. A semiconductor cooling chip is fixedly embedded in the inner wall of the second U-shaped component. A U-shaped thermally conductive copper sheet is fixedly connected to the outer wall of the cooling end of the semiconductor cooling chip. Thermally conductive silicone sheets are fixedly connected to the outer walls of both the first U-shaped component and the U-shaped thermally conductive copper sheet. A miniature cooling fan is fixedly connected inside the second U-shaped component. Multiple heat dissipation copper sheets are fixedly connected to the outer wall of the heating end of the semiconductor cooling chip. Two U-shaped clips are slidably fitted onto the outer walls of both the first and second U-shaped components. Two elastic ropes are fixedly connected to each of the four U-shaped clips in pairs. A docking mechanism is provided on the outer wall of the first U-shaped component.

[0007] Preferably, the docking mechanism includes six rectangular blocks, one end of each of the six rectangular blocks is fixedly connected to the outer wall of the first U-shaped component, and the outer wall of the second U-shaped component has six rectangular insertion holes. The outer wall of the rectangular blocks is slidably connected to the inner wall of the rectangular insertion holes. The docking mechanism is provided to facilitate the cooperation between the first U-shaped component and the second U-shaped component.

[0008] Preferably, the outer wall of the thermally conductive silicone pad is in contact with the outer wall of the probe body, and the heat is transferred to the U-shaped thermally conductive copper sheet by setting the thermally conductive silicone pad.

[0009] Preferably, the outer wall of the second U-shaped component is provided with a plurality of air inlets, and the outer wall of the micro cooling fan is provided with an air outlet.

[0010] Preferably, multiple heat dissipation copper fins are located on one side of the air outlet, and a heat dissipation exhaust port is provided at the bottom of the second U-shaped component.

[0011] Preferably, the first U-shaped component and the second U-shaped component are fitted together.

[0012] Compared with the prior art, the advantages of this utility model are:

[0013] This solution uses a first U-shaped component, a second U-shaped component, a semiconductor cooling chip, a U-shaped thermally conductive copper sheet, a thermally conductive silicone sheet, a miniature cooling fan, and a heat dissipation copper sheet to dissipate heat from the probe body housing, reducing heat transfer to the internal electronic components and facilitating long-term weld inspection.

[0014] By incorporating U-shaped clips, elastic cords, rectangular inserts, and rectangular holes, the heat dissipation structure can be detachably mounted on the probe body, facilitating maintenance of the heat dissipation structure. Attached Figure Description

[0015] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of a high-temperature detection probe cooling device proposed in this utility model;

[0017] Figure 2 This is a cross-sectional structural diagram of a high-temperature detection probe cooling device proposed in this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of a high-temperature detection probe cooling device proposed in this utility model;

[0019] Figure 4 This is a schematic diagram of the micro cooling fan and air inlet structure of a high-temperature detection probe cooling device proposed in this utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the first U-shaped component, the second U-shaped component, the U-shaped clip, the elastic rope, the rectangular plug and the rectangular socket of a high-temperature detection probe cooling device proposed in this utility model.

[0021] In the diagram: 1. Probe body; 2. First U-shaped component; 3. Second U-shaped component; 4. Semiconductor cooling chip; 5. U-shaped thermally conductive copper sheet; 6. Thermally conductive silicone sheet; 7. Miniature cooling fan; 8. Air inlet; 9. Air outlet; 10. Heat dissipation copper sheet; 11. Heat dissipation exhaust vent; 12. U-shaped clip; 13. Elastic cord; 14. Rectangular insertion block; 15. Rectangular insertion hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Depend on Figures 1-5 As shown, a high-temperature detection probe cooling device is disclosed, including a probe body 1, a first U-shaped component 2 slidably sleeved on the outer wall of the probe body 1, and a hollow second U-shaped component 3 slidably sleeved on the outer wall of the probe body 1, with the first U-shaped component 2 and the second U-shaped component 3 being in contact with each other.

[0024] The inner wall of the second U-shaped component 3 is fixedly embedded with a semiconductor cooling chip 4. The outer wall of the cooling end of the semiconductor cooling chip 4 is fixedly connected with a U-shaped thermally conductive copper sheet 5. The cooling end of the semiconductor cooling chip 4 cools the U-shaped thermally conductive copper sheet 5. The outer walls of the first U-shaped component 2 and the U-shaped thermally conductive copper sheet 5 are both fixedly connected with thermally conductive silicone sheets 6. The outer wall of the thermally conductive silicone sheet 6 is in contact with the outer wall of the probe body 1. The thermally conductive silicone sheet 6 wraps the outer wall of the probe body 1 shell with its own material and extrusion force, which facilitates heat transfer.

[0025] A miniature cooling fan 7 is fixedly connected inside the second U-shaped component 3. The miniature cooling fan 7 and the semiconductor cooling chip 4 are powered by an existing rechargeable battery. Multiple air inlets 8 are evenly opened on the outer wall of the second U-shaped component 3. The multiple air inlets 8 are used for outside air to enter the second U-shaped component 3. An air outlet 9 is opened on the outer wall of the miniature cooling fan 7. Multiple heat dissipation copper fins 10 are fixedly connected to the outer wall of the heating end of the semiconductor cooling chip 4. The multiple heat dissipation copper fins 10 conduct heat from the heating end of the semiconductor cooling chip 4 and then cool it down by air cooling. The multiple heat dissipation copper fins 10 are located on one side of the air outlet 9. A heat dissipation exhaust port 11 is opened at the bottom of the second U-shaped component 3. The heat dissipation exhaust port 11 is set downward. When the probe body 1 is in use, the detection end position is blown by the airflow, which is beneficial to the cooling of the weld position.

