Detection device suitable for integrated circuit chip after tape-out

Abstract

The utility model relates to the technical field of chip detection, and aims to provide an integrated circuit chip detection device suitable for tape-out, which comprises a bottom plate, a sliding assembly arranged on the bottom plate, a driving assembly arranged on the side wall of the bottom plate, a clamping assembly arranged on the sliding assembly, a supporting assembly arranged on the outer wall of the bottom plate, and a clamping assembly arranged on the supporting assembly. The supporting assembly is provided with the detection assembly, and efficient clamping and detection of integrated circuit chips of different specifications are achieved through the sliding assembly and the clamping assembly. Through the design of a pressing plate and a pressing rubber column in the clamping assembly, stable fixation of the chip in the detection process can be ensured, detection errors caused by movement or shaking of the chip are avoided, and through the combination of a reversible motor and a lead screw nut pair in the driving assembly, the movement speed and position of the clamping assembly can be accurately controlled.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a device for testing integrated circuit chips after tape-out. Background Technology

[0002] Integrated circuits (ICs) are core components of modern electronic devices, and their quality and performance directly affect the stability and reliability of the entire system. With the rapid development of technology, the specifications and types of ICs are becoming increasingly diverse, placing higher demands on post-tape fabrication chip testing equipment. Traditional post-tape fabrication chip testing equipment often can only test ICs of specific specifications, failing to meet the diverse chip needs of the market. Therefore, developing a chip testing device applicable to ICs of different specifications is particularly important.

[0003] In existing post-fabrication chip inspection devices, the clamping components are typically fixed, unable to be flexibly adjusted according to the size of the chip after fabrication, thus limiting the inspection range. Meanwhile, the driving components often only achieve a single movement mode, lacking sufficient flexibility and precision to meet the demands of high-precision inspection. Furthermore, the design of the support and inspection components is often relatively simple, failing to provide a stable and accurate inspection environment, thus affecting the accuracy of the inspection results. Utility Model Content

[0004] The purpose of this invention is to provide a device for testing integrated circuit chips after tape-out, in order to solve the problems mentioned in the background art and facilitate its widespread application.

[0005] An integrated circuit chip inspection device suitable for post-wafer fabrication includes a base plate, a sliding assembly on the base plate, a driving assembly on the side wall of the base plate, a clamping assembly on the sliding assembly, a support assembly on the outer wall of the base plate, and a detection assembly on the support assembly.

[0006] The sliding assembly includes a slide rail one and a slide rail two formed on the upper surface of the base plate. A slider is slidably provided in the slide rail one and the slide rail two, and a sliding support frame is provided on the slider.

[0007] Furthermore, the clamping assembly includes a plurality of evenly arranged clamping slots fixedly mounted on the sliding support frame. A connecting shaft is provided on the clamping slot, a pressing plate is provided on the connecting shaft, a pressing rubber post is provided at one end of the pressing plate, and a torsion spring is provided between the pressing plate and the connecting shaft.

[0008] Furthermore, the drive assembly includes a drive connecting frame one and a drive connecting frame two symmetrically arranged on the side wall of the base plate. The outer wall of the drive connecting frame one is provided with a support plate, and a drive motor is provided on the support plate. A drive threaded rod is fixedly provided on the output end of the drive motor. A lead screw and nut pair is threadedly connected to the drive threaded rod, and a drive connecting rod is provided between the lead screw and nut pair and the sliding support frame.

[0009] Furthermore, the support assembly includes a support cross plate and a second support cross plate fixedly mounted on the outer wall of the base plate, and a support frame is provided on the support cross plate and the second support cross plate.

[0010] Furthermore, the detection assembly includes an electric slide rail and a guide rod fixedly mounted on the inner wall of the support frame. An electric slider is slidably mounted on the electric slide rail. A guide sleeve is fitted on the guide rod. A detection cross plate is provided between the guide sleeve and the electric slider. An electric push rod is provided below the detection cross plate. A detection probe is provided at the end of the electric push rod away from the detection cross plate.

[0011] Furthermore, the drive motor is a reversible motor.

[0012] As an improvement, the beneficial effects of this utility model are as follows:

[0013] This invention relates to a device for inspecting integrated circuit chips after wafer fabrication. Through a sliding assembly and a clamping assembly, it achieves efficient clamping and inspection of integrated circuit chips of different specifications after wafer fabrication. The pressing plate and pressing rubber pillars in the clamping assembly ensure stable fixation of the chip during the inspection process, avoiding inspection errors caused by chip movement or shaking. The reversible motor and lead screw-nut combination in the drive assembly allows for precise control of the moving speed and position of the clamping assembly. This high-precision movement control ensures that the inspection probes accurately reach each inspection point on the chip, thereby improving the accuracy and reliability of the inspection. The precise cooperation of components such as the electric slide rail and guide rod in the inspection assembly also ensures that the inspection probes remain stable during movement, avoiding inspection errors caused by shaking or vibration. Attached Figure Description

[0014] Figure 1 This is an isometric A-view of an integrated circuit chip inspection device applicable to the present invention after wafer fabrication;

[0015] Figure 2 This is an isometric B-view of an integrated circuit chip inspection device applicable after wafer fabrication according to this utility model;

[0016] Figure 3 This is an isometric C-view of an integrated circuit chip inspection device applicable to the present invention after wafer fabrication;

[0017] Figure 4 This utility model Figure 1 Enlarged view of point A in the image;

[0018] Figure 5 This utility model Figure 2 Enlarged view of point B in the image;

[0019] Figure 6 This utility model Figure 2 Enlarged view of point C in the image;

[0020] Figure 7 This utility model Figure 3 Enlarged view of point D in the image;

[0021] Reference table for attached figures:

[0022] 1. Base plate; 2. Sliding assembly; 201. Slide rail one; 202. Slide rail two; 203. Slider; 204. Sliding support frame; 3. Drive assembly; 301. Drive connecting frame one; 302. Drive connecting frame two; 303. Support plate; 304. Drive motor; 305. Drive threaded rod; 306. Screw and nut pair; 307. Drive connecting rod; 4. Clamping assembly; 401. Clamping groove; 402. Connecting shaft; 403. Pressing plate; 404. Pressing rubber column; 405. Torsion spring; 5. Support assembly; 501. Supporting horizontal plate; 502. Supporting horizontal plate two; 503. Support frame; 6. Detection assembly; 601. Electric slide rail; 602. Guide rod; 603. Electric slider; 604. Guide bushing; 605. Detection horizontal plate; 606. Electric push rod; 607. Detection probe. Detailed Implementation

[0023] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0024] To make the content of this utility model easier to understand, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Identical components are indicated by the same reference numerals.

[0025] This embodiment provides an integrated circuit chip inspection device suitable for post-wafer fabrication, including a base plate 1, a sliding component 2 on the base plate 1, a driving component 3 on the side wall of the base plate 1, a clamping component 4 on the sliding component 2, a support component 5 on the outer wall of the base plate 1, and a detection component 6 on the support component 5.

[0026] In this embodiment, the sliding component 2 is installed on the upper surface of the base plate 1, specifically including a first slide rail 201 and a second slide rail 202, which are arranged in parallel to provide a sliding track for the slider 203. The slider 203 is tightly fitted with the first slide rail 201 and the second slide rail 202 to ensure smooth sliding. A sliding support frame 204 is provided above the slider 203. This support frame is used to install the clamping component 4, which is moved by the slider 203 on the slide rail.

[0027] In this embodiment, the clamping assembly 4 is fixed to the sliding support frame 204 and includes multiple evenly arranged clamping slots 401. Each clamping slot 401 is equipped with a connecting shaft 402 and a pressing plate 403. The pressing plate 403 is rotatably mounted on the clamping slot 401 via the connecting shaft 402. One end of the pressing plate 403 is provided with a pressing rubber post 404 to increase the contact area and friction with the integrated circuit chip, ensuring stable chip clamping. A torsion spring 405 is provided between the pressing plate 403 and the connecting shaft 402. When the chip is placed into the clamping slot 401, the pressing plate 403 automatically closes under the action of the torsion spring, realizing automatic chip clamping.

[0028] In this embodiment, the drive assembly 3 is symmetrically mounted on the side wall of the base plate 1, including a drive connecting frame one 301 and a drive connecting frame two 302. A support plate 303 is fixed to the outer wall of the drive connecting frame one 301, and a drive motor 304 is mounted on it. This motor is a reversible motor, capable of adjusting its rotation direction as needed. The output end of the drive motor 304 is fixedly connected to a drive threaded rod 305, and a lead screw and nut pair 306 is threaded onto the threaded rod. The lead screw and nut pair 306 is connected to the sliding support frame 204 via a drive connecting rod 307. When the drive motor 304 starts, it drives the lead screw and nut pair 306 to move via threaded transmission, which in turn pushes the sliding support frame 204 and the clamping assembly 4 to slide on the slide rail via the drive connecting rod 307, achieving precise adjustment of the chip position.