[0026] Two U-shaped clips 12 are slidably fitted on the outer walls of the first U-shaped part 2 and the second U-shaped part 3. The four U-shaped clips 12 are fixedly connected in pairs to two elastic ropes 13. The elastic ropes 13 have elasticity. When the U-shaped clips 12 are fitted on the first U-shaped part 2 and the second U-shaped part 3, the elastic ropes 13 deform to generate tension.

[0027] The outer wall of the first U-shaped part 2 is provided with a docking mechanism, which includes six rectangular inserts 14. One end of each of the six rectangular inserts 14 is fixedly connected to the outer wall of the first U-shaped part 2. The outer wall of the second U-shaped part 3 is provided with six rectangular insertion holes 15. The outer wall of the rectangular inserts 14 is slidably connected to the inner wall of the rectangular insertion holes 15.

[0028] Working principle: When the probe body 1 inspects the weld of the small connecting pipe, the first U-shaped piece 2 and the second U-shaped piece 3 are pre-fitted onto the outer wall of the probe body 1. At this time, multiple rectangular inserts 14 slide into multiple rectangular insert holes 15 respectively, so that the first U-shaped piece 2 and the second U-shaped piece 3 are aligned. The probe body 1 is then wrapped with a thermally conductive silicone sheet 6. Four U-shaped clips 12 are then fitted onto the outer walls of the first U-shaped piece 2 and the second U-shaped piece 3 respectively. The elasticity of the elastic rope 13 tightens the first U-shaped piece 2 and the second U-shaped piece 3, fixing their positions so that they can be detachably installed on the probe body. On the probe body 1, after heat is generated on the outer shell of the probe body 1, the heat is transferred to the outer wall of the U-shaped thermally conductive copper sheet 5 through the thermally conductive silicone sheet 6. The heat on the U-shaped thermally conductive copper sheet 5 is then drawn into the second U-shaped component 3 by the operation of the micro cooling fan 7 through multiple air inlets 8. The airflow is then blown onto multiple heat dissipation copper sheets 10 through the air outlet 9 to dissipate heat from the heating end of the semiconductor cooling chip 4. The heat is discharged from the heat dissipation exhaust port 11 with the airflow. Meanwhile, the cooling end of the semiconductor cooling chip 4 cools the U-shaped thermally conductive copper sheet 5, thereby achieving heat dissipation of the probe body 1 shell.

[0029] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. Furthermore, the structure and principle of the components known to those skilled in the art can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0030] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature detection probe cooling device, comprising a probe body (1), characterized in that, The outer wall of the probe body (1) is slidably fitted with a first U-shaped part (2), and the outer wall of the probe body (1) is slidably fitted with a hollow second U-shaped part (3). The inner wall of the second U-shaped part (3) is fixedly embedded with a semiconductor cooling chip (4). The outer wall of the cooling end of the semiconductor cooling chip (4) is fixedly connected with a U-shaped heat-conducting copper sheet (5). The outer walls of the first U-shaped part (2) and the U-shaped heat-conducting copper sheet (5) are both fixedly connected with heat-conducting silicone sheets (6). The interior of the second U-shaped part (3) is fixedly connected with a miniature cooling fan (7). The outer wall of the heating end of the semiconductor cooling chip (4) is fixedly connected with multiple heat-dissipating copper sheets (10). The outer walls of the first U-shaped part (2) and the second U-shaped part (3) are slidably fitted with two U-shaped clips (12). The four U-shaped clips (12) are fixedly connected in pairs with two elastic ropes (13). The outer wall of the first U-shaped part (2) is provided with a docking mechanism.

2. The high-temperature detection probe cooling device according to claim 1, characterized in that, The docking mechanism includes six rectangular inserts (14), one end of each of the six rectangular inserts (14) is fixedly connected to the outer wall of the first U-shaped part (2), and the outer wall of the second U-shaped part (3) is provided with six rectangular insertion holes (15). The outer wall of the rectangular inserts (14) is slidably connected to the inner wall of the rectangular insertion holes (15).

3. The high-temperature detection probe cooling device according to claim 1, characterized in that, The outer wall of the thermally conductive silicone sheet (6) is in contact with the outer wall of the probe body (1).

4. The high-temperature detection probe cooling device according to claim 1, characterized in that, The outer wall of the second U-shaped component (3) is provided with a plurality of air inlets (8), and the outer wall of the micro cooling fan (7) is provided with an air outlet (9).

5. A high-temperature detection probe cooling device according to claim 1, characterized in that, Multiple heat dissipation copper fins (10) are located on one side of the air outlet (9), and the bottom of the second U-shaped part (3) is provided with a heat dissipation exhaust port (11).

6. The high-temperature detection probe cooling device according to claim 1, characterized in that, The first U-shaped part (2) and the second U-shaped part (3) are fitted together.

Images