[0029] In this embodiment, the support assembly 5 is fixedly installed on the outer wall of the base plate 1, and mainly includes a support horizontal plate 501 and a second support horizontal plate 502, which are arranged in parallel to support the detection assembly 6. The support horizontal plate 501 and the second support horizontal plate 502 are provided with support frames 503, which provide a stable installation platform for the detection assembly 6.

[0030] In this embodiment, the detection component 6 is installed on the inner wall of the support frame 503, and includes an electric slide rail 601 and a guide rod 602. An electric slider 603 is slidably mounted on the electric slide rail 601, and a guide sleeve 604 is fitted onto the guide rod 602. A detection cross plate 605 is fixed between the electric slider 603 and the guide sleeve 604 via a connector, ensuring that the detection cross plate 605 moves smoothly under the combined action of the electric slide rail 601 and the guide rod 602. An electric push rod 606 is located below the detection cross plate 605, and a detection probe 607 is located at the telescopic end of the electric push rod 606. When it is necessary to detect an integrated circuit chip, the electric push rod 606 pushes the detection probe 607 down to contact the chip and perform electrical performance testing. At the same time, the coordinated work of the electric slide rail 601 and the electric slider 603 enables the precise positioning and movement of the detection probe 607 on the chip surface, meeting the needs of different detection points.

[0031] The above are merely preferred embodiments of this utility model patent and are not intended to limit this utility model patent. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model patent should be included within the protection scope of this utility model patent.

Claims

1. A device for testing integrated circuit chips after wafer fabrication, comprising a base plate (1), characterized in that, The base plate (1) is provided with a sliding component (2), the side wall of the base plate (1) is provided with a driving component (3), the sliding component (2) is provided with a clamping component (4), the outer wall of the base plate (1) is provided with a support component (5), and the support component (5) is provided with a detection component (6). The sliding assembly (2) includes a slide rail one (201) and a slide rail two (202) opened on the upper surface of the base plate (1). A slider (203) is slidably provided in the slide rail one (201) and the slide rail two (202). A sliding support frame (204) is provided on the slider (203).

2. The integrated circuit chip testing device according to claim 1, characterized in that, The clamping assembly (4) includes a plurality of evenly arranged clamping slots (401) fixedly mounted on the sliding support frame (204). A connecting shaft (402) is provided on the clamping slot (401), and a pressing plate (403) is provided on the connecting shaft (402). A pressing rubber post (404) is provided at one end of the pressing plate (403), and a torsion spring (405) is provided between the pressing plate (403) and the connecting shaft (402).

3. The integrated circuit chip testing device according to claim 2, characterized in that, The drive assembly (3) includes a drive connecting frame one (301) and a drive connecting frame two (302) symmetrically arranged on the side wall of the base plate (1). The outer wall of the drive connecting frame one (301) is provided with a support plate (303). A drive motor (304) is provided on the support plate (303). A drive threaded rod (305) is fixedly provided on the output end of the drive motor (304). A screw nut pair (306) is threadedly connected to the drive threaded rod (305). A drive connecting rod (307) is provided between the screw nut pair (306) and the sliding support frame (204).

4. The integrated circuit chip inspection device according to claim 3, characterized in that, The support assembly (5) includes a support horizontal plate (501) and a support horizontal plate two (502) fixedly installed on the outer wall of the base plate (1), and a support frame (503) is provided on the support horizontal plate (501) and the support horizontal plate two (502).

5. The integrated circuit chip inspection device according to claim 4, characterized in that, The detection assembly (6) includes an electric slide rail (601) and a guide rod (602) fixedly mounted on the inner wall of the support frame (503). An electric slider (603) is slidably mounted on the electric slide rail (601). A guide sleeve (604) is fitted on the guide rod (602). A detection cross plate (605) is provided between the guide sleeve (604) and the electric slider (603). An electric push rod (606) is provided below the detection cross plate (605). A detection probe (607) is provided at one end of the electric push rod (606) away from the detection cross plate (605).

6. The integrated circuit chip inspection device according to claim 3, characterized in that, The drive motor (304) is a reversible motor.

